Abstract: A method of assembling a terminal assembly includes a terminal and a terminal insert. The terminal insert may be configured to be disposed at least partially in the terminal; the terminal and the terminal insert may be configured to receive at least a portion of a wire; and/or the terminal and the terminal insert may be configured to be crimped to the said wire. The terminal insert may include a first insert wing, a second insert wing a third insert wing, and/or a fourth insert wing. The terminal may include a first wing, a second wing, a third wing, and/or a fourth wing. The first wing of the terminal may be disposed proximate the first wing of the terminal insert and/or the second wing of the terminal may be disposed proximate the second wing of the terminal insert.

Abstract: Crimping of an LED leadframe to a subassembly may stress the leadframe. Flat leadframes cannot accommodate these stresses. Strain relief sections are added to the leadframe to accommodate crimping or other stresses on the leadframe. Strain relief sections are created in the leadframe in the form of openings, notches or bulges. The strain relief sections may be symmetric or asymmetric.

Abstract: A method of manufacturing a device having a microelectronic component housed in a hermetically sealed vacuum housing, including forming a getter in said housing, pumping out and heating the device to degas elements housed in said housing, after said pumping, hermetically sealing the housing in fluxless fashion. Further, each material forming the device likely to degas into the inner space is a mineral material, the getter is capable of substantially trapping hydrogen only and is inert to oxygen and/or to nitrogen and the heating and the sealing are performed at a temperature lower than 300° C.

Abstract: To reduce radio frequency losses during operation of a radio frequency integrated circuit module, the radio frequency integrated circuit module is fabricated such that at least one of an edge of the wirebond pad on the copper trace and a sidewall of the copper trace is free from high-resistivity plating material. The unplated portion provides a path for the radio frequency current to flow around the high-resistivity material.

Abstract: The present disclosure provides a semiconductor package, including a first device having a first joining surface, a first conductive component at least partially protruding from the first joining surface, a second device having a second joining surface facing the first joining surface, and a second conductive component at least exposing from the second joining surface. The first conductive component and the second conductive component form a joint having a first beak. The first beak points to either the first joining surface or the second joining surface.

Abstract: An apparatus for a manufacturing semiconductor device including a plate member and a joint member. The apparatus includes a plate-type tool having the plate member mounted thereon, a first fixing tool and a second fixing tool having an inclined surface for abutting an upper edge of an end part in a width direction of plate member. The second fixing tool is fixed onto the plate-type tool adjacent to the end part. An ultrasonic horn applies ultrasonic vibration in the width direction of plate member while pressing the joint member toward the plate member.

Abstract: A semiconductor device includes a first ceramic substrate, a second ceramic substrate, an inter-ceramic metal having an intermediate portion interposed between an upper surface of the first ceramic substrate and a lower surface of the second ceramic substrate, a first surmounting portion formed on an upper surface of the second ceramic substrate, a second surmounting portion formed on the upper surface of the second ceramic substrate, a first connection portion abutting on an outer edge of the second ceramic substrate and connecting the intermediate portion and the first surmounting portion, and a second connection portion abutting on an outer edge of the second ceramic substrate and connecting the intermediate portion and the second surmounting portion, a circuit pattern formed on the second ceramic substrate, and a semiconductor element provided on the circuit pattern.

Abstract: A method of recovering a bonding apparatus from a bonding failure to resume a normal operating state for semiconductor chip fabrication is disclosed. The bonding apparatus comprises: i) a bonding tool for bonding a wire between a semiconductor chip and a substrate; and ii) a position sensor. Specifically, the method comprises the steps of: a) the position sensor determining a position of the bonding tool when the bonding tool contacts a surface to bond the wire to the substrate; b) the bonding apparatus detecting a bonding failure caused by detachment of the semiconductor from the substrate based on the position of the bonding tool; and c) the bonding apparatus detaching the semiconductor chip from the wire.

Abstract: During mounting to an inlay substrate, at least one end portion (including end) of an antenna wire is positioned directly over a terminal of the chip module for subsequent connecting thereto. A sonotrode is disclosed with a cutter above the capillary for cutting or nicking the wire. Insulation may be removed from a portion of the wire. The antenna may comprise two separate stubs, each having an end portion (including end) positioned over a terminal of the chip module. Additional techniques for mounting the antenna wire are disclosed.

Abstract: A weld stack includes a horn having a weld end, a polar mount adapted to receive a portion of the horn therein, a first adjustment ring coupled to the polar mount at a pre-determined distance from the weld end of the horn, and a second adjustment ring coupled to the polar mount adjacent the first adjustment ring, wherein the second adjustment ring includes a fine adjustment device for adjusting a relative position of the first adjustment ring and the second adjustment ring.

Abstract: A joined body which is formed by, first, an aqueous solution containing an oxide film remover is disposed on a junction region of a first metal plate. Then, with the aqueous solution remaining on the first metal plate, a second metal plate is placed on the first metal plate. Thereafter, a load is applied to junction regions of the first metal plate and the second metal plate in the vertical direction, thereby joining the first metal plate and the second metal plate together to form a junction portion.

Abstract: In some cases, it is difficult to carry out ultrasonic joining of high quality with a conventional bonding tool. A bonding tool includes: a horn that transmits an ultrasonic vibration; an ultrasonic vibrator that is provided at one end of the horn, and generates the ultrasonic vibration; and an electronic component holding part that holds an electronic component, wherein the electronic component holding part has a male fitting part in a shape of a tapering-off, and an electronic component holding face that holds the electronic component on an opposite side to the male fitting part, a female fitting part in a shape according to a shape of the male fitting part is formed in a predetermined face of the horn, and the male fitting part is fitted into the female fitting part via an adhesion layer.

Abstract: A system includes host and learning machines. Each machine has a processor in electrical communication with at least one sensor. Instructions for predicting a binary quality status of an item of interest during a repeatable process are recorded in memory. The binary quality status includes passing and failing binary classes. The learning machine receives signals from the at least one sensor and identifies candidate features. Features are extracted from the candidate features, each more predictive of the binary quality status. The extracted features are mapped to a dimensional space having a number of dimensions proportional to the number of extracted features. The dimensional space includes most of the passing class and excludes at least 90 percent of the failing class. Received signals are compared to the boundaries of the recorded dimensional space to predict, in real time, the binary quality status of a subsequent item of interest.

Abstract: Disclosed is an apparatus for mounting a transducer to a bond head of a wire bonder. In particular, the bond head of the wire bonder is operative to mechanically drive the transducer when forming electrical interconnections between separate locations within a semiconductor package. Specifically, the apparatus comprises: i) a flexural structure having a connector for connecting to the transducer, the flexural structure being configured to bend; and ii) at least one actuator attached to the flexural structure, the at least one actuator being operative to bend the flexural structure to thereby cause a displacement of the transducer connected thereto via the connector.

Abstract: Electric cable 16 having an inner conductor 16a, a primary isolation 16b surrounding the inner conductor 16a, an electric shield 18 surrounding the primary isolation 16b, and a secondary isolation 16c surrounding the shield, wherein at least at one end 22 of the cable 16 the secondary isolation 16c is removed so that the shield 18 is stripped. A contacting of the shield to a vehicle body is electrically and mechanically ensured in that a sleeve 2 is pushed over the stripped shield 18, in that a part of the shield 18 protruding beyond the sleeve 2 in the direction of the end 22 of the cable 16 is put over the sleeve 2, and in that the part of the shield 18 that is put over the sleeve 2 is intermetallically connected to the sleeve 2.

Abstract: Systems and methods in accordance with embodiments of the invention fabricate objects including metallic glass-based materials using ultrasonic welding. In one embodiment, a method of fabricating an object that includes a metallic glass-based material includes: ultrasonically welding at least one ribbon to a surface; where at least one ribbon that is ultrasonically welded to a surface has a thickness of less than approximately 150 ?m; and where at least one ribbon that is ultrasonically welded to a surface includes a metallic glass-based material.

Abstract: A structure of an electric wire for connection includes a conductor end portion of the electric wire comprised of a plurality of core wires. The conductor end portion is compressed by press-forming to pressurize from the side of an outer peripheral surface thereof toward the side of the axis thereof. A tapered surface is formed by the press-forming on the outer peripheral surface of at least a tip side of the conductor end portion, which inclines toward a direction crossing an axial direction of the conductor end portion. The conductor end portion on which the tapered surface is formed is electrically connected with a connected portion by ultrasonic joining.

Abstract: In connecting a conductor consisting of a plurality of core lines of an electric wire to a terminal, it is performed to make the core lines, which are adjacent to each other at a peripheral part in a vicinity of an end of the conductor, into contact with each other adhesively and join the end of the conductor to the terminal by pressurized ultrasonic oscillation using a compression-and-vibration horn. In making the adjacent core lines in contact with each other, a metal sleeve may be fitted in an annular manner in the vicinity of the end or the peripheral part of the conductor may be subjected to welding, alternatively.

Abstract: A method for connecting functional elements (14) to a shaft (10, having the following steps: (a) forming elevations (12) for receiving the functional elements (14), said elevations (12) being machined out of the shaft (10) by removing material, and (b) welding the functional elements (14) to the elevations (12) on the shaft (10).

Abstract: A method to electrically and mechanically connect at least one wire conductor to a terminal includes the steps of cutting and stripping a portion of an insulation outer layer along an end section of the at least one wire conductor to expose a lead of the at least one wire conductor. A further step includes applying a bonding process to the exposed lead to break down oxides disposed on the lead. A further step in the method is crimping the lead having the applied bonding process to the terminal to form a crimp connection connecting the at least one wire conductor to the terminal.

Abstract: A system includes host and learning machines in electrical communication with sensors positioned with respect to an item of interest, e.g., a weld, and memory. The host executes instructions from memory to predict a binary quality status of the item. The learning machine receives signals from the sensor(s), identifies candidate features, and extracts features from the candidates that are more predictive of the binary quality status relative to other candidate features. The learning machine maps the extracted features to a dimensional space that includes most of the items from a passing binary class and excludes all or most of the items from a failing binary class. The host also compares the received signals for a subsequent item of interest to the dimensional space to thereby predict, in real time, the binary quality status of the subsequent item of interest.

Abstract: An apparatus and a process are disclosed for straw tube formation utilized in manufacturing boron coated straw neutron detectors. A preferred embodiment of the process for creating a thin walled straw for use in a boron-coated straw neutron detector comprises providing foil having a boron coating on a surface, forming the coated foil into a cylindrical tube having a longitudinal seam and the boron coated surface on the inside of the cylindrical tube, and then ultrasonically welding closed the seam of the tube. Optionally, the cylindrical tube can then be drawn through a die to form a straw tube having a non-circular cross section, preferably a star-shaped cross section.

Abstract: An electric wire connecting method for connecting together a wire having a conductor and a stranded wire having a plurality of strands which are twisted, the electric wire connecting method is provided. The electric wire connecting method includes a forming step and a welding step. In the forming step, the conductor is formed into a plate element by pressing the conductor. In the welding step, the strands are welded to the plate element in a state where the strands are superposed on the plate element.

Abstract: An ultrasonic welding machine and method are provided. The machine includes a base portion having a first aperture that defines first internal threads. The machine further includes an electrically non-conductive member disposed on the base portion having a second aperture that is aligned with the first aperture. The machine further includes an anvil portion disposed on the electrically non-conductive member having a third aperture that is aligned with the second aperture. The machine further includes a first bolt disposed through the third aperture and the second aperture that is threadably received in the first internal threads, and the first bolt and the anvil portion are electrically isolated from the base portion.

Abstract: A vibration welding system includes an anvil, a welding horn, a thin film sensor, and a process controller. The anvil and horn include working surfaces that contact a work piece during the welding process. The sensor measures a control value at the working surface. The measured control value is transmitted to the controller, which controls the system in part using the measured control value. The thin film sensor may include a plurality of thermopiles and thermocouples which collectively measure temperature and heat flux at the working surface. A method includes providing a welder device with a slot adjacent to a working surface of the welder device, inserting the thin film sensor into the slot, and using the sensor to measure a control value at the working surface. A process controller then controls the vibration welding system in part using the measured control value.

Abstract: A feed-through, in particular a feed-through which passes through part of a housing, in particular a battery housing, for example made of metal, in particular light metal, for example aluminum, an aluminum alloy, AlSiC, magnesium, an magnesium alloy, titanium, a titanium alloy, steel, stainless steel or high-grade steel. The housing part has at least one opening through which at least one conductor, in particular an essentially pin-shaped conductor, embedded in a glass or glass ceramic material, is guided. The base body is, for example, an essentially annular-shaped base body.

Abstract: A process for electric bonding of an aluminum wire to a contact area which wire, provided with an oxide layer on its outer surface, is wrapped with an insulating lacquer and ultrasonic bonded to said contact area, wherein insulation is removed from the aluminum wire section to be connected to the contact area prior to the ultrasonic bonding process by removing the insulating layer which surrounds the outer surface of the wire with oxide layer by means of an electric plasma.

Abstract: The present invention is directed to connection technology for providing a sufficient connection strength in bonding a wire material and a twisted wire each having a large diameter when directly bonding the wire material, which is used for a stator of an electric motor and a generator, and the twisted wire serving as a lead wire by ultrasonic bonding. A twisted wire having a plurality of core wires is hardened by ultrasonic vibration using a pressurized vibration tool when the twisted wire is connected to a wire material. After that, the twisted wire is reversed such that the hardened surface thereof faces the wire material and then comes into contact with the wire material. In this state, ultrasonic waves are applied to the hardened surface from the opposite side using the vibration tool, thereby connecting the hardened surface of the twisted wire and the wire material.

Abstract: The invention relates to a method for dispensing solder and a method for mounting a semiconductor chip on the dispensed solder. The substrate is heated to a temperature which lies above the melting temperature of the solder and a solder portion is applied. A pin is thereafter immersed in the solder portion until it touches the solder portion and presses against the substrate. The pin is subjected to ultrasonic sound in such a way that ultrasonic waves are generated in the pin, which are directed perpendicularly or angularly in relation to the surface of the substrate, and is then moved along a predetermined path in order to distribute the solder. The treatment with ultrasonic sound locally improves the wettability of the substrate. The temperature of the pin is preferably lower than the melting temperature of the solder.

Abstract: Provided is a bonding apparatus capable of forming even loops at high speed. According to a bonding apparatus 1, a capillary 5 is lowered to a bonding position to bond an initial ball 10 to a pad 104 on an overhanging die 100. Here, a position of the capillary 5 in a Z direction and a load detected by a load sensor 7 are detected and stored every predetermined time period. A load change point is detected by referring to the stored load and the stored position. By subtracting the bonding position from a load changing position of the capillary 5 at the load change point, a movement amount Z of the capillary 5 from the load changing position to the bonding position is calculated. After the capillary 5 is lifted by the movement amount Z, a wire loop is formed between the pad 104 and a lead 105.

Abstract: First, an aqueous solution (103) containing an oxide film remover is disposed on a junction region of a first metal plate (101). Then, with the aqueous solution (103) remaining on the first metal plate (101), a second metal plate (102) is placed on the first metal plate (101). Thereafter, a load is applied to junction regions of the first metal plate (101) and the second metal plate (102) in the vertical direction, thereby joining the first metal plate (101) and the second metal plate (102) together to form a junction portion (110). In this manner, a joined body is manufactured.

Abstract: An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.

Abstract: A wire end processing method includes tree steps. In a core wire portion exposing step, a sheath of a wire is stripped so as to expose a core wire portion composed of a plurality of element wires. In a core wire portion unifying step, ultrasonic vibration is applied to the exposed core wire portion while applying a pressure thereto, thereby causing the plurality of the element wires to rub against one another so as to unify the core wire portion. In a terminal connecting step, the unified core wire portion is press-contacted or press-fitted to the terminal.

Abstract: A method of joining the ends of wire windings for a motor stator or the like includes preparing a surface at each end (e.g., by removing any enamel coating), deforming the surfaces to produce knurls, striations, and the like, and then ultrasonically bonding the two surfaces to produce the bond between windings, thereby providing a joint with improved strength.

Abstract: A welding assembly for forming a weld along a welding interface of a work piece(s) using vibrations includes a welding tool and a thermal barrier. The thermal barrier is at least a chemical and/or mechanical insulating layer positioned adjacent to the welding tool, which minimizes the rate of dissipation of heat generated by the vibrations at or along the welding interface. The welding assembly may also include a wear-resistant layer adjacent to the thermal barrier, which protects the thermal barrier from damage or wear. The welding tool is a portion an anvil assembly and/or a sonotrode assembly. A method of insulating a welding tool includes applying or connecting a thermal barrier to a surface of the welding tool, and minimizing the rate of dissipation of heat generated by the vibrations at or along the welding interface using the thermal barrier, which includes an insulating layer.

Abstract: A method for bonding two partially form-fitting surfaces of two metal bodies which contain the same metal is carried out by generating a first layer on the surface of a first one of the two bodies, the first layer containing a mixture of the metal and the oxide of the metal; generating a second layer on the first layer, the second layer containing the metal but less oxide of the metal than does the first layer; placing the partially form-fitting surfaces of the two metal bodies adjacent to each other; heating the bodies placed adjacent to each other to a temperature which lies in a target range below the melting point of the metal and above the eutectic temperature of the eutectic of the metal and the metal oxide; and holding the temperature within the target range over a predetermined or a controllable duration of time.

Abstract: An ultrasonic welding system for securing a first work piece to a second work piece includes a welding assembly and a loading assembly disposed adjacent to the welding assembly. The welding assembly includes an ultrasonic controller, an ultrasonic transducer, and a welding tip. The ultrasonic transducer is configured to impart an ultrasonic vibration to the welding tip in response to an electrical signal received from the ultrasonic controller. The loading assembly is configured to generate a pressure load between the welding tip and the first work piece, and includes a first actuator and a second actuator. The first actuator is configured to apply a substantially constant load to the welding assembly, and the second actuator is configured to apply a dynamically variable load to the welding assembly.

Abstract: An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.

Abstract: A bonding device, particularly for producing bond connections between electrical conductors made of wire material or strip material and contact points of substrates such as electrical circuits, wherein the bonding device comprises a bonding head (2) which can be rotated about a geometric axis of rotation (D), in particular a vertical axis, and on which a bonding tool (5) and an ultrasonic transducer (35) are disposed for ultrasonic vibration excitation of the bonding tool (5). It is proposed that the main direction of extension (36) of the ultrasonic transducer (35) and/or the direction of extension thereof in the direction of the axis of the minimum moment of inertia extends parallel to the geometric axis of rotation (D) of the bonding head (2). The invention further relates to a bonding device or an ultrasonic transducer.

Abstract: A method of forming a composite sheet includes disposing an untextured metal or alloy first sheet in contact with a second sheet in an aligned opposing position; bonding the first sheet to the second sheet by applying an oscillating ultrasonic force to at least one of the first sheet and the second sheet to form an untextured intermediate composite sheet; and annealing the untextured intermediate composite sheet at a temperature lower than a primary re-crystallization temperature of the second sheet and higher than a primary re-crystallization temperature of the first sheet to convert the untextured first sheet into a cube textured sheet, wherein the cube texture is characterized by a ?-scan having a FWHM of no more than 15° in all directions, the second sheet remaining untextured, to form a composite sheet.

Abstract: A connecting structure includes a sheathing connecting section in which sheathed sections of a plurality of electric wires, which are sections at both sides of exposed conductor sections, are bundled together in a state of being superimposed with each other; and a conductor connecting section in which the conductor sections of the plurality of electric wires are intertwined in a state of being folded back, and a section of the folded back conductor section remaining as a result of excluding a portion of the folded back conductor section are ultrasonically bonded in integration.

Abstract: A method of performing ultrasonic stir welding uses a welding head assembly to include a plate and a rod passing through the plate. The rod is rotatable about a longitudinal axis thereof. In the method, the rod is rotated about its longitudinal axis during a welding operation. During the welding operation, a series of on-off ultrasonic pulses are applied to the rod such that they propagate parallel to the rod's longitudinal axis. At least a pulse rate associated with the on-off ultrasonic pulses is controlled.

Abstract: An ultrasonic stir welding system includes a welding head assembly having a plate and a rod passing through the plate. The rod is rotatable about a longitudinal axis thereof. During a welding operation, ultrasonic pulses are applied to the rod as it rotates about its longitudinal axis. The ultrasonic pulses are applied in such a way that they propagate parallel to the longitudinal axis of the rod.

Abstract: A method for sealing the curved vacuum glass comprises: first preparing metallized layer bonded with the glass plate on the edge surface of the curved glass to be sealed by locally heating the metal slurry coating; then air-tightly sealing the edges of two glass plates by using the metal brazing technology, or air-tightly sealing the edges of two glass plates by air-tightly welding the metal sealing sheet between the metallized layers of two glass plates to be sealed. A curved vacuum glass is also provided. The method makes the sealing part have firm connection, good air tightness and good thermal shock resistance. The sealing structure made of the metal sealing sheet is well compatible with the temperature deformation caused by the temperature difference between the internal and external glass plates of the vacuum glass.

Abstract: A method and assembly for the electrically conductive connection of a bundle of wires having an insulation, wherein the insulation is at least partially removed by means of ultrasonic effects. In order to ensure high mechanical strength in a good electrically conductive connection, according to the invention the insulation of the wires is removed in a first step by means of plastic-ultrasonic welding and the wires are bonded in a second step by means of metal-ultrasonic welding or resistance welding.

Abstract: A process of fabricating a slip ring component, a slip ring component, and a slip ring assembly are disclosed. The process includes forming a first shot, forming a second shot, and immersion bathing the first shot and the second shot. The immersion bathing applies an electrically conductive plating to exposed surfaces of the second shot.

Abstract: A wire end processing method includes tree steps. In a core wire portion exposing step, a sheath of a wire is stripped so as to expose a core wire portion composed of a plurality of element wires. In a core wire portion unifying step, ultrasonic vibration is applied to the exposed core wire portion while applying a pressure thereto, thereby causing the plurality of the element wires to rub against one another so as to unify the core wire portion. In a terminal connecting step, the unified core wire portion is press-contacted or press-fitted to the terminal.

Abstract: A method of forming a composite sheet includes the steps of: providing a first sheet having a surface and including a metal or alloy, the first sheet having a given strength characteristic; providing a second sheet having a surface and a strength characteristic that is superior to the given strength characteristic of the first sheet; disposing the first sheet and the second sheet in an aligned opposing position with at least a portion of the surface of the first sheet touching the surface of the first sheet to form a contact area; and bonding the first sheet to the second sheet at least in part by applying an oscillating ultrasonic force to at least one of the first sheet and the second sheet to form a composite sheet, the first sheet having a cube texture characterized by a ?-scan having a FWHM of no more than 15° in all directions.

Abstract: A coaxial connector for interconnection with a coaxial cable with a solid outer conductor by ultrasonic welding is provided with a monolithic connector body with a bore. An annular flare seat is angled radially outward from the bore toward a connector end of the connector; the annular flare seat open to the connector end of the connector. The flare seat may be provided with an annular flare seat corrugation.

Abstract: A system and method for terminating a wire having an aluminum conductor includes a terminal having a conductor receiving area adapted to receive the aluminum conductor, and a welding buffer sized and shaped to fit within the conductor receiving area of the terminal with the aluminum conductor disposed between the welding buffer and the terminal. The terminal, the welding buffer and the aluminum conductor are ultrasonically welded together to form an integrated unit, such that the welding buffer forms a part of a finished terminated wire assembly.