Abstract: An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.

Abstract: The present invention provides a battery including a container, an electrode group including a positive electrode and a negative electrode, multiple current collecting tabs being extended from any one of the positive electrode and the negative electrode of the electrode group, and overlapped with one another; a lead bonded to at least one of the current collecting tabs by ultrasonic bonding, a lid configured to close an opening portion of the container, and an external terminal provided on the lid and connected to the at least one current collecting tab via the lead, in which the lead has a cross-sectional area that is increased in a middle of extension of the lead from an ultrasonic-bonded portion to the at least one of the current collecting tabs to the external terminal.

Abstract: A method of manufacturing a fibre reinforced metal matrix composite article, the method comprises forming a first metal component, forming a second metal component and forming at least one fibre preform comprising at least one metal coated fibre. The metal at least one first portion of the at least one metal coated fibre of the at least one fibre preform is bonded to the metal at least one second portion of the at least one metal coated fibre of the at least one fibre preform to hold the at least one fibre in position. The at least one fibre preform is placed between the first metal component and the second metal component. The second metal component is sealed to the first metal component, and heat and pressure is applied such as to consolidate the at least one fibre preform and to diffusion bond the metal on the fibre of the at least one fibre preform, the first metal component and the second metal component to form a unitary composite article. The bonding comprises ultrasonic welding.

Abstract: Methods and systems are described for enabling the efficient fabrication of wedge bonding of integrated circuit systems and electronic systems. In particular a reverse bonding approach can be employed.

Abstract: Methods and systems are described for enabling the efficient fabrication of wedge-bonding of integrated circuit systems and electronic systems.

Abstract: The present invention relates to an electrochromic device having at least one active area (CDEF), having, on a carrier substrate (3), a multilayer stack comprising a layer forming a lower electrode (4), various functional layers (7) at least one of which is an electrochromic layer, at least one (6, 7a) of these layers being electrically insulating, and an upper electrode (9), in which device: at least one partition (5) separating the surface of the lower electrode (4) into two isolated regions, namely a free region (4a) and an active region (4b) containing the active area (CDEF); and at least one partition (12) separating the surface of the upper electrode (9) into two regions electrically isolated from each other, namely a free region (9a) and an active region (9b) containing the active area (CDEF).

Abstract: A method of forming a conductive bump is provided. The method includes the steps of: (1) bonding a free air ball to a bonding location using a bonding tool to form a bonded ball; (2) raising the bonding tool to a desired height, with a wire clamp open, while paying out wire continuous with the bonded ball; (3) closing the wire clamp; (4) lowering the bonding tool to a smoothing height with the wire clamp still closed; (5) smoothing an upper surface of the bonded ball, with the wire clamp still closed, using the bonding tool; and (6) raising the bonding tool, with the wire clamp still closed, to separate the bonded ball from wire engaged with the bonding tool.

Abstract: The invention allows for the contacting of preferably microcomponents using electrical wires. By growing metallic microdepositions on cut surfaces of microcables, a contact region is generated which simplifies the dosing and application of a contact auxiliary and allows ultrasonic bonding, comprising a defined size of the electrically conductive area and allowing the contacting of very stably insulated wires. The application of this method in a panelized manner and in series is inexpensive.

Abstract: Provided is a wire bonding apparatus including: a wire cutting unit configured to cut a wire by bonding the wire using a capillary and then moving the capillary and a first clamper upward while the first clamper remains closed; and a wire extending unit configured to extend a tail wire from a tip end of the capillary by moving the capillary upward and then moving the capillary and the first clamper upward in a state in which the first clamper is opened and a second clamper is closed. The wire bonding apparatus having such a structure effectively prevents the wire from falling out and bending.

Abstract: An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.

Abstract: A method for production of a welded connection between at least one first electrical conductor and at least one second electrical conductor, in which the conductors are brought into a compression chamber enclosed by delimitation elements and welded therein by an ultrasound welding device, one of the delimitation elements forming a sonotrode which may be subjected to ultrasound vibration. According to the invention, in order to connect a first conductor in the desired circumference with second conductors, where the total cross-section of the second conductors for connection to the first conductor can optionally be greater than the usual cross-section with the ultrasound device used, the first conductor is welded sequentially with two or more second conductors in the compression chamber.

Abstract: An ultrasonic device includes a coupler, a mounting sleeve and an exponential horn form by both the coupler and the mounting sleeve. A flange is located on the mounting sleeve for support at a node of minimum vibratory motion. The mounting sleeve and coupler are formed separately and then metallurgically attached so they vibrate together as a substantially unitary member. The formation of the horn by the two components in this manner allows the diameter at the start of the horn to be increased to the outer diameter of the mounting sleeve, thereby increasing cross-sectional area at the horn start and increasing amplitude at the horn tip. Preferably, the coupler and mounting sleeve are made from stainless steel alloy and attached using a silver braze alloy. The device may also include a support collar attached to the mounting sleeve flange to support the mounting sleeve and primary coupler.

Abstract: A terminal of a compact wire loop with a great strength of bonding is formed by a method including: a first folding step in which a tip end of a capillary is raised by a height of H1 from a point 86a where the center of the capillary is positioned during second bonding on a lead 74 to a point “p”, and then moved horizontally by a first distance of L1 toward a pad 73, and lowered to a point “r”; a second folding step in which the tip end of the capillary is raised from the point “r” to a height of H2 and then moved horizontally toward the lead 74 by a second distance of L2; and a third bonding step in which the center of the capillary is aligned with and then lowered to a point 87a on the lead 74 adjacent to the point 86a.

Abstract: Selected surface regions of coulomb vibration damping strips are bonded face-to-face by ultrasonic welding to a surface region of an article that may experience excessive vibration in use. In one embodiment, prior to welding, the intended facing side of the damping strip is treated to form surface regions that are oxidized, roughened, or coating so that the treated regions do not weld to the article surface. In another embodiment of the invention the ultrasonic welding process is controlled so as to produce regions (sometimes randomly interposed regions) of welded and non-welded regions between the damping strip and adjacent article surface. The unbonded regions of the otherwise welded strip lie in closely-spaced, interfacial, frictional contact with the adjacent article surface to damp vibration in the article.

Abstract: A method and apparatus for welding of battery terminals to an interconnect includes: juxtaposing two or more battery cell terminals to each other to create a terminal stack including an innermost terminal and an outermost terminal; juxtaposing a battery cell interconnect with the innermost terminal of the stack; positioning an anvil in contact with the interconnect; directing an air stream against the outermost terminal so that the air stream compresses the terminal stack and urges the innermost terminal into contact with the interconnect; positioning a sonotrode horn in contact with the outermost terminal; and energizing the sonotrode horn to vibrate the terminal stack and thereby make an ultrasonic weld between the stacked terminals of the terminal stack and the interconnect. The air stream is directed at the terminal below the sonotrode horn to capture any debris and a suction removes the debris.

Abstract: The invention relates to a method for producing coated spring-loaded steel rails especially for windshield wipers comprising a rubber or elastomer wiper blade, wherein a cold-rolled steel rail blank is provided with a zinc layer, whereafter a zinc-containing anchor layer is produced, and a coating made of a polymerizable coating powder is deposited on the anchor layer and partially cured.

Abstract: A battery pack for use in a vehicle may comprise battery cells, with each of the battery cells including a main body and a foil cell tab extending from the main body, with the battery cells arranged into a first set and a second set; an interconnect having a first leg, a second leg, and a bridge connecting the legs; first weld locations securing the foil cell tabs of the first set of battery cells to the first leg; and second weld locations securing the foil cell tabs of the second set of battery cells to the second leg. The foil cell tabs or the legs of the interconnect or both may include relief slots extending between the weld locations. Also, the thickness of a set of the tabs may be equal to the thickness of the leg to which they are welded.

Abstract: The present invention provides a bonding method in which a bonded portion having a sufficient bonding strength can be obtained at a relatively low temperature, for example, in die bonding a semiconductor chip. A metal paste 20 was applied to a semiconductor chip 10, the metal paste 20 consisting of metal powder of one or more kinds selected from gold powder, silver powder, platinum powder, and palladium powder having a purity not lower than 99.9 wt % and an average particle diameter of 0.005 ?m to 1.0 ?m and an organic solvent. After being applied, the metal paste 20 was dried in a vacuum in a dryer. The chip was heated at 230° C. for 30 minutes to sinter the metal paste, by which a metal powder sintered compact 21 was formed. Next, a nickel plate 30 was placed on the semiconductor chip 10, and bonded to the semiconductor chip 10 by heating and pressurization.

Abstract: A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.

Abstract: A method of joining the ends of wire windings for a motor stator or the like includes preparing a surface at each end (e.g., by removing any enamel coating), deforming the surfaces to produce knurls, striations, and the like, and then ultrasonically bonding the two surfaces to produce the bond between windings, thereby providing a joint with improved strength.

Abstract: Apparatus for use in welding a pour spout fitment (22) to a container (32) comprises an ultrasonic welding horn (18) formed with a recess (20) at one end for receiving part of the fitment (22), an anvil (2) between an annular surface portion of which and that one end of the horn (18) are vibratingly pressed a wall off the container (32) and the flange (28) to each other, a head (14) at the opposite end of the head (14) for maintaining an annular, radially inner portion of the flange (28) spaced axially outwards from the annular surface portion of the anvil (2), the outer periphery of the ring (16) being radially dimensioned to be received in the recess (20).

Abstract: A soldering method for soldering an electronic component onto a circuit board is provided. The soldering method uses a cooling circuit board as the circuit board. The cooling circuit board includes an insulation substrate and a metal heat sink. The insulation substrate has a front surface with a metal circuit and a rear surface to which the heat sink is fixed. The heat sink has a refrigerant passage. The electronic component is arranged on the metal circuit with solder in between. A heated heating medium is supplied to the refrigerant passage when heating and melting the solder.

Abstract: An improved method of bonding an insulated wire (14) that has one end connected to a first bond pad (16) to a second bond pad (18) includes moving a tip of a capillary (20) holding the bond wire (14) over the surface of the second bond pad (18) such that the bond wire (14) is rubbed between the capillary tip (20) and the second bond pad (18), which tears the bond wire insulation so that at least a portion of a metal core of the wire (14) contacts the second bond pad (18). The wire (14) is then bonded to the second pad (18) using thermocompression bonding. The tip of the capillary (20) is roughened to enhance the tearing of the bond wire insulation.

Abstract: A method is described for the manufacture of a Copper-Aluminium-Copper component (C-A-C “sandwich”) which can be used in the production of multilayer printed circuit boards, obtained by means of joining two external sheets of copper to one internal sheet of aluminium by means of a process of electro-mechanical joining, which does not require the use of additional material (such as, for example, an adhesive) and guarantees a consistently high level of quality. The joining process, normally continuous, is based on the use of a sonotrode to effect ultrasonic welding, wherein a single ultrasonic weld provides two joining zones between the two external copper sheets and the one internal aluminium sheet. According to a further embodiment, the component is manufactured with at least one layer of resin deposited externally on one of the external faces of the two copper sheets, which are not into contact with the internal aluminium sheet.

Abstract: A method for reducing adhesive build-up on ultrasonic bonding surfaces of ultrasonic bonding systems is disclosed. The method includes providing an ultrasonic bonding surface. A pad is provided proximate to, and in fluid contact with, the ultrasonic bonding system. A fluid is conducted to the pad such that the fluid is applied is intermittently or continuously applied to at least a portion of the ultrasonic bonding surface.

Abstract: A new soldering technique and solder alloy for wetting and joining hard-to-wet materials including titanium alloys such as nitinol uses a solder alloy containing tin and an active wetting promoting element such as aluminum in the presence of ultrasound. As shown in the Figure, molten solder alloy (10) is applied to the hard-to-wet material (18) with the application of ultrasonic energy (14) which removes coatings (20) such as tenacious surface oxides to leave the base material (18) which is readily wetted by the solder alloy (20).

Abstract: A wire bonding apparatus equipped with a chip heating assembly which is installed above a heater block that contains heaters so as to heat the chip portion of a device such as a semiconductor device, and a cooling pipe which is installed in the heater block so as to cool the heater block. The temperature of the bonding surface of the device is maintained by the chip heating assembly at a temperature that allows bonding to be executed while the heater block is cooled by cooling water or a cooling air draft that flows through the cooling pipe so that the temperature of the heater block is maintained at a low temperature that cause no softening of the resin substrate of the device.

Abstract: A method of making low profile wire connection comprising steps of: connecting a wire to a first bonding point, moving a capillary straight up a first length, moving the capillary away from a second bonding point thus making the first reverse action to bend the wire in an appropriate angle so as to form the first bent point, again raising the capillary a second length, again moving the capillary in the direction of the second bonding point to bend the wire in an appropriate angle so as to form the second bent point, again raising the capillary a third length, moving the capillary to the second bonding point thus making an action to bend the wire in an appropriate angle so as to form the third bent point, raising the capillary a fourth length by feeding out the wire to a length which is enough to make a wire loop, and then moving the capillary down to the second bonding point where the bonding is performed.

Abstract: The invention relates to a device for connecting metallic materials, in particular electrical conductors such as flexible cables, by means of a transducer (10) which generates ultrasonic oscillations and contains a sonotrode (16) with a sonotrode head (14) as well as a converter (12). In order to be able to embody the transducer compactly, it is provided that the transducer alone is seated in the first oscillation node remote from the sonotrode head.

Abstract: Device for the singled-out application of joining material deposits (30), particularly solder beads, from a joining material reservoir (11) with an application device (13) and a singling-out device (12) for singling-out joining material deposits from the joining material reservoir, wherein the singling-out device (12) is designed as a conveying device (20) for the singled-out transfer of joining material deposits (30) to the application device (13).

Abstract: A system and method for suppression of air bubble generation in the ink supply and nozzles of an ink-containing printer cartridge when ultrasonic welding is performed on the ink-containing printer cartridge. The printer cartridge has a top end and a bottom end, and the bottom end includes at least one ink outlet for the ink within the printer cartridge. The system includes a mounting fixture having a recess for receiving and holding at least the lower end of the printer cartridge, an ultrasonic welding device for welding an article to the printer cartridge, and a fluid or liquid, such as water, collected in the bottom of the recess in sufficient quantity such that the at least one ink outlet on the bottom end of the printer cartridge is immersed in the fluid or liquid. The welding device is preferably an ultrasonic welding horn that typically welds a lid to the top end of an ink-containing printer cartridge.

Abstract: A wire bonding method and apparatus using a computer that has a memory which stores correction values that correct positional discrepancies in the height position of a bonding arm and limit values that limit an electric power not only in a state in which no load is applied but also in a state in which a weight is mounted on a supporting frame so that a load equal to a bonding load is applied to a linear motor that raises and lowers the bonding arm.

Abstract: A single point bonding method used in individually bonding, for example, the leads of a pad of a chip to a pad of a circuit board, including the steps of forming a pressure scar at the free end of each lead by a bonding tool, catching the irregular portions of the thus made pressure scar by the end of the bonding tool so as to move the free end of the lead towards its fixed end and then bonding the lead to a corresponding pad.

Abstract: An improved method of ultrasonically welding together two conductors having differing lateral dimensions comprising selecting a welding capture fixture having lateral sides spaced apart by a distance substantially equal to the lateral dimension of a first conductor having the greatest lateral dimension. The first conductor is placed in the selected fixture so that the first conductor is proximate to or substantially engages both lateral sides of the fixture. The second conductor is formed so that at least a first portion extends laterally beyond a second portion. The second conductor is placed into the select fixture so that the first portion is proximate to or substantially engages one of the lateral sides of the fixture and the second portion is proximate to or substantially engages the other lateral side of the fixture with both portions substantially engaging the first conductor.

Abstract: A method is provided for wire bonding an aluminum wire to a surface of a lead of an electronics package. The method entails a nickel plating process and an ultrasonic bonding process which together cooperate to form a reliable and highly repeatable joint between the wire and the lead member. The ultrasonic bonding process is specifically tailored to the nickel plating produced by the plating process, so as to significantly enhance the bond strength of the resulting ultrasonic bond joint. The plating process is devised to produce a nickel plating which is thicker than that generally practiced, and whose surface is characterized as having a relatively smooth microfinish which unexpectedly serves to enhance the bond strength of the ultrasonic bond joint.

Abstract: Method for forming welded joints on superconducting foils to form long lengths of foil for use in superconducting magnet tapes including fixturing for controlling the accurate positioning of sheared foils and control of the overlap to be welded.

Abstract: A method and means of bonding a semiconductor die (10) to a support substrate (35) using a thermosonic bonding apparatus (50). The semiconductor die (10) has bonding pads (14, 15, 17) on a first major surface (12), and the support substrate (35) has contact pads (46, 47, 44) on a principal surface (43). Hourglass shaped gold bumps (30) are formed on bonding pads (14, 15, 17). A second major surface (13) of semiconductor die (10) is secured to a thermosonic tool/end-effector (52), and the support substrate (35) is secured to a substrate chuck (48). The hourglass shaped gold bumps (30) are mated with the contact pads ( 46, 47, 44 ) on the support substrate (35). A bond is thermosonically formed between the gold bumps (30) and the contact pads (46, 47, 44).

Abstract: The present invention relates generally to apparatus and methods for making simultaneous electrical connections, and more particularly to making these electrical connections simultaneously using a new bond tip configuration. Various methods and processes are being disclosed to simultaneously make electrical connections between electrical conductor lines or pads. The electrical connection is made by placing an electrically conductive wire across a pair of electrical lines or pads that have to be electrically connected and then by using a special tip, both ends of the electrically conductive wire are simultaneously secured to the two electrically conductive lines or pads.

Abstract: A bonding tool having a round pointed end smaller than the bonding pad for the semiconductor element is urged with a bonding force F.sub.1 and pressed down into the inner lead of a TAB tape such that the bonding tool end and inner lead come in close contact with each other. Then, the bonding force F.sub.1 applied to the tool is reduced to F.sub.2, while at the same time ultrasonic vibration 17 is applied to the tool, thus effecting bonding of the inner lead to the bonding pad with applied heat and pressure. Unlike the prior art, no bump has to be formed on the bonding pad for the semiconductor element or on an end of the inner lead. It is thus possible to simplify the bonding process and also to reduce the cost of bonding. Further, a highly reliable bond can be realized without causing crack or other damage to the pad structure.

Abstract: A method of bonding an end of an aluminum wire to a lead comprises the steps of: forming a plurality of parallel bonding grooves on a surface of the lead; pressing the wire end against the grooved surface of the lead with the wire end held in parallel to the bonding grooves; and applying ultrasonic vibration to the wire end in a direction parallel to the bonding grooves.

Abstract: A wire bonding method and apparatus for welding a wire with at least one end formed with a ball and a pad of a printed wiring board. A bonding head moves downward slowly to crush the ball to form a flat surface, and will move upward once to adjust a relative position of the pad and the ball. The bonding head will move downward again, and an ultrasonic wave is applied to heat the ball and the bonding head so that the ball and the pad are welded. If necessary, a portion of the wire to be bent is moved to a desired position of the wiring board, by a supporting apparatus. A free end of the wire which is not welded is moved by a jig to bend the portion of the wire for routing.

Abstract: A method of electrically connecting a tape automated bonding lead to an aluminum input/output pad of an integrated circuit includes sequentially sputtering an adhesive layer, a diffusion barrier layer and a gold layer on the input/output pad. The adhesive layer is a metallic film having good step coverage and adhesive properties to contact the pad. The diffusion barrier layer is formed atop the adhesive layer and is sandwiched by the gold layer. The method employs "bumpless" techniques and the bond lead is connected to the gold layer by applying a combination of pressure and vibrational energy.

Abstract: A first piece (22) is bonded to a second piece (24) at a selected location (45) by positioning the first piece (22) and second piece (24) between a pair of bonding tools (36 and 38), with the bonding tools at the selected location (45) of the first piece (22) and the second piece (24) where bonding is to be achieved. The selected location (45) of the first piece (22) and the second piece (24) is pressed between the pair of bonding tools (36 and 38) with an applied force (46), the applied force (46) increasing from zero to a prebonding force (64), being maintained at the prebonding force (64) for a prebonding period (66), changing to a bonding force (60), and thereafter decreasing from the bonding force (60) to zero.

Abstract: A method of joining transformer winding conductor cables is disclosed. Initially, the ends of the conductor cables to be joined are cut in a staggered configuration. The staggered ends are then chamfered. The ends are then welded together to form a staggered joint which is of substantially the same thickness as the individual conductor cables.

Abstract: A process for manufacturing devices with improved connections between the pins and the semiconductor material chip which integrates electronic components. In order to allow the integration of signal components and power components in a same device with a reduced use of area for the soldering pads and with high reliability of the connections, the connecting wires are made of different materials. Advantageously, the wires for the power connections are based on aluminum and have large diameters, and the wires for the signal connections are gold-based and have a small diameter. In order to ensure good soldering, the ends of the pins on which the connecting wires are to be soldered are gold-plated.

Abstract: A method of bonding a superconductive ribbon lead to a superconductive bonding pad connected to superconducting circuitry. The thin ribbon is first coated with a fresh layer of the same material from which it is made and then a very thin layer of a noble metal is applied over that fresh layer. The bonding pad is also prepared with a very thin layer of the noble metal. Those coated surfaces are placed in facing contact and ultrasonically bonded.

Abstract: An apparatus and process for attaching a liner to a shell of a magnetic disk cartridge. A cover is provided that covers at least a portion of the liner and shell when in an attachment position. The cover has blow-out holes which are positioned around the periphery of the welding head of a welding device. Pressurized air is introduced into the blow holes so as to lift out any dust located in the vicinity of the half shell. An exhaust hole is provided in the cover for removal of the dust by virtue of a suction device.

Abstract: A method of bonding a superconductive ribbon lead to a superconducting bonding pad connected to superconducting circuitry. The thin ribbon is first coated with a fresh layer of the same material from which it is made and then a very thin layer of a noble metal is applied over that fresh layer. The bonding pad is also prepared with a very thin layer of the noble metal. Those coated surfaces are placed in facing contact and ultrasonically bonded.

Abstract: A method of joining transformer winding conductor cables is disclosed. The ends of the conductor cables to be joined are first chamfered to both clean and taper the respective ends. The tapered ends are then overlapped and pressed together. Vibratory energy is then applied to at least one of the overlapped ends to weld the cleaned conductor cable ends together to form a joint that has substantially the same cross sectional area as the conductor cables themselves.

Abstract: The present invention is characterized in that, in a ball wedge bonding using a fine bonding wire precoated with a thin insulating layer, ultrasonic vibration is applied to a capillary to effect the delivery of the wire smoothly during movement of the capillary to a second bonding point while delivering the wire after ball bonding at a first bonding point.