Abstract: A method of construction of a tungsten carbide/TSP insert for hard facing a wear surface comprises the steps of forming a tungsten carbide body (12) in a mould. After the moulding step, a channel section slot (24) or pocket (24?) is created in the body before it has hardened substantially. The body is then heat-treated to harden it. A TSP body (32) is fitted in the slot/pocket (24/24?) so that it is a close sliding fit between the sides (18) of the slot, and is of the same depth as the slot. The TSP is (preferably) brazed into the slot. The insert has pips (30) on its edges (18) to facilitate welding to a substrate prior to a final brazing step.

Abstract: According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.

Abstract: Disclosed herein is a manufacturing method for a ceramic heater. The manufacturing method includes the step of manufacturing a sintered ceramic substrate using a ceramic material and forming a conductive through hole in the ceramic substrate, the step of screen printing low temperature firing paste on the ceramic substrate, thus forming a heating wire, the step of screen printing Ag paste on the through hole, thus forming an electrode, the step of joining, using heat and pressure, a green sheet to a surface of the ceramic substrate on which the heating wire is formed, the step of firing the joined ceramic substrate and green sheet at low temperature, thus manufacturing a substrate body, and the step of brazing the lead wire to the electrode of the substrate body using filler metal while the lead wire is exposed to atmosphere.

Abstract: A multi-layer seal arrangement includes a dissolution barrier between a braze alloy and a ceramic component. The inventive seal is useful for joining a ceramic component to another ceramic component or a metal component, for example. In one example, the braze comprises a gold alloy and the dissolution barrier comprises a layer of alumina on the order of 2-3 microns thick. A titanium wetting layer is provided between the alumina layer and the alloy. A metallization layer provided between the dissolution barrier and the ceramic component in one example comprises a layer of gold between two thin layers of titanium. In one particular example, a platinum mesh is included with the gold of the braze alloy to control braze flow during the brazing operation.

Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.

Abstract: A terahertz interaction circuit is provided. The terahertz interaction circuit includes a waveguide and an electron beam tunnel. The waveguide has a folded shape and in which an electromagnetic wave propagates. The electron beam tunnel is formed to penetrate through the waveguide. An electron beam passes through the electron beam tunnel. The waveguide includes a ridge portion in which a portion of a surface of the waveguide protrudes into the waveguide.

Abstract: A process for coating metallic surfaces with an anti-corrosive composition that contains a conductive polymer and is a dispersion that contains the at least one conductive polymer mainly or entirely in particulate form, as well as a binder system. The conductive polymer is at least one polymer based on polyphenylene, polyfuran, polyimidazole, polyphenanthrene, polypyrrole, polythiophene and polythiophenylene charged with anti-corrosive mobile anions. Alternatively, the metallic surfaces can be first coated with a dispersion based on conductive polymers in particulate form, then coated with a composition which contains a binder system.

Abstract: A method for manufacturing a high temperature electrolyzer <<HTE>> or a high temperature fuel cell <<SOFC>>, comprising a vertical stack of n elementary planar cells alternating with n+1 interconnection plates, each of the elementary cells consisting of an openworked planar porous anode and an openworked planar porous cathode respectively positioned on each of the faces of a planar dense electrolyte, and brazed joints being made by infiltration of a defined amount of brazing in the electrodes at contact points between the elementary cells and the interconnection plates.

Abstract: Short fibers in a solder or a welding material often do not have the desired strength. Fiber mats that are introduced onto a surface or into a recess of a metallic component are provided. In addition a process for applying material to a metallic component is provided. In the process, a first fiber mat and a second fiber mat are used.

Abstract: A method for manufacturing a thermally-assisted magnetic recording head is provided, in which a light source unit including a light source and a slider including an optical system are bonded. A unit substrate is made of a material transmitting light having a predetermined wavelength, and an adhesion material layer is formed on the light source unit and/or the slider. The manufacturing method includes: aligning the light source unit and the slider in such a way that a light from the light source can enter the optical system and the adhesion material layer is sandwiched therebetween; irradiating the adhesion material layer with a light including the predetermined wavelength through the unit substrate; and bonding them. The adhesion material layer melted by the light including the predetermined wavelength and transmitted through the unit substrate can ensure high alignment accuracy as well as higher bonding strength and less change with time.

Abstract: Apparatus and methods for alkali vapor cells are provided. In one embodiment, a vapor cell for a Chip-Scale Atomic Clocks (CSAC) comprises a silicon wafer having defined within a first chamber, a second chamber, and a pathway connecting the first chamber to the second chamber; a first glass wafer anodically-bonded to a first surface of the silicon wafer; a second glass wafer anodically-bonded to an opposing second surface of the silicon wafer, wherein the first chamber defines an optical path through the vapor cell; and an alkali metal material deposited into the second chamber. The pathway connecting the first chamber to the second chamber is configured with a geometry that is at least partially inhibitive to alkali metal vapor flow.

Abstract: The apparatus and methods of the present disclosure, in a broad aspect, provide methods for bonding or sealing pieces of glass of photovoltaic cell modules. These methods include providing the first piece of glass, providing a second piece of glass, providing a photovoltaic cell between the first piece of glass and second piece of glass, providing an amount of solder to at least one solder contact area disposed on at least one of the first or second pieces of glass, bringing the first and second pieces of glass into contact at the at least one solder contact area, and heating the solder to about the melting point or working point of the solder to provide the first and second pieces of glass with a bond or seal at the at least one solder contact area.

Abstract: A microwave plasma processing apparatus has a microwave antenna in which a wavelength-shortening plate and a cooling portion of a cooling jacket are arranged adjacent to each other

Abstract: A method for making thermally conductive high aspect ratio large area contact between devices while reducing the heating of the devices. The method of the invention includes the use of reactive foils to solder two devices together at room temperature while imparting significantly less temperature rise and resultant residual stress in the bulk devices when compared with conventional reflow solder techniques.

Abstract: The invention is a method for permanent connection of two components by soldering employing a glass or metal solder as the solder material. A layer system providing adhesion is applied to both components, between which the solder material is introduced. the layer system is heated to a soldering temperature characteristic for the solder material and results in a permanent solder connection between both components after cooling. The layer system providing adhesion has an adhesive layer applicable directly to the component and a solderable layer. The adhesive layer, if a glass solder is used, contains oxidic, carbidic, or nitridic components or mixed compounds thereof and, if a metal solder is used, the adhesive layer contains carbidic or nitridic components or mixed compounds thereof.

Abstract: A method of joining at least two parts includes steps of dispersing a joining material comprising a multi-phase nanocrystalline magnetic metal-aluminum powder at an interface between the at least two parts to be joined and applying an alternating magnetic field (AMF). The AMF has a magnetic field strength and frequency suitable for inducing magnetic hysteresis losses in the metal-aluminum powder and is applied for a period that raises temperature of the metal-aluminum powder to an exothermic transformation temperature. At the exothermic transformation temperature, the metal-aluminum powder melts and resolidifies as a metal aluminide solid having a non-magnetic configuration.

Abstract: Polycrystalline ultra-hard compact constructions comprise a polycrystalline ultra-hard compact having a polycrystalline ultra-hard body attached to a substrate. A support member is attached to the compact by a braze material. The support member can have a one-piece construction including one or more support sections. The support member has a first section extending axially along a wall surface of the compact, and extending circumferentially along a portion of the compact. The support member can include a second section extending radially along a backside surface of the compact, and/or a third section extending radially along a front side surface of the compact. In one embodiment, the support member includes a second and/or third section and the compact disposed therein is in an axially compressed state. The support member is interposed between the compact and an end-use device.

Abstract: Broadly speaking, disclosed is a carrier assembly for an optical device, the carrier assembly comprising in combination: a glass substrate with an optical die thereon; and a silicon carrier attached to the glass carrier. During manufacture, a number of optical dies can be attached on the glass substrate using self-alignment of AuSn solder bumps using gaseous flux at about 300 deg C. The glass carrier can be mounted to the silicon carrier to form an optical device carrier assembly comprising micromechanical guide holes to facilitate a optical fiber connection, using self-alignment of SnAg solder bumps using gaseous flux at about 250 deg C. Each individual optical device can be tested at a wafer scale. The resulting optical device assembly can be diced to form individual optical devices having a carrier assembly that exhibits the traits of both a silicon carrier and a glass carrier.

Abstract: The present invention provides an imaging lens unit configured to be processed by the solder reflow process, can be miniaturized, and has sufficient thermal resistance for the reflow temperatures. The imaging lens unit also provides excellent optical characteristics such as transmissivity, a refractive index, and the like without deteriorating the optical characteristics in alignment of the centers of the lens and the diaphragm even after the reflow process, so as to contribute to reduction in the size and an increase in the capabilities. The imaging lens unit is configured to be processed by a solder reflow process, and includes a lens group consisting of one or more lenses; and a lens tube that supports the lens group, wherein the imaging lens unit comprises one or more cationically-cured epoxy resin lenses formed from an cationically-curable epoxy resin material, the lens tube is formed from a thermoplastic resin material having a deflection temperature under load of not lower than 200° C.

Abstract: Systems and methods for bonding ceramic materials are disclosed herein. In various embodiments, a process is provided comprising the steps of disposing a bonding material at least partially adjacent to a surface of a first silicon carbide component and at least partially adjacent to a surface of a second silicon carbide component, and bonding said first silicon carbide component to said second silicon carbide component by heating, wherein said bonding material comprises vanadium or titanium.

Abstract: A joined body includes a first ceramic member, a second ceramic member, and a joining layer which contains soft metal, and joins the first ceramic member and the second ceramic member to each other by being thermally compressed at a joining temperature lower than a solidus of the soft metal.

Abstract: Method for producing a vacuum measuring cell having a pressure transducer diaphragm with housing plates sealed on opposite sides to form reference and measuring vacuum chambers. An opening in one plate communicates with the measuring vacuum chamber and has a sealed connection for joining to medium to be measured. The diaphragm and plates are aluminum oxide ceramic and at least one of the seals is aluminum with a thickness of 0.5 ?m to 30 ?m. The ceramic parts are pressed together at increased temperature of 600° C. to 680° C. in a process gas atmosphere including a reducing gas, during a time of 30 to 90 minutes, and subsequently a tempering step is carried out in a second process gas atmosphere including oxygen, tempering taking place at a temperature of 450° C. to 575° C. such that the metallic aluminum is oxidized into aluminum oxide.

Abstract: A simple method is provided for protecting slider mounted read/write transducers from electrostatic discharge damage during the manufacture of disk drives. The method involves placing a ball of conducting thermoplastic resin, such as a gold or silver epoxy, between the terminal pads of the transducer and using the ball to shunt the pads to read-head shields and the slider substrate and thence to ground. The epoxy ball is easily applied and easily removed and can be used at different stages in the manufacturing process.

Abstract: A method for manufacturing a power module substrate, includes: preparing a ceramics substrate and a metal plate made of pure aluminum; a fusion step in which the ceramics substrate and the metal plate are stacked in layers with a brazing filler metal interposed therebetween, and a fused aluminum layer is formed at an interface between the ceramics substrate and the metal plate by fusing the brazing filler metal which is caused by heating; and a solidifying step in which the fused aluminum layer is solidified by cooling, and a crystal is grown so as to be arranged in a crystal orientation of the metal plate when the fused aluminum layer is solidified.

Abstract: The invention is a method for permanent connection of two components by soldering employing a glass or metal solder as the solder material. A layer system providing adhesion is applied to both components, between which the solder material is introduced. the layer system is heated to a soldering temperature characteristic for the solder material and results in a permanent solder connection between both components after cooling. The layer system providing adhesion has an adhesive layer applicable directly to the component and a solderable layer. The adhesive layer, if a glass solder is used, contains oxidic, carbidic, or nitridic components or mixed compounds thereof and, if a metal solder is used, the adhesive layer contains carbidic or nitridic components or mixed compounds thereof.

Abstract: The x-ray target assemblies have an oxide dispersion strengthened (ODS) refractory metal alloy substrate that is bonded to a carbon-containing heat sink. The x-ray target assemblies have excellent bonding between the substrate and the heat sink. The improved bonding is achieved by placing an oxide-free barrier layer between the ODS metal substrate and the heat sink. The oxide-free barrier layer minimizes or eliminates chemical reactions that would otherwise be possible between the dispersed oxides and the carbon-based heat sink during the manufacturing process. Preventing these undesired reactions while manufacturing the x-ray target assembly yields a device with improved bonding between the heat sink and the substrate, compared to devices manufactured without the barrier layer.

Abstract: In one aspect of the invention, an attack tool is disclosed which has a wear-resistant base suitable for attachment to a driving mechanism, a first cemented metal carbide segment brazed to the base at a first interface, and a second metal carbide segment brazed to the first carbide segment at a second interface opposite the base.

Abstract: A method for joining two ceramic parts, or a ceramic part and a metal part, and the joint formed thereby. The method provides two or more parts, a braze consisting of a mixture of copper oxide and silver, a diffusion barrier, and then heats the braze for a time and at a temperature sufficient to form the braze into a bond holding the two or more parts together. The diffusion barrier is an oxidizable metal that forms either a homogeneous component of the braze, a heterogeneous component of the braze, a separate layer bordering the braze, or combinations thereof. The oxidizable metal is selected from the group Al, Mg, Cr, Si, Ni, Co, Mn, Ti, Zr, Hf, Pt, Pd, Au, lanthanides, and combinations thereof.

Abstract: A composite body which can withstand high thermal stresses is formed by high-temperature soldering at least a part of a high-temperature-resistant, metallic or nonmetallic component and at least a part of a high-temperature-resistant, nonmetallic component. Prior to soldering, a metallic barrier layer, which is impervious to the solder melt, of one or more elements selected from the group consisting of V, Nb, Ta, Cr, Mo, W, Ti, Zr, Hf and alloys thereof, is deposited on that surface of each nonmetallic component which is to be soldered. Solder material, barrier layer and soldering conditions are adapted to one another in such a manner that during the soldering operation the metallic barrier layer remains at least partially in the solid state, so that after the soldering operation it is still present in a thickness of at least 10 ?m at least over the majority of the soldering surface.

Abstract: A method for bonding two materials uses radio frequency energy to swiftly induce heat in a high permeability material for heating a medium to the bonding temperature of the medium so as to bond the two materials with each other.

Abstract: The invention relates to a method of manufacturing conductive inter-layer connections in a microsystem built by a patterned stack of flexible foils (10). Conductive inter-layer connections (210, 300, 400) made of solder material, sputtered or evaporated material or by means of carbonization of plastic material building the isolating layer (30) of the flexible foils (10) are formed to connect patterned conductive layers (40, 50) separated by means of at least one isolating layer (30) in a conductive way in order to interconnect different parts of the microsystem in an easy way.

Abstract: A lead-free metal solder material capable of realizing excellent bonding strength and hermetic sealing is provided. The solder alloy is a solder alloy for bonding to an oxide, and includes 2.0-15.0 mass % of Ag, more than 0.1-6.0 mass % of Al, and the remainder is composed of Sn and some inevitable impurities. The content of Al is preferably 0.3-3.0 mass %, and more preferably 0.5-3.0 mass %. The content of Ag is preferably 3.0-13.0 mass %, more preferably more than 5.0-12.0 mass %, and most preferably 6.0-10.0 mass %. A relation between Ag and Al that fits the inequality 0<[(% Ag)?(% Al)×7.8]<10 is desirable. The solder alloy for bonding to an oxide of the present invention is used for bonding between glasses, for instance, and has excellent effects.

Abstract: A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad onto the printed wiring board, placing the semiconductor component with the thin film onto the printed wiring board, and positioning the thin film adjacent the solder pad.

Abstract: An embedded sensor or other desired device is provided within a completed structure through a solid-state bonding process (e.g., by diffusion bonding) and/or through a dynamic bonding process (e.g., by brazing). The embedded sensor or other desired device is provided on a substrate through any know or later-developed method (e.g., a photolithography or conductive ink printing process). A cover is then bonded to the substrate using a solid-state bonding process and/or a dynamic bonding process. The solid-state bonding process and/or dynamic bonding process may include providing heat and/or pressure to the substrate, the cover and/or a bonding agent (e.g., a filler metal or alloy) to bond the substrate and the cover together.

Abstract: Process for the assembly of at least two articles made of silicon carbide-based materials by moderately refractory non-reactive brazing, in which the articles are placed in contact with a non-reactive brazing composition, and the assembly formed by the articles and the brazing composition is heated to a brazing temperature that is sufficient to melt the brazing composition in order to form a refractory joint, in which the non-reactive brazing composition is a binary alloy formed, as mass percentages, from 56% to 70% silicon and 44% to 30% yttrium.

Abstract: A method is provided for connecting components particularly in the field of aerospace wherein a first component is connected to a second component, comprising the following steps: arranging at least one nano- or microstructured material between the first and the second component, initiating an exothermic reaction of the nano- or microstructured material for connecting both components with each other.

Abstract: A cutting tip for a drilling tool includes a cemented carbide cutting base, a diamond element supported by the cutting base, and a bonding layer formed between the cutting base and the diamond element in order to bond them. The bonding layer includes diffusion layers and in which one or two or more metals selected from a group consisting of Fe, Ni, Co, Ti, Zr, W, V, Nb, Ta, Cr, Mo, and Hf diffuses into at least one of the diamond or the cement carbide.

Abstract: Polycrystalline ultra-hard compact constructions comprise a polycrystalline ultra-hard compact having a polycrystalline ultra-hard body attached to a substrate. A support member is attached to the compact by a braze material. The support member can have a one-piece construction including one or more support sections. The support member has a first section extending axially along a wall surface of the compact, and extending circumferentially along a portion of the compact. The support member can include a second section extending radially along a backside surface of the compact, and/or a third section extending radially along a front side surface of the compact. In one embodiment, the support member includes a second and/or third section and the compact disposed therein is in an axially compressed state. The support member is interposed between the compact and an end-use device, and improves the compact attachment strength to an end-use device when compared to conventional compacts.

Abstract: A bonding member, which can achieve a sufficient degree of vacuum without forming a gap caused by air bubbles that have been released out through the surface of the bonding member, a bonding method, an image display apparatus, and a manufacturing method therefor. The bonding member 92 of a strip has a first portion 92a and a second portion 92b. The first portion 92a has a uniform thickness t1. The second portion 92b has a smaller thickness t2 than the thickness t1 of the first portion 92a and constitutes a side plane of the bonding member 92. The second portion 92b also has a shape such that a convexity and a concavity alternate along a longitudinal direction of the bonding member 92.

Abstract: A transparent pane, in particular a glass pane, having at least one electroconducting, non-transparent contact surface placed on one of its surfaces, to connect it by soldering to a connection piece. In the region of the soldering location, the contact surface has at least one cutout via which the soldering filler metal is visible through the pane after the connection piece has been soldered to the contact surface. Such a configuration allows reliable visual verification of the soldering locations, even in cases in which the soldering location is incorporated within a composite glazing panel and has been soldered, if necessary by induction heating.

Abstract: An electrical structure method of forming. The method includes forming a plurality of individual metallic structures from metallic layer formed over a first substrate. A plurality of vias are formed within a second substrate. The plurality of vias are positioned over and surrounding the plurality of metallic structures. A portion of each via is filled with solder to form solder structure surrounding an exterior surface of each metallic structure. The first substrate is removed from the metallic structures. The metallic structures comprising the solder structures are positioned over a third substrate comprising a plurality of electrically conductive pads. The metallic structures comprising the solder structures are heated to a temperature sufficient to cause the solder to melt and form an electrical and mechanical connection between each metallic structure and an associated electrically conductive pad. The second substrate is removed from the individual metallic structures.

Abstract: In a ceramic circuit board 1 prepared by integrally joining a circuit layer 4 composed of a clad member including a circuit plate 2 made of an Al plate and an Al—Si brazing material layer 3 to a ceramic substrate 6, a surface of the clad member adjacent to the Al—Si brazing material layer 3 is joined to the ceramic substrate 6 with an Al alloy film 5 therebetween, the Al alloy film 5 having a thickness of less than 1 ?m and being provided on the surface of the ceramic substrate 6. According to this structure, a ceramic circuit board in which the generation of voids in the joint interface can be effectively suppressed, the joint strength of the metal member serving as the circuit layer can be increased, and the heat resistance cycle characteristics can be drastically improved, and a method for producing the same can be provided.

Abstract: A method for producing a brazed joint having at least one of a metal/ceramic joint and a ceramic/ceramic joint. The method includes forming bores in at least one ceramic surface to be brazed, and the bores have an average diameter of greater than 550 ?m. The instant abstract is neither intended to define the invention disclosed in this specification nor intended to limit the scope of the invention in any way.

Abstract: (a) A first Sn absorption layer (5) is formed on the principal surface of a first substrate (1), the first Sn absorption layer being made of metal absorbing Sn from AuSn alloy and lowering a relative proportion of Sn in the AuSn alloy. (b) A second Sn absorption layer (17) is formed on the principal surface of a second substrate (11) the second Sn absorption layer being made of metal absorbing Sn from AuSn alloy and lowering a relative proportion of Sn in the AuSn alloy. (c) A solder layer (7) made of AuSn alloy is formed at least on one Sn absorption layer of the first and second Sn absorption layers. (d) The first and second substrates are bonded together by melting the solder layer in a state that the first and second substrates are in contact with each other, with the principal surfaces of the first and second substrates facing each other.

Abstract: An assembly between a metal piece and a ceramic material piece made of SiC and/or C based ceramic material. The assembly includes a stack structure including the following elements assembled together in pairs in this order, by brazing: the metal piece; a first intermediate piece; a second intermediate piece; and the ceramic material piece. The second intermediate piece is made of another ceramic material, that is chemically less reactive relative to metals than are SiC or C, and that presents a coefficient of expansion smaller than that of the material constituting the metal piece. The first intermediate piece is made of metal and can deform to compensate for expansion difference between the metal piece and the second intermediate piece. The assembly can be used in a turbomachine.

Abstract: A first electronic component, e.g., a semiconductor die and a second electronic component, e.g., a substrate, each with a main surface, are bonded to each other by applying at least one metal layer comprising an indium layer on each of the main surfaces. Then the semiconductor die and the substrate are aligned against each other with their main surfaces facing each other. The die and substrate with the metal layers in between form an arrangement, which is introduced into a compression means. Afterwards the arrangement is compressed in the compression means at a pressure in a range of 10 to 35 MPa, and heat in a range of 230 to 275° C. is applied to the arrangement, by which temperature and pressure the electronic components are bonded to each other. The compression process is performable in oxygeneous gas atmosphere inside the compression means.

Abstract: In order to produce a seal arrangement for a fuel cell stack which comprises a plurality of fuel cell units that succeed one another in a stack direction wherein each of the fuel cell units comprises a housing incorporating at least one housing part consisting of a metallic material such that it exhibits an adequate electrically insulating effect and adequate mechanical rigidity even at a high operating temperature of the fuel cell stack, it is proposed that the seal arrangement comprises at least one housing part of a first fuel cell unit consisting of a metallic material which is provided with a coating of a ceramic material, wherein the housing part of the first fuel cell unit is brazed to a housing part of a second fuel cell unit by means of a metallic braze at least one position that is provided with the ceramic coating.

Abstract: The invention relates to a method of brazing together two parts (10, 20), the method being characterized in that a pad (30) is interposed between the two surfaces (S10, S20) of the parts that are to be joined together, said pad being formed by a refractory fiber texture, and being at least in part in contact with a brazing composition (40), and heat treatment is performed to liquefy the brazing composition (40) so as to cause the molten brazing composition to be distributed by capillarity over the entire brazing area between the two parts (10, 20) covered by the pad (30).

Abstract: A heat pipe housing assembly (22) includes a pair of silicon housing pieces (24, 26) and a bond joint (42) between the housings (24, 26), with the bond joint (42) preferably including a eutectic layer (43).

Abstract: An electrode assembly for a plasma reactor, such as a plasma etch or plasma-enhanced chemical vapor deposition reactor, comprises an electrode plate having a support frame attached to one surface thereof. The electrode plate is composed of a substantially pure material which is compatible with a particular reaction being performed in the reactor, while the support frame is composed of a material having desirable thermal, electrical, and structural characteristics. The support frame is bonded to the electrode plate using a bonding layer, usually a ductile metallic bonding layer, which provides effective thermal and electrical coupling while permitting a degree of thermal expansion mismatch between the support frame and the electrode plate.