Abstract: Apparatus and associated methods relate to a unitary ring gear-flange body (URGFB). In an illustrative example, the flange body may be spin-formed and may, for example, include a riser body extending substantially parallel to a longitudinal axis and a flange extending substantially radially outward from the riser body. To the riser body may, for example, be welded a ring gear to form a unitary assembly, the ring gear having an axis of revolution aligned with the longitudinal axis. A continuous coating may, for example, be applied to at least a selected portion of a surface of the unitary assembly. Various embodiments may advantageously provide a cost-efficient, weight-efficient, and/or time-efficient unitary body which may, for example, be coupled to machinery to provide a shaftless torque-transmitter.

Abstract: A semiconductor chip (6) having flexibility is bonded to a heat radiation material (4) with solder. The semiconductor chip (6) is pressed by a tip of a pressing member (9,11) from an upper side. As a result, convex warpage of the semiconductor chip (6) can be suppressed. Furthermore, since voids can be prevented from remaining in the solder (7), the heat radiation of the semiconductor device can be enhanced.

Abstract: A method for edge-to-edge welding of a first sheet metal panel to a second sheet metal panel on a bearing structure. The method comprises positioning and fixing the first panel to the bearing structure, positioning and fixing the second panel to the bearing structure with the second panel overlapping a raw edge of the first panel, jointly cutting the first panel and the second panel in the overlap area to form a connection edge of the first panel and a connection edge of the second panel, withdrawing scrap cuttings from the first panel and scrap cuttings from the second panel, and friction stir welding the connection edges.

Abstract: Methods and systems for sequentially laser welding terminal tabs of a battery cell to corresponding terminal tabs of a busbar are described using a single laser position and path. The terminal tabs of a battery cell are aligned in contact with terminal tabs of a busbar. A laser welder, from a first position, generates a laser weld beam at a first diameter welding the first terminal tab of the battery cell to the first terminal tab of the busbar. Next, the laser weld beam is narrowed, reducing the first diameter to a smaller second diameter. Without moving the laser welder from the first position, the narrowed laser weld beam burns a hole through the welded first set of terminal tabs, traverses a gap toward a second set of terminal tabs behind the first set and welds the second set together.

Abstract: A winding system may include a plurality of metal plates including the same shape and size, such that the plates are stacked, and each of the plurality of metal plates is reversely positioned with respect to a gap pattern in an adjacent one of the plurality of metal plates. The plates are simultaneously brazed together while flow of molten brazing material is constrained by grooves formed on brazing tabs of the plates.

Abstract: A semiconductor module includes: a semiconductor element; a wiring substrate on which the semiconductor element is mounted; a heat dissipation substrate; a first metal material that bonds the wiring substrate and the heat dissipation substrate; and a second metal material that bonds the wiring substrate and the heat dissipation substrate and has a different melting point from the first metal material. Each of the following is at least partially bonded: the first metal material and the wiring substrate, the first metal material and the heat dissipation substrate, the second metal material and the wiring substrate, the second metal material and the heat dissipation substrate, and the first metal material and the second metal material. Each of the following is bonded by alloying: the first metal material and the wiring substrate, the first metal material and the heat dissipation substrate, and the first metal material and the second metal material.

Abstract: A hybrid preform component including a plurality of elongated metallic cores and a coating paste is provided. The coating paste envelops the plurality of elongated metallic cores. The coating paste includes a first material having a first melting point, a second material having a second melting point, and a binder. A method for treating a component is also provided. The method includes the step of mixing a second material, a first material, and a binder to make coating paste. The method further includes the step of coating the plurality of cores using the coating paste to form a coated rod assembly. The method further includes the step of compressing the coated rod assembly to envelop the coating paste to the plurality of cores and form a preform component having a near net shape. The method further includes the step of sintering the preform component to form a pre-sintered preform.

Abstract: The disclosure provides an LED display device including a substrate, at least one first bonding pad and at least one second bonding pad, at least one spacer, at least one LED, and a conductive paste layer. The first and the second bonding pads are disposed on the substrate. The spacer is located between the first and the second bonding pads, wherein a height of the spacer is P ?m. The LED is disposed on the substrate and includes a first electrode and a second electrode. The first and the second electrodes have a height H ?m. The conductive paste layer is located between the substrate and the LED and includes a plurality of conductive particles. The first and the second electrodes are respectively electrically connected to the first and the second bonding pads through the conductive particles, and H+3.5 ?m?P ?m?H+0.48 ?m.

Abstract: An apparatus for eutectic bonding includes (a) a bonding frame that includes two substrates and (b) a frame device situated on the substrates, the frame device including two frames, the apparatus being usable to develop a eutectic, formed during bonding, in a spatially defined manner, whereby a volume formed by the frames and the substrates can be filled up completely with the eutectic.

Abstract: A three-dimensional nano-structure array includes a substrate and a number of three-dimensional nano-structures. Each three-dimensional nano-structure has a first peak and a second peak aligned side by side. A first groove is defined between the first peak and the second peak. A second groove is defined between the two adjacent three-dimensional nano-structures. A depth of the first groove is lower than that of the second groove.

Abstract: Provided are methods of forming a bump and a semiconductor device with the same. The method may include providing a substrate with pads, forming a bump maker layer to cover the pads and include a resin and solder particles, thermally treating the bump maker layer to aggregate the solder particles onto the pads, removing the resin to expose the aggregated solder particles, forming a resin layer to cover the aggregated solder particles, and reflowing the aggregated solder particles to form bumps on the pads.

Abstract: Method of assembly of a first element (I) and a second element (II) each having an assembly surface, at least one of the assembly surfaces comprising recessed metal portions (6, 106) surrounded by dielectric materials (4, 104) comprising: A) a step to bring the two assembly surfaces into contact without application of pressure such that direct bonding is obtained between the assembly surfaces, said first and second assemblies (I, II) forming a stack with a given thickness (e), B) a heat treatment step of said stack during which the back faces (10, 110) of the first (I) and the second (II) elements are held in position so that they are held at a fixed distance (E) between the given stack thickness+/?2 nm.

Abstract: A method for attaching a head to a drive shaft may include winding a wire to create a drive shaft, selecting a head, forming a tapered tip on a distal end of the drive shaft, placing the head on the tapered tip such that a distal end of the tapered tip extends from a distal end of the head, engaging the distal end of the tapered tip and turning down the drive shaft to create a turned down portion, advancing the head proximally over the turned down portion, and disengaging the distal end of the tapered tip wherein the drive shaft frictionally engages the head.

Abstract: A method of fabricating a near-net shape erosion shield, a method of forming a shielded article, and a near-net shape erosion shield are provided. The method of fabricating a near-net shape erosion shield includes providing a base, positioning an energy source relative to the base, and depositing at least one wear resistant material over the base with an energy beam from the energy source. The at least one wear resistant material deposited on the base forms the near-net shape erosion shield configured to be positioned on a turbine component. The method of forming a shielded article includes removing the base from the near-net shape erosion shield, and securing the near-net shape erosion shield to a turbine component. The near-net shape erosion shield includes a near-net shape erosion-resistant portion configured to be positioned on a turbine component.

Abstract: A method for joining metal materials, which joins a first member with at least a joining face made of Metal A, the Metal A being mainly composed of at least one selected from the group consisting of Al, Cu, Ag and Au, to a second member with at least a joining face made of Metal B, the Metal B being mainly composed of at least one selected from the group consisting of Al Cu, Ag and Au, includes interposing an insert between the joining faces of the first and second members, wherein the insert contains Zn as a metal capable of causing an eutectic reaction with at least one metal except for Au in Metal A as well as at least one metal except for Au in Metal B.

Abstract: A train rail track structure system includes a c-face down steel channel cross tie defining a plurality of holes in a top wider web surface thereof and a protrusion with perpendicular faces extending from an underside of the top surface, the holes configured to pass a fixative and solidifying mixture into a ballast bed there beneath. The protrusion anchors the steel channel cross tie in the fixative and solidifying mixture and the ballast bed. The disclosed system also includes a c-face down steel channel connecting link defining a receptacle for at least one intermediate rail support member in a top wider web surface thereof. The link also defines tabs and notches proximal to both longitudinal ends of the steel channel connecting link configured to interleave with at least one steel channel cross tie and interlock the steel channel connecting link to the steel channel cross tie.

Abstract: A method for connecting functional elements (14) to a shaft (10, having the following steps: (a) forming elevations (12) for receiving the functional elements (14), said elevations (12) being machined out of the shaft (10) by removing material, and (b) welding the functional elements (14) to the elevations (12) on the shaft (10).

Abstract: A thermocompression bonding structure includes a first member and a second member having a linear expansion coefficient different from that of the first member; and metal fine particles interposed between the first and second members as a bonding material to thermocompression bond the two members. The two members are disposed to apply thermal stress generating between the first member and the second member as pressurizing force on a bonding surface between the two members, and to increase temperature to thermocompression bond the first member and the second member.

Abstract: A method for producing a metal sheet with a welded-on tube which has at least partially curved sections, wherein the tube is guided by at least one guide element onto the sheet, is pressed thereon with at least one pressure element and is welded thereto at least at some points and wherein the tube is bent to form the curved sections. In order to achieve the welding-on in a simple manner even in the curved sections, it is provided that a bending is carried out in a plurality of discrete steps, wherein in individual steps firstly the tube with the at least one guide element is bent around a last created welding point and thereafter a new welding point is created. Furthermore, the invention relates to a device for carrying out the method.

Abstract: A process for producing a diffusion barrier or blocking layer includes providing aluminum oxide on a metal sheet formed of a base material including at least iron, chromium and aluminum. A process for producing an exhaust gas treatment unit includes providing a honeycomb body and a housing in which at least one of the honeycomb body or the housing is formed of the metal sheet and the metal sheet is formed of a base material including at least iron, chromium and aluminum. The metal sheet thus includes, at least in a subregion, a surface layer including at least aluminum oxide and a metal from the group including cobalt and nickel. An exhaust gas treatment unit and a motor vehicle are also provided.

Abstract: A method of processing an alloy workpiece to reduce thermal cracking may comprise spraying a metallic coating material onto at least a portion of a surface of the alloy workpiece to form a surface coating metallurgically bonded to the alloy workpiece. The surface coating may be more ductile than the alloy workpiece and reduces heat loss from the alloy workpiece.

Abstract: The present invention relates to an assembly structure with filter device and printed circuit board and a welding method for making the same. The welding method is firstly make the metal lines of at least one filter devices be disposed in the metal notches formed on at least one edges of the printed circuit board, and then respectively remove the insulation layers covering the metal lines; therefore, the welding metal lines can be respectively welded with the metal notches after the metal lines and the metal notches are treated with a dip soldering process. Thus, the welding process of the filter device and the printed circuit board can be carried out on the edges of the printed circuit board by simple process procedures; moreover, the fabrication yield of the assembly structure can be effectively increased, and the manufacturing time and cost of the assembly structure can be simultaneously reduced.

Abstract: Disclosed are sintered silver bonded electronic package subcomponents and methods for making the same. Embodiments of the sintered silver bonded EPSs include topography modification of one or more metal surfaces of semiconductor devices bonded together by the sintered silver joint. The sintered silver bonded EPSs include a first semiconductor device having a first metal surface, the first metal surface having a modified topography that has been chemically etched, grit blasted, uniaxial ground and/or grid sliced connected to a second semiconductor device which may also include a first metal surface with a modified topography, a silver plating layer on the first metal surface of the first semiconductor device and a silver plating layer on the first metal surface of the second semiconductor device and a sintered silver joint between the silver plating layers of the first and second semiconductor devices which bonds the first semiconductor device to the second semiconductor device.

Abstract: A firearm silencer includes a first cylindrical body section formed as a single unit having a first inner bore and a receiving end having a first axial bore, and a second cylindrical body section formed as a single unit having a second inner bore and a discharge end having a second axial bore. The first cylindrical body section is joined to the second cylindrical body section to form a cylindrical body. A plurality of baffles disposed within the cylindrical body, each baffle having a baffle axial bore.

Abstract: An electronic part mounting substrate includes: a metal plate 10 (for mounting thereon electronic parts) of aluminum or an aluminum alloy having a substantially rectangular planar shape, one major surface of the metal plate 10 being surface-processed so as to have a surface roughness of not less than 0.2 micrometers; a plating film 20 of nickel or a nickel alloy formed on the one major surface of the metal plate 10; an electronic part 14 bonded to the plating film 20 by a silver bonding layer 12 (containing a sintered body of silver); a ceramic substrate having a substantially rectangular planar shape, one major surface of the ceramic substrate 16 being bonded to the other major surface of the metal plate 10; and a radiating metal plate (metal base plate) 18 bonded to the other major surface of the ceramic substrate 16.

Abstract: A valve body assembly for use in an automotive transmission is provided. The valve body assembly includes a first valve body part formed of powdered metal and a second valve body part formed of powdered metal. The first valve body part is attached to the second valve body part by a brazed joint. A method of forming a valve body assembly is also provided. The method includes forming a first valve body part from powdered metal, forming a second valve body part from powdered metal, and sinter brazing the first and second valve body parts together to form a brazed joint between the first and second valve body parts.

Abstract: A process for manufacturing a metal part reinforced with ceramic fibers including machining at least one housing for an insert in a metal body having an upper face. At least one insert formed from ceramic fibers in a metal matrix is placed in the housing. The insert is covered with a cover. A vacuum is created in the interstitial space around the insert and the interstitial space is hermetically sealed under vacuum. The assembly, namely the metal body with the cover, is treated by hot isostatic pressure. The treated assembly is machined in order to obtain the part. The cover includes an element covering the insert in the slot and projecting from the upper face, and a sheet covering the upper face with said element. In particular, the insert is straight and the housing for the insert in the metal body forms a straight slot.

Abstract: A feed-through element of an ignition device for igniters of airbags or seatbelt tighteners is provided. The feed-through element has a metal support body, at least one first access opening in which a metal rod is arranged in an electrically insulating fixing material, and at least one second access opening in which a further metal rod is electrically conductively fixed to the support body by a soldered connection in this access opening. The support body and the access openings are configured as a shaped part. The feed-through element further includes a solder gap between the metal rod and the wall of the second access opening, where the solder gap has a small width.

Abstract: An axle housing and a method of manufacture. The axle housing may include first and second housings that have spindle portions that cooperate to define at least one spindle that may be configured to rotatably support a wheel assembly.

Abstract: A magnetic path forming member is formed by heating a radially intermediate portion of a workpiece made of a magnetic material to melt the radially intermediate portion from one axial face of the workpiece to the other axial face of the workpiece to form a keyhole, and disposing an alloy element in a molten pool around the keyhole to demagnetize a melted portion.

Abstract: A turbine component and a process of fabricating a component are disclosed. The process includes excavating a base metal of the component to form a fill region and filling the fill region with a filler metal. The filler metal has a filler metal elongation that is at least 25% greater than a base metal elongation of the base metal. The filler includes, by weight, between about 4% and about 7% iron, between about 14% and about 17% chromium, between about 15% and about 17% molybdenum, between about 3% and about 5% tungsten, up to about 0.02% carbon, up to about 1% manganese, up to about 2.5% cobalt, and a balance of nickel and/or the filler metal elongation is greater than about 35% in/in per two inches.

Abstract: A method for connecting a plurality of solar cells and an improved interconnect is disclosed. The method includes aligning an interconnect to a plurality of solar cells having solder pads, where the interconnect has a main body and tabs extending therefrom, and where each of the tabs has a downward depression, such that the tabs are positioned above the solder pads in between solar cells and pinning the interconnect against a work surface by pressing a hold down pin against the main body of the interconnect such that a lower surface of the interconnect tabs are maintained parallel to an upper surfaces of the solder pads, and such that the depression of each of the tabs flatly contacts the solder pads. The method can also include cantilevered tabs extending downwardly from the main body providing a controlled spring force between the tab lower surface and the solder pad upper surface.

Abstract: Power generation and transmission components and methods of manufacture are described in which a component is custom designed and produced in discrete layers using computer numerical controlled machining. The design is separated into layers, and the layers are individually machined to impart design features. The layers are then prepared for, and undergo a brazing process in order to build a functionally unitary mechanical component. Components according to the invention include, but are not limited to, engine blocks, cylinder heads, transmission housings, centrifugal pump housings, cylinder blocks, monoblocs (engines in which the cylinder block and cylinder head are formed as one unit), engine crank cases, automotive power train housings and many other large unit or unitary structure components. A commercial method of producing custom components is also described.

Abstract: A hard-faced composite article includes an iron-based substrate having a composition with less than 0.6% by weight of carbon, and a wear-resistance element joined to the iron-based substrate. The wear-resistance element has a metallic matrix and boron-containing regions dispersed through the metallic matrix.

Abstract: Electronic devices may be provided with antenna structures. The antenna structures may include an antenna support structure covered with patterned antenna traces. An antenna support structure may be mounted in an electronic device so that a surface of the antenna support structure that is covered with patterned antenna traces lies flush with a planar surface of the electronic device housing. A display cover layer or other planar structure may be attached to the surface of the antenna support structure and the planar surface of the housing adhesive. Injection molding and extrusion techniques may be used in forming a support structure with elongated parallel cavities. An injection molding tool may have a mold core supported by a support structure at one end, supporting engagement features at the ends of mating mold core structures, or support pins. Molded interconnect devices may be soldered to laser direct structuring components to form antennas.

Abstract: Copper metal or metal alloy workpieces and/or aluminum metal or metal alloy workpieces are joined in a solid state weld by use of a reactive material placed, in a suitable form, at the joining surfaces. Joining surfaces of the workpieces are pressed against the interposed reactive material and heated. The reactive material alloys or reacts with the workpiece surfaces consuming some of the surface material in forming a liquid-containing reaction product comprising a low melting liquid that removes oxide films and other surface impediments to a welded bond across the interface. Further pressure is applied to expel the reaction product and to join the workpiece surfaces in a solid state weld bond.

Abstract: A first metal such as germanium is prepared for metal-to-metal bonding by depositing the first metal onto a roughened foundation layer so that asperities are present on the first metal layer substantially following the topology of the asperities on the surface of the foundation layer without having to process the surface of the first metal layer. Such asperities can break through barrier layer(s) on the surface of another metal (e.g., an oxide layer, an anti-stiction coating, and/or other barrier layer) during a bonding process so that direct metal-to-metal bonding can be accomplished without having to remove the barrier layer(s) and without having to process the surface of the first metal such as by photolithography or depositing and subsequently removing a material that partially interdiffuses with the first metal.

Abstract: A universal bell housing which may be adapted to a variety of automotive engine and transmission combinations and method of making the same is disclosed. The bell housing is made by spin forming a sheet of steel and welding a transmission plate onto the cone. The cone and transmission plate are indexed to mount to a specified engine-transmission combination.

Abstract: A method of manufacturing an electronic apparatus including a first and a second components, includes: forming a first solder bump on one of the first component and the second component; forming a second solder bump on the other one of the first component and the second component; bringing the first solder bump into contact with the second solder bump at a temperature higher than the liquidus temperature of any of the first and the second solder bumps such that the first and the second solder bumps are fused together to form a solder joint of an alloy having a lower liquidus temperature than any of the first and the second solder bumps; and solidifying the solder joint between the first and the second component.

Abstract: Provided are a seamless bent pipe constituted by a bent section and straight pipe sections on both ends of the bent section, with the inside diameter at each pipe end portion being larger than the inside diameter of the bent section, and a welded component comprising a seamless bent pipe and a seamless straight pipe at one or each end of the seamless bent pipe, with the end of the seamless straight pipe to be welded to one or each end of the seamless bent pipe having the same inside diameter as the inside diameter of the seamless bent pipe, as well as methods of manufacturing them. As a result, elements suited for use in pipelines can be obtained, without unnecessarily increasing the wall thickness of the seamless bent pipe and without internal machining of the pipe end portions of the seamless bent pipe after the manufacturing thereof.

Abstract: According to one embodiment, there is provided a method of manufacturing a high-frequency acceleration cavity component, the method including covering a mold with a conducting material, enclosing, in an outer shell, the mold covered with the conducting material, vacuum-airtight-welding the outer shell enclosing the mold, conducing hot isostatic pressing of the vacuum-airtight-welded outer shell, and taking the conducting material formed in the mold out of the outer shell which has undergone the hot isostatic pressing.

Abstract: A method for producing an electrical connection between a rigid printed circuit board and a metallic contact partner, includes preparing the rigid printed circuit board having at least one copper layer and at least one prepreg layer, bringing the metallic contact partner and the printed circuit board together in such a way that the metallic contact partner is brought into contact with a contact pad on the copper layer of the printed circuit board, forming a cutout in the printed circuit board by removing the prepreg layer in at least one partial region of the contact pad, and irradiating with laser light to form a weld connection between the contact partner and the contact pad. A configuration of a rigid printed circuit board, a metallic contact partner and an electrical connection point, as well as a module having such a configuration, are also provided.

Abstract: A method for manufacturing an element (8) of a modular scaffolding system, comprising: providing an at least partly galvanized pipe part (10) having a first end (12) and a second end; providing an at least partly galvanized first connection head (40) which is designed to be connected to the first end (12) of the pipe part (10); forming, through welding, a weld (24) which connects the first end (12) of the pipe part (10) to the first connection head (40), the weld (24) comprising an internal weld surface (24b) and an external weld surface (24a), which internal weld surface is proximal to the pipe part (10) and/or the connection head (40), and which external weld surface is proximal to an outside environment (60) of the pipe part (10) and the connecting head (40).; and covering the external weld surface with a protective layer, such that the external weld surface is screened off from the outside environment (60).

Abstract: Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.

Abstract: A pressurized fluid filtering vessel of the type having a rigid porous container which may be a basket filled with filtering material has a barrier disposed in the outlet such that, in the event of structural failure of the container, particles of the container are prevented from entering the outlet of the pressure vessel. In one version, the barrier comprises a grid and in another version, the barrier comprises a perforated plate.

Abstract: A nanoimprinting mold having high durability enables reduction of thickness fluctuations in resist. The mold is equipped with a patterned base plate having a patterned region, in which a fine pattern of protrusions and recesses is formed, on a first surface thereof, and a second surface having a 3? value related to a height difference distribution within a range from 1 nm to 6 nm; a hollowed base plate having a hollowed shape at least at a portion corresponding to the patterned region and a thickness greater than or equal to that of the patterned base plate; and a metal film formed between the patterned base plate and the hollowed base plate so as to bond the second surface of the patterned base plate and a surface of the hollowed base plate that faces the second surface.

Abstract: A method of manufacturing a printed circuit board is disclosed. The method in accordance with an embodiment of the present invention includes providing an insulation layer having a first area and a second area formed thereon, forming a solder resist layer on the insulation layer, in which the solder resist layer has a first opening formed thereon and the first opening exposes the first area, forming a first surface treatment layer on the first area inside the first opening, forming a second opening on the solder resist layer, in which the second opening exposes the second area, and forming a second surface treatment layer on the second area inside the second opening.

Abstract: A feed-through element of an ignition device for igniters of airbags or seatbelt tighteners is provided. The feed-through element has a metal support body, at least one first access opening in which a metal rod is arranged in an electrically insulating fixing material, and at least one second access opening in which a further metal rod is electrically conductively fixed to the support body by a soldered connection in this access opening. The support body and the access openings are configured as a shaped part. The feed-through element further includes a solder gap between the metal rod and the wall of the second access opening, where the solder gap has a small width.

Abstract: A body comprising a steel substrate and a hard face structure fused to the steel substrate, the hard face structure comprising a core region and an intermediate region, the intermediate region at least partially enclosing the core region and comprising at least about 0.

Abstract: The board has a transformer, choke coil and, for example, is used for a DC-DC converter such as for an automobile. At the board, a circuit conductor therein is exposed to outside at an electronic component mounting part, a printed board mounting part and a conductor part, and other portions are covered with resin to form an injection molded board, which installs an electronic component, etc. The printed board mounting part is a section that is provided for installing a printed board. A conductor part of the printed board and the conductor part of the printed board mounting part are joined via an electronic component by soldering, etc.