Abstract: A micromachined switch is provided including a base substrate, a bond pad on the base substrate, a cantilever arm connected to the bond pad, the cantilever arm having a conductive via from the bond pad, a first actuation electrode on the base substrate, and a second actuation electrode on the cantilever arm connected to the bond pad by way of the conductive via, positioned such that an actuation voltage applied between the first actuation electrode and the second actuation electrode will deform the cantilever arm, wherein the first actuation electrode is facing a side of the cantilever arm opposite the second actuation electrode.

Abstract: Earth-boring tools comprise a body comprising at least one pocket extending into the body. A first discrete cutting element segment is secured within the at least one pocket. At least another discrete cutting element segment is secured within the at least one pocket. Methods of forming a cutting structure secured to an earth-boring tool comprise disposing at least one discrete cutting element or at least one cutting element segment within a pocket or recess formed in a blade extending longitudinally and radially over a face of a body. At least one discrete wearable element or at least another discrete cutting element segment is disposed within the pocket or recess. The at least one discrete cutting element or at least one discrete cutting element segment and the at least one discrete wearable element or at least another discrete cutting element segment are secured to the blade within the pocket or recess.

Abstract: In various embodiments, protective layers are bonded to a steel layer and connected by a layer of unmelted metal powder produced by cold spray.

Abstract: A method for manufacturing a rotor by welding a plurality of elements together is described. The elements have a body with cavities and surfaces to be welded to surfaces of adjacent elements. According to the method, the elements are vertically stacked one above the other to form a pile with facing surfaces to be welded together defining slots. The cavities of adjacent elements define bores that extend within the pile. Then, adjacent elements are welded together within the slots. The bore is purged with an inert gas or mixture during welding. The slots are welded at an upper part of the bore before the slots at a lower part of the bore, and a slot at the upper part of the bore is welded last.

Abstract: Disclosed are an electronic component mounting system and an electronic component mounting method capable of reducing the space occupied by equipment and equipment cost and ensuring high connection reliability. An electronic component mounting system (1) includes a solder printing device (M1), a coating/inspection device (M2), a component mounting device (M3), a bonding material supply/substrate mounting device (M4), and a reflow device (M5). The electronic component mounting system (1) mounts an electronic component on a main substrate (4) and connects a module substrate (5) to the main substrate (4). A cream solder is printed on the main substrate (4) to mount an electronic component, a bonding material in which solder particles are contained in thermosetting resin is supplied to a first connection portion of the main substrate (4), and a second connection portion of the module substrate (5) is landed on the first connection portion through the bonding material.

Abstract: A process for manufacturing a honeycomb seal is disclosed. The process includes the following steps: a) the honeycomb structure is brought to the desired three-dimensional form and is fixed in this form; b) then the honeycomb structure is filled with a filler material; c) then the honeycomb structure filled with the filler material is machined on a side on which a carrier element is arranged, such that this side has the desired contour and that the end edges of the honeycomb structure are sealed flushly with the filler compound; d) then the side contoured in this way is coated with a coating; e) next the carrier element is applied to the coating, preferably by laser powder build-up welding.

Abstract: A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided. A temporary bonding agent 55 is applied onto multiple substrates 50a, 50b, and a heater 33 heats the substrates while the substrates are temporarily bonded with the temporary bonding agent 55 interposed therebetween, and before the solder 54 is melted or while the solder 54 is melted, the temporary bonding agent 55 is evaporated, and the substrates 50a, 50b are bonded with solder with the melted solder 54 interposed therebetween.

Abstract: A golf club head manufacturing method, including: welding a first reinforcing piece with first thickness to a central portion between a toe and a heel, so as to extend along an edge of a face side of a sole part, the sole part being part of a lower part formed integrally with a side part; welding a second reinforcing piece of second, larger thickness to a central portion between the toe and heel so as to extend along the edge on the face side of the first piece; welding a face part to the first and second pieces from an inner space of the lower part; welding a hosel part to the lower and face parts; welding a crown part to the lower, face and hosel parts; and welding the lower and face parts together from the outside.

Abstract: A process for cohesive bonding between a metal surface and a nonmetallic substrate is provided. The non-metallic substrate may comprise a plurality of microfilaments and/or nanofilaments dispersed into and below the surface of the substrate. The application of pressure and laterally-oriented high frequency and low amplitude vibration may allow for diffusion bonding between the metal surface and material of the nanofilaments. Another method includes discharging energy from a bank of capacitors to melt adjoining surfaces of the metal surface and nonmetallic substrate. Additionally, a cohesive bonding method may further comprise converting electrical oscillations of ultrasonic frequency into ultrasonic vibrations which are transmitted to the metal body and/or substrate for fusing the two materials together.

Abstract: A first substrate mounted to a bonder head and a second substrate mounted to a base plate are held at different elevated temperatures at the time of bonding that provide a substantially matched thermal expansion between the second substrate and the first substrate relative to room temperature. Further, the temperature of the solder material portions and the second substrate is raised at least up to the melting temperature after contact. The distance between the first substrate and the second substrate can be modulated to enhance the integrity of solder joints. Once the distance is at an optimum, the bonder head is detached, and the bonded structure is allowed to cool to form a bonded flip chip structure. Alternately, the bonder head can control the cooling rate of solder joints by being attached to the chip during cooling step.

Abstract: A method for manufacturing a printed wiring board, the method including forming a solder resist layer having a small-diameter aperture and a large-diameter aperture, each aperture exposing a respective joint pad. A metal ball having a first diameter is mounted in the small-diameter aperture by using a mask for small diameter metal balls, which includes a small-diameter aperture area that corresponds to the small-diameter aperture on the solder resist layer. A metal ball having a second diameter larger than the first diameter is mounted in the large-diameter aperture by using a mask for large diameter metal balls, which includes a large-diameter aperture area that corresponds to the large-diameter aperture on the solder resist layer.

Abstract: A vehicle body frame includes a left frame member, a right frame member, a cross member, and a first patch member. The cross member is fitted in both of a left connecting hole and a right connecting hole and welded to the left frame member and the right frame member. The cross member includes a pipe member having a hollow portion which has a first end, and a second end opposite to the first end along the hollow portion. The first patch member is fitted in the first end of the hollow portion and welded to an inner peripheral face of the hollow portion such that a weld bead is provided within a range of a first welding margin provided in the first end of the hollow portion. The first welding margin is provided on the inner peripheral face of the hollow portion.

Abstract: A frame structure of a saddle type vehicle that can easily secure the bending strength of welded portions by a structure that seat rails are welded to rear portions of pivot frames, etc. is provided. Elongated holes 71A extending along an axis L of a front portion 15F of the seat rail is provided to a side surface of the pivot frame 14, and the pivot frame 14 and the front portion 15F of the seat rail are welded to each other at the peripheral edge of the elongated hole 71A.

Abstract: A sub-frame (1) of an automobile includes a pair of a front width direction member (2) and a rear width direction member (3) extending in a vehicle width direction, a pair of front-back direction members (4, 5) extending in a vehicle front-back direction, connecting members (6, 7) for connecting between a lower arm supporting part (11) of the front width direction member (2) and the rear width direction member (3), and a pair of linking brackets (8, 9) for respectively linking between an upper arm supporting part (10) of the front width direction member (2) and the pair of front-back direction members (4, 5). According to this, it is possible to achieve weight saving while maintaining rigidity in the front-back direction.

Abstract: Systems and methods for joining BMG Composites are disclosed. Specifically, the joining of BMG Composites is implemented so as to preserve the amorphicity of their matrix phase and the microstructure of their particulate phase. Implementation of the joining method with respect to the construction of modular cellular structures that comprise BMG Composites is also discussed.

Abstract: A method and machine for producing welded reinforcing steel rod mats for use in the production of DIN-conforming reinforced concrete components having primarily no static loads, and to such a reinforcing steel rod mat, uses a welding device, one or more reinforcing steel rods, and one or more stay braces in the case of uniaxial reinforcing steel mats, positioned relative to each other with position control and optionally with position correction of the reinforcing steel rods to be welded together, and a reinforcing steel rod is welded in the area of at least one of the ribs thereof to a stay brace, or to another reinforcing steel rod in the area of at least one of the ribs of the rod.

Abstract: A method of metalworking a substrate (10) previously strengthened in a gas heat treatment to form precipitates throughout an entire volume of the substrate (10), where the precipitates have an active chemical element incorporated during the gas heat treatment. The method includes: melting a portion of the substrate (10) during a full penetration metalworking process to form a molten portion (12); generating a metalworking atmosphere (22) having a supply of an active chemical element in a gas state during the metalworking process; exposing the molten portion (12) to the metalworking atmosphere (22); and cooling the molten portion (12) while maintaining exposure to the metalworking atmosphere (22) to form a solidified portion (36) comprising precipitates comprising the active chemical element, where the precipitates are present throughout an entire volume of the solidified portion (36), and thereby re-strengthen the entire volume of the solidified portion (36).

Abstract: This metal lip seal capable of ensuring tightness between two elements includes: two resilient members each intended to be accommodated in a cavity of one of the two elements, said cavities being located in line with a zone of engagement of the two elements one with the other in which tightness is desired; and a flexible body secured to the element receiving the resilient members, provided with two free ends, said free ends extending at least in line with said engagement zones and being in contact with the resilient members. Each of the resilient members is capable of exerting a contact force on the free ends in order to ensure tightness between the two elements.

Abstract: A method for manufacturing a rotor by welding a plurality of elements together is described. The elements have a body with cavities and surfaces to be welded to surfaces of adjacent elements. According to the method, the elements are vertically stacked one above the other to form a pile with facing surfaces to be welded together defining slots. The cavities of adjacent elements define bores that extend within the pile. Then, adjacent elements are welded together within the slots. The bore is purged with an inert gas or mixture during welding. The slots are welded at an upper part of the bore before the slots at a lower part of the bore, and a slot at the upper part of the bore is welded last.

Abstract: Illustrated and described is an apparatus for connecting double jacketed pipes, comprising two fixed flanges and a locking element for connecting the fixed flanges axially; the fixed flanges respectively comprising an inner ring and an outer ring connected in a torque-proof manner to the inner ring; an inner pipe being assigned to each of the inner rings and a jacket pipe being assigned to each of the outer rings, and the fixed flanges respectively having between the inner ring and the outer ring at least one axial bore hole spaced apart from one another by an annular space. In order to achieve easy fitting of the coupling with double pipes, the pipes of which can not be displaced axially relative to one another, it is proposed to arrange an axially displaceable telescopic pipe at least between one of the outer rings and the jacket pipe assigned to it.

Abstract: A first substrate mounted to a bonder head and a second substrate mounted to a base plate are held at different elevated temperatures at the time of bonding that provide a substantially matched thermal expansion between the second substrate and the first substrate relative to room temperature. Further, the temperature of the solder material portions and the second substrate is raised at least up to the melting temperature after contact. The distance between the first substrate and the second substrate can be modulated to enhance the integrity of solder joints. Once the distance is at an optimum, the bonder head is detached, and the bonded structure is allowed to cool to form a bonded flip chip structure. Alternately, the bonder head can control the cooling rate of solder joints by being attached to the chip during cooling step.

Abstract: A reflow method for solder includes heating the solder to a first temperature that is above a liquidus temperature of the solder; cooling the solder to a second temperature that is below a solidification temperature of the solder; reheating the solder to a third temperature that is above a solidus temperature of the solder and below the liquidus temperature of the solder; cooling the solder to a fourth temperature that is below the solidification temperature of the solder.

Abstract: The method for manufacturing a solid housing, in particular a valve housing for an electromagnetically operable valve, is characterized in that the following method steps are used: a) providing a sheet metal strip made of a magnetic or magnetizable material, b) introducing an additive into a middle area of the sheet metal strip and fusing there for forming a non-magnetizable structure, c) cutting the sheet metal strip into a sheet metal piece of desired width, d) deforming the sheet metal piece into a sleeve shape, e) mutual fastening of the cut edges now facing each other and running in the longitudinal direction of the sleeve for forming a sleeve blank, f) final machining of the sleeve blank until a desired geometry of the housing is achieved. The housing is suitable in particular for use in fuel injectors in fuel injector systems of mixture-compressing spark-ignition internal combustion engines.

Abstract: A solder paste comprising a solder alloy powder and a flux. The volumetric expansion at the time of melting of the solder alloy is at most 0.5%. The flux contains a bisphenol A epoxy resin and a curing agent selected from a carboxylic anhydride and a dicarboxylic acid. The solder paste can be used in applications suitable for high-temperature solders. The solder alloy has an alloy composition comprising, in mass percent, 70-98% of Bi, a total of 0-0.5% of at least one substance selected from Ag, Cu, Sb, In, Zn, Ni, Cr, Fe, Mo, P, Ge, and Ga, and a remainder of Sn.

Abstract: A method for batch brazing in a diffusion furnace includes inserting a plurality of fusible parts into a plurality of slots of at least one quartz boat, transporting the at least one quartz boat, including the fusible parts, into an interior of a reaction chamber of the diffusion furnace, sealing the interior of the reaction chamber, adjusting an atmosphere of the interior of the reaction chamber according to a recipe, moving a preheated furnace heating element from a location spaced apart from the reaction chamber to a location in substantial proximity with the reaction chamber to increase a temperature of the atmosphere of the interior of the reaction chamber above a predefined brazing temperature for a predefined brazing time period according to the recipe.

Abstract: In certain embodiments, a system includes a deposition system and a plasma/bonding system. The deposition system deposits a solder outwardly from a substrate of a number of substrates. The plasma/bonding system comprises a plasma system configured to plasma clean the substrate and a bonding system configured to bond the substrates. The plasma/bonding system at least reduces reoxidation of the solder. In certain embodiments, a method comprises depositing solder outwardly from a substrate, removing metal oxide from the substrate, and depositing a capping layer outwardly from the substrate to at least reduce reoxidation of the solder.

Abstract: A method of sealing a package includes plating a perimeter of a hole formed in a package and attaching a solder film to the plated perimeter, the solder film covering the hole. The method further includes assembling a device in the package and sealing the package to define an interior and an outside, the device being contained within the interior. Next, the method includes heating the assembled package in a vacuum oven to a predetermined temperature where the solder film bonds to the plated perimeter, evacuating the vacuum oven to form a vacuum until the solder film fractures as a gas contained in the interior escapes to the outside, and further heating the assembled package in the vacuum oven after the gas in the interior escapes to the outside and until the solder film re-melts and seals over the hole.

Abstract: A method for manufacturing a laminated core is provided that makes positions of boundary parts of laminated blocks and improves an efficiency of a welding operation of the blocks. The above-described object is achieved by the method of manufacturing the laminated core 10 including a process that forms a plurality of blocks 12 having a plurality of welding parts 13 to 15 of different forms or colors at intervals of prescribed angles in the circumferential direction, a process that laminates the plurality of blocks 12 under a state that the blocks are rotated at intervals of the prescribed angles and a process that welds the welding parts 13 to 15 having the different forms or colors of the laminated blocks 12 to form integrally the plurality of blocks 12.

Abstract: In various embodiments, a metallic structure includes first and second clad structures each comprising a protective layer disposed over a steel layer, a joint joining the steel layers of first and second clad structures, and, directly connecting the protective layers of the first and second clad structures, a layer of metal powder disposed in contact with (i) the joint, (ii) the protective layers of the first and second clad structures, and (iii) a portion of at least one of the steel layers proximate the joint.

Abstract: A method for producing a stainless steel three-ply clad sheet for a fuel cell separator comprises heating a source blank and then performing rough rolling, hot rolling and cold rolling thereto, whereby the clad steel sheet for the fuel cell separator or a solid polymer type fuel cell separator thereby is obtained. The source blank for the clad steel sheet is composed of a stainless steel utilizing 0 to 0.3% B as a core component and a stainless steel containing 0.3 to 2.5% B as face component. The source blank is made using face components, a core component, tabs and protectors and performing steps including bonding of the tabs and protectors to the face components, removing portions of the tabs and protectors, piling of the face components to the core component, and further bonding of the face and core components together to form the source blank.

Abstract: A method is provided for providing external insulation for an exhaust gas aftertreatment or acoustic device, including the steps of (a) securing an insulating blanket around the exterior of the device, (b) securing a sheet of foil around the insulating blanket, (c) interconnecting a plurality of wires into a sleeve oriented in an axial direction by knitting or interweaving, whereby extending the sleeve in the axial direction biases the sleeve radially inwardly, (d) positioning the wire sleeve around the foil sheet, (e) welding one end of the wire sleeve to the device adjacent one end of the insulating blanket, (f) pulling the other end of the sleeve in the axial direction to bias the sleeve radially inwardly sufficiently to apply a compressive force to the insulating blanket, and (g) welding the other end of the sleeve to the device adjacent the other end of the insulating blanket.

Abstract: An embodiment of the present invention is an interconnect technique. Carbon nanotubes (CNTs) are prepared. A CNT-solder composite paste is formed containing the CNTs and solder with a pre-defined volume fraction.

Abstract: A process of making efficient metal bump bonding with relative low temperature, preferably lower than the melting point of Indium, is described. To obtaining a lower processing temperature (preferred embodiments have a melting point of <100° C.), a metal or alloy layer is deposited on the indium bump surface. Preferably, the material is chosen such that the metal or alloy forms a passivation layer that is more resistant to oxidation than the underlying indium material. The passivation material is also preferably chosen to form a low melting temperature alloy with indium at the indium bump surface. This is typically accomplished by diffusion of the passivation material into the indium to form a diffusion layer alloy. Various metals, including Ga, Bi, Sn, Pb and Cd, that can be used to form a binary to quaternary low melting point alloy with indium.

Abstract: In a method of attaching a solder ball, a first material is coated on a solder ball. A second material is coated on a pad of a substrate where the solder ball is to be attached to exothermically react with the first material. The solder ball makes contact with the pad such that the first material and the second material exothermically react with each other to release heat to adhere the solder ball to the pad using the heat.

Abstract: A method for producing a connection for a motor vehicle seat, wherein a seat frame side part is welded to a seat rail to form the connection.

Abstract: The present invention provides a welding method of butted profile. The welding method of the butted profile comprises the following steps of: assembling a profile without backing bars and a profile with double backing bars and/or a profile with a single backing bar of the butted profile together; and welding two lateral parts of the profile without backing bars with the corresponding profile with double backing bars and/or the profile with a single backing bar at the same time.

Abstract: According to a metal joining method of the present invention, first and second dissimilar metals are joined together by interposing between the first and second metal materials a third metal material dissimilar to the first and second metal materials and causing eutectic melting at least either at an interface between the first and third metal materials or at an interface between the second and third metal materials.

Abstract: A method for cleaning a thermode tip including applying an energy pulse to the thermode tip. The energy pulse involves raising the temperature of the thermode tip higher than the working temperature of the thermode tip. A method for cleaning a thermode tip may include periodically performing a predetermined number of soldering cycles at a working temperature; and applying an energy pulse to the thermode tip.

Abstract: In various embodiments, a method of joining clad structures includes providing first and second clad structures each comprising a protective layer disposed only partially over a steel layer such that an edge region of the steel layer is exposed, joining the first and second clad structures at their respective edge regions, thereby forming a joint, and cold spraying a metal powder over and in contact with (i) the joint, (ii) the edge regions, and (iii) the protective layers of the first and second clad structures, thereby directly connecting the protective layers of the first and second clad structures with a layer of unmelted metal powder.

Abstract: According to a metal joining method of the present invention, first and second dissimilar metals are joined together by interposing between the first and second metal materials a third metal material dissimilar to the first and second metal materials and causing eutectic melting at least either at an interface between the first and third metal materials or at an interface between the second and third metal materials.

Abstract: The invention relates to a sheet metal plate, especially made of steel, for producing motor vehicle body components. In order to make the body component sufficiently rigid at highly stressed points in spite of using lightweight materials, the sheet metal plate (11) is provided with local reinforcement zones (13, 14). To this avail, the sheet metal plate (11) is joined together from at least two cut metal sheets (7, 9) with a straight seam (10). At least one of the cut metal sheets (7) comprises several parallel strips (2 to 6) having different strengths while each local reinforcement zone (13, 14) lies within a reinforced strip (2, 3).

Abstract: The present invention is directed to a fluid conduit assembly. In accordance with one embodiment of the present invention, the inventive fluid conduit assembly includes a fluid conduit having an inlet, at least one outlet and a fluid flow passageway therebetween configured to allow for fluid to be communicated between said inlet and said at least one outlet. The inventive fluid conduit assembly further includes at least one damper disposed within the passageway of the fluid conduit. The damper includes a sealed vent configured to vent gases captured by the damper during a brazing process performed on the fluid conduit when unsealed.

Abstract: A method for assembling, and the resultant electronic module, includes attaching a chip to a substrate using a first solder interconnection array, and attaching a board to the substrate using a second solder interconnection array, which may be a single-melt or a dual-melt solder array. The second solder interconnection array resides entirely within a space defined between the board and substrate. A creep resistant structure is provided within this space for maintaining the defined space and optimizing integrity of the second solder interconnection array. The creep resistant structure may include an underfill material, balls, brackets, frames, collars or combinations thereof. Wherein the creep resistant structure is an underfill material, it is crucial that the substrate be attached to the board before either entirely encapsulating the second interconnection array with underfill material, or partially encapsulating the second solder interconnection array at discrete locations with underfill material.

Abstract: A process of forming an encapsulated magnet assembly is provided, the process comprising welding a second portion of a housing cover formed of a non-magnetic material to a first portion of a housing cover formed of a magnetic material to provide a welded housing cover and subsequently heat-treating the welded housing cover at a temperature effective to relieve weld stress; disposing a magnet within a housing comprising at least one wall formed of the non-magnetic material and defining at least one aperture; and welding the heat treated welded housing cover to the housing such that the second portion of the housing cover is fixedly attached to the housing wall to hermetically seal the aperture. In one embodiment, the magnet of the encapsulated magnet assembly is a permanent magnet, and in an alternate embodiment an electromagnet. In one embodiment the encapsulated magnet assembly is a component of a stator-rotor assembly.

Abstract: Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed.

Abstract: The invention relates to a method of assembling gold alloy parts that enables identical or different gold alloys, particularly gold alloys of different colors, to be assembled. This method comprises the following steps: a) a film of tin is applied over at least one portion of a face of a first gold alloy part; b) the tinned face of the first gold alloy part is brought directly into contact with a face of a second gold alloy part; c) the first and second parts are pressed against each other; and d) the assembly is heated. This method may be used to manufacture checkerboards.

Abstract: A method for manufacturing a solid housing, in particular a valve housing for an electromagnetically operable valve. The method includes providing at least three flat metal plates side by side, each having different magnetic properties directly adjacent to the others. The at least three plates are joined to the directly adjacent bordering edges to form a sheet metal section. The sheet metal section shaped into a sleeve shape. Furthermore, the bordering edges, which are now opposite one another, and run in the longitudinal direction of the sleeve to form a sleeve blank are joined together. The sleeve blank is machined until a desired geometric shape of the housing is achieved. The housing may be suitable in particular for use in fuel injectors in fuel injector systems of internal combustion engines operating by spark ignition of a compressed fuel-air mixture.

Abstract: The invention proposes a process for producing components (10) or semi-finished products which contain intermetallic titanium aluminide alloys, which includes the following process steps: rough contouring of a plurality of plate-like bodies (11) so as to correspond to a desired final shape of the component (10) or semi-finished product, some of these plate-like bodies or all the plate-like bodies consisting of titanium aluminide alloys; carrying out surface-to-surface joins between the plurality of plate-like bodies (11) stacked on top of one another so as to form an overall body (10); and forming the desired final shape of the overall body (10). The invention also concerns a component, in particular for jet engines, which is produced using this process.

Abstract: A method is provided for the production of a bond between a first element having at least one first metal coating and at least one further element having a second metal coating, the at least one further element being freely moveable in a medium and the at least one first metal coating of the first element and the second metal coating of the at least one further element being in a solid state, a liquid phase being formed upon contact of the at least one first metal coating with the second metal coating.

Abstract: According to a metal joining method of the present invention, first and second dissimilar metals are joined together by interposing between the first and second metal materials a third metal material dissimilar to the first and second metal materials and causing eutectic melting at least either at an interface between the first and third metal materials or at an interface between the second and third metal materials.