Abstract: In a gap retention member to be disposed between a pair of glass plates when a circumference of a gap formed between the pair of glass plates with their plate faces opposing each other is to be sealed to maintain the gap under a depressurized state, the gap retention member includes hard portions to contact the pair of glass plates respectively and a soft portion disposed between the hard portions and having a lower hardness than the hard portions, the soft portion being more susceptible to deformation based on a shearing force effective in the direction along the opposing faces of the glass plates than deformation based on a compressive force effective in a thickness direction perpendicular to the opposing faces of the glass plates.

Abstract: The invention relates to a mounting device in an aircraft. In one aspect of the invention, a method is disclosed for assembling a metal securement member of the mounting device. In another aspect of the invention, a mounting device is disclosed. In another aspect of the invention, a method is disclosed for installing and using a mounting device in an aircraft.

Abstract: A manufacturing method of an integrally forged golf club head has acts of: forging a crude rod to form a blank of a main body of a golf club head, mounting a weight in a mounting recess of the blank of the main body of the golf club head, covering the mounting recess with an outer cover, and then welding and forging the blank of the main body of the golf club head and the outer cover to form a golf club head. Thus, the at least one weight is securely held in the golf club head and does not come off the golf club head, and also no noise occurs when the golf club head strikes a golf ball. Furthermore, the at least one weight is not exposed so that the golf club head has a good appearance and improved quality.

Abstract: A die is prepared for thermal compression bonding by first aligning electrical contacts on the die to bond pads on a substrate onto which the die is to be mounted. Those electrical contacts are held against the bond pads on the substrate with a bonding tool. Partially bonding the die onto the substrate by providing heat to a portion of the die to elevate a temperature there to above a melting point of solder in the electrical contacts so as to melt at least some of the solder. Then thermally compress the whole die and heat it to above the melting point of the solder of the electrical contacts so that the solder of the electrical contacts outside the portion of the die are also melted to bond the die to the substrate.

Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.

Abstract: A method and a device for controlling a thermal cycle of a weld joining one end of a first strip to an end of a second strip, suited to a joining machine of a strip treatment plant. The control device includes connections intended to connect the control device to a central automation system of the strip treatment plant and to the joining machine respectively, so as respectively to allow an exchange of at least one strip data item and an exchange of at least one operating data item. A computer is capable of computing, from the strip and operating data items, at least one thermal parameter of the weld. A weld control and characterization device is capable of controlling the welding as a function of the thermal parameter.

Abstract: Disclosed is an apparatus for determining an alignment of a bondhead of a die bonder relative to a workchuck. Specifically, the apparatus comprises: i) a sensor configured to measure a distance between the bondhead and the sensor; and ii) a positioning device coupled to the sensor, the positioning device being configured to position the sensor relative to a plurality of locations on the bondhead facing the sensor. In particular, the sensor is operative to measure a set of distances between each of the plurality of locations on the bondhead and the sensor, the set of distances being for determining the alignment of the bondhead. A method of determining an alignment of a bondhead of a die bonder relative to a workchuck is also disclosed.

Abstract: Disclosed herein is a method of making a structure by ultrasonic welding and superplastic forming. The method comprises assembling a plurality of workpieces comprising a first workpiece including a first material having superplastic characteristics; ultrasonically welding the first workpiece to a second workpiece, to form an assembly; heating the assembly to a temperature at which the first material having superplastic characteristics is capable of superplastic deformation, and injecting a fluid between the first workpiece and the second workpiece to form a cavity between the first workpiece and the second workpiece.

Abstract: A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

Abstract: A method includes bonding a first bond layer to a second bond layer through eutectic bonding. The step of bonding includes heating the first bond layer and the second bond layer to a temperature higher than a eutectic temperature of the first bond layer and the second bond layer, and performing a pumping cycle. The pumping cycle includes applying a first force to press the first bond layer and the second bond layer against each other. After the step of applying the first force, a second force lower than the first force is applied to press the first bond layer and the second bond layer against each other. After the step of applying the second force, a third force higher than the second force is applied to press the first bond layer and the second bond layer against each other.

Abstract: During implementing a composite metal part by compaction of an insert having reinforcing fibers in a metal body or container, gas used for compaction may enter the cavity formed in the container for receiving the insert between a lid covering the insert and the container, which can prevent or degrade compaction and diffusion welding of fiber sheaths of the insert therebetween and/or with walls of the cavity. To solve this problem, the present method includes initiating isostatic compaction by a phase including raising and maintaining temperature, followed by a phase including hot-feeding pressurized gas, and machining an assembly to obtain the part. The temperature raising phase includes a diffusion pre-welding of material rigidly connecting the pressure-adjusted walls of the lid and the container. The method can be used for designing parts having a tensile and compression resistance, such as parts for aircraft landing gear.

Abstract: A visually seamless method of joining a first piece of metal and a second piece of metal is described. The first piece of metal is placed in contact with an edge of the second piece of metal. In some embodiments, the edge includes a sacrificial lip. The first piece of metal forming a junction area with the edge of the second piece of metal, applying a forging force to the first piece of metal, the forging force having an effect of creating an extremely tight fit up between the first and the second pieces of metal, welding the first and the second pieces to form an assembly and forming a cosmetically enhancing protective layer on the surface of the assembly, the protective layer obscuring any visible artifacts on the surface of the assembly, the obscured visible artifacts including any discoloration or discontinuity created by the laser welding.

Abstract: Productivity is to be improved in assembling a semiconductor integrated circuit device. A matrix substrate is provided and semiconductor chips are disposed on a first heating stage, then the matrix substrate is disposed above the semiconductor chips on the first heating stage, subsequently the semiconductor chips and the matrix substrate are bonded to each other temporarily by thermocompression bonding while heating the chips directly by the first heating stage, thereafter the temporarily bonded matrix substrate is disposed on a second heating stage adjacent to the first heating stage, and then on the second heating stage the semiconductor chips are thermocompression-bonded to the matrix substrate while being heated directly by the second heating stage.

Abstract: A method includes providing a substrate carrier including work piece holders, and placing a first plurality of work pieces into the work piece holders. A second plurality of work pieces is picked up and placed, with each of the second plurality of work pieces being placed on one of the first plurality of work pieces. Solder bumps between the first and the second plurality of work pieces are then reflowed to simultaneously bond the first and the second plurality of work pieces together.

Abstract: A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

Abstract: A repair apparatus includes a heating head device configured to heat a soldering member, which is soldered to a circuit board. The heating head device includes a heating head and a contact member heated by the heating head. The contact member is formed of a material having a spring characteristic and a thermal conductivity higher than a thermal conductivity of the heating head. The contact member is configured to be brought into contact with a soldered surface of the soldering member with an elastic force so as to melt a solder joining the soldering member to the circuit board.

Abstract: A manufacturing method of a forged golf club head has acts of: providing pre-forged strike element and the pre-forged hosel made with different materials, welding the hosel on a connecting end of the strike element, and press-forging the blank to form a main component of the golf club head. The main component of the golf club head may accomplish the golf club head. Otherwise, a pre-forged secondary component is welded on a back part of the strike face of the main component to accomplish the golf club head. The strike element and the hosel made of different materials are directly secured to each other to precisely form a predetermined, shape so that the following surface treating steps and the manufacturing time are reduced and the quality of the golf club head is enhanced.

Abstract: A method for soldering an LED to a circuit board includes firstly providing a solder-applying pattern overlaying the circuit board. First holes and second holes are defined in the solder-applying patter. Then, solder pastes are filled in the first holes and the second holes. The solder-applying pattern is removed and a plurality of first solder poles and second solder poles are remained on the circuit board. An LED is then put on the first solder poles and the second solder poles. The first solder poles and the second solder poles are heated to form a first solder ball and a second solder ball respectively after the heated first and second solder poles are cooled. The first and second solder balls electrically connect positive and second electrodes of the LED with the circuit board.

Abstract: A solder apparatus includes a platform, an operating mechanism, a solder member, a heater, and a control box module. The control box module includes a temperature controller and a temperature sensor. The temperature controller defines a predetermined temperature. The temperature sensor is capable of measuring the temperature of the solder member. The temperature controller has the heater heat the solder member when the measured temperature of the solder member is lower than or equal to the predetermined temperature, and has the heater stop heating the solder member, when the measured temperature of the solder member is higher than the predetermined temperature.

Abstract: A method includes providing a substrate carrier including work piece holders, and placing a first plurality of work pieces into the work piece holders. A second plurality of work pieces is picked up and placed, with each of the second plurality of work pieces being placed on one of the first plurality of work pieces. Solder bumps between the first and the second plurality of work pieces are then reflowed to simultaneously bond the first and the second plurality of work pieces together.

Abstract: Productivity is to be improved in assembling a semiconductor integrated circuit device. A matrix substrate is provided and semiconductor chips are disposed on a first heating stage, then the matrix substrate is disposed above the semiconductor chips on the first heating stage, subsequently the semiconductor chips and the matrix substrate are bonded to each other temporarily by thermocompression bonding while heating the chips directly by the first heating stage, thereafter the temporarily bonded matrix substrate is disposed on a second heating stage adjacent to the first heating stage, and then on the second heating stage the semiconductor chips are thermocompression-bonded to the matrix substrate while being heated directly by the second heating stage.

Abstract: In a method of manufacturing an article (28) by diffusion bonding and superplastic forming stop off material (122) is applied to prevent diffusion bonding in a predetermined pattern on a first surface (106) of a first metal workpiece (100) and the predetermined pattern is spaced from the edges of the first surface (106) of the first metal workpiece (100). Stop off material (124) to prevent diffusion bonding is applied in a predetermined position on the first surface (106) of the first metal workpiece (100) and the predetermined position extends from the predetermined pattern of stop of material (122) on the first surface (106) of the first metal workpiece (100) towards one edge of the first surface (106) of the first metal workpiece (100).

Abstract: A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

Abstract: A tab lead soldering apparatus soldering a tab lead to a front face and a rear face of a solar cell has a first pressing mechanism pressing the tab lead toward the front face of the solar cell, a second pressing mechanism pressing the tab lead toward the rear face of the solar cell rear face, a heat member and a support member provided to the first pressing mechanism and/or the second pressing mechanism to contact with the tab lead, a heat member shift mechanism shifting the heat member between a contact position to contact an end of the heat member with the tab lead and a separation position to separate the end of the heat member from the tab lead, and a support member shift mechanism shifting the support member between a contact position to contact an end of the support member with the tab lead and a separation position to separate the end of the support member from the tab lead.

Abstract: The invention relates to a method for forming a highly electroconductive surface on an aluminum piece. A highly conductive layer of silver is formed on the piece by means of a eutectic join. The temperature of the aluminum piece is raised gradually and the oxide layer formed on the surface of the piece is removed. After the first heating stage, the silver piece that is to be attached is transferred to the cleaned surface. The contact point is heated to a temperature where a eutectic bond is generated between the aluminum and silver. During the second heating stage a slight momentary loading is applied to the contact point.

Abstract: This invention relates to a method for producing components with internal architectures, and more particularly, this invention relates to a method for producing structures with microchannels via the use of diffusion bonding of stacked laminates. Specifically, the method involves weakly bonding a stack of laminates forming internal voids and channels with a first generally low uniaxial pressure and first temperature such that bonding at least between the asperites of opposing laminates occurs and pores are isolated in interfacial contact areas, followed by a second generally higher isostatic pressure and second temperature for final bonding. The method thereby allows fabrication of micro-channel devices such as heat exchangers, recuperators, heat-pumps, chemical separators, chemical reactors, fuel processing units, and combustors without limitation on the fin aspect ratio.

Abstract: In a soldering method for mounting a semiconductor device on a wiring board, a plurality of solid-phase solders are provided between the semiconductor device and the wiring board, and are thermally melted to thereby produce a plurality of liquid-phase solders therebetween. A constant force is exerted on the liquid-phase solders by relatively moving the semiconductor device with respect to the wiring board so that an invariable gap is determined between the semiconductor device and the wiring board.

Abstract: Productivity is to be improved in assembling a semiconductor integrated circuit device. A matrix substrate is provided and semiconductor chips are disposed on a first heating stage, then the matrix substrate is disposed above the semiconductor chips on the first heating stage, subsequently the semiconductor chips and the matrix substrate are bonded to each other temporarily by thermocompression bonding while heating the chips directly by the first heating stage, thereafter the temporarily bonded matrix substrate is disposed on a second heating stage adjacent to the first heating stage, and then on the second heating stage the semiconductor chips are thermocompression-bonded to the matrix substrate while being heated directly by the second heating stage.

Abstract: A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

Abstract: A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

Abstract: A device includes (a) radiation detector including a semiconductor substrate having opposing front and rear surfaces, a cathode electrode located on the front surface of said semiconductor substrate, and a plurality of anode electrodes on the rear surface of said semiconductor substrate, (b) a printed circuit board, and (c) an electrically conductive polymeric film disposed between circuit board and the anode electrodes. The polymeric film contains electrically conductive wires. The film bonds and electrically connects the printed circuit board and anode electrodes.

Abstract: A reflow process is provided for multiple units which improves productivity. A reflow furnace is moved along a transport direction of a tape substrate and is fixed at a position matching the product pitch of a circuit substrate. Any of a plurality of heating blocks and cooling blocks are matched to the product pitches of the circuit substrate. By doing so, it is possible to continuously carry out the reflow process for a tape substrate on which circuit substrates having different product pitches are arranged.

Abstract: This invention improves upon existing approaches by providing a method for improving the uniformity of additive manufacturing processes of the type wherein material increments are consolidated to produce a three-dimensional object. According to one aspect of the invention, the method comprises the steps of tacking an increment during the method to minimize creep, then fully consolidating that increment to the underlying material. According to a different aspect of the invention, the method includes a step of steering the welding head or the feeding of the increments to ensure that the relative orientation of the contact line of the welding head as defined by the lowest surface is parallel to the central axis. As yet a further aspect of the invention, a different method includes a step of placing the increment so as to minimize the ratio of deformed to undeformed material. Such placement may be carried out manually over automatically.

Abstract: A method of joining expandable tubulars includes joining the tubulars by forge welding and flushing a reducing flushing gas around the heated tubular ends during at least part of the forge welding operation such that oxides are removed from the forge welded tubular ends and the amount of irregularities between the forge welded tubular ends is limited.

Abstract: For the purpose of contact-connecting an electrical component, in particular a semiconductor component, on a substrate having a conductor structure, a joining temperature is chosen in such a way that the substrate, with a pressure being exerted on the electrical component, experiences a plastic deformation, with the result that the electrical component is pressed together with the conductor structure into the substrate in a positively locking manner. In order to produce the connection between the component and the substrate, use is preferably made of a thin diffusion solder layer which can be processed at temperatures lying below the melting point of the substrate.

Abstract: A directionally solidified nickel-base superalloy article has a defect therein extending parallel to the solidification direction. The article is repaired by removing any foreign matter present in the defect, and then heating the article to a repair temperature of from about 60 to about 98 percent of the solidus temperature of the base material in a chamber containing a protective gas that inhibits oxidation of the base material. The defect is filled with a filler metal while maintaining the article at the repair temperature. The filling is accomplished by providing a source of the filler metal of substantially the same composition as the base material of the directionally solidified article, and melting the filler metal into the defect progressively while moving the source of the filler metal relative to the article in a direction parallel to the solidification direction.

Abstract: A process for joining metals is provided, by which a core wire of a coated electric wire can be securely joined to a metal having a plated layer on the surface thereof. The process is to assemble a wiring module 1. The wiring module 1 has a metal piece 2, a coated electric wire 3 and so on. A plated layer 6 made of tin is formed on a surface of a matrix 5 of the metal piece 2. The coated electric wire 3 has a core wire 7. An ultrasonic welding is carried out after placing a part 7a of the core wire 7 on the plated layer 6 of the metal piece 2. The plated layer 6 is melted so as to join the part 7a of the core wire 7 to the matrix 5 and the core wire 7 is broken off separating the part 7a therefrom. Another ultrasonic welding is carried out after further placing another core wire 7 on the part 7a joined to the matrix 5, so that the core wire 7 of the coated electric wire 3 is joined to the metal piece 2 through the part 7a of the core wire 7.

Abstract: The invention includes a method of forming an assembly of a physical vapor deposition target and support. A physical vapor deposition target is provided. The physical vapor deposition target has a coefficient of thermal expansion of less than 10×10−6K−1. The physical vapor deposition target is joined to a support. The support comprises a thermal coefficient of expansion of less than 11×10−6K−1. The invention also includes an assembly comprising a physical vapor deposition target and a support joined to the physical vapor deposition target. The support comprises carbon fibers and copper.

Abstract: A directionally solidified nickel-base superalloy article has a defect therein extending parallel to the solidification direction. The article is repaired by removing any foreign matter present in the defect, and then heating the article to a repair temperature of from about 60 to about 98 percent of the solidus temperature of the base material in a chamber containing a protective gas that inhibits oxidation of the base material. The defect is filled with a filler metal while maintaining the article at the repair temperature. The filling is accomplished by providing a source of the filler metal of substantially the same composition as the base material of the directionally solidified article, and melting the filler metal into the defect progressively while moving the source of the filler metal relative to the article in a direction parallel to the solidification direction.

Abstract: Method of forming a two-piece hollow cathode sputter target assembly and the assembly formed thereby. The sputter target assembly includes an outer shell having a substantially cylindrical side wall and is composed of a relatively low purity metallic material. A sputtering insert includes a substantially cylindrical side wall and is concentrically received within, and bonded to, the outer shell. The sputtering insert is composed of a relatively high purity metallic material as used for depositing a thin layer or film onto a desired substrate.

Abstract: Method for welding two end portions (6, 8) of a coil (not shown) onto two electric contact pads or bumps (24, 26) of an integrated circuit (2) or an electronic unit of small dimensions. This welding method is characterised in that, prior to the actual welding step, a preliminary step is provided consisting in removing at least partially the insulating sheath from the electric wire (10) at least at the locations of the two end portions (6, 8) provided for the welding onto said electric contact pads or bumps (24, 26). The insulating sheath is removed locally by means of heat application, in particular using a heating press (58) working at a sufficiently high temperature to melt or sublimate the insulating sheath. The welding step is achieved at a much lower temperature than the temperature of the preliminary step, which allows the heat and mechanical stress to be reduced for the integrated circuit (2) and the bumps (24, 26) during welding of the ends (6, 8) onto said bumps.

Abstract: A method of repairing a metallic member, such as a superalloy turbine blade, includes the step of preparing the blade by stripping the protective coatings from the blade. The blade is then pre-conditioned for welding by a first hot isostatic process. Once the blade conditioning sequence is complete, the blade is welded using a laser welding technique and by adding weld fillers to the weld area. After the welding step, the blade is sealed by a second hot isostatic process treatment performed at conditions similar to the first hot isostatic process. The blade is finally prepared for re-entry into service.

Abstract: An improved seal and method of making is disclosed for sealing a filter element to a filter mounting. The improved seal comprises a bonding pad formed from a sintered matrix of randomly oriented metallic fiber. The bonding pad is disposed between the filter element and the filter mounting. A mechanical fastener coacts between the filter element and the filter mounting for compressing the bonding pad to provide a seal between the filter element and the filter mounting. The bonding pad may be heated to create a frangible seal.

Abstract: A method, machine and termination for connecting two or more insulated wire ends includes placing them in a metal tube held between fusing electrodes. The electrodes are shaped to deform the tube and wires therein with the application of fusing pressure. During fusing, pressure builds first to press the assembly together, then heat and current are applied as the tube and internal wires are compressed. Fusing current first flows from a longitudinal region of the tube equally in both direction through the tube metal to soften the tube and distribute the fusing heat broadly. As the wire insulation is burned off or flows away, current also passes through the bare wire ends to aid the fusing process. For tinned copper tubes, some of the inside tin layer flows to wet copper surfaces and dissolve copper impurities. Some tin flows to seal small spaces between the fused wires. Some of the tin on the outside surface and inside surface of the tube may vaporize.

Abstract: A process for cladding precious metals to precipitation hardenable materials. In accordance with one aspect of the present invention, are the steps of (i) placing a precious metal layer of a first selected thickness atop a selected beryllium-copper alloy base metal strip of a second selected thickness to approximate a desired final product thickness, (ii) cold rolling the layer and strip to reduce their respective thicknesses by generally more than 50%, (iii) heating the layer and strip to a first selected temperature generally within a range of 1000.degree.-1300.degree. F., (iv) maintaining the first temperature for a first selected time to promote metallic bonding of the layer to the strip while softening the base metal, (v) pickling the layer and strip to remove surface oxides, (vi) cold rolling the layer and strip to a thickness generally 11% greater than that of the desired final product thickness, (vii) heating the layer and strip to a second selected temperature generally within a range of 1250.degree.

Abstract: There is provided an improved coated composite article and an improved process for making the article. A cloth-like flexible preform is brazed to a metallic substrate to make the article. The article is then subjected to a uniform high pressure and temperature for sufficient time to remove porosity in the coating. The result is a fully dense coating, which is metallurgically bonded to the substrate without any porosity, which has improved physical properties, and which is capable of being polished to a surface finish of at least 4 RMS.

Abstract: A method of producing a thermally stable diamond compact having a metal layer bonded to a surface thereof is provided. The thermally stable diamond compact comprises a mass of diamond particles containing diamond-to-diamond bonding and a second phase uniformly distributed through the diamond mass. The metal of the metallic layer is molybdenum, tantalum, titanium or like high melting refractory metal, nickel or an alloy containing a dominant amount of any one of these metals.

Abstract: A first surface of a first metal component of an ink jet print head is bonded to a second surface of a second metal component of the ink jet print head, the first and second surfaces being of materials having the same or similar coefficients of thermal expansion. A layer of filler material is electroplated or otherwise placed on at least one of these surfaces. The filler material has a melting point which is below the melting point of the first and second components, and the total thickness of the filler material on the surfaces together is in the range of from approximately one-sixteenth micron to approximately five microns, with one-eighth micron to two microns being a preferred range. These surfaces are placed together and subjected to heat and pressure to diffusion bond the surfaces without melting the filler material. The diffusion bonding is performed in one approach until no more than approximately one micron of filler material remains between the surfaces.

Abstract: A method of producing substantially distortion-free weld metal tubing wherein a mandrel and a thin metal layer covering the mandrel are used to provide structural support for a starter tube while a weld metal is being deposited on the exterior surface of the starter tube to a desired thickness. The material used for the thin metal layer is selected to have a lower melting temperature than that of the mandrel, starter tube and weld metal, and after the weld metal deposit process is completed, the entire assembly is heated to a temperature in excess of the melting temperature of the thin metal layer, the molten material is flowed out from between the mandrel and the starter tube, thereby facilitating extraction of the mandrel from the weld metal tubing.

Abstract: A silicon wafer bonding technique is described utilizing low pressures and a dissolvable gas to substantially eliminate voids formed between the bonding surfaces of two wafers.