Abstract: Method for producing a component system having a first component with a first component portion and a second component with a second component portion, including the following steps: connecting, in particular welding or soldering, the first component portion, which consists of an aluminum alloy, to the second component portion, which in particular consists of a naturally aged aluminum alloy, a copper alloy or an iron alloy, in particular a steel alloy, so as to form a connection seam; artificially aging the connection seam such that the yield strength of the connection seam is above the yield strength of the first component portion and/or of the second component portion; and deforming, in particular deep-drawing and/or stretch-drawing, the component system.

Abstract: A semiconductor device according to an embodiment includes a lead frame, a semiconductor chip provided above the lead frame, and a bonding material including a sintered material containing a predetermined metal material and a predetermined resin, where the bonding material includes a first portion provided between the lead frame and the semiconductor chip, and a second portion provided on the lead frame around the semiconductor chip, where the bonding material bonds the lead frame and the semiconductor chip, wherein an angle formed by a lower face of the semiconductor chip and an upper face of the second portion adjacent to the lower face is 80 degrees or less.

Abstract: A semiconductor device according to an embodiment includes a lead frame, a semiconductor chip provided above the lead frame, and a bonding material including a sintered material containing a predetermined metal material and a predetermined resin, where the bonding material includes a first portion provided between the lead frame and the semiconductor chip, and a second portion provided on the lead frame around the semiconductor chip, where the bonding material bonds the lead frame and the semiconductor chip, wherein an angle formed by a lower face of the semiconductor chip and an upper face of the second portion adjacent to the lower face is 80 degrees or less.

Abstract: Reliability of a semiconductor device is improved. For this, embodied is a basic idea that a semiconductor chip (CHP1) mounted on an Ag layer (AGL) is fixed by using a temporarily fixing material (TA) having tackiness without forming the temporarily fixing material (TA) on a surface of the Ag layer (AGL) having a porous structure as much as possible, is realized. More specifically, the temporarily fixing material (TA) is supplied so as to have a portion made in contact with a chip mounting part (TAB), and the semiconductor chip (CHP1) is also mounted on the Ag layer (AGL) so that one portion of a rear surface of the semiconductor chip (CHP1) is made in contact with the temporarily fixing material (TA).

Abstract: A brazing process and plate assembly are disclosed. The brazing process includes positioning a braze foil on a first workpiece, then securing the braze foil to the first workpiece to form a brazable component, then positioning a second workpiece proximal to the brazable component, and then brazing the second workpiece to the brazable component. Additionally or alternatively, the brazing process includes positioning the braze foil on a tube, then securing the braze foil to the tube to form a brazable tube, then positioning a plate of a plate assembly proximal to the brazable tube, and then brazing the plate to the brazable tube. The plate assembly includes a plate and a tube brazed to the plate by a braze foil secured to the tube.

Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.

Abstract: A method of bonding superalloys is provided. The method includes: aligning a first superalloy subcomponent having a gamma-prime solvus g?1 and a second superalloy subcomponent having a gamma-prime solvus g?2, with a filler material that includes at least 1.5 wt % boron disposed between the first and second superalloy subcomponents; performing a first heat treatment at a temperature T1, where T1 is above the solidus of the filler material and below the liquidus of the filler material; and performing a second heat treatment at a temperature T2, where T2 is greater than T1, and where T2 is greater than or equal to the lower of g?1 and g?2.

Abstract: According to one aspect of the invention, a method for assembling a turbine includes placing a middle layer between a first and second outer member, wherein the middle layer includes a non-continuous layer of material and the first and second outer members each include a member of continuous material and welding a primary joint between the middle layer, first outer member and second outer member, the primary joint extending through the first outer member, the middle layer and at least a portion of the second outer member. The method also includes welding a secondary joint between the middle layer and first outer member, the secondary joint extending through the first outer member and at least a portion of the middle layer.

Abstract: A method and a device for controlling a thermal cycle of a weld joining one end of a first strip to an end of a second strip, suited to a joining machine of a strip treatment plant. The control device includes connections intended to connect the control device to a central automation system of the strip treatment plant and to the joining machine respectively, so as respectively to allow an exchange of at least one strip data item and an exchange of at least one operating data item. A computer is capable of computing, from the strip and operating data items, at least one thermal parameter of the weld. A weld control and characterization device is capable of controlling the welding as a function of the thermal parameter.

Abstract: Disclosed is an apparatus for determining an alignment of a bondhead of a die bonder relative to a workchuck. Specifically, the apparatus comprises: i) a sensor configured to measure a distance between the bondhead and the sensor; and ii) a positioning device coupled to the sensor, the positioning device being configured to position the sensor relative to a plurality of locations on the bondhead facing the sensor. In particular, the sensor is operative to measure a set of distances between each of the plurality of locations on the bondhead and the sensor, the set of distances being for determining the alignment of the bondhead. A method of determining an alignment of a bondhead of a die bonder relative to a workchuck is also disclosed.

Abstract: Two pipes are arranged end to end, the pipes being shaped such that a groove is defined between the ends of the pipe. A plurality of welding torches are used to weld in the groove, such that at least some of the welding torches perform a first welding pass, the welding characteristics of the torches are adjusted and at least some of the welding torches are used to perform a second welding pass. At least one torch welds in a first sector in the first welding pass and a second sector in the second welding pass, the second sector being different to the first. The sectors might overlap or might not overlap.

Abstract: The present invention relates to a method of brazing articles of stainless steel, which method comprises the following steps: step (i) applying an iron-based brazing filler material to parts of stainless steel; step (ii) optionally assembling the parts; step (iii) heating the parts from step (i) or step (ii) to a temperature of at least about 1000° C. in a non-oxidizing atmosphere, a reducing atmosphere, vacuum or combinations thereof, and heating the parts at the temperature of at least about 1000° C. for at least about 15 minutes; step (iv) providing articles having an average hardness of less than about 600 HV1 of the obtained brazed areas. The present invention relates also to brazed articles of stainless steel.

Abstract: A method for producing a metal sheet with a welded-on tube which has at least partially curved sections, wherein the tube is guided by at least one guide element onto the sheet, is pressed thereon with at least one pressure element and is welded thereto at least at some points and wherein the tube is bent to form the curved sections. In order to achieve the welding-on in a simple manner even in the curved sections, it is provided that a bending is carried out in a plurality of discrete steps, wherein in individual steps firstly the tube with the at least one guide element is bent around a last created welding point and thereafter a new welding point is created. Furthermore, the invention relates to a device for carrying out the method.

Abstract: The invention concerns a method for manufacturing a steel component (6, 11) comprising a first steel part (7) and a second steel part (8), the first (7) and second (8) steel part having a carbon content up to 1.5 weight percent, The method is comprising: Heating (1), at least partly, the first steel part (7), and at least partly, the second steel part (8), to above the alpha/gamma transformation temperature, and joining (2) the first steel part (7) and the second steel part (8) by welding, the welding taking place at a temperature above the alpha/gamma transformation temperature, and cooling (3) such that hardening effects are avoided. The invention further concerns weld seams (9), welded steel components (6, 11), and bearing components (11, 15, 20, 22, 26, 27, 31).

Abstract: A method includes bonding a first bond layer to a second bond layer through eutectic bonding. The step of bonding includes heating the first bond layer and the second bond layer to a temperature higher than a eutectic temperature of the first bond layer and the second bond layer, and performing a pumping cycle. The pumping cycle includes applying a first force to press the first bond layer and the second bond layer against each other. After the step of applying the first force, a second force lower than the first force is applied to press the first bond layer and the second bond layer against each other. After the step of applying the second force, a third force higher than the second force is applied to press the first bond layer and the second bond layer against each other.

Abstract: An intermediary (such as a web reverse proxy), which is located between a web browser and one or more backend applications, manages cookies that are provided by the backend applications and returned to the web browser during a user session. The intermediary decides which cookies should be sent to the browser and which cookies should be stored therein. Preferably, this determination is made in an automated manner by examining the response for any cookie-dependent code (e.g., scripting) included in the response.

Abstract: A soldering apparatus for connecting solar cells includes an induction heat source to connect cell conducting tracks, provided with soldering medium, with electric conductors. The heat source has a high-frequency generator and an inductor loop in which the flow of a high-frequency current causes a high-frequency magnetic field to induce in the conducting track and in the electric conductor arranged along the conducting track eddy currents that generate the heat that is necessary for the soldering operation. The U-shaped inductor loop has narrowings and widenings that serve to optimize the heat development in the soldering zone and thus also save energy. Each widening affords access to the soldering point for a magnetic-field-neutral pressure foot that presses the conductor onto the conducting track. The inductor loop extends the entire length of the conducting track of the cell upper and lower sides to solder to the conductor in one soldering operation.

Abstract: A concentrated photovoltaic receiver and backplane assembly is described herein. A thermally conductive heat spreader is configured between the receiver and the backplane for dissipating at least a portion of the thermal energy in a direction including a horizontal component towards a portion of the heat spreader which is not directly in contact with a receiver portion. In some embodiments, the heat spreader is electrically conductive and is adapted for conducting current from the receiver to the backplane. In some embodiments, a surface area of a receiver substrate is less than 5 times larger than a surface area of a solar cell that is mounted onto the receiver substrate. In some embodiments, the receiver substrate comprises vias for conducting current from a top face to a bottom face of the receiver.

Abstract: Method for producing coated assembly parts for chemical device elements including the following series of steps: (a) the formation of an initial assembly including a steel support part, typically a plate, a zirconium or zirconium alloy coating, typically a sheet having dimensions similar to those of the steel plate, and at least one brazing material between the support part and the coating, wherein said brazing material is an alloy including silver and copper; (b) the insertion of the initial assembly into a brazing chamber with a controlled atmosphere; (c) the formation of a controlled atmosphere in said chamber; (d) the reheating of said assembly to a temperature at least equal to the melting temperature of said brazing material; wherein, prior to the formation of said initial assembly, the deposition of a titanium or titanium alloy layer on said zirconium (or zirconium alloy) coating is performed, and in that said coating is placed so that its titanium- or (titanium alloy-) coated surface is in contact w

Abstract: A metal joining system having a first burner assembly configured to selectively heat a first zone and an assembly support at least partially vertically lower than at least a portion of the first heat zone and a first hood vertically above at least a portion of the assembly support.

Abstract: A joint apparatus of the present invention includes: a pre-thermal processing unit including a first thermal processing plate mounting and thermally processing a superposed substrate where substrates are superposed on each other with joint portions of the substrates in contact with each other, and a first pressure reducing mechanism; a joint unit including a second thermal processing plate mounting and thermally processing the superposed substrate processed in the pre-thermal processing unit, a pressurizing mechanism pressing the superposed substrate on the second thermal processing plate toward the second thermal processing plate side, and a second pressure reducing mechanism; and a post-thermal processing unit including a third thermal processing plate mounting and thermally processing the superposed substrate processed in the joint unit, and a third pressure reducing mechanism, wherein each of the pre-thermal processing unit and the post-thermal processing unit is hermetically connected to the joint unit.

Abstract: A manufacturing method of a forged golf club head has acts of: providing pre-forged strike element and the pre-forged hosel made with different materials, welding the hosel on a connecting end of the strike element, and press-forging the blank to form a main component of the golf club head. The main component of the golf club head may accomplish the golf club head. Otherwise, a pre-forged secondary component is welded on a back part of the strike face of the main component to accomplish the golf club head. The strike element and the hosel made of different materials are directly secured to each other to precisely form a predetermined, shape so that the following surface treating steps and the manufacturing time are reduced and the quality of the golf club head is enhanced.

Abstract: A method of performing primary solder bonding of a semiconductor chip to an organic interposer, and secondary solder bonding of the organic interposer to a motherboard and a 3-dimension stacked assembly structure formed by the method thereof. The method includes: providing on the organic interposer, a first solder bump, where the first solder bump has a solder material of a relatively high melting point stacked on a solder material of a relatively low melting point; heating the first solder material to a first temperature that melts the solder material of a relatively low melting point but does not melt the solder material of a relatively high melting point; sealing, using an underfill material, the gap between the semiconductor chip and the organic interposer; and heating the first solder bump to a second temperature that melts the solder material of a relatively high melting point.

Abstract: A structural member comprising at least two aluminum alloy parts displaying different property balances, said at least two parts being welded and wherein one of said parts either is (i) selected from an aluminum alloy different from the other of said at least two parts and/or (ii) is selected from an initial temper different from the other of said at least two parts, and wherein at least one of said at least two parts has been pre-aged prior to being welded, and, wherein said structural member has undergone a post-welding thermal treatment conferring a final temper to each of said at least two parts. The parts are advantageously welded by friction stir welding. Another subject of the invention is a method for manufacturing a structural member.

Abstract: A solder apparatus includes a platform, an operating mechanism, a solder member, a heater, and a control box module. The control box module includes a temperature controller and a temperature sensor. The temperature controller defines a predetermined temperature. The temperature sensor is capable of measuring the temperature of the solder member. The temperature controller has the heater heat the solder member when the measured temperature of the solder member is lower than or equal to the predetermined temperature, and has the heater stop heating the solder member, when the measured temperature of the solder member is higher than the predetermined temperature.

Abstract: A bonding apparatus includes a thermal treating unit and a bonding unit that are integrally bonded together. The thermal treating unit includes a first thermal treating plate for supporting and thermally processing a superimposed substrate. The bonding unit includes a second thermal treating plate for supporting and thermally processing the superimposed substrate processed in thermal treating unit, and a pressing mechanism for pressing the superimposed substrate against the second thermal treating plate. The first thermal treating plate includes a cooling mechanism for cooling the superimposed substrate placed on the first heating plate. Each unit can depressurize the internal atmosphere to a specified degree of vacuum. The thermal treating unit has a plurality of carrying mechanisms for conveying the wafers between the two units.

Abstract: A reflow method for solder includes heating the solder to a first temperature that is above a liquidus temperature of the solder; cooling the solder to a second temperature that is below a solidification temperature of the solder; reheating the solder to a third temperature that is above a solidus temperature of the solder and below the liquidus temperature of the solder; cooling the solder to a fourth temperature that is below the solidification temperature of the solder.

Abstract: A welding method is provided for forming a weld joint between first and second elements of a workpiece. The method includes heating the first and second elements to form an interface of material in a plasticized or melted state interface between the elements. The interface material is then allowed to cool to a plasticized state if previously in a melted state. The interface material, while in the plasticized state, is then mixed, for example, using a grinding/extruding process, to remove any dendritic-type weld microstructures introduced into the interface material during the heating process.

Abstract: Electronic assemblies with solder containment brackets are provided. A solder containment bracket may have a planar base and a vertically extending wall. The wall may protrude upwards from the base to form an enclosed region. The base may have a hole that corresponds to the shape of the enclosed region. The wall may have an opening. A wire may be inserted into the opening. The wire may be soldered to the solder containment bracket to form a solder joint that electrically connects the wire to the bracket. The solder joint formed within the enclosed region may have a size that is defined by the bracket wall. The solder containment bracket may be soldered to a solder pad on a printed circuit board by reflowing a layer of solder paste.

Abstract: In a method of manufacturing an article (28) by diffusion bonding and superplastic forming stop off material (122) is applied to prevent diffusion bonding in a predetermined pattern on a first surface (106) of a first metal workpiece (100) and the predetermined pattern is spaced from the edges of the first surface (106) of the first metal workpiece (100). Stop off material (124) to prevent diffusion bonding is applied in a predetermined position on the first surface (106) of the first metal workpiece (100) and the predetermined position extends from the predetermined pattern of stop of material (122) on the first surface (106) of the first metal workpiece (100) towards one edge of the first surface (106) of the first metal workpiece (100).

Abstract: A welding apparatus is provided for forming a weld joint between first and second elements of a workpiece. The apparatus heats the first and second elements to form an interface of material in a plasticized or melted state interface between the elements. The interface material is then allowed to cool to a plasticized state if previously in a melted state. The interface material, while in the plasticized state, is then mixed, for example, using a grinding/extruding mixer, to remove any dendritic-type weld microstructures introduced into the interface material during heating.

Abstract: The present invention includes a step of cooling a molten metal within a fine space present in the inside of an object and hardening it while applying a forced external force exceeding atmospheric pressure to the molten metal. The fine space is opened on the outer surface of the object in terms of one end thereof. The forced external force is given by at least one member selected among a pressing pressure, an injection pressure and a rolling compaction and applied to the molten metal from the opening surface side on which the fine space is opened, in a state that the other end side of the fine space is closed.

Abstract: An object of the present invention is to provide a composition of a sintering Ag paste which can metallically bond to a nonprecious metal member with high strength as well as to a precious metal member, in a sintering Ag paste which metallically bonds to a metal at a low temperature, and to provide a bonding method to obtain a joint part having high strength. The sintering Ag paste is a material containing a solution of an organic silver complex that is easily decomposed by heat regardless of an atmosphere. Furthermore, the bonding method includes: metallizing a face of a nonprecious metal with Ag in a non-oxidizing atmosphere in a step prior to sintering Ag particles; and then sintering the Ag particles in an oxidizing atmosphere.

Abstract: An antenna resonating element may be mounted in an antenna cavity. The antenna resonating element may have a printed circuit board substrate with a patterned metal layer. Components may be soldered to the antenna resonating element using solder with a given melting point before soldering the antenna resonating element the antenna cavity using solder with a lower melting point. Solder widow openings may be formed in the antenna resonating element and antenna cavity to allow for application of solder paste. Engagement features and alignment structures may be used to align the antenna resonating element relative to the antenna cavity. The antenna cavity may have a curved opening. The printed circuit board substrate may be bent to the shape of the curved opening before soldering components to the printed circuit board. An elastomeric fixture may be used to hold the antenna resonating element to the cavity during soldering.

Abstract: A unique heat treat method for relieving stresses caused by a repairing weld joint in a full hoop part heat treats locally, at the location of the weld joint, and at a diametrically opposed location. By providing the diametrically opposed heat treat location, the present invention relieves stresses caused by the weld joint, without creating any additional residual stress in the weld joint.

Abstract: A welding method and apparatus are provided for forming a weld joint between first and second elements of a workpiece. The method includes heating the first and second elements to form an interface of material in a plasticized or melted state interface between the elements. The interface material is then allowed to cool to a plasticized state if previously in a melted state. The interface material, while in the plasticized state, is then mixed, for example, using a grinding/extruding process, to remove any dendritic-type weld microstructures introduced into the interface material during the heating process.

Abstract: This invention relates to a method for producing components with internal architectures, and more particularly, this invention relates to a method for producing structures with microchannels via the use of diffusion bonding of stacked laminates. Specifically, the method involves weakly bonding a stack of laminates forming internal voids and channels with a first generally low uniaxial pressure and first temperature such that bonding at least between the asperites of opposing laminates occurs and pores are isolated in interfacial contact areas, followed by a second generally higher isostatic pressure and second temperature for final bonding. The method thereby allows fabrication of micro-channel devices such as heat exchangers, recuperators, heat-pumps, chemical separators, chemical reactors, fuel processing units, and combustors without limitation on the fin aspect ratio.

Abstract: Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed.

Abstract: Two pipes are arranged end to end, the pipes being shaped such that a groove is defined between the ends of the pipe. A plurality of welding torches are used to weld in the groove, such that at least some of the welding torches perform a first welding pass, the welding characteristics of the torches are adjusted and at least some of the welding torches are used to perform a second welding pass. At least one torch welds in a first sector in the first welding pass and a second sector in the second welding pass, the second sector being different to the first. The sectors might overlap or might not overlap.

Abstract: A method of manufacturing a ceramic/metal composite structure includes the steps of: performing a multi-stage pre-oxidizing process on the copper sheet; placing the copper sheet on a ceramic substrate; and heating the copper sheet and the ceramic substrate to a joining temperature to join the copper sheet and the ceramic substrate together to enhance interface strength between the copper sheet and the ceramic substrate according to the multi-stage pre-oxidizing process. The multi-stage pre-oxidizing process includes a first stage of pre-oxidizing process and a second stage of pre-oxidizing process, and the first and second stages of pre-oxidizing processes are performed in atmospheres with different oxygen partial pressures and at different temperatures.

Abstract: A method for manufacturing a down hole cutting tool, wherein the cutting tool includes a cutting element support structure having at least one cutter pocket formed therein to support a cutting element comprising a substrate and an ultrahard layer, wherein the method includes inserting a base portion of the cutting element into the cutter pocket; locating a first braze alloy such that when heated the first braze alloy melts and fills a space in the cutter pocket between the cutting element and the cutting element support structure adjacent the ultrahard layer; locating a second braze alloy such that when heated the second braze alloy melts and fills a space in the cutter pocket between the cutting element and the cutting element support structure non-adjacent the ultrahard layer; and heating the first and second braze alloy such that they melt.

Abstract: A brazing composition for the brazing of superalloys including a base material with at least one initial phase is provided. The initial phase has a solidus temperature that is below the solidus temperature of the base material and, above a certain temperature, forms with the base material and/or with at least one further initial phase at least one resultant phase, the solidus temperature of which is higher that the solidus temperature of the initial phases. Heat treatment takes place in two stages, wherein the temperature of the second heat treatment is preferably 800-1200° C. The brazing composition may likewise be of the type MCrAlX, and the power particles of the initial phase may be in the form of nanoparticles.

Abstract: A device includes (a) radiation detector including a semiconductor substrate having opposing front and rear surfaces, a cathode electrode located on the front surface of said semiconductor substrate, and a plurality of anode electrodes on the rear surface of said semiconductor substrate, (b) a printed circuit board, and (c) an electrically conductive polymeric film disposed between circuit board and the anode electrodes. The polymeric film contains electrically conductive wires. The film bonds and electrically connects the printed circuit board and anode electrodes.

Abstract: In soldering processes according to prior art, there is often an insufficient tie-up to a substrate of a component. A method in which no voids occur during the soldering processes is provided. A temperature pattern is proposed according to the method in which the temperature is lowered successively during the soldering operation.

Abstract: A welded component includes at least one high temperature segment of a high alloy Cr steel with high creep strength and a low temperature segment of a low alloy steel with high toughness and/or a high yield strength which are connected materially to one another via a weld joint. In one such component a gradual transition of chemical, physical and mechanical properties in the joining area is achieved in that between the weld joint and the high temperature segment there are at least two successive clad layers of at least two lower alloy weld metals with a total content of elements which increase the creep strength, such as for example Cr, Mo, W and V, which total content decreases toward the weld joint, and/or an increasing total content of elements which increase the toughness and/or yield strength, such as for example Ni and Mn, which total content increases toward the weld joint.

Abstract: A reflow process is provided for multiple units which improves productivity. A reflow furnace is moved along a transport direction of a tape substrate and is fixed at a position matching the product pitch of a circuit substrate. Any of a plurality of heating blocks and cooling blocks are matched to the product pitches of the circuit substrate. By doing so, it is possible to continuously carry out the reflow process for a tape substrate on which circuit substrates having different product pitches are arranged.

Abstract: There are provided reflow apparatuses and a methods therefor. In some embodiments, a reflow apparatus includes a first heating unit capable of heating a solder on a substrate up to just below before a melting point of the solder at ambient pressure such that the solder on the substrate is melted and electronic components mounted on the substrate are then soldered to the substrate; and a second heating unit connected to the first heating unit, the second heating unit capable of heating the solder on the substrate heated in the first heating unit through at least a portion of a solder melting temperature range in a vacuum state.

Abstract: To improve the quality of the products that are manufactured by soldering, through enabling highly reliable soldering while suppressing damages to the bonding targets caused due to the soldering. Provided is a soldering method for bonding each of bonding pads formed in respective bonding targets with solder. The method comprises: a bonding target placing step for placing each of bonding targets to a bonding position; a soldering step for placing solder between each of the bonding pads formed in each of the bonding targets, and for performing soldering by irradiating a heating beam to the solder; and a bonding target heating step for heating at least one of the bonding targets, which is executed before the soldering step and/or simultaneously with the soldering step.

Abstract: A method and apparatus for soldering interconnectors to photovoltaic cells that, after soldering, prevents bending of the photovoltaic cells due to heat warping caused by heat contraction of the lead wires. The interconnectors are positioned at predetermined positions on the photovoltaic cell, the interconnectors and the photovoltaic cells are held tightly together, and the solder is melted as the photovoltaic cells are heated, after which the photovoltaic cells are sequentially cooled in the long direction of the interconnectors with cold blasts from the end of the photovoltaic cells in the long direction of the interconnector.

Abstract: The present invention provides a method for welding and heat-treating seam-welded constructions of hardenable steel and ferrous alloys with reduced weld-zone hardness and improved weld-zone ductility and toughness. This method consists of controlling the cooling rate of the seam weld with a secondary heat source, applied after the weld cools below the materials upper critical temperature (AC3), but prior to the weld cooling to ambient temperature. This invention is particularly suited to the production of high strength hardenable alloy seam-welded pipe and tubing.