Abstract: A water-based organic solderability preservative includes (A) an imidazole compound, (B) an organic acid, (C) a complex coating formation aid, (D) an organic solvent and (E) water. The component (D) (organic solvent) has a solubility to water of 10 g/100 g or more at 20 degrees C. and a boiling temperature in a range from 100 degrees C. to 300 degrees C.

Abstract: The present invention relates to an impeller manufacturing method in which a thermal cycle is performed on an assembly body with a brazing material formed of a Ni-containing Au alloy being placed at a bond portion of at least two impeller constituent members. The thermal cycle includes a temperature increasing process with a temperature increasing rate of 20° C./hr. to 100° C./hr., the process including a first intermediate retention and a second intermediate retention each keeping the temperature, the first intermediate retention performed in a temperature range of 500° C. to 850° C. and the second intermediate retention performed in a temperature range of 850° C. to 950° C. (but not including 850° C.). In the thermal cycle, the temperature is increased in a temperature range exceeding 950° C. after the second intermediate retention at a rate lower than that before the second intermediate retention.

Abstract: A brazing process and plate assembly are disclosed. The brazing process includes positioning a braze foil on a first workpiece, then securing the braze foil to the first workpiece to form a brazable component, then positioning a second workpiece proximal to the brazable component, and then brazing the second workpiece to the brazable component. Additionally or alternatively, the brazing process includes positioning the braze foil on a tube, then securing the braze foil to the tube to form a brazable tube, then positioning a plate of a plate assembly proximal to the brazable tube, and then brazing the plate to the brazable tube. The plate assembly includes a plate and a tube brazed to the plate by a braze foil secured to the tube.

Abstract: A welding method of applying energy to an interface where a metal glass and a crystalline metal make contact with each other or to the metal glass near the interface, heating and melting the metal glass to form a molten layer, and joining the metal glass and the crystalline metal. The metal glass has a glass formation ability in which a nose time of a TTT curve when a solid of the metal glass is reheated is 0.2 seconds or more. The metal glass and the crystalline metal are formed with a material that satisfies a temperature range of a temperature of the metal glass at which a spread factor of the crystalline metal that has not been melted and the molten metal glass is 25% or more and a melting point of the crystalline metal to be 100 K or more.

Abstract: A method of bonding superalloys is provided. The method includes: aligning a first superalloy subcomponent having a gamma-prime solvus g?1 and a second superalloy subcomponent having a gamma-prime solvus g?2, with a filler material that includes at least 1.5 wt % boron disposed between the first and second superalloy subcomponents; performing a first heat treatment at a temperature T1, where T1 is above the solidus of the filler material and below the liquidus of the filler material; and performing a second heat treatment at a temperature T2, where T2 is greater than T1, and where T2 is greater than or equal to the lower of g?1 and g?2.

Abstract: The present invention relates to a method of brazing articles of stainless steel, which method comprises the following steps: step (i) applying an iron-based brazing filler material to parts of stainless steel; step (ii) optionally assembling the parts; step (iii) heating the parts from step (i) or step (ii) to a temperature of at least about 1000° C. in a non-oxidizing atmosphere, a reducing atmosphere, vacuum or combinations thereof, and heating the parts at the temperature of at least about 1000° C. for at least about 15 minutes; step (iv) providing articles having an average hardness of less than about 600 HV1 of the obtained brazed areas. The present invention relates also to brazed articles of stainless steel.

Abstract: The invention concerns a method for manufacturing a steel component (6, 11) comprising a first steel part (7) and a second steel part (8), the first (7) and second (8) steel part having a carbon content up to 1.5 weight percent, The method is comprising: Heating (1), at least partly, the first steel part (7), and at least partly, the second steel part (8), to above the alpha/gamma transformation temperature, and joining (2) the first steel part (7) and the second steel part (8) by welding, the welding taking place at a temperature above the alpha/gamma transformation temperature, and cooling (3) such that hardening effects are avoided. The invention further concerns weld seams (9), welded steel components (6, 11), and bearing components (11, 15, 20, 22, 26, 27, 31).

Abstract: A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

Abstract: Cobalt-based solder alloys are proposed. The cobalt-based solder alloys have germanium. The germanium has a higher melting point than nickel-based alloys such that the germanium is used advantageously for repairing or treating components having the nickel-based alloys used at high temperatures. The components are repaired or treated by soldering using the cobalt-based solder alloys.

Abstract: The invention relates to a method for assembling at least one part made of a porous carbon material with at least one part made of a copper-rich metal material, and to an alloy paste used to implement same. The method according to the invention includes a step comprising the use of an alloy based on copper and silicon, having formula I CuxSiy, wherein x and y are atomic percentages with 25?x?60, 40?y?75 and x+y?95%, in order to assemble at least one part made of a porous carbon material with at least one part made of a copper-rich metal material. The invention is particularly suitable for use in the field of thermal engineering.

Abstract: The present disclosure generally relates to methods of using active braze techniques on beta-alumina. In some specific embodiments, the present disclosure relates to a method of sealing a portion of beta-alumina electrolyte, insulated collar and metal rings of a sodium-based thermal battery.

Abstract: A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

Abstract: The present invention relates to an impeller manufacturing method in which a thermal cycle is performed on an assembly body with a brazing material formed of a Ni-containing Au alloy being placed at a bond portion of at least two impeller constituent members. The thermal cycle includes a temperature increasing process with a temperature increasing rate of 20° C./hr. to 100° C./hr., the process including a first intermediate retention and a second intermediate retention each keeping the temperature, the first intermediate retention performed in a temperature range of 500° C. to 850° C. and the second intermediate retention performed in a temperature range of 850° C. to 950° C. (but not including 850° C.). In the thermal cycle, the temperature is increased in a temperature range exceeding 950° C. after the second intermediate retention at a rate lower than that before the second intermediate retention.

Abstract: A method of producing or repairing single-crystalline turbine or engine components by the following steps: heating of braze filler metal to a temperature which is greater than or equal to the melting temperature of the braze filler metal; introducing the molten mass of the braze filler metal produced through the heating process into a crack formed in the turbine or engine component, or into the gap formed between two turbine or engine components, or into a damaged area of a turbine or engine component; and non-isothermal control or regulation of the temperature of the braze filler metal or turbine or engine component during an epitaxic solidification process of the braze filler metal.

Abstract: The present disclosure concerns a method for assembling aluminum alloy parts, in which (i) at least a first aluminum alloy part is procured in a solution heat treated, quenched, optionally cold worked, and naturally aged at ambient temperature or pre-aged temper, and at least a second aluminum alloy part, (ii) said parts are welded to obtain a welded assembly having a welded zone, (iii) cold working the entire welded zone between 0.3% and 5% is performed, (iv) the welded assembly thus cold worked undergoes post-weld aging to obtain a final metallurgical temper.

Abstract: An array of solder balls is attached to solder pads of one of a first substrate and a second substrate. After aligning the array of solder balls relative to solder pads of the other of the first substrate and the second substrate, a thermal-mass-increasing fixture is placed on a surface of the second substrate to form an assembly of the first substrate, the second substrate, and the array of the solder balls therebetween, and the thermal-mass-increasing fixture. The thermal-mass-increasing fixture is in physical contact with at least a surface of a periphery of the second substrate. The thermal-mass-increasing fixture reduces the cool-down rate of peripheral solder balls after a reflow step, thereby increasing time for deformation of peripheral solder balls during the cool-down and reducing the mechanical stress on the solder balls after the cool-down.

Abstract: A method for manufacturing a module with a hollow area by hot isostatic compression, including: making an assembly including superposed elements defining the hollow area, the assembly forming a sealed casing containing the hollow area, including at least one meltable obturation member separating the hollow area from the outside of the assembly; followed by hot isostatic compression of the assembly, to obtain diffusion-welding of its elements, by letting temperature and pressure conditions change over time to cause a rupture of the meltable obturation member allowing pressurization gas to penetrate into the hollow area.

Abstract: A Sn—Ag bonding and a method thereof are revealed. By means of a bonding layer formed by tin and silver between wafers, the stress released by diffusion and bonding between tin(Sn) and silver(Ag) is larger than the stress released by diffusion and bonding of conventional gold-silver bonding. Moreover, a Sn—Ag bonding method of the present invention forms Sn—Ag bonding at low temperature and releases more stress so as to reduce thermal stress generated during wafer bonding effectively. And after wafer bonding, the high temperature processes can be performed.

Abstract: A process for producing a semiconductor device, includes: first melting by heating only a superior portion of a bump formed on an electrode on one principle surface of a semiconductor substrate; and second melting the entire bump by also heating an inferior portion of the bump.

Abstract: A method for forming bumps 19 on electrodes 32 of a wiring board 31 includes the steps of: (a) supplying a fluid 14 containing conductive particles 16 and a gas bubble generating agent onto a first region 17 including the electrodes 32 on the wiring board 31; (b) disposing a substrate 40 having a wall surface 45 formed near the electrodes 32 for forming a meniscus 55 of the fluid 14, so that the substrate 40 faces the wiring board 31; and (c) heating the fluid 14 to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.

Abstract: Disclosed herein is an electronic apparatus produced using a high-temperature lead-free solder alloy which makes it possible to form soldered joints having no variations in strength and which has an excellent balance between strength and solderability. The lead-free solder alloy is an alloy which is made of an element A and an element B and which has a composition composed of AmBn being a stable phase and the element B in an equilibrium state at room temperature. When the lead-free solder alloy is solidified by quenching, the element A is dissolved in a room-temperature stable phase of the element B so that a supersaturated solid solution is formed, and when melted for soldering and then solidified, the alloy returns to its equilibrium state and has a composition composed of the stable phase AmBn and the element B and therefore maintains strength due to the presence of the stable phase AmBn even when reheated to a soldering temperature.

Abstract: A method for brazing a metallic honeycomb body (1) for exhaust gas treatment, includes at least: a) pretreatment of a honeycomb body (1) at a temperature above 400° C.; b) cooling the honeycomb body (1); c) brazing the honeycomb body (1) at a temperature in a range of from 1050° C. to 1100° C. under atmospheric pressure; and d) cooling the honeycomb body (1). A suitable apparatus for carrying out the method is also provided.

Abstract: A method of fabrication of a rocket engine nozzle assembly using pressure brazing generally includes initially assembling a rocket engine nozzle liner into a rocket engine nozzle jacket for a rocket engine nozzle assembly. The rocket engine nozzle assembly may then be sealed. Prior to pressure brazing the rocket engine nozzle assembly, pressure brazing parameters may be determined. The pressure brazing may be performed with the determined pressure brazing parameters to complete the fabrication of the rocket engine nozzle. The rocket engine nozzle assembly may include a rocket engine nozzle jacket and a rocket engine nozzle liner having a plurality of channels, with the space between each channel defining a land, and the rocket engine nozzle liner having at least a pair of endlands disposed at each end thereof. The rocket engine nozzle liner is bonded to the rocket engine nozzle jacket by the endlands being bonded to the nozzle jacket and the lands being pressure brazed to the nozzle jacket.

Abstract: A method in which no voids occur during the soldering processes is provided. A component with a soldering material is heated using a first temperature plateau for a first time duration such that the solder material is completely melted. Each subsequent heating is at a temperature plateau with a temperature that is lower than a temperature of the previous plateau.

Abstract: To form high performance bonding connections suitable for producing micro-structured components made of a plurality of individual layers, bonding by the steps; providing at least two work pieces; forming a metal bonding layer on at least one side of at least one of said at least two work pieces by chemical or electrolytic metal plating method; the metal bonding layer being a nickel/phosphorous alloy having a prescribed phosphorous content and prescribed thickness; forming a bonding arrangement comprising said work pieces so that there is at least one metal bonding layer between said at least two respective work pieces; heating at a prescribed heating rate to a temperature above the melting temperature of the bonding layer; bonding the two work pieces by applying contact pressure within a prescribed range; and cooling at a prescribed rate.

Abstract: A method of producing an electro-optical device for electrically connecting a first terminal portion provided on an electro-optical panel to a second terminal portion of a substrate includes applying an anisotropic conductive adhesive containing conductive particles made of a low-melting-point material onto either the first terminal portion or the second terminal portion, and electrically connecting the first terminal portion to the second terminal portion by eutectic bonding by melting the conductive particles by application of heat in thermocompression bonding of the second terminal portion to the first terminal portion with the anisotropic conductive adhesive therebetween.

Abstract: A method of forming a bonded body comprised of a first base member, a second base member, and a first bonding film and a second bonding film provided between the first base member and the second base member is provided. The first bonding film and the second bonding film are constituted of copper and an organic component, and an amount of copper contained in each of the first bonding film and the second bonding film is 80 atom % or higher but lower than 90 atom % at an atomic ratio.

Abstract: A method of forming a bonded body comprised of a first base member, a second base member, and a first bonding film and a second bonding film provided between the first base member and the second base member is provided. The first bonding film and the second bonding film are constituted of copper and an organic component, and an amount of copper contained in each of the first bonding film and the second bonding film is 90 atom % or higher but lower than 99 atom % at an atomic ratio.

Abstract: The present invention relates to a method and device (10) for the temperature treatment of workpieces (19) or components, in particular for producing a solder connection between a solder material and at least one component or workpiece used as a solder material carrier by means of melting the solder material arranged on the solder material carrier, where a heating and, in a subsequent method step, a cooling of at least one component is carried out in a process chamber (13, 14) which is sealed from the surrounding area, wherein the heating and the cooling of the component (19) are carried out in two chamber regions (13, 14) of the process chamber (12), which can be separated from one another by means of a condensation device (15).

Abstract: Method for producing a vacuum measuring cell having a pressure transducer diaphragm with housing plates sealed on opposite sides to form reference and measuring vacuum chambers. An opening in one plate communicates with the measuring vacuum chamber and has a sealed connection for joining to medium to be measured. The diaphragm and plates are aluminum oxide ceramic and at least one of the seals is aluminum with a thickness of 0.5 ?m to 30 ?m. The ceramic parts are pressed together at increased temperature of 600° C. to 680° C. in a process gas atmosphere including a reducing gas, during a time of 30 to 90 minutes, and subsequently a tempering step is carried out in a second process gas atmosphere including oxygen, tempering taking place at a temperature of 450° C. to 575° C. such that the metallic aluminum is oxidized into aluminum oxide.

Abstract: In soldering processes according to prior art, there is often an insufficient tie-up to a substrate of a component. A method in which no voids occur during the soldering processes is provided. A temperature pattern is proposed according to the method in which the temperature is lowered successively during the soldering operation.

Abstract: Methods and articles for receiving times and temperatures for stages of a profile including solder heating stages to rework a populated printed circuit board (PCB), the rework including removing a first integrated circuit (IC) from the PCB, focusing heat on the first integrated circuit using an oven element during rework of the PCB, collecting actual temperature information from a plurality of temperature sensing elements to detect actual temperature information associated with the first integrated circuit, and generating a suggested modification for an operator to modify the time and/or the temperature of at least one of the stages in the profile in response to a fail status indicating that the collected actual temperature information did not meet temperatures for a variable.

Abstract: A method of producing a conductive circuit board including imparting tackiness through the use of a tackiness-imparting compound to the surface of the conductive circuit on a printed wiring board, attaching a solder powder to the tacky area and then heating the printed wiring board to melt the solder to form a solder circuit. The characteristic feature of this method is that the tackiness-imparted printed wiring board is kept in a liquid, etc at not more than 10° C. before attaching the solder powder.

Abstract: To provide a pasty silver particle composition, which, upon heating, allows silver particles to be easily sintered to form solid silver possessing excellent strength, electric conductivity and thermal conductivity, and a production process of solid silver and the like. A pasty silver particle composition comprising nonspherical silver particles having an average particle diameter of 0.1 to 18 ?m and a carbon content of not more than 1.0% by weight and a volatile dispersion medium, wherein, upon heating, the volatile dispersion medium is volatilized and the nonspherical silver particles are sintered to one another to form solid silver. There are also provided a process for producing solid silver comprising heating the pasty silver particle composition, solid silver having excellent strength, electric conductivity and thermal conductivity, a method for joining a metallic member using the pasty silver particle composition, and a production process of a printed wiring board comprising silver wiring.

Abstract: A reflow process is provided for multiple units which improves productivity. A reflow furnace is moved along a transport direction of a tape substrate and is fixed at a position matching the product pitch of a circuit substrate. Any of a plurality of heating blocks and cooling blocks are matched to the product pitches of the circuit substrate. By doing so, it is possible to continuously carry out the reflow process for a tape substrate on which circuit substrates having different product pitches are arranged.

Abstract: A method for mounting a semiconductor chip onto a substrate the side of which facing towards the substrate is coated with an adhesive layer is characterised by the following steps: (1) Lowering the semiconductor chip until the semiconductor chip touches the substrate, (2) Waiting a predetermined period of time during which a force exerted on the semiconductor chip disappears or is at least comparatively small, and (3) Applying a bond force.

Abstract: A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another.

Abstract: When aluminium products are preheated in a preheating furnace up to about 500° C. before they are brazed with a flux in a heating furnace, a nitrogen atmosphere in the preheating furnace is made convectional by fans for improving heating efficiencies and also for having the oxygen which is brought into the preheating furnace as a disturbance thereof and scattered about in the nitrogen atmosphere, contacted to furnace inner walls of the preheating furnace which are made from carbonaceous materials, and reacted therewith so as to be changed to CO, resulting in keeping the oxygen concentration of nitrogen atmosphere low, whereby when the aluminium products are brazed by heating them in a continuous atmosphere furnace including said preheating furnace and said heating furnace, heating time thereof is shorten and the brazing is made more economically than before.

Abstract: A solder bump reflow process includes raising the temperature of an aligned die-substrate assembly to a temperature and for a time sufficient to cause a first reflow; allowing the temperature of the assembly to fall to a first cooling temperature and for a time sufficient to re-solidify the solder; raising the temperature of the die-substrate assembly a second time to a temperature and for a time sufficient to cause a second reflow; allowing the temperature of the assembly to fall a second time to a second cooling temperature and eventually to an ambient room temperature; in which at least the first and second melts and the first re-solidification are conducted without exposing the assembly to oxidizing atmosphere. Also, apparatus for carrying out the method includes a multi-zone oven.

Abstract: A method of welding age-hardenable aluminum alloys to improve strength properties in the heat affected zone and the weld zone, the method comprising the steps of providing precipitation hardenable aluminum alloy members to be welded and subjecting said members to a first aging step for times and temperatures to generated strengthening precipitates. Thereafter, the aged members are welded to provide a welded assembly having a weld zone. The welded members are subjected to a second aging step to reprecipitate strengthening precipitates dissolved in the weld zone.

Abstract: A method for producing aluminum-containing honeycomb bodies includes providing at least partly structured aluminum-based metal foils. The at least partly structured metal foils are stacked and/or wound to form a honeycomb structure having passages. The metal foils are heated from an open end face of the passages with at least one radiant heater. The honeycomb structure is heated in at least one subregion in such a way that the at least one subregion has a temperature between approximately 450° C. and approximately 600° C. after approximately 2 seconds to approximately 30 seconds. The metal foils are connected together in the at least one subregion by technical joining.

Abstract: A method and an apparatus are provided for mounting and removing electronic components using solder bumps while constraining thermal stresses to a substrate. The method and apparatus for mounting and removing an electronic component (bear chip 32) to be soldered onto the substrate with solder bumps 114 is configured to move the electronic component to detect contact of the solder bumps with the substrate or contact of a tool (chuck unit 38) with the electronic component, to define the contact as an original point for raising a heating temperature of the electronic component and the substrate from the heating temperature to a maximum heating temperature HTm as well as move the electronic component in conformity with the temperature rising, and to move the electronic component from a position where the maximum heating temperature is achieved to a mounting height of the substrate.

Abstract: A structure of solder joint structure formed of zinc-based lead-free solder having excellent characteristics is disclosed. Between a first lead-free solder layer and a soldering pad, the following layers are formed: a tin-copper alloy layer formed on the pad; a first alloy layer formed of second lead-free layer of which main ingredients are tin and silver; and a second alloy layer formed between the first alloy layer and the first lead-free solder. This structure allows forming the solder joint structure formed of zinc-based lead-free solder having high joint strength.

Abstract: A system and method for reflowing lead-free solder to interconnect a plurality of electronic components to a substrate is disclosed. The system includes an oven for preheating the substrate and the plurality of electronic components disposed thereon, and a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder.

Abstract: A bath apparatus 12 reserves a liquid 13 as a heating medium and includes an input partition bath 31, a first intermediate partition bath 32, a heat partition bath 33, a second intermediate partition bath 34 and a removing partition bath 35 that are divided by gates 21 through 24 and sequentially arranged in a direction in which a printed board assembly where components are loaded onto a printed board moves. The temperatures of liquids 13-31 and 13-32 in the input partition bath 31 and the first partition bath 32 are a preheating temperature. The temperature of a liquid 13-33 in the heat partition bath 33 is a soldering temperature. The gate 21 is gradually opened while the printed board assembly 11 is located in the first intermediate partition bath 32 and before the printed board assembly 11 is conveyed into the heat partition bath 33.

Abstract: There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material. In the flow soldering process, thermal efficiency of flow soldering is improved in preheating step and/or solder material supplying step thereof. In one aspect of the present invention, a heating cover is located above a preheater, and the flow soldering is conducted while the board passes between the heating cover and the preheater. In another aspect of the present invention, a gap between a preheater and a solder bath is 20 to 60 mm. In yet another aspect of the present invention, a distance between a primary wave and a secondary wave is not larger than 60 mm.

Abstract: The invention discloses design concepts and means and methods that can be used for enhancing the reliability and extending the operating life of electronic devices, and assemblies incorporating such devices, and substrates and/or PCBs, especially if such assemblies are exposed to severe environments such as thermal cycling or power cycling. The main thrust of the invention is to provide flexible joints, such as columns, between the attached components, and preferably to orient such joints, so that they would present their softest bending direction towards the thermal center or fixation point of the assemblies. Joints with rectangular or elongated cross-section are preferred, and they should be oriented so that the wide face of each joint would be facing the thermal center, perpendicular to the thermal deformation ray emanating from the thermal center towards the center of each respective joint. The concepts apply equally to leadless packages as well as to leaded packages.

Abstract: An electronic fabrication process and structure is provided for attaching discrete passive surface mount devices (SMD) to a substrate in a single step. A liquid noflow resin encapsulant containing flux material is dispensed between presoldered pads on a substrate. The SMD, having a pair of electrical contacts, is pressed into said encapsulant so that the electrical contacts make contact with said presoldered pads. Heat is applied to first activate said flux material and then reflow the solder on said presoldered pads to bond said SMD contacts to said presoldered pads. The reflow temperature is maintained for about 180 seconds during which time the resin solidifies. The resin encapsulant fills the space between substrate and SMD and forms fillets around the solder bonded contacts.

Abstract: The method of manufacturing a long-life heat-resisting low alloy steel welded component, with which creep damages do not easily occur in the heat affected zone. The manufacturing method includes the steps of subjecting a base metal containing, at % by weight, C: 0.15% or less, Si: 0.5% or less, Mn: 0.3 to 0.8%, Cr: 1.9 to 2.6%, Mo: 0.87 to 1.20%, and a balance of iron and unavoidable impurities, to a hot working, to a heat treatment, and then to a welding. In this method the base metal is normalized once or more times before the welding in addition to the hot working.

Abstract: A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).