Abstract: A method for the manufacturing or repair of a superalloy gas turbine component including a liquid phase diffusion bonding process wherein the brazing heat treatment used for the diffusion bonding of a powder material to the component is accomplished by a heat cycle that is performed on the component for another purpose. A manufacturing solution heat treatment, a pre-weld heat treatment, a post-weld heat treatment, or a rejuvenating heat treatment may be used as the brazing heat treatment. The composition of the powder material is selected so that a desired set of material properties is achieved when the powder material is subjected to the dual-purpose heat cycle. In one embodiment, a 50/50 mixture of AM775 and IN939 powder is diffusion brazed to an IN939 superalloy component using a heat treatment which also functions as the post-casting solution heat treatment for the IN939 component.

Abstract: A process for diffusion bonding of cracks and other gaps in high-temperature nickel and cobalt alloy components is described. The gap is filled with alloy powder matching the substrate alloy, or with an alloy of superior properties, such as MAR-M 247, MAR-M 247LC, or CM 247LC. A braze containing a melting point depressant is either mixed into the alloy powder or applied over it. The depressant is preferably hafnium, zirconium, or low boron. The component is heated for 15-45 minutes above the melting point of the braze, which fills the spaces between the alloy powder particles. The component is diffused at a temperature above or below the liquidus of the braze and solution heat-treated and aged at a temperature at which the braze and alloy mixture in the gap is solid, but the depressant diffuses away.

Abstract: The present invention relates to a method for repairing components formed from a single crystal nickel based superalloy. The method comprises the steps of applying a repair alloy to at least one portion of a component formed from the single crystal nickel based superalloy and heating the component with the repair alloy thereon to a temperature that avoids recrystallization and repair zone incipient melting of the single crystal nickel based superalloy. Following the heating step, the component is preferably rapidly cooled and subjected to an aging treatment.

Abstract: An electronic unit manufacturing apparatus includes: a cream solder printer for printing cream solder on one side of a printed-circuit board; a chip placement machine for placing a plane-mounted part on the printed-circuit board on which the cream solder is printed; a first reflow furnace for fixedly securing the plane-mounted part to the printed-circuit board; a solder application machine for applying a larger amount of cream solder than that printed by the cream solder printer in the vicinity of holes made in the one side of the printed-circuit board; and a second reflow furnace for inserting pins of a deformed part into the holes made in the printed-circuit board from an opposite side thereof and fixedly securing the pins of the deformed part to the printed-circuit board, wherein in the second reflow furnace. In the second reflow furnace, temperature on the opposite side of the printed-circuit board is set lower than temperature on the one side thereof.

Abstract: Articles to be brazed are preheated to an increased temperature in a preheating process and the temperature of the articles to be brazed is measured. Conversion data obtained and stored for different combinations of articles to be brazed is referred to on the basis of the measured temperature and a time for which brazing filler metal supply nozzles are kept in a wait state is set on the basis of the conversion data to define the timing for supplying the brazing filler metal wires (S40). A heating burner moves forward and then a timer starts counting the time for which the nozzles are kept in the wait state (S42). When the nozzle wait timer has counted the set time and expired, the brazing filler metal supply nozzles move forward and supply the wires to braze the articles (S43 to 45). In this way, the articles to be brazed, heated by the heating burner, are at an increased temperature suitable for brazing at the time when the brazing filler metal wires are supplied.

Abstract: There is provided a flow soldering process for mounting an electronic component onto a board by means of a lead-free solder material, wherein the molten solder material is supplied and attached to a predetermined portion of the board in a solder material supplying zone, and thereafter the board is cooled by a cooling unit in a cooling zone such that the solder material adhering to the board is rapidly cooled to solidify.

Abstract: Soldering methods and compositions are disclosed to provide electrical connections between surfaces with reduced likelihood of short circuits or solder-starved joints. Two component solder compositions are employed to preferably form “metallic foam” joints upon heating. In one embodiment, bimetallic particles are disclosed which fuse together rapidly reducing the likelihood of reflow-related solder joint faults. The methods and compositions of the present invention can also reduce the potential for thermal fatigue and other solder joint failures in electronic devices following fabrication because the porous solder joints relieve plastic constraints and lower the average tensile joint stress. In one preferred embodiment, solder compositions are employed which are composed of particles of a first metal coated with a second metal. Alternatively, the compositions can include particles of a first metal surrounded by a salt solution or suspension of a second metal.

Abstract: A lead-free solder alloy of electrode for joining electronic parts fine in texture and excellent in thermal fatigue resistant characteristic is presented. This is a solder alloy of electrode for joining electronic parts comprising Sn, Ag and Cu as principal components, and more particularly a solder alloy of electrode for joining electronic parts containing 92 to 97 wt. % of Sn, 3.0 to 6.0 wt. % of Ag, and 0.1 to 2.0 wt. % of Cu. By adding a small amount of Ag to the solder mainly composed of Sn, a fine alloy texture is formed, and texture changes are decreased, so that an alloy excellent in thermal fatigue resistance is obtained. Further, by adding a small amount of Cu, an intermetallic compound is formed, and the junction strength is improved.

Abstract: A method of bonding two pieces of metal having a foil or layer of another metal, either of lower melting point or such that it forms a liquid layer at or near to the bonding temperature, disposed therebetween. The method comprises the steps of: bringing the pieces into contact; applying pressure across the area of contact; heating the area of contact; and providing a predetermined temperature gradient across the area of contact.

Abstract: The invention relates to a method for the temperature regulation of components, for example semiconductor circuits, printed circuit boards and the like, in which the components are conveyed on carriers through an inlet slot into a temperature-regulating housing provided with temperature-regulating members and are conveyed out through an outlet slot opposite the inlet slot. The carriers are accommodated by a magazine in the housing, which magazine is provided with adjacently arranged holders and, after the first holder has been loaded, is displaced progressively in one direction from a starting position into successive accommodating positions in which the individual holders of the magazine are loaded one after the other.

Abstract: A method for determining the condition of a reflow furnace so as to prevent the semiconductor element from tilting due to different collapsed amounts of solder bumps in the single semiconductor element of multiple chip modules mounted on the semiconductor element on the substrate. For the carrying direction in the reflow furnace using a carrying belt, temperature analysis for time duration is performed for the solder bumps at both the front and rear, and then the condition of the reflow furnace is determined so as to close at both the times for reaching the solder melting temperature and the times for maintaining the solder melting temperature.