Abstract: A solder paste transfer process is provided and includes defining an arrangement of solder pad locations on a surface, applying solder paste onto a transfer tool in a pre-defined configuration reflective of the arrangement, disposing the transfer tool in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the transfer tool to the solder pad locations.

Abstract: Solder mold plates and methods of manufacturing the solder mold plates are provided herein. The solder mold plates are used in controlled collapse chip connection processes. The solder mold plate includes a plurality of cavities. At least one cavity of the plurality of cavities has a different volume than another of the cavities in a particular chip set site. The method of manufacturing the solder mold plate includes determining susceptible white bump locations on a chip set. The method further includes forming lower volume cavities on the solder mold plate which coincide with the susceptible white bump locations, and forming higher volume cavities on the solder mold plate which coincide with less susceptible white bump locations.

Abstract: A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.

Abstract: A substrate for suspension which is produced at low costs and can sufficiently attain the prevention of damage by electrostatic discharge and restraint of noises. The substrate for suspension includes: a metallic substrate, an insulating layer formed on the metallic substrate and having an opening from which the metallic substrate is exposed, a grounding-wiring layer formed on the insulating layer and arranged near the opening, and a ground terminal formed in the opening and contacting the metallic substrate and the grounding-wiring layer. The ground terminal is made of a metal having a melting point of 450° C. or lower.

Abstract: The present invention relates to a method for manufacturing an electronic assembly (50) comprising an electronic component, a cavity and a substrate which method comprises; —providing an electronic component (10) having a first pattern with a substantially closed configuration; —providing a cover (18) on a surface of the electronic component, which cover together with said surface defines a cavity (20), the closed configuration of the first pattern substantially enclosing the cover at said surface; —providing a substrate (30) having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad; —disposing solder material at the solder pad; —positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface (28) of the cover; —reflow-soldering the solder mate

Abstract: A method of manufacturing a printed wiring board having at least one solder bump includes forming a solder resist layer on a conductor layer. The solder resist layer has at least one opening that exposes a connection pad of the conductor layer, and the at least one opening in the solder resist layer has a depth D, from the solder resist layer to the exposed connection pad, of from 3 ?m to 18 ?m. The method also includes loading a solder ball into each of the at least one opening in the solder resist layer, and forming a bump on the exposed connection pad by heating the solder ball to a reflow temperature.

Abstract: Obtained are fine-pitched pad electrodes and also solder bumps with a large amount of solder and a less difference in the amount. First, in an inert liquid in a liquid tank, a substrate is positioned with a surface facing up. Subsequently, the inert liquid containing solder fine particles is fed from a solder fine particle forming unit to the liquid tank and the solder fine particles are dropped from a supply pipe onto the substrate in the inert liquid. The solder fine particles naturally fall down by the gravity, thereby reaching the substrate. The solder fine particles reached on the pad electrodes on the substrate stay there due to the gravity, and spread on the surfaces of the pad electrodes after the solder wet time, thereby forming solder coating.

Abstract: The method of fabricating a hollow mechanical part of the invention includes a step b) of depositing an anti-diffusion substance in a predefined pattern on at least one face of primary parts to be assembled together.

Abstract: A method and a device for placing a multitude of shaped parts of solder material (20) on a bond pad arrangement (29) of a substrate (23), said bond pad arrangement comprising a multitude of bond pads (28), and for subsequent re-melting of the shaped parts of solder material on the bond pads (28), with arrangement of a template device (21) comprising a multitude of template apertures (27) for accommodating shaped parts of solder material (20) opposite a substrate (23) comprising a bond pad arrangement (29), such that the shaped parts of solder material are associated with the individual bond pads (28); and application of laser energy to the shaped parts of solder material (20) accommodated in the template apertures (27) using a laser device (39) arranged at the rear of the template device (21) such that said laser energy is applied to the shaped parts of solder material through the template device.

Abstract: [Problem ] To prevent decreases in fatigue strength of a base material by relieving the residual stress of a weld.

Abstract: The present invention is drawn to a method of making solder bump interconnections or BGAs ranging from chip-level connections to either single chip or multichip modules, flip-chip packages and printed circuit board connections. According to the method of the present invention, a die wafer or a substrate with a conductive contact location is positioned in close proximity and aligned with a mold wafer having a pocket corresponding to the contact location of the die wafer. A source of a molten solder is also provided which interconnects with the mold wafer. The molten solder from the source is introduced into the pocket of the mold wafer such that the molten solder wets the contact location aligned with the pocket. Before the molten solder inside the pocket is allowed to solidify, the die wafer and the mold wafer are separated from each other.

Abstract: The invention provides a new and improved process and exothermic reaction mixture for producing molten weld metal. The molten weld metal is used in joining one metallic piece with at least one other metallic piece. The process and exothermic reaction mixture have distinct advantages over the prior art. These advantages include a higher filler metal yield, an increased tensile strength, and a higher quality corrosion resistant weld. These advantages are accomplished by a process wherein a reactant mixture is provided which has a reducing agent, a metallic compound, and at least two filler metals that at least in part do not chemically react with the metallic compound, one of which is aluminum. The metallic compound subsequently forms, with the reducing agent, having a high heat of formation which provides an exothermic reaction with sufficient heat to melt the filler metals.

Abstract: A bump forming apparatus comprises a container for retaining therein a solder melt, a solder forming member having a side wall portion and a ceiling portion which form, above a substrate's flat surface, a chamber for receiving therein the solder melt. The solder forming member also includes a height regulator portion provided on an exterior of the side wall portion and having a flat surface for restricting the height of the solder melt during formation. Heating means for heating the solder melt may also be provided. A hole in the solder forming portion allows solder melt to flow from the container to the chamber. Pressurizing means for pressurizing the solder melt in the container to thus expedite passage of solder melt into the chamber of the forming member may be used. Depressurization means for reducing the inside pressure of the container to cause the unused metal to return from the chamber into the container may also be used.

Abstract: The present invention is drawn to a method of making solder bump interconnections or BGA ranging from chip-level connections to either single chip or multichip modules, flip-chip packages and printed circuit boards connections. According to the method of the present invention, a die wafer or a substrate with a conductive contact location is positioned in close proximity and aligned with a mold wafer having a pocket corresponding to the contact location of the die wafer. A source of a molten solder is also provided which interconnects with the mold wafer. The molten solder from the source is introduced into the pocket of the mold wafer such that the molten solder wets the contact location aligned with the pocket. Before the molten solder inside the pocket is allowed to solidify, the die wafer and the mold wafer are separated from each other.

Abstract: A wear surface for helicopter shoes is constructed by forming a railed enclosure on a curved base plate, placing a mosaic of smooth-surfaced tungsten carbide blocks on the base plate within the enclosure, brazing the blocks to the plate and rails, and grinding the rails to form a smooth, edgeless transition between the wear surface and the plate surface.

Abstract: Disclosed is a method and apparatus for rapidly producing a metal component from partially solidified metal slurry. A source of metal alloy slurry is provided and maintained under conditions to maintain the slurry state, for example by shearing at a temperature between a liquidus and solidus thereof. The slurry is dispensed through a source nozzle and deposited upon a substrate or upon previously dispensed slurry in a predetermined, controlled manner to produce a component of desired geometry. The substrate may be planar or contoured and may comprise an element of the component being produced. A temperature, pressure or chemical composition controlled deposition environment may be provided to facilitate producing a component having desired characteristics.

Abstract: The improvement in the soldering method comprising the steps of feeding a predetermined volume of solid solder to a solder melting pot, heating and melting the solder in the pot, and then dropping the molten solder onto a workpiece. A wire solder is held between at least one pair of endless running belts which run with opposed faces thereof in contact with each other thereby to straighten the wire solder. The tip-end of the straightened wire solder is pressed against the solder melting pot to melt the wire solder from the tip-end. On completion of feeding a predetermined volume of the wire solder, the running belts are run in reverse to retreat the tip-end of the wire solder from the solder melting pot. A soldering apparatus for realizing the aforementioned method is also provided.

Abstract: An end plate of a tank whose inside is partitioned by a partition has a plurality of insertion holes receiving connecting portions of tube elements. In the end plate, a first projection is distended and formed so as to run through narrow middle portions of the insertion holes, and a fit groove for the partition is formed on the inside of the first projection. Even when a core of the heat exchanger is put sideways on a furnace in a heat brazing method, brazing filler material can easily flow into the gaps between the insertion holes and the tube elements inserted into the insertion holes. As a result, good brazing can be performed.

Abstract: A sliding contact producing method is provided wherein noble metal balls are easily positioned on a metal plate; the weld strength between the noble metal ball and the metal plate can be obtained sufficiently; and a noble metal mounting jig can be prevented from damage when the metal plate is beam-welded with the noble metal ball. While being received in the recess portions of a jig, the noble metal balls are respectively contacted with bowllike recesses formed in the base surface of the metal plate. YAG laser beam is irradiated on the metal plate to weld the metal plate with the noble metal ball. Then the metal plate is sheared in a determined shape to form resilient strips. The present invention can improve welding operation efficiency and the reliability of welded portions. Since the metal plate being wider than that of the resilient strip receives beam, the metal contact mounting jig can be prevented from damage due to beam welding.

Abstract: A solder is disposed outside a joint area without putting a solder foil in an area to be joined or performing preparatory soldering, and soldering is performed by making the melted solder permeate the joint area by a capillary phenomenon. Further, one member is supported by a solder, and a joint solder layer of desired thickness is obtained by use of a jig for supporting the one and the other member at a predetermined distance therebetween when the solder is melted. Further, if a solder outside a joint area is made to stand vertically in its longitudinal direction, and melted at such a state, pressure caused by self-weight is given to the melted solder, and oxide of the solder surface is separated from the melted solder, so that it is possible to further reduce the generation of voids.

Abstract: A nozzle assembly is shown for depositing solder onto a series of conductive surfaces such as the mounting pads of a surface mount integrated circuit board. The nozzle assembly includes a nozzle head which has an interior bore for receiving an elongate heat source. The nozzle head also includes an orifice for receiving solid solder fed within the interior bore to contact the elongate heat source. The interior bore terminates in a solder reservoir for molten solder which is fed within the inteiror bore to contact the elongate heat source. The molten solder is dispensed through a tip opening to deposit uniform amounts of solder on each pad. A source of bleed gas is supplied to the interior of the assembly to protect the component parts and excluse oxygen from the interior of the assembly. A cover gas is also supplied to the solder site to reduce oxidation of the moltent solder and reduce the amount of flux required.

Abstract: A nozzle assembly is shown for depositing solder onto a series of conductive surfaces such as the mounting pads of a surface mount integrated circuit board. The nozzle assembly includes an upper nozzle mount and a removeable nozzle head which has an interior bore for receiving a portion of the nozzle mount and an elongate heat source. The nozzle head also includes an orifice for receiving solid solder fed within the interior bore to contact the elongate heat source. The interior bore terminates in a solder reservoir for molten solder which is fed within the interior bore to contact the elongate heat source. The molten solder is dispensed through a tip opening to deposit uniform amounts of solder on each pad.

Abstract: Fluxing station (34) has a flux dispenser (52) where liquid flux cascades down steps (88, 90). Circulating pump (46) draws liquid flux from a reservoir (54) below the steps and recirculates it to cascade down the steps. There is provision to add makeup flux from reservoir (38) or supply a cleaning liquid such as alcohol from reservoir (37) to clean the circulating system. A drain (62) is provided. Electrical components can be positioned with their leads on the steps so that liquid flux cascades thereover for accurately fluxing only the ends of the leads. Two or more pairs of steps, with different spacing, may be provided to accommodate components of different lengths.

Abstract: The invention comprises a method of mounting a cutter, having a stud portion defining one end thereof and a cutting formation generally adjacent the other end, in a pocket in a drill bit body member. The method includes the steps of forming a channel extending into the pocket, inserting brazing material into the channel, inserting the stud portion of the cutter assembly into the pocket, then heating the bit body member to cause the brazing material to flow through the channel into the pocket, and finally re-cooling the bit body member. During the assembly of the various pieces required in the steps mentioned immediately above, a spring is used, cooperative between the cutter and the bit body member, to retain the stud portion in the pocket and also to displace the stud portion toward the trailing side of the pocket.

Abstract: This is a process relating to improvements in the soldering of headers to conventional radiators. Tubular members of the radiator extend through holes in the header. The tubes are initially sealed to the header with a solder having a high temperature melting point T.sub.1. Infrared heat heats the header to a temperature T.sub.2 which is less than T.sub.1 but above a lower temperature T.sub.3 which is the melting temperature of a second solder. Upon the header reaching a selected temperature T.sub.2, a selected amount of the second solder in a molten state is poured in the header to puddle the entire pan area of the header, and allowed to cool to form a very strong soldered connection.

Abstract: A method of installing rotor bars in a dynamoelectric machine rotor of the type having a shaft, a laminated magnetic core carried by the shaft, with the core having a plurality of arcuately spaced longitudinal passageways therethrough for accommodating the rotor bars. The rotor bars are inserted in the core with end portions of the bars protruding beyond the end laminations at opposite ends of the core, and a pair of end rings disposed at opposite ends of the core are joined to the protruding end portions of the rotor bars. The axially facing inner end surface of each end ring has a series of arcuately spaced radially extending channels formed therein with intervening arcuately spaced radially extending ribs defined therebetween, with the channels receiving the protruding end portions of the rotor bars therein, and with the ribs bearing tightly against the end laminations at opposite ends of the laminated core to maintain the laminated core in tightly compressed condition.

Abstract: In magnetic disk equipment or the like, the read/write magnetic heads are each bonded to the wall of a thru-hole of a carrier plate adapted to act as a "flying" member maintained by an aerodynamical action in close proximity to the surface of the rotating disk. In a device according to the invention, the bond between the lateral surface of the head and said wall is made to ensure magnetostatic and electrostatic shielding of the head against spurious magnetic, electromagnetic and electrostatic fields. Said bond may comprise thin films of a high permeability anisotropic material coating at least the facing surfaces of the head and the wall and a layer of solder intervening between said films. Such a shield may partially extend over selected areas of the rear faces of the plate and head.

Abstract: A printed wiring board is oriented with a wiring surface facing up for mass soldering. Molten solder is pumped from a tank onto a trough and flows in a thin, wide stream across the upper surface of the printed wiring board which is held down to prevent the board from floating on top of the solder.

Abstract: A mass soldering system is described in which a standing wave of molten solder is formed. The solder wave is characterized by having a substantially horizontal crest, and the wave has varying pressures along its flow path. In a preferred embodiment of the invention the wave pressures are varied to produce a wave having increasing pressure along its flow path whereby a substantially uni-directional wave may be formed which is highest adjacent its rear.

Abstract: A mass wave soldering system is described in which a standing wave of molten solder is formed from a static head of solder. The system comprises a soldering apparatus which has a two-compartment solder reservoir. The first compartment is designed to hold a first portion of the solder supply at a first liquid level with a layer of oil floating on the solder therein. The second compartment is designed for holding a second portion of the solder supply at a second liquid level above the first liquid level with a layer of oil floating on the solder therein. A sump and nozzle are positioned in the first compartment so that the sump is partially submerged in the molten solder therein, with the nozzle above the solder and oil levels therein, but below the solder and oil levels in the second compartment.

Abstract: A method of assembling a dynamoelectric machine having a stationary member, a rotatable member, and a pair of means for rotatably supporting the rotatable member within the stationary member. In this method, beams are attached to the stationary member, and opposite end portions of the beams extend from the stationary member. The rotatable means is then mounted with the stationary member and the supporting means with one of the opposite end portions of the beams within means in one of the supporting means for receiving them. The receiving means is at least partially filled with molten metal which solidifies for interconnecting the one opposite end portion of the beams with the one supporting means, and the other of the supporting means is then secured to the other of the opposite end portions of the beams.