Abstract: A package comprising a substrate and an integrated device coupled to the substrate. The substrate comprises at least one dielectric layer; a plurality of interconnects comprising plurality of pad-on-pad interconnects, wherein the plurality of pad-on-pad interconnects is embedded through a first surface of the substrate. The plurality of pad-on-pad interconnects includes a first pad-on-pad interconnect comprising a first pad and a second pad coupled to the first pad. The package further comprising a solder resist layer located over the first surface of the substrate. The solder resist layer comprises a first solder resist layer portion comprising a first thickness; and a second solder resist layer portion comprising a second thickness that is less than the first thickness. The second solder resist layer portion is located between the at least one dielectric layer and the integrated device.

Abstract: The present application relates to a stencil printing machine, which comprises a first holder device (110), a mobile device (121), two support tables (131, 132) and two driving devices (151, 152), wherein the first holder device (110) is configured to be able to horizontally reciprocate in the portrait orientation, the mobile device (121) is mounted on the first holder device (110) and is configured to be able to horizontally reciprocate in the landscape orientation on the first holder device (110), the two support tables (131, 132) are mounted at the lower end of the mobile device (121) and are used to bear corresponding solder paste jars (141, 142), the two driving devices (151, 152) are mounted on the mobile device (121) so that each of the two driving devices (151, 152) is located above a corresponding support table (131, 132) and is used to press a corresponding solder paste jar (141, 142), and the mobile device (121) is configured to be able to drive the two support tables (131, 132) and the two driving

Abstract: In one general aspect, an apparatus can include a semiconductor component, a substrate including a recess, and a conductive-bonding component. The conductive-bonding component is disposed between the semiconductor component and the substrate. The conductive-bonding component has a first thickness between a bottom of the recess and a bottom surface of the semiconductor component greater than a second thickness between the top of the substrate and the bottom surface of the semiconductor component.

Abstract: Various semiconductor chips and packages are disclosed. In one aspect, an apparatus is provided that includes a semiconductor chip that has a side, and plural conductive pillars on the side. Each of the conductive pillars includes a pillar portion that has an exposed shoulder facing away from the semiconductor chip. The shoulder provides a wetting surface to attract melted solder. The pillar portion has a first lateral dimension at the shoulder. A solder cap is positioned on the pillar portion. The solder cap has a second lateral dimension smaller than the first lateral dimension.

Abstract: This copper/ceramic bonded body includes: a copper member made of copper or a copper alloy; and a ceramic member made of nitrogen-containing ceramics, the copper member and the ceramic member are bonded to each other, in which, between the copper member and the ceramic member, an active metal nitride layer containing nitrides of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on a ceramic member side, and a Mg solid solution layer in which Mg is solid-dissolved in a Cu matrix is formed between the active metal nitride layer and the copper member, and Cu-containing particles composed of either one or both of Cu particles and compound particles of Cu and the active metal are dispersed in an interior of the active metal nitride layer.

Abstract: Aluminum-magnesium alloys useful as welding wire and mechanical support are disclosed. The aluminum-magnesium alloys exhibit improved cold wire drawing performance. Grain refiners and methods of forming the aluminum-magnesium alloys are further disclosed.

Abstract: A method includes bonding a device die to a direct bonded metal (DBM) substrate, bonding a spacer block to the device die, and at least partially reducing coefficient of thermal expansion (CTE) mismatches between the DBM substrate, the spacer block and the device die. At least partially reducing the CTE mismatches between the DBM substrate, the spacer block and the device die includes at least one of: disposing an arrangement of pillars and grooves in a surface region of the spacer block coupled to the device die, disposing at least one cavity in the spacer block, and disposing a groove in an outer conductive layer of the DBM substrate.

Abstract: A stacked semiconductor device encompasses a mother-plate having a mounting-main surface and a bottom-main surface, an onboard-element having a connection face facing to the mounting-main surface, a parent bump provided on the mother-plate, having a mother-site wall made of a layer of conductor, mother-site wall is perpendicular to the mounting-main surface, and a repair bump provided on the onboard-element at a side of the connection face, having a repair-site wall made of a layer of conductor having different hardness from the mother-site wall, the repair-site wall is perpendicular to the connection face, configure to bite each other with the parent bump at an intersection between the mother-site wall and the repair-site wall conductor.

Abstract: A method for fabricating a copper pillar. The method includes forming a layer of titanium tungsten (TiW) over a semiconductor wafer, forming a layer of zinc (Zn) over the layer of TiW, and forming a copper pillar over the via. In addition, the method includes performing an anneal to diffuse the layer of Zn into the copper pillar. A semiconductor device that includes a layer of TiW coupled to a via of a semiconductor wafer and a copper pillar coupled to the layer of TiW. The copper pillar has interdiffused Zn within its bottom portion. Another method for fabricating a copper pillar includes forming a layer of TiW over a semiconductor wafer, forming a first patterned photoresist, forming a layer of Zn, and then removing the first patterned photoresist. The method further includes forming a second patterned photoresist and forming a copper pillar.

Abstract: An arrangement is disclosed. In one example, the arrangement of a conductor and an aluminum layer soldered together comprises a substrate and the aluminum layer disposed over the substrate. The aluminum forms a first bond metal. An intermetallic compound layer is disposed over the aluminum layer. A solder layer is disposed over the intermetallic compound layer, wherein the solder comprises a low melting majority component. The conductor is disposed over the solder layer, wherein the conductor has a soldering surface which comprises a second bond metal. The intermetallic compound comprises aluminum and the second bond metal and is predominantly free of the low melting majority component.

Abstract: A screen-printing machine includes a mask holding device; a board holding device configured to grip a board; a positioning device to relatively position the board and the mask; and a control device. The board holding device includes a lifting and lowering table positioned in an up-down direction by a lifting and lowering mechanism, and a backup block including a mounting surface on which the board is placed, an installation surface disposed parallel to the mounting surface on an opposite side thereof, multiple suction holes to penetrate in a thickness direction between the mounting surface and the installation surface, and a chamber recessed section formed on an installation surface side so as to surround positions of the multiple suction holes, and in which an air chamber made by the chamber recessed section is configured when the backup block overlaps an upper face of the lifting and lowering table.

Abstract: In a solder processing device (A) which includes: a substantially tubular iron tip (5) that can be heated and that is extended vertically; and a solder piece supply portion (2, 6) that supplies a solder piece (Wh) from above into the iron tip (5), and in which the heat of the iron tip (5) is used to melt the solder piece (Wh) such that the molten solder is supplied downward, the supplied solder piece (Wh) is forcefully brought into contact with the inner wall of the iron tip (5). In this way, it is possible to more reliably heat and melt the solder piece (Wh) by use of the heat of the iron tip (5).

Abstract: A semiconductor device package includes an embedded plurality of solder balls within an integrated circuit die (ICD) substrate In one embodiment, the integrated circuit die (ICD) substrate has a top surface and a bottom surface, and a plurality of solder balls at least partially embedded in the ICD substrate, where each of the plurality of solder balls comprises an exposed surface that is substantially flat and parallel planar to the bottom surface, and where the exposed surface of each of the plurality of solder balls is disposed in the bottom surface. In certain examples, the apparatuses also include a plurality of integrated circuit dies stacked on the top surface of the ICD substrate.

Abstract: A joint between at least one element of metal material and at least one element of plastic material is obtained by pressing these elements in contact against each other, with a simultaneous application of heat. A cladding of metal material and/or of plastic material is applied above the joint by additive manufacturing technology.

Abstract: A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube comprising tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to provide a level of thermal energy to liquefy the solder sphere, detecting the movement of the liquefied solder sphere after it has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.

Abstract: A system for manufacturing an assembly board includes an undersupporting device, a transporter configured to transport a board and the undersupporting device, an undersupporting-device installer provided below the transporter, the undersupporting-device installer being attachable to and detachable from the undersupporting device, a board processor configured to perform a predetermined processing to an upper surface of the board, a carry-in side delivering unit having first and second receiving positions different from each other, a board supplier configured to supply the board to the first receiving position, and an undersupporting-device supplier configured to supply the undersupporting device to the second receiving position. The transporter transports, to the carry-in side delivering unit, the undersupporting device detached from the undersupporting-device installer.

Abstract: A system for manufacturing an assembly board includes an undersupporting device, a carrier configured to hold the undersupporting device, a transporter, an undersupporting-device installer attachable to and detachable from the undersupporting device, a board processor, and a magnet provided on a lower surface of the undersupporting device. The transporter transports the undersupporting device to a working position by transporting the carrier to the working position while the carrier holds the undersupporting device on the lower surface of the carrier. The transported undersupporting device is fixed to the undersupporting-device installer by a magnetic force of the magnet at the working position. The transporter transports the board to the working position. The undersupporting device supports the lower surface of the board when the board is transported to the working position. The board processor performs a predetermined processing to an upper surface of the board.

Abstract: System for manufacturing an assembly board includes an undersupporting device, a transporter, an undersupporting-device installer attachable to and detachable from the undersupporting device, a board processor, a carry-in side delivering unit having different first and second receiving positions, a board supplier configured to supply the board to the first receiving position, and an undersupporting-device supplier configured to supply the undersupporting device to the second receiving position. The carry-in side delivering unit delivers the undersupporting device to the transporter, which transports the undersupporting device to a working position. The undersupporting-device is fixed to the undersupporting-device installer. The carry-in side delivering unit delivers the board to the transporter, which transports the board to the working position.

Abstract: A high-strength steel sheet having improved HIC resistance and fracture resistance even when it is thick has a chemical composition comprising, in mass %, C: 0.02-0.07%, Si: 0.05-0.50%, Mn: 1.10-1.60%, P: at most 0.015%, S: at most 0.0030%, Nb: 0.005-0.030%, Ti: 0.005-0.020%, Al: 0.005-0.060%, Ca: 0.0005-0.0060%, N: 0.0015-0.0070%, at least one of Cu, Ni, Cr, and Mo in a total of greater than 0.1% to less than 1.5%, and a remainder of Fe and impurities and a steel structure composed of at least 10% by area of bainite and a remainder of ferrite and pearlite. The degree of segregation is less than 1.6 for Nb and less than 1.4 for Mn in the central portion of the thickness of the steel sheet.

Abstract: A method for manufacturing a probe card is provided wherein probes are held in a holding plate such that the respective probes correspond to through holes with their connecting end portions projected from one surface of the holding plate. A plate-like member including openings having larger diameters than diameters of the through holes and housing the connecting end portions in the openings is arranged by making one surface of the plate-like member abut the one surface of the holding plate. After supplying solder cream in the respective openings from the other surface of the plate-like member, a connection base plate and the holding plate are relatively fixed so that the solder cream, burying the connecting end portions of the respective probes held in the holding plate with the plate-like member removed, may abut the respective corresponding connection pads, and the solder cream is heated to melt the solder cream.

Abstract: A weld joint (30) having asymmetric sides and providing reduced restraint of weld metal shrinkage and a reduced propensity for weld centerline cracking. The weld joint may have a first side (38) formed at an angle (A1) of 35-60° relative to the component surface (36), and a second side (40) formed at an angle (A2) of 10-35° relative to the surface. The sides may be extended to intersect (44) without the necessity for a flat bottom surface (20) as is typical for prior art weld joints (10). The inventive weld joint may be formed by moving an end mill tool (60) into and along the surface with its axis of rotation (64) being transverse to the surface.

Abstract: A composite composition that includes an MCrAlX alloy and a nano-oxide ceramic is disclosed. In the formula, M includes nickel, cobalt, iron, or a combination thereof, and X includes yttrium, hafnium, or a combination thereof, from about 0.001 percent to about 2 percent by weight of the alloy. The amount of the nano-oxide ceramic is greater than about 40 percent, by volume of the composition. A protective covering that includes the composite composition is also disclosed. The protective covering can be attached to a tip portion of a blade with a braze material. A method for joining a protective covering to a tip portion of a blade, and a method for repair of a blade, are also provided.

Abstract: Semiconductor device packages and methods of manufacturing the semiconductor device packages are provided. A semiconductor device package may include a bonding layer between a substrate and a semiconductor chip, and the bonding layer may include an intermetallic compound. The intermetallic compound may be a compound of metal and solder material. The intermetallic compound may include Ag3Sn. A method of manufacturing the semiconductor device package may include forming a bonding layer, which bonds a semiconductor chip to a substrate, by using a mixed paste including metal particles and a solder material. The bonding layer may be formed by forming an intermetallic compound, which is formed by heating the mixed paste to react the metal particles with the solder material.

Abstract: An earth-boring tool may comprise a body having at least one blade, and at least one cutting element recess may be formed in a surface of the at least one blade. At least one cutting element may be affixed within the at least one cutting element recess. The at least one cutting element may comprise a substantially cylindrical lateral side surface configured to allow the at least one cutting element to rotate about a longitudinal axis within the at least one cutting element recess when the at least one cutting element is partially inserted into the at least one cutting element recess. The at least one cutting element may also comprise a back face comprising alignment features configured to abut complementary alignment features disposed on a back surface of the at least one cutting element recess. Methods of forming earth-boring tool bodies.

Abstract: Described herein is an apparatus that includes a housing that defines an interior cavity. The housing also includes a feedthrough aperture. The apparatus also includes an electrical connector that is coupled to the housing over the feedthrough aperture. The electrical connector includes a base, a plurality of pins extending through the base, and a skirt positioned about a periphery of the base. The pins extend from a location external to the housing to a location within the interior cavity of the housing. Further, an inner surface of the base is co-planar with an outer end of the feedthrough aperture. The apparatus also includes solder positioned on the housing and against an entire periphery of the skirt to seal the electrical connector to the housing.

Abstract: A brazing method is disclosed. The brazing method includes providing a substrate, providing at least one groove in the substrate, providing a support member, positioning the support member over the at least one groove in the substrate, providing a braze material, applying the braze material over the support member to form an assembly, and heating the assembly to braze the braze material to the substrate. Another brazing method includes providing a preform, providing a wire mesh, pressing the wire mesh into the preform, heating the preform to form a braze material including the wire mesh, providing a substrate, providing at least one groove in the substrate, applying the braze material over the at least one groove in the substrate, then brazing the braze material to the substrate.

Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.

Abstract: The present invention relates to a blend of at least one boron source and at least one silicon source, wherein the blend comprises boron and silicon in a weight ratio boron to silicon within a range from about 5:100 to about 2:1, wherein silicon and boron are present in the blend in at least 25 wt %, and wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the blend is a mechanical blend of powders, and wherein particles in the powders have an average particle size less than 250 ?m. The present invention relates further to a composition comprising the blend a substrate applied with the blend, a method for providing a brazed product, and uses.

Abstract: Al—Mg and Al—Mg—Zn weld filler alloy compositions for use with fusion weldable 7xxx, 6xxx, 5xxx and 2xxx series aluminum alloy base metals are disclosed. The weld filler alloys may be used for joining a first aluminum base metal segment to a second aluminum base metal segment, where the base metal segments is at least one of 7xxx, 6xxx, 5xxx and 2xxx series aluminum alloy. The weld filler alloys, in wire or rod form, may also be used to repair a defective weld.

Abstract: A method for contacting at least two metal electrodes, wherein the metal electrodes are located in a cavity of a basic body of sintered ceramic and frontal end faces of the metal electrodes. The metal electrodes are arranged essentially planparallel to an outer surface of the basic body. The method includes steps as follows: introducing a solder into at least one hole of the basic body, wherein the hole is so embodied that it leads to a rear portion of the metal electrode away from the frontal end face of the metal electrode wherein the solder can wet the rear portion of the metal electrode, wherein the metal electrodes are in their longitudinal direction shorter than the basic body, especially have only ? of the length of the basic body; introducing a cable into the hole at least until the cable extends into the solder; and heating the basic body with solder and cable above the solidification temperature of the solder.

Abstract: A three-dimensional chip stack includes a first chip bonded to a second chip to form a bonded interconnection therebetween. The bonded interconnection includes a first conductive pillar overlying a first substrate of the first chip, a second conductive pillar overlying a second substrate of the second chip, and a joint structure between the first conductive pillar and the second conductive pillar. The joint structure includes a first IMC region adjacent to the first conductive pillar, a second IMC region adjacent to the second conductive pillar, and a metallization layer between the first IMC region and the second IMC region.

Abstract: A gas turbine vane containment cap is attached to an inboard surface of the vane inner shroud by penetrating flat weld filler, formed in a root gap between the cap and inner shroud. A semi-circular bead weld filler is formed outboard the penetrating weld filler closer to the vane exterior. Vane containment caps so welded are more resistant to in-service cracking along weldments.

Abstract: In a heat insulating load jig 11 of the present invention, a solder material 14 having a melting point or a solidus temperature in a range between a thermal resistance temperature of a semiconductor chip 13 and a temperature 100° C. below the thermal resistance temperature is interposed between a circuit board 12 and the semiconductor chip 13; a heat insulating body 17 is placed on an upper side of the semiconductor chip 13 in this state; a metal weight 16 is disposed on the heat insulating body 17; and load is applied to the semiconductor chip 13 while the solder material 14 is melted and solidified.

Abstract: The present invention provides a solder bump formation resin composition which ensures resist (e.g., dry film) removability and which exhibits excellent solder bonding performance, even when the working substrate is placed at high temperature during reflowing, baking, or a similar process. The solder bump formation resin composition contains (A) at least one species selected from among an alkali-dissoluble thermoplastic resin having an acid value (mgKOH/g) of 110 or higher, an unsaturated fatty acid polymer having an acid value of 80 or higher, and an unsaturated fatty acid-aliphatic unsaturated compound copolymer having an acid value of 50 or higher; (B) a solvent; and (C) a solder powder, and contains no activating agent.

Abstract: An additive manufacturing system includes an additive manufacturing tool configured to receive a plurality of metallic anchoring materials and to supply a plurality of droplets to a part, and a controller configured to independently control the composition, formation, and application of each droplet to the plurality of droplets to the part. The plurality of droplets is configured to build up the part. Each droplet of the plurality of droplets includes at least one metallic anchoring material of the plurality of metallic anchoring materials.

Abstract: A method is provided for connecting at least two components, in which a sintering preform is used. This preform includes a carrier having a surface that has at least one structuring element containing hardened paste, wherein the hardened paste contains: (a) metal particles having a coating that contains at least one organic compound; and (b) at least one sintering aid selected from the group consisting of (b1) organic peroxides, (b2) inorganic peroxides, (b3) inorganic acids, (b4) salts of organic acids, wherein the organic acids have 1-4 carbon atoms, (b5) esters of organic acids, wherein the organic acids have 1-4 carbon atoms, and (b6) carbonyl complexes. The surface of the carrier having the hardened paste is not reactive to the constituents of the paste.

Abstract: A spacer for a thermal, flow measuring device, wherein the spacer has a planar bearing surface for a thin-film resistance thermometer and an otherwise circularly cylindrical, lateral surface, wherein the bearing surface is inclined relative to a longitudinal axis of the spacer.

Abstract: Methods of forming a structure for treating a vessel include providing a mandrel and braiding a plurality of filaments around the mandrel. The mandrel may include a strand having a longitudinal axis and a plurality of balls coupled to the strand along the longitudinal axis. Pairs of the plurality of balls may be spaced along the longitudinal axis. Braiding the plurality of filaments around the mandrel may include, during braiding, forming a plurality of bulbs around the plurality of balls and forming necks between pairs of the plurality of balls. The methods may include, after braiding the plurality of filaments, heat treating (e.g., shape setting) the plurality of filaments on the mandrel. Portions of the braided plurality of filaments may be secured to the mandrel, for example using bangles, wire, and/or adhesive.

Abstract: A core assembly for a heat exchanger includes a plurality of parting sheets defining a plurality of fluid passages including a plurality of first fluid passages and a plurality of second fluid passages arranged in an alternating arrangement, wherein each of the plurality of parting sheets comprises a thickness of about 0.016?. Also included is a plurality of first fluid passage fins disposed between the plurality of parting sheets within each of the plurality of first fluid passages. Further included is a plurality of second fluid passage fins disposed between the plurality of parting sheets within each of the plurality of second fluid passages. Yet further included is a plurality of closure bars disposed between respective pairs of the plurality of parting sheets.

Abstract: In joining a first metal member composed of a first metal to a second metal member composed of a second metal with a joining material interposed therebetween, the joining material including a low melting point metal having a lower melting point than the first metal and/or the second metal, the low melting point metal composing the joining material is Sn or an alloy containing Sn, at least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the low melting point metal composing the joining material, and heat treatment is performed at a temperature at which the low melting point metal melts in a state of locating the joining material between the first metal member and the second metal member.

Abstract: A brazed part includes two or more components that are brazed together and has related method of making. Using a method of locating parts relative to one another, an inter-component gap between the components may be formed. Subsequently, during brazing, flow control features formed along the inter-component gap may then be used to assist in the retention of the braze material between the components during brazing.

Abstract: When electrodes of a BGA plated by electroless Ni plating are soldered with solder balls of a lead-free solder, peeling of soldered joints readily takes place under an external impact. When a BGA electrode plated by electroless Ni plating is soldered with a lead-free solder to which 0.03-0.1 mass percent of P is added, the growth of brittle SnNi intermetallic compounds formed on the portion being soldered and a P layer on the electroless Ni plating surface is suppressed, resulting in an increased bonding strength.

Abstract: One plate-like member and the other plate-like member to be aligned with each other are provided with guide holes and guide portions to be received in the guide holes, respectively. The plate-like members are aligned appropriately, and in a state in which this alignment is held, the guide portions are formed on land portions provided on the other plate-like member so as to be aligned with the guide holes. Accordingly, regardless of presence/absence or size of a process error in the guide holes, the guide portions appropriate to the respective guide holes can be formed. Consequently, by aligning the guide portions with the guide holes, the plate-like members can be aligned appropriately without relative fine adjustment between the members.

Abstract: A printed circuit board solder mounting method of solder-jointing a first-land formed on a first-printed-circuit-board and a second-land formed on a second-printed-circuit-board together, includes: filling a solder-filling-hole with cream solder, the solder-filling-hole provided so as to be open in a planar region of the first-land; arranging a solder-drawing-hole so that the solder-drawing-hole and the solder-filling-hole face each other, the solder-drawing-hole being formed so as to be open in a planar region of the second region, having a center position to be superposed on a center position of the solder-filling-hole, and having a solder wettability higher than a solder wettability of the solder-filling-hole; melting the cream solder in the solder-filling-hole by reflow heating and causing at least part of the cream solder to ascend to the solder-drawing-hole facing the solder-filling-hole; and jointing the first-land and the second-land together by solidifying the cream solder interposed between the firs

Abstract: Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a bond pad of a microfeature workpiece, with the volume of material including a first metallic constituent and the bond pad including a second constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the bond pad to alloy the first metallic constituent and the second metallic constituent so that the first metallic constituent is alloyed generally throughout the volume of material. A thickness of the bond pad can be reduced from an initial thickness T1 to a reduced thickness T2.

Abstract: A method of forming an electronic device, comprising providing a semiconductor substrate having a first contact and an undoped electroplated lead-free solder bump formed on the first contact. The method also comprises providing a device package substrate having a second contact and a doped lead-free solder layer on the second contact comprising a fourth row transition metal dopant. The method further comprises melting the solder bump and the solder layer while the solder layer and the solder bump are in contact, thereby forming a doped solder bump consisting essentially of Sn, one or both of Ag and Cu, and the fourth row transition metal dopant.

Abstract: A fan blade includes first and second titanium portions that are secured to one another with an aluminum alloy braze. A method of manufacturing a fan blade includes providing first and second titanium portions, applying an aluminum alloy braze to at least one of the first and second titanium portions, and heating the fan blade to melt the aluminum alloy braze and join the first and second portions to one another to provide a fan blade with an airfoil exterior contour.

Abstract: A component includes a substrate, a chip, and a frame. The frame, the substrate, and the chip enclose a volume. A metal sealing layer is provided which is designed to hermetically seal the volume. The metal sealing layer has a hardened liquid metal or a hardened liquid metal alloy.

Abstract: A brazing process and plate assembly are disclosed. The brazing process includes positioning a braze foil on a first workpiece, then securing the braze foil to the first workpiece to form a brazable component, then positioning a second workpiece proximal to the brazable component, and then brazing the second workpiece to the brazable component. Additionally or alternatively, the brazing process includes positioning the braze foil on a tube, then securing the braze foil to the tube to form a brazable tube, then positioning a plate of a plate assembly proximal to the brazable tube, and then brazing the plate to the brazable tube. The plate assembly includes a plate and a tube brazed to the plate by a braze foil secured to the tube.

Abstract: A metallized film-over-foam contact suitable for circuit grounding of surface mount technology devices generally includes a silicone foam resilient core member, a solderable electrically conductive layer, and an adhesive bonding the solderable electrically conductive layer to the resilient core member. The adhesive has no more than a maximum of 900 parts per million chlorine, no more than a maximum of 900 parts per million bromine, and no more than a maximum of 1,500 parts per million total halogens.