Abstract: A process for joining two parts by braze-welding, including forming a joint, between two surfaces to be joined, and a fillet. The composition of the filler metal used to form the fillet is different from that used to form the joint, to provide the joint with a higher ductility. The method can, for example, be applied to production of high-pressure compressor guide-vane sectors for a turbomachine.

Abstract: A corner fitting includes a sleeve body having a hollow inner space and configured to coaxially fit over a pipe member of a predetermined size. An edge of the sleeve body at a second distal end has a corner cut portion, a protruding tab, and two recesses, the protruding tab being diametrically opposed to the corner cut portion in the radial direction of the sleeve body, and the recesses being diametrically opposed to each other in the radial direction of the sleeve body. The corner cut portion is configured and shaped such that the sleeve body fits together with an identical sleeve body on the pipe member of the predetermined size with the corner cut portions of the two sleeve bodies contacting each other and with the pipe being nested between the protruding tabs of the second distal ends of the two sleeve bodies.

Abstract: A brazed part includes two or more components that are brazed together and has related method of making. Using a method of locating parts relative to one another, an inter-component gap between the components may be formed. Subsequently, during brazing, flow control features formed along the inter-component gap may then be used to assist in the retention of the braze material between the components during brazing.

Abstract: A method of forming a brazed joint is provided in which a surface portion of a first metal part is placed in contact with a surface portion of a second metal part to form a contact area therebetween, and the first and second metal parts include copper, silver and/or gold as the primary base metal(s) and at least the surface portion of the first metal part is a modified alloy of the primary base metal(s) having 0.5-12 wt. % phosphorus as a modifier. The surface portion of the first metal part is heated to a temperature sufficient to cause the phosphorus to wet the surface portion of the second metal part and to flow a low melting portion of the first metal part into the contact area by capillary attraction to form the brazed joint between the first and second metal parts.

Abstract: The present invention relates to a method of brazing articles of stainless steel, which method comprises the following steps: step (i) applying an iron-based brazing filler material to parts of stainless steel; step (ii) optionally assembling the parts; step (iii) heating the parts from step (i) or step (ii) to a temperature of at least about 1000° C. in a non-oxidizing atmosphere, a reducing atmosphere, vacuum or combinations thereof, and heating the parts at the temperature of at least about 1000° C. for at least about 15 minutes; step (iv) providing articles having an average hardness of less than about 600 HV1 of the obtained brazed areas. The present invention relates also to brazed articles of stainless steel.

Abstract: This application discloses a multilayer aluminum material comprising an aluminum alloy core and aluminum alloy cladding, wherein the aluminum alloy cladding contains 0.1-1.0 wt % Cu, 0.1-0.5 wt % Fe, 0.1-1.0 wt % Mn, 3-15 wt % Si, 0.005-0.15 wt % Ti and >3-?7 wt % Zn, remainder Al. The aluminum alloy cladding can also optionally contain one or more of 0.001-0.3 wt % Mg, 0.001-0.01 wt % Ni or 0.001-0.05 wt % of at least one of Sr, Ca or Na. A process for producing the material is also described. The material can be produced in sheet form and is suitable for brazing application. The metal forms fabricated from the multilayer aluminum material by a process comprising brazing steps are also described.

Abstract: This application discloses a multilayer aluminum material having an aluminum alloy core and an aluminum alloy cladding, wherein the aluminum alloy cladding contains ?1.0 wt % Cu, ?0.5 wt % Fe, ?1.0 wt % Mn, ?15 wt % Si, ?0.15 wt % Ti, ?7 wt % Zn and at least one of Sr or Na, remainder Al. The aluminum alloy cladding can also contain one or more of ?0.2 wt % Mg or ?0.05 wt % Ni. A process for producing the material is also disclosed. The material can be produced in sheet form and is suitable for brazing application. The metal forms fabricated from the multilayer aluminum material by a process comprising brazing steps are also disclosed.

Abstract: A corner fitting includes a sleeve body having a hollow inner space and configured to coaxially fit over a pipe member of a predetermined size. An edge of the sleeve body at a second distal end has a corner cut portion, a protruding tab, and two recesses, the protruding tab being diametrically opposed to the corner cut portion in the radial direction of the sleeve body, and the recesses being diametrically opposed to each other in the radial direction of the sleeve body. The corner cut portion is configured and shaped such that the sleeve body fits together with an identical sleeve body on the pipe member of the predetermined size with the corner cut portions of the two sleeve bodies contacting each other and with the pipe being nested between the protruding tabs of the second distal ends of the two sleeve bodies.

Abstract: A brazed part, and methods of forming a brazed joint therein, are disclosed. The brazed part includes two or more components that are brazed together. Using the method of locating the parts herein disclosed, an inter-component gap between the components may be formed. Flow control features formed along the inter-component gap may then be used to assist in the retention of the braze material between the components during brazing.

Abstract: The invention relates to a target arrangement comprising a tubular-shaped carrier element and a hollow-cylindrical target having at least one target material, said target comprising at least one one-piece tube segment which at least partially surrounds the carrier element. Said carrier element and the tube segment are partially interconnected in a material fit by at least two plastically deformable compensating means. The invention also relates to a method for producing said type of target arrangement and a tubular segment.

Abstract: An electronic device 1 has a first semiconductor substrate 2 on which a bonding projection section 42 is projected via an insulation film 41, a second semiconductor substrate 3 that is bonded by welding the bonding projection section 42 of the first semiconductor substrate 2 via conductive bonding material, a through hole 54 that is formed to penetrate the bonding projection section 42 and the insulation film 41 in a bonding direction, and a conduction wiring section 44 that is formed by the conductive bonding material filled in the through hole 54 at a time of bonding by welding and conducts the first semiconductor substrate 2 with the second semiconductor substrate 3 to have same electric potential.

Abstract: A method of attaching a component to a substrate, including providing a component guide attached to a substrate, the component guide having a cavity substantially conforming to contours of a portion of a component, attaching a first solder pad to the component, inserting the component into the guide cavity, providing a second solder pad, offset from the first solder pad and near the cavity, and inserting the component, the component guide and the substrate into an oven heating the solder pads, wherein the component is drawn further into the guide cavity by a capillary effect of the heated solder pads.

Abstract: A brazed part, and methods of forming a brazed joint therein, are disclosed. The brazed part includes two or more components that are brazed together. Using the method of locating the parts herein disclosed, an inter-component gap between the components may be formed. Flow control features formed along the inter-component gap may then be used to assist in the retention of the braze material between the components during brazing.

Abstract: A method for joining a first component to a second component with a brazing material, the first component including an aperture for receiving the second component. The method includes positioning the second component within the first component via the aperture to form a gap between an inner surface of the first component and an outer surface of the second component, introducing by capillary action brazing material into the gap between the first component and the second component, and forming a join between the first and second component upon cooling of the brazing material introduced by capillary action. According to this first aspect of the present invention, the capillary flow of brazing material in the gap is diverted via a capillary flow diverter located in the gap between the first and second component.

Abstract: The invention relates to a method for high-precision fixing of a miniaturized component (1), in particular having a microoptical element (2), on a predetermined fixing section (3) of a support plate (4) by a solder joint. The support plate is formed throughout from a metallic material and has a cut-out region (10) which encloses the fixing section (3), is bridged by at least one connecting web (9) of the support plate (4), keeps the heat transfer from the fixing section (3) to the remaining support plate low and compensates lateral thermal expansions of the fixing section (3). Solder material (8) is applied on the top of the fixing section (3). The method comprises in particular the steps: arrangement of the component (1) above the fixing section (3), the solder material (8) and the base (7) of the component (1) being present in opposite positions without contact and forming a space.

Abstract: Embodiments of the invention provide a method of welding sputtering target tiles to form a large sputtering target. Embodiments of a sputtering target assembly with welded sputtering target tiles are also provided.

Abstract: A method of making a golf club head is disclosed. A striking plate is attached to a front open end of a metal casing to cover an opening. The striking plate is placed over the front open end by contacting a rear surface of the striking plate with the front open end, thereby creating a clearance between the rear surface and the front open end. A brazing material is positioned on one of the rear surface and the front open end externally of and immediately adjacent the clearance. When the brazing material melts, it flows into the clearance through a capillary action, thereby forming a layer of brazing material between the rear surface and the front open end.

Abstract: A method for forming a tool 10 and a tool 10 which is comprised of several selectively coupled sectional members, such as members 12, 16, which are placed upon a heat resistant surface 20. A sealing material 24, such as copper in a solid molecular state, is placed around the periphery of the tool 10. The copper in a solid molecular state 24, the heat resistant surface 20, and the tool 10 are placed within a heat source which transforms the copper in a solid molecular state 24 into liquid which flows within the gaps, such as gap 41 and within knife edges 26, 28 which exists within the tool 10. After the copper 24 cools, the cooper 24 reinforces and strengthens the tool 10.

Abstract: The present invention provides a method of manufacturing a honeycomb body (1) formed by winding a flat metal foil (3) and a corrugated metal foil (4) in layers and brazing them, capable of reducing the equipment cost of honeycomb body manufacturing facilities and conforming to the countermeasure against an engine misfire problem of the honeycomb body, without causing insufficient or excessive application of adhesive which is seen in the cases of adhesive application methods using rolls; and relates to a method of manufacturing a honeycomb body characterized by: applying an adhesive to the portions to be brazed of the flat or corrugated foil corresponding to a bonding portion (17) which is located at one or both ends of the honeycomb body and/or a bonding portion (18) inside the honeycomb body over a cross section which is located away from one or both ends thereof in the axial direction; then, winding the flat and corrugated foils in layers to form a honeycomb body; then, making the portion of one or both end

Abstract: A device for integrally joining a metal block (11′) that can consist of a number of plates, by hard-soldering or brazing. The hard-solder provides a connection covering a large surface and with a minimal thickness in solder gaps (17j; j=1, 2, . . . , n−1) located between adjacent segment plates (12i; i=1, 2, . . . , n). At least one capillary solder inflow path (14) is provided. Said solder inflow path starts at a solder depot containing a supply of hard solder or braze material (42), which melts as the stack (11) of plates is heated. The melted solder material flows directly to the individual, also capillary solder gaps (17j; j=1, 2, . . . , n−1) via said solder inflow path, the solder gaps being provided between surfaces of the segment plates (12i) that face towards each other.

Abstract: A manufacturing method of a circuit board comprises the steps of: (a) feeding a printing stage having a porous member comprising a porous plate and a porous sheet, the porous sheet is composed of 90 wt % to 98 wt % of cellulose; (b) placing a plate for the circuit board having a pierced hole above the porous member; and (c) filling a conductive material in the pierced hole from an upper side of the plate for circuit board by sucking the porous member at a prescribed vacuum pressure from a back of the porous member.

Abstract: An assembly of parts is prepared by providing a female part having a recess and a male part having an inserted surface received within the recess. A relief pattern such as knurling is formed on the inserted surface. The inserted surface of the male part is inserted into the recess of the female part with a contacting-channeled fit between the inserted surface and the recess surface, so that the knurl serves to align the inserted surface within the recess. The inserted surface of the male part is brazed or otherwise joined to the recess of the female part.

Abstract: A method for manufacturing a contract arrangement for a vacuum switching tube having a contact carrier and a contact piece joined to the contact carrier in a vacuum using soldering material. The contact carrier is made of electrically highly conductive material, for example, copper, and the contact piece is made of a flame-resistant sintering material containing copper. The contact piece is pressed flat directly onto the contact carrier, generating a gap along the contact surface, and the soldering material is arranged on areas directly bordering the gap of the contact surface between the contact piece and the contact carrier. Subsequently, in a vacuum through the application of heat, the soldering material is brought to the melting point, and the molten soldering material penetrates into the gap of the contact surfaces between the contact carrier and the contact piece.

Abstract: Fastening an attaching eye to the base of a dashpot by welding. The object is to simplify tooling and position the parts more accurately. The eye (3) is fabricated from strip, preferably by rolling or bending, prior to welding and is provided with an outward-tapering V-shaped abutment (4). The base (1) is provided with a transverse W-shaped groove comprising two rounded depressions (5 & 6), their depths and middle elevations (7) dimensioned to ensure that the eye will come into contact with the lateral edges (8 & 9) of the groove. The abutment is more or less in alignment with the groove's elevation.

Abstract: Ultra-small satellite droplets of molten metal, generated from capillary stream break-up, are selectively directed to predetermined locations on a substrate. The satellite droplets are produced at a high rate and are highly uniform because of the nature of capillary stream break-up. Applied harmonic disturbances are used to control and generate the satellite and parent droplets. The satellite droplets are electrostatically charged on a droplet-by-droplet basis and are then deflected by, e.g., an electric field to predetermined locations on a substrate. The substrate is moveable, attached to an x-y table, for facilitating the placement of satellite droplets on the substrate. The satellite droplets can be placed in individual locations on the substrate (e.g., for forming a ball grid array) or can be overlapped to form conductive traces. Because the satellite droplets have small diameters, these traces may have correspondingly small widths or pitches.

Abstract: An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is directed through the capillary onto the solder to reflow the solder to the substrate. The apparatus provides for individual introduction of the solder material into the capillary and urging of the solder material from a reservoir to the capillary while preventing unintended jams and blockage of the solder material.

Abstract: Ultra-small satellite droplets of molten metal, generated from capillary stream break-up, are selectively directed to predetermined locations on a substrate. The satellite droplets are produced at a high rate and are highly uniform because of the nature of capillary stream break-up. Applied harmonic disturbances are used to control and generate the satellite and parent droplets. The satellite droplets are electrostatically charged on a droplet-by-droplet basis and are then deflected by, e.g., an electric field to predetermined locations on a substrate. The substrate is moveable, attached to an x-y table, for facilitating the placement of satellite droplets on the substrate. The satellite droplets can be placed in individual locations on the substrate (e.g., for forming a ball grid array) or can be overlapped to form conductive traces. Because the satellite droplets have small diameters, these traces may have correspondingly small widths or pitches.

Abstract: Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.

Abstract: A capillary for electrical bonding between a semiconductor chip and corresponding pins of a semiconductor device in which the chip is accommodated, comprising a body whose terminal portion is substantially frustum-shaped, the body having a diametrical through hole which allows the passage of a copper wire for electrical bonding between the chip and the semiconductor device; the portion of the body that is adjacent to a lower end of the through hole is flared, with a flaring diameter and a flaring angle which allow to form a substantially flat annular peripheral region on a copper ball when the copper ball placed at a lower end of the copper wire is deformed by the action of the capillary, the formation of the substantially flat annular peripheral region being independent of the position of the copper wire within the through hole of the body of the capillary.

Abstract: Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.

Abstract: A method for assembling electronic devices including a plurality of soldering pads for soldering contacts of electronic devices, and at least an insulated zone neighboring at least one of the soldering pads, from which soldering paste is extendible to at least a portion of the insulated zone while applying soldering paste. The method includes the steps of applying soldering paste onto at least a portion of the soldering pads allowing the soldering paste to extend outwardly from at least one soldering pad to locations not in contact with other soldering pads or traces, or to at least a portion of an insulated zone neighboring the soldering pad; and soldering contacts of electronic devices to the circuit board having the portion of soldering pads including the at least one soldering pad.

Abstract: A method is disclosed of manufacturing a pulley with integral bearing comprising a sheet metal pulley mounted on the outer race of a bearing. The pulley is a close sliding fit on the outer race. The interstice between the pulley and the race is at least partly filled with a low-melting-point filler metal which, when heated, melts and diffuses by capillary action into the interstice between the pulley and the race, at least partly filling the interstice and fastens the pulley to the race when it solidifies. The filler metal is advantageously a brazing alloy having a melting point much lower than that of the parts to be joined together. Applications of the method include the manufacture of belt tensioning pulleys with integral bearings, as used on automobile vehicle engines, for example.

Abstract: A method of applying molten solder to connection surfaces on a substrate. The substrate, which has a surface which can be wetted with solder or at least one area which can be wetted while the rest cannot, is immersed in an organic liquid medium whose boiling point is the same as or above the melting point of the solder. Solder is applied to the surface or the area on the substrate where a terminal is to be formed to produce a solder bump, the quantity of solder to be placed on the connection surface is in the liquid medium, at least at the moment when it makes contact with the surface, and the temperature of the liquid medium is at or above the melting point of the solder.

Abstract: One and two piece surface mount pin constructions include excess solder receiving channels. In the one piece construction an elongate channel is provided through a tubular pin which is flared or swaged at the lower end to form a base. In the two piece construction a solid pin is provided at a lower end with a uniform cross section in the form of a regular polygon, such as a square, hexagon or octagon. The resulting edges are press-fit against an internal surface of a sleeve which is also swaged at a lower end to form a base. The spaces between the sleeve and the flat or convex surfaces on the captured end of the pin provide the solder-receiving channels. A bead or shoulder on the pins can provide a stop for a vacuum nozzle. When a flared upper lip is used for this purpose it can also serve as a reservoir or well to receive excess solder beyond the amount that can be received in the channels.

Abstract: The portion of the lead which is soldered between electrical components in a circuit module includes one or more radially extending slits. Once heated, the fluid solder is drawn into the slits by capillary action. Trapped air escapes, eliminating air pockets or gaps. The result is a stronger joint and a reduction in solder overflow.

Abstract: A joint for brazing includes a male member having an external surface and a female receptacle having an internal surface. The external surface is positionable in face-to-face relationship with the internal surface when the male member is inserted within the female receptacle. A self-fixturing surface is provided on at least one of the male member and the female receptacle for centering the male member with respect to the female receptacle when the male member is inserted within the female receptacle and to provide substantially equal clearance between and around the male member and the female receptacle for proper capillary attraction of the metallic intermediate bonding material or filler alloy during brazing. The filler alloy is drawn by capillary attraction into the space between the meeting faces defined by the external surface of the male element and the internal surface of the female receptacle.

Abstract: A method of preparing a substrate (1) having terminal electrodes (2, 3) which are provided on its both surfaces and a through hole (4), having a conductive film (5) formed on its inner peripheral surface, provided between the terminal electrodes (2, 3), mounting a lead terminal (9) having a pair of branch portions (9a, 9b) for elastically holding said terminal electrodes (2, 3) therebetween to the substrate (1), dipping the substrate (1) in molten solder from its lower surface (1b), drawing out the substrate (1) and solidifying the molten solder, thereby soldering the lead terminal (9) to the terminal electrodes (2, 3).

Abstract: A method of adhering in advance a soldering material to a location on each of a plurality of claw-shaped portions of a commutator at which a winding for the armature of an electric motor is to be electrically connected thereto, for ensuring a strong and reliable electrical connection between the windings and the claw-shaped portions.A plurality of narrow grooves are defined in the claw-shaped portions and the narrow grooves are charged with molten soldering material, which solidifies therein. The thus-solidified soldering material is thereafter re-melted by heat produced at the time of resistance welding of the windings to the claw-shaped portions to thereby reinforce the electrical connection between the claw-shaped portions and the windings and to prevent an increase in the electric resistance between the windings and the claw-shaped portions.

Abstract: In brazing a first metal piece having a tubular joint portion of predetermined length at an end thereof and a second metal piece having a bore for inserting the extremity of the joint portion thereinto by replaced brazing with the extremity of the joint portion inserted in the bore, a plurality of axial grooves having a depth of 0,3 to 1,5 mm and arranged at a spacing of 5 to 30 mm in the circumferential direction are formed in the outer peripheral surface of joint portion of the first metal piece. Each of the grooves has one end extending to the outside of the bore of the second metal piece when the joint portion is inserted in the bore. The gas or residue of flux produced during brazing escapes through the grooves, whereby voids or like defects are prevented from occurring in the fillet of the brazed joint. Since the grooves are all filled up with the brazing filler metal, the brazed joint is given a sufficient bond strength and prevented from permitting leakage there-through.

Abstract: A solder is disposed outside a joint area without putting a solder foil in an area to be joined or performing preparatory soldering, and soldering is performed by making the melted solder permeate the joint area by a capillary phenomenon. Further, one member is supported by a solder, and a joint solder layer of desired thickness is obtained by use of a jig for supporting the one and the other member at a predetermined distance therebetween when the solder is melted. Further, if a solder outside a joint area is made to stand vertically in its longitudinal direction, and melted at such a state, pressure caused by self-weight is given to the melted solder, and oxide of the solder surface is separated from the melted solder, so that it is possible to further reduce the generation of voids.

Abstract: A solder coating apparatus for coating lead sections of a lead frame, including a liquid solder bath and a coating block having a first slit-like passage therethrough for permitting a lead frame to pass through the block and a second passage of enlarged cross section communicating with and extending along the first passage for permitting the lead frame package to pass through the block. A pair of liquid solder supply slits are formed in the block and communicates with the first passage along the length thereof and on opposite sides of the second passage. A pump at least partially immersed in the liquid solder bath provides for positive supply of liquid solder to and through the slits into the first passage to coat the lead sections. A conduit connects between the delivery side of the pump and the liquid solder supply slits.

Abstract: A method for applying solder to a braided shield of a cable, particularly of a coaxial cable. A cable end portion is dipped into a solder bath a defined depth and for a defined time period prior to the removal of the jacket of the cable.

Abstract: A method for soldering in a furnace the end of a small diameter metallic pipe to a mating member. The soldered product is generally used as an oil or air supply means for automobiles and other various kinds of machines and devices. According to the method of this invention, a larger outer diameter portion is formed at the connecting end of a pipe and forced into the inner peripheral wall of the connecting end of a mating member leaving a small clearance therebetween. Then a soldering material arranged near the the clearance is fused by heating. The method of the invention is advantageous in that upon heating, the soldering material distributes uniformly throughout the clearance between the mating walls of the connecting members thereby securely soldering both members without the necessity of tack welding.

Abstract: Method and apparatus for holding the ends of two metal rods which are to be joined, cutting a face on each of the two metal rods, maintaining alignment of the two cut faces, and providing proper compressive force on the two rods while they are joined by a brazing operation.

Abstract: In a method of mounting an electronic component onto a printed circuit board by reflow mounting, the electronic component having a plurality of connection leads protruding from the component, a plurality of strips of solder are applied on a group of pads arranged in a line on the printed circuit board. The pads are disposed on the circuit in correspondence to the connection leads, and the connection leads of the electronic component are bonded to the corresponding pads by reflow soldering. By applying solder in strips, their widths need not be excessive, thereby avoiding solder bridging.

Abstract: An electronic component (14) is soldered to a circuit carrying substrate (11) by a method that allows the component to remain in better contact with the flat solder pads of the substrate. The circuit carrying substrate (11) has a plurality of solder pads (12) disposed thereon, each pad consisting of a terminal portion (16), a solder reservoir portion (18), and a bridging portion (17). The terminal portion is connected to the reservoir portion by the bridging portion. The bridging portion is typically a necked down portion of the pad. The electronic component (14) has a plurality of solderable terminals (15) corresponding to the terminal portions (16) of the solder pads (12). Each of the solder pad reservoir portions are coated with a reservoir of solder (23). The amount of solder coated onto the reservoir portion is sufficient to provide a fillet between the component (14) and the solder pad terminal portion (16) during a subsequent heating step.

Abstract: A plate-like material is rounded in the form of a cylinder so as to form a main body of a commutator to which an end of a winding for an armature coil of an electric motor is electrically connected, and both ends of the plate-like material are opposed to each other so as to define a joint portion therebetween. When a molten soldering material is introduced into the joint portion and solidified therein, the joint point is closed by the soldering material, thereby making it possible to mold the main body of the commutator, which is shaped substantially in the form of a jointless cylinder. The commutator can be easily fabricated and the manufacturing cost thereof can also be reduced as compared with a case where the main body of the commutator is fabricated from a pipe-shaped material. Since the joint portion can reliably be closed, resin used to charge the inside of the main body of the commutator therewith at a subsequent step can be prevented from extruding toward the outside of the main body.

Abstract: The method of the invention comprises the steps of locating the integrated circuit so that the projecting ends of the pins thereon are in juxtaposition with the corresponding connector pads on the printed circuit board; and applying solder to the connector pads with a heated soldering tool moving over the pads and touching the projecting ends of the pins on the integrated circuit without overlying the pins to solder the projecting ends of the pins to the connector pads. The method of the invention further comprises the step of applying a soldering flux to the pins and connector pads prior to applying the solder with the soldering iron. After the soldering operation is complete, the flux is removed with a flux remover. If the connector pads are new, a base solder is applied to the connector pads prior to placement of the integrated circuit on the printed circuit board.

Abstract: When soldering a honeycomb body formed by alternately piling flat foils (plates) and corrugated foils (plates), a binder liquid is sucked up from the end face of the honeycomb body to form a binder streak in a space defined by contacting portions of the flat foil (plate) and corrugated foil (plate), a solder is scattered and applied onto the binder streak, and the honeycomb body is then dried and heated to effect a soldering of the honeycomb body. According to this method, soldering can be accomplished only in the vicinity of the contacting portions of the flat foil (plate) and corrugated foil (plate), with a desired soldering structure.

Abstract: When soldering a honeycomb body formed by alternately piling flat foils (plates) and corrugated foils (plates), a binder liquid is sucked up from the end face of tile honeycomb body to form a binder streak in a space defined by contacting portions of the flat foil (plate) and corrugated foil (plate), a solder is scattered and applied onto the binder streak, and the honeycomb body is then dried and heated to effect a soldering of the honeycomb body. According to this method, soldering can be accomplished only in the vicinity of the contacting portions of the flat foil (plate) and corrugated foil (plate), with a desired soldering structure.