Using Spray Patents (Class 228/261)
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Patent number: 8871356Abstract: The invention relates to a self-fluxing brazing piece. The piece comprises a composite material comprising at least one inorganic material distributed in a metal or metal alloy matrix, the inorganic material forming a flux during brazing to promote the formation of a thermally induced metallic bond. The matrix may be an aluminum silicon brazing alloy and the inorganic material may be a potassium-fluoro-aluminate flux. The piece is made by spray forming.Type: GrantFiled: March 14, 2008Date of Patent: October 28, 2014Assignees: Sandvik Osprey Limited, Sapa Heat Transfer ABInventors: Andrew Josef Widawski Ogilvy, Douglas Kenneth Hawksworth, Elisabeth Abom
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Publication number: 20140226285Abstract: A component includes a substrate, a chip, and a frame. The frame, the substrate, and the chip enclose a volume. A metal sealing layer is provided which is designed to hermetically seal the volume. The metal sealing layer has a hardened liquid metal or a hardened liquid metal alloy.Type: ApplicationFiled: August 10, 2012Publication date: August 14, 2014Applicant: EPCOS AGInventors: Christian Bauer, Hans Krueger, Juergen Portmann, Alois Stelzl, Alexander Schmajew
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Publication number: 20130001280Abstract: Metal nanoink for bonding an electrode of a semiconductor die and an electrode of a substrate and/or bonding an electrode of a semiconductor die and an electrode of another semiconductor die by sintering under pressure is produced by injecting oxygen into an organic solvent in the form of oxygen nanobubbles or oxygen bubbles either before or after metal nanoparticles whose surfaces are coated with a dispersant are mixed into the organic solvent. Bumps are formed on the electrode of the semiconductor die and the electrode of the substrate by ejecting microdroplets of the metal nanoink onto the electrodes, the semiconductor die is turned upside down and overlapped in alignment over the substrate, and then, the metal nanoparticles of the bumps are sintered under pressure by pressing and heating the bumps between the electrodes. As a result, generation of voids during sintering under pressure is minimized.Type: ApplicationFiled: August 21, 2012Publication date: January 3, 2013Applicants: SHINKAWA LTD., ULVAC, INC., TOHOKU UNIVERSITYInventors: Toru MAEDA, Tetsuro TANIKAWA, Akinobu TERAMOTO, Masaaki ODA
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Patent number: 8240544Abstract: The invention relates to a method for joining objects made of metal, plastic or ceramic by means of heat input such as soldering or welding, wherein materials such as particles, in particular nanoparticles, elements, atoms, molecules or ions are introduced into the joint. It is proposed according to the invention that a gas stream brings gaseous compounds to the joint which decompose at elevated temperature and deposit particles.Type: GrantFiled: October 27, 2010Date of Patent: August 14, 2012Assignee: Linde AktiengesellschaftInventor: Wolfgang Danzer
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Publication number: 20120048912Abstract: Embodiments of a method for forming an MCrAlY coating on a gas turbine engine component are provided, as are embodiments of a method for repairing a structurally-damaged region of a gas turbine engine component utilizing an MCrAlY material. In one embodiment, the method includes the step of preparing an MCrAlY slurry containing an MCrAlY powder, a low melting point powder, a binder, and a dilutant. After application over the gas turbine engine component, the MCrAlY slurry is heated to a predetermined temperature that exceeds the melting point of the low melting point powder to form an MCrAlY coating on the gas turbine engine component. The MCrAlY powder may have any one of a number of different compositions.Type: ApplicationFiled: August 26, 2010Publication date: March 1, 2012Applicant: HONEYWELL INTERNATIONAL INC.Inventors: Yiping Hu, Richard L. Bye
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Patent number: 7915562Abstract: The present invention relates to a high energy density beam welding system using molten metal droplet jetting. The present invention includes a beam emitting unit for emitting a high energy density beam onto a welded portion on a target object; and a molten metal droplet jetting unit for generating molten metal droplets to transfer or spray the molten metal droplets onto the welded portion on the target object, which follows a path of the beam emitting unit. Thus, it has advantages of widening a range of applications and enhancing the productivity and the quality in that a welding can be performed at a high junction efficiency even where a gap is wide, a loss in the high density energy beam is small, and heat distortions of the welded portion can be minimized.Type: GrantFiled: May 12, 2005Date of Patent: March 29, 2011Assignee: Institute For Advanced EngineeringInventor: Kyoung Don Lee
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Patent number: 7900812Abstract: A process for physically bonding two parts to each other is disclosed. In addition, a process for forming electrical connections have a low resistance is disclosed. The process is generally applicable to the joining of two parts each formed from a metal, an alloy, or a combination thereof. The process finds special use in the formation of multi-celled batteries. The process involves placing two parts or electrical conductors in contact with each other and then bonding them to each other using a kinetic spray process and powder particles. In formation of a multi-celled battery the particles are preferably electrically conductive. The process enables for rapid and cost effective formation of a physical connection. In addition, the connection can have an electrical resistance of less than about 0.5 milli Ohms and strength equal or greater than ultrasonic welding.Type: GrantFiled: November 30, 2004Date of Patent: March 8, 2011Assignee: EnerDel, Inc.Inventors: Richard E. Teets, Thomas H. Van Steenkiste, Duane D. Kruger, Robert C. Beer
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Publication number: 20100038348Abstract: A method for joining aligned discrete optical elements by which the optical elements can be joined in the aligned state. A thermal connection having long-term stability can be produced at little expense and with high positioning accuracy. Surface regions to be joined can be provided with at least one thin metallic layer by the method for joining aligned discrete optical elements. The surface regions are subsequently wetted using a liquid solder free of flux in a contactless dosed manner. The solder is applied to the surface regions to be joined via a nozzle using a pressurized gas stream.Type: ApplicationFiled: January 8, 2008Publication date: February 18, 2010Inventors: Erik Beckert, Henrik Banse, Elke Zakel, Matthias Fettke
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Patent number: 7556689Abstract: A spreading device (10) includes an injector (14) and a spreading tube (16) connected with the injector. The injector contains therein a viscous thermal medium material for being spread on a surface of a cooling device for electronic components. The spreading tube defines therein at least one outlet hole (164) for release of the thermal medium material contained in the injector. The spreading device further includes means formed on the spreading tube for evenly distributing the material released through the outlet hole of the spreading tube over an entire area of the surface to be applied with the thermal medium material.Type: GrantFiled: February 13, 2006Date of Patent: July 7, 2009Assignee: Foxconn Technology Co., Ltd.Inventors: Chih-Peng Lee, Tay-Jian Liu
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Patent number: 7506793Abstract: A process for repairing a turbine component of a turbomachine, as well as a sintered preform used in the process and a high gamma-prime nickel-base superalloy component repaired thereby. The sintered preform contains a sintered mixture of powders of a cobalt-base braze alloy and a cobalt-base wear-resistant alloy. The braze alloy constitutes at least about 10 up to about 35 weight percent of the sintered preform and contains a melting point depressant such as boron. The preform is formed by mixing powders of the braze and wear-resistant alloys to form a powder mixture, and then sintering the powder mixture. To use the preform, a surface portion of the turbine component is removed to expose a subsurface portion, followed by diffusion bonding of the preform to the subsurface portion to form a wear-resistant repair material containing the braze alloy dispersed in a matrix of the wear-resistant alloy.Type: GrantFiled: October 4, 2007Date of Patent: March 24, 2009Assignee: General Electric CompanyInventor: Sujith Sathian
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Publication number: 20080149692Abstract: A solder-flux composition is sprayed onto a substrate by rotating the solder-flux composition inside a spray cap, and before the solder-flux liquid exits the spray cap, perturbing the flow thereof with a fluid.Type: ApplicationFiled: December 20, 2006Publication date: June 26, 2008Inventors: Harikrishnan Ramanan, Nitin Deshpande, Sabina J. Houle
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Patent number: 7311241Abstract: A printed board is arranged above solder blowing nozzles of a spot flow soldering apparatus with first terminal groups facing upward, second terminal groups projected toward the solder blowing nozzles are shielded by shield jigs, solder jetted from the solder blowing nozzles solders soldered portion of the first terminal groups to a first conductor on a back side of the printed board, then the printed board is turned upside down to put the second terminal groups in an upward facing state and to use a jig to shield the first terminal groups facing downward, and solder jetted from the solder blowing nozzles solders soldered portion of the second terminal groups to a second conductor on a front side of the printed board.Type: GrantFiled: August 18, 2005Date of Patent: December 25, 2007Assignees: Sumitomo Wiring Systems, Ltd., Daihatsu Motor Co., Ltd.Inventors: Shunji Taga, Kazuhiro Nakanishi
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Patent number: 7059512Abstract: An object of the present invention is to provide solder bumps sufficiently satisfying the expected functions and having a small diameter which conventional methods cannot attain, a semiconductor device on which these bumps are mounted, and a bump transferring sheet. The present invention provides a method for forming the bumps, which includes forming a solder alloy material layer and flux material layer one by one on an intermediate metallic layer formed on an external electrode pad in a semiconductor device, and then fusing these layers, wherein each of the solder alloy material layer and flux material layer is formed by a liquid spraying method (e.g., ink jetting method).Type: GrantFiled: November 4, 2003Date of Patent: June 13, 2006Assignee: Ricoh Company, Ltd.Inventors: Hitoshi Arita, Akio Kojima
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Patent number: 6997371Abstract: The invention relates to a method of manufacturing and coating heat transfer parts for a heat exchanger such as tubes in an automobile radiator. The tubes are coated with brazing material by thermal spraying, such as plasma deposition or wire-arc deposition. The coating is then melted by application of heat to braze the tubes to the fins and to the headers to complete the formation of the heat exchanger.Type: GrantFiled: April 26, 2005Date of Patent: February 14, 2006Assignee: Outokumpu OyjInventor: Yoram Leon Shabtay
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Patent number: 6840432Abstract: A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to the end face of the second electric component to form a second metallized layer. A first fusible alloy layer is applied to the first metallized layer by melting a fusible alloy and propelling the melted fusible alloy onto the first metallized layer, and a second fusible alloy layer is applied to the second metallized layer by melting a fusible alloy and propelling the melted fusible alloy to the second metallized layer. The method further includes contacting the first fusible alloy layer to the second fusible alloy layer. Next, the end faces and fusible alloy layers are heated to melt the fusible alloy layers. After heating, the end faces and fusible alloy layers are cooled to form a bond between the end faces.Type: GrantFiled: April 21, 2003Date of Patent: January 11, 2005Assignee: McGraw-Edison CompanyInventors: Michael M. Ramarge, David P. Bailey, Thomas C. Hartman
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Patent number: 6811073Abstract: A method for connecting conductive members includes a step of providing a first conductive member, a step of providing a second conductive member, and a step of jetting droplets of molten metal so as to form a connecting portion which electrically connects the first conductive member to the second conductive member.Type: GrantFiled: November 4, 2002Date of Patent: November 2, 2004Assignee: Yazaki CorporationInventors: Hitoshi Ohashi, Hitoshi Ushijima
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Patent number: 6811074Abstract: For dispensing solder on a substrate, a soldering wire and a forming gas heated to a predetermined temperature are fed to a mixing chamber of a two-component nozzle so that, in the mixing chamber, solder is melted off and carried with the gas stream. The solder blown out of the two-component nozzle settles on the substrate. The two-component nozzle is moved or swivelled relative to the substrate in order to distribute the solder over a predetermined area of the substrate.Type: GrantFiled: February 27, 2003Date of Patent: November 2, 2004Assignee: ESEC Trading SAInventors: Guido Suter, Christoph Tschudin
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Publication number: 20040164131Abstract: An electronic component 10 is moved along a predetermined path in a first direction D1 by a work conveying unit 16. From a second direction substantially orthogonal to the first direction, a solder material is applied, by injection, to lead terminals 11 of the electronic component by a solder supply unit 14. While the applied solder material is in a molten state, a high-temperature fluid is sprayed to the lead terminals by a fluid spray unit 15. It is desirable that the direction of spraying of the high-temperature fluid is adjustable.Type: ApplicationFiled: February 26, 2004Publication date: August 26, 2004Applicant: TECT CorporationInventor: Haruo Watanabe
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Patent number: 6749901Abstract: A condenser that is to be brazed in a radiant energy oven has a significant, localized mass differential which would, without further treatment, create a significant temperature differential across the condenser in the braze oven. This is compensated for, in the method of the invention, by thermally spraying onto the surface of the higher mass portion a rough surface layer of a compatible material that increases the emissivity of that portion sufficiently, relative to the rest of the condenser, to decrease the temperature differential that would otherwise occur.Type: GrantFiled: August 24, 2000Date of Patent: June 15, 2004Assignee: Delphi Technologies, Inc.Inventors: Kunal Ghosh, Michael Czajkowski, Frank Joseph Leitch, Christopher Alfred Fuller, Lorraine Anders
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Publication number: 20040016793Abstract: A method is disclosed for direct application of a brazing flux material to a brazing surface. The method includes the step of applying a brazing filler material to a substrate utilizing a kinetic spray process to form a brazing surface. Following application of the brazing filler material to the substrate brazing flux material can be directly applied to the brazing surface as either a dry powder or a wet slurry. The nature of the brazing surface allows the applied flux material to adhere to the surface without the utilization of additional binders or resin materials.Type: ApplicationFiled: July 24, 2002Publication date: January 29, 2004Inventors: Zhibo Zhao, Bryan A. Gillispie, John R. Smith, Thomas Hubert Van Steenkiste, Yang Luo
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Patent number: 6575355Abstract: A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to the end face of the second electric component to form a second metallized layer. A first fusible alloy layer is applied to the first metallized layer by melting a fusible alloy and propelling the melted fusible alloy onto the first metallized layer, and a second fusible alloy layer is applied to the second metallized layer by melting a fusible alloy and propelling the melted fusible alloy to the second metallized layer. The method further includes contacting the first fusible alloy layer to the second fusible alloy layer. Next, the end faces and fusible alloy layers are heated to melt the fusible alloy layers. After heating, the end faces and fusible alloy layers are cooled to form a bond between the end faces.Type: GrantFiled: June 5, 2001Date of Patent: June 10, 2003Assignee: McGraw-Edison CompanyInventors: Michael M. Ramarge, David P. Bailey, Thomas C. Hartman
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Publication number: 20020153405Abstract: A HVOF process is used for applying brazing materials to repair surfaces of a substrate such as a turbine blade. The brazing material is applied in powdered form and is free of binders and adhesives. The brazing materials may be any one or more of a nickel based, cobalt based or ferrous based high temperature brazing material. Alloys of these elements may be used together with a temperature depressing melting point element such as boron or silicon.Type: ApplicationFiled: February 22, 2001Publication date: October 24, 2002Applicant: HICKMAN INDUSTRIES, INC.Inventor: Hans Van Esch
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Patent number: 6435396Abstract: An embodiment of the present invention includes a disposable print head for ejecting controlled amounts of liquid (e.g., solder) at a high rate onto the surface (e.g., an integrated circuit) in close proximity to the ejecting source. The embodiment involves the use of a controlled burst of gas that is developed by rapidly heating a metallic hydride film with a laser to disassociate the hydrogen therefrom. The pressure created by the burst of hydrogen gas is used to eject an amount of a liquid (e.g., a solder) from an appropriate conduit that is fed liquid from a reservoir. The surfaces in the print head that contact the liquid are coated to assist in priming the print head for a subsequent ejection event.Type: GrantFiled: April 10, 2000Date of Patent: August 20, 2002Assignee: Micron Technology, Inc.Inventor: Jerome M. Eldridge
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Patent number: 6398103Abstract: A method for applying a wear coating on a surface of a substrate is described. A foil of the wear coating is first attached to the substrate surface, and then fused to the surface, e.g., by brazing. The wear coating may be formed from a carbide-type material. The substrate is very often a superalloy material, e.g., a component of a turbine engine. A method for repairing a worn or damaged wear coating applied over a substrate is also described, along with related articles of manufacture.Type: GrantFiled: February 23, 2001Date of Patent: June 4, 2002Assignee: General Electric CompanyInventors: Wayne Charles Hasz, Anthony Mark Thompson, Marcus Preston Borom
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Patent number: 6328199Abstract: Method for connecting a first object to a second object along a common contact surface, wherein the first object comprises at the location of the contact surface a portion for a connecting means to be applied, which portion is accessible along an edge zone of or via at least one opening in the second object, by means of thermal spraying of particles of a material suitable as connecting means onto the first object along the edge zone of respectively via the at least one opening in the second object in a quantity such that in solidified state the deposited material particles form a connection between the first and the second object, in addition to a convector element manufactured according to this method.Type: GrantFiled: July 20, 2000Date of Patent: December 11, 2001Assignee: Stichting Energieonderzoek Centrum NederlandInventor: Meindert Willem Brieko
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Patent number: 6302318Abstract: A method for applying a wear coating on a surface of a substrate is described. A foil of the wear coating is first attached to the substrate surface, and then fused to the surface, e.g., by brazing. The wear coating may be formed from a carbide-type material. The substrate is very often a superalloy material, e.g., a component of a turbine engine. A method for repairing a worn or damaged wear coating applied over a substrate is also described, along with related articles of manufacture.Type: GrantFiled: June 29, 1999Date of Patent: October 16, 2001Assignee: General Electric CompanyInventors: Wayne Charles Hasz, Anthony Mark Thompson, Marcus Preston Borom
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Patent number: 6279811Abstract: A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to the end face of the second electric component to form a second metallized layer. A first fusible alloy layer is applied to the first metallized layer by melting a fusible alloy and propelling the melted fusible alloy onto the first metallized layer, and a second fusible alloy layer is applied to the second metallized layer by melting a fusible alloy and propelling the melted fusible alloy to the second metallized layer. The method further includes contacting the first fusible alloy layer to the second fusible alloy layer. Next, the end faces and fusible alloy layers are heated to melt the fusible alloy layers. After heating, the end faces and fusible alloy layers are cooled to form a bond between the end faces.Type: GrantFiled: May 12, 2000Date of Patent: August 28, 2001Assignee: McGraw-Edison CompanyInventors: Michael M. Ramarge, David P. Bailey, Thomas C. Hartman
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Patent number: 6264094Abstract: A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.Type: GrantFiled: February 23, 2000Date of Patent: July 24, 2001Assignee: International Business Machines CorporationInventors: Wilton L. Cox, Joseph D. Poole, Kris A. Slesinger
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Patent number: 6257482Abstract: A jet solder feeding device allowing the molten solder ejected from ejecting ports to be kept at a desired height in a stable manner. The molten solder is ejected and fed from multiple ejecting ports formed on a corrugated plate, each wall portion surrounding the multiple ejecting ports formed on the corrugated plate is projected upward by coining or extrusion. This configuration allows the molten solder introduced under the corrugated plate to be satisfactorily guided by the conically shaped wall portion which surrounds each ejecting port and projected upward. Thus the molten solder ejected from the ejecting ports can be kept at a desired height, and in addition, its state is satisfactorily maintained in a stable manner.Type: GrantFiled: May 23, 2000Date of Patent: July 10, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masuo Koshi, Tadahiko Sugimoto, Hiroaki Nakayama, Kenichirou Todoroki
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Patent number: 6258402Abstract: A machine tool or die that is fabricated from thermally spray-formed steel is easily repaired by cleaning, roughing and covering the surface to be repaired by a cold-spray layer of metal and then forming a weldment by conventional electric welding processes. The repaired surface is then finished by conventional machining, grinding and polishing and then the tool is put back into service.Type: GrantFiled: October 12, 1999Date of Patent: July 10, 2001Inventors: Nakhleh Hussary, Paul Earl Pergande, Robert Corbly McCune
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Patent number: 6227435Abstract: A method of providing a smooth paintable surface after aluminum joining. Two aluminum pieces are welded together to form a joint, and a weld bead is formed at the joint. An aluminum spray filler is applied by thermal spraying on an area around the weld bead, and the area around the weld bead and aluminum spray filler is ground to produce a smooth paintable surface at the joint. The area around the weld bead is preferably roughened prior to spray brazing. The roughening is preferably produced by a process selected from grit blasting, rough sanding, and depositing a flux.Type: GrantFiled: February 2, 2000Date of Patent: May 8, 2001Assignee: Ford Global Technologies, Inc.Inventors: Kimberly Ann Lazarz, Matthew John Zaluzec
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Patent number: 6209774Abstract: A method of using a robot to repeatedly manipulate a brazing nozzle is provided. In a preferred embodiment, the method includes using a pointer to teach the robot to manipulate the brazing nozzle at a preselected angle with respect to, and length away from, an instant surface along a multi-dimensional seam line on an automotive sheet metal body. The pointer includes a base portion for connection with an end of a robot arm. The pointer additionally has a main body having a length inclusive of the base portion approximating the length of the brazing nozzle and the preselected work distance of the brazing nozzle away from the work piece. A contact portion of the pointer is continuous with the main body and is provided for contacting the work piece. The contact portion has two small parallel-spaced surface flats. The surface flats of the contact portion are generally aligned in a common plane at a preselected angle with respect to the robot arm.Type: GrantFiled: March 24, 2000Date of Patent: April 3, 2001Assignee: DaimlerChrysler CorporationInventors: John LeBlanc, Mark Simpson, Anthony J. Osborne, Ron Moore
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Patent number: 6186388Abstract: The invention features soldering parts (e.g., printed circuit boards) by indexing the parts sequentially and continuously through a series of processing stations. Flux may be applied to precise areas of the parts at a flux station, and the flux station may include a rough part locator that roughly locates a part indexed into the flux station and a precise part locator that precisely locates the part. The flux station may further include a guide rail for supporting the part and a mechanism for raising and lowering the guide rail. The flux station may include a flux sprayer for applying flux to the part, where the flux sprayer includes an air valve, a flux valve, and a controller coupled to activate and deactivate separately the air valve and the flux valve. The controller may activate the air valve before activating the flux valve and deactivate the flux valve before deactivating the air valve.Type: GrantFiled: April 23, 1999Date of Patent: February 13, 2001Assignee: VLT CorporationInventors: Steven P. Sadler, Patrizio Vinciarelli
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Patent number: 6036084Abstract: Screen printing and chip mounting are executed in a dry air atmosphere to prevent generation of solder balls due to absorption of moisture by a flux ingredient of paste solder. Screen printing of the solder on a board takes place in a space which has the board, a printing screen and a squeegee arranged therein and is formed therein with a dry air atmosphere having a pressure slightly higher than that of an atmosphere outside the space. Likewise, mounting of a chip on the board is carried out in a like space. Also, a reflow step is executed in a reflow oven kept at a dry air atmosphere.Type: GrantFiled: May 15, 1997Date of Patent: March 14, 2000Assignee: TDK CorporationInventors: Hiroshi Yagi, Hiroyuki Ohira
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Patent number: 5964395Abstract: A method of attaching an electronic component to a substrate comprising the steps of depositing a spray metal coating atop a substrate. An electronic component is placed atop a coating. A liquid metal is dispensed on or near the component. The liquid metal wets the component and the coating. The metal is reacted with the coating to form an electrically conductive bond with the substrate and adheres the component to the substrate. The reactive metal may be heated to a temperature which makes it liquid and facilitates wetting the coating and component. Suitable materials for the spray metal coating include copper, nickel, tin, bismuth, lead and silver and mixtures thereof. Suitable liquid metals generally include low melting temperature metals such as gallium and indium and mixtures thereof.Type: GrantFiled: June 9, 1997Date of Patent: October 12, 1999Assignee: Ford Motor CompanyInventors: Andrew Z. Glovatsky, Mohan R. Paruchuri
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Patent number: 5549239Abstract: A prefluxed, flux retaining aluminum-based component is provided comprising a solidified coating layer having flux particles embedded into the coating layer. A method for producing such components comprises steps of applying a molten metallic coating to an aluminum-based component, maintaining the coating in a molten state, driving flux particles against the coating, and cooling the component to solidify the coating and thereby fix the particles firmly in the solidified coating.Type: GrantFiled: November 1, 1994Date of Patent: August 27, 1996Assignee: Norsk Hydro a.sInventors: Edward J. Morley, Morten Syslak
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Patent number: 5526977Abstract: A method for attaching a metal wheel disc to a wheel rim formed from a metal which is dissimilar to the wheel disc metal. A layer of metal which is compatible for welding to the metal forming the wheel disc is thermally sprayed onto an outboard portion of the wheel rim to form a weld anchor. The wheel disc is positioned adjacent to the sprayed metal layer and welded thereto. The wheel disc also can be cast or forged over the sprayed metal layer with the wheel disc bonding to the sprayed metal layer to form a secure air-tight seal between the wheel disc and the wheel rim. Alternately, a metal filler compatible with both the metals forming the wheel disc and wheel rim is thermally sprayed onto the wheel rim and the wheel disc brazed thereto.Type: GrantFiled: December 15, 1994Date of Patent: June 18, 1996Assignee: Hayes Wheels International, Inc.Inventor: Daniel C. Wei
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Patent number: 5301863Abstract: A system and method for manufacturing an article that is formed by the incremental buildup of layers on a work surface contains a material deposition station to deposit the layers. In addition, a plurality of processing stations are employed. Each processing station performs a separate function such that when the functions are performed in series, a layer of the article is produced and is prepared for the deposition of the next layer. An article transfer apparatus repetitively moves the work surface and any layers formed thereon selectively among the deposition station and the processing stations. The article transfer apparatus continues to move between the processing stations until each layer is processed and a completely manufactured article is produced.Type: GrantFiled: November 4, 1992Date of Patent: April 12, 1994Inventors: Fritz B. Prinz, Lee E. Weiss
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Patent number: 5275329Abstract: This invention relates to butt joining methods. Such methods of this type, generally, allow fiber reinforced metal matrix composite components having a metal matrix and a fiber reinforcement to be butt joined in order to form a large integral structure.Type: GrantFiled: November 2, 1992Date of Patent: January 4, 1994Assignee: General Electric CompanyInventor: Herman A. Nied
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Patent number: 5224644Abstract: Method and apparatus for installation of honeycomb core seals in jet engine mounting rings, including spray deposition of brazing alloy in seals and establishment of compressive relationships between seal and ring prior to brazing of seal in ring.Type: GrantFiled: December 16, 1991Date of Patent: July 6, 1993Assignees: Thomas P. Mahoney, Donald A. Ruston, Robert S. BarnesInventor: James R. Campbell
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Patent number: 5018661Abstract: A method of lining an exhaust manifold is disclosed, comprising the steps of applying a thin layer of a heat-resistant compound to the interior of an exhaust manifold and bonding the compound to the manifold. The manifold may be in two or more sections when the compound is applied and the sections may subsequently be joined together to form the manifold. The compound may contain zirconium and/or may be a ceramic material.Type: GrantFiled: March 19, 1990Date of Patent: May 28, 1991Inventor: Frederick F. Cyb
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Patent number: 5014903Abstract: A method lining a component of a vehicle which may contact exhaust gases is disclosed, including the steps of applying a thin layer of a heat-resistant compound to an inner surface of the component to form a liner therein and bonding the liner to the surface. The manifold may be in two or more sections when the compound is applied and the sections may subsequently be joined together to form the component. The compound may contain zirconium and/or may be a ceramic material.Type: GrantFiled: April 12, 1990Date of Patent: May 14, 1991Inventor: Frederick F. Cyb
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Patent number: 5009359Abstract: The following steps are performed for joining workpieces of metal or ceramic to each other by boundary surface diffusion at the junction location. After laying together the surfaces at which the workpieces are to be joined together, a layer is applied to the outer edge of the joint location consisting of a material compatible with the material of the parts to be joined and mechanically stable under high static pressure. The layer is fixed and sealed. Thereafter the workpieces are diffusion welded by hot isostatic pressing (HIP). A layer meeting the requirements of this process can be applied by plasma spraying onto the region of the seam at the outer edge of the junction location.Type: GrantFiled: May 9, 1990Date of Patent: April 23, 1991Assignee: Forschungszentrum Julich GmbHInventors: Detlev Stover, Hans-Peter Buchkremer, Rudolf Hecker
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Patent number: 4961528Abstract: The invention relates to a method of providing a semiconductor body on a support with the interposition of a metal layer of aluminum. The adherence is effected in that the semiconductor body and the support are pressed against each other during the supply of heat at the area of the metal layer. The metal layer of aluminum is first applied to the support by flame spraying.Type: GrantFiled: March 21, 1989Date of Patent: October 9, 1990Assignee: U.S. Philips CorporationInventor: Petrus J. M. Peters
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Patent number: 4911353Abstract: A method of making a solar energy collector where the absorber plate, selective surface, and protective outer skin of the collector are formed by spraying molten metal particles onto a substrate and building a coating of metal up to a desired thickness. This process allows greater flexibility in permitting a greater choice of materials and geometric shapes to be used for manufacturing the collector. The process may also be used to create the individual components of the collector, i.e., body, absorber plate, or selective surface as well as a storage tank.Type: GrantFiled: September 29, 1988Date of Patent: March 27, 1990Inventor: David Deakin
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Patent number: 4901908Abstract: An aluminum material for brazing, comprising a core made of aluminum or an aluminum alloy, and a layer coated on the surface of the core. The layer is made of zinc or an alloy of zinc-and-aluminum and a brazing alloy having a melting point which is lower than that of the core by a predetermined value. The zinc or the alloy of zinc-and-aluminum and the brazing alloy have different melting points. Also disclosed are a method of manufacturing an aluminum material for brazing and a method of manufacturing an aluminum alloy heat exchanger by use of the Al material for brazing.Type: GrantFiled: September 6, 1988Date of Patent: February 20, 1990Assignee: Nippondenso Co., Ltd.Inventors: Kengi Negura, Ken Yamamoto, Shigeo Ito, Masahiro Shimoya
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Patent number: 4886202Abstract: A method of fabricating irregular shapes wrapped with metal matrix composite monotape utilizing a cylindrical deposition drum wrapped with a spiraling array of evenly spaced strands of high strength fibers and overlaid with a metal matrix, which is cut into a narrow ribbon which is transferred to a spool and then wound on the irregular shape in a helical manner so that the opposite side margins are adjacent each other in adjacent turns.Type: GrantFiled: November 7, 1988Date of Patent: December 12, 1989Assignee: Westinghouse Electric Corp.Inventor: Robert L. Ammon
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Patent number: 4757934Abstract: A semiconductor die is mounted on a metal substrate via intermediate layers which permit the die to be readily soldered to the combination while yet reducing thermal stresses. A dielectric layer is formed over the substrate, followed by another layer of a selected metal, either molybdenum or tungsten. Atop the metal layer is another layer comprising a mixture of solder and the selected metal. A layer of only solder is formed over the mixture, and the semiconductor die is bonded thereto by means of the layer of solder.Type: GrantFiled: February 6, 1987Date of Patent: July 19, 1988Assignee: Motorola, Inc.Inventor: Bernard Greenstein
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Patent number: 4521947Abstract: A carrier matrix for use in the manufacture of a catalytic reactor for the purification of exhaust gases in an internal combustion engine of a motor vehicle is prepared by joining in wound form a corrugated steel sheet and a generally flat steel sheet, the sheets being joined in locations where they contact one another by the use of solder or brazing material. In one embodiment solder is applied in spots along the tops of the arches of the corrugated sheet, and after coiling the solder is activated by heating. In another embodiment, coiling is first carried out and then soldering is accomplished by the application of solder into one or both end faces of the coil.Type: GrantFiled: September 30, 1982Date of Patent: June 11, 1985Assignee: Suddeutsche Kuhlerfabrik Julius Fr. Behr GmbH & Co. KG.Inventors: Manfred Nonnenmann, Heinrich Oltmanns, Manfred Hohhausel
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Patent number: 4426762Abstract: A method for selectively obturating at least one end of a structural module provided with rows of parallel ducts for the passage of at least two different fluids, said method comprising the steps of forming notches in those portions of the module end corresponding to the rows through which flows a first one of said fluids, said notches forming openings through the lateral wall of said module, and depositing an impervious material over the end of said module, so as to obturate the ducts through which the other fluid or fluids flow, while laterally leaving free access, by means of said notches, to the ducts through which flows said first fluid, said impervious material being sprayed in a liquid state, then gradually cooled, the angle at which it is sprayed being between 18.degree. and 30.degree. with respect to the direction of the ducts.Type: GrantFiled: August 14, 1980Date of Patent: January 24, 1984Assignee: Commissariat a l'Energie AtomiqueInventor: Guy Schnedecker