Abstract: Apparatus for applying solder to electrical or electronic components mounted in a horizontally oriented carrier, includes a solder bath, a pair of tracks (1,2) for guiding the carrier across the solder bath, and a device for urging the carrier along the tracks. The track has a first profiled region (12,19) for guiding a leading position of the carrier down towards the surface of the solder, and a second profiled region (16,20) longitudinally spaced from the first region, and laterally offset, for simultaneously guiding a trailing portion of the carrier down towards the surface of the solder, the profiles being substantially the same so that the carrier maintains its horizontal orientation while being moved vertically towards and away from the surface of the solder. The carrier moves on follower wheels which run along the tracks.

Abstract: A soldering apparatus wherein lead pins of a part inserted from above in through-holes of a printed circuit board are soldered to the through-holes from below. The soldering apparatus comprises a solder supplying nozzle, a preliminary heating nozzle and a flux nozzle. Each of the nozzles has an opening and a pair of slits formed to extend downwardly from the opening. The nozzles are moved upwardly and downwardly in a Z direction by respective elevators and are moved and positioned in X and Y directions by a moving table. A printed circuit board to which a lead part to be soldered is temporarily fastened is disposed on the nozzles.

Abstract: A pallet for holding a printed circuit board comprises first and second parallel rails and third and fourth parallel rails. The third and fourth rails each have first and second ends and form an angle of between about 30.degree. and 60.degree. with the first and second rails. The first and second ends of the third and fourth rails are connected to one of the first and second rails. The pallet further comprises an attachment for securing the printed circuit board to the third and fourth rails. The angled pallet has advantages over conventional pallets as shorts and shadowing are reduced.

Abstract: A flexible fixture for holding a printed circuit board, particularly for reflow soldering of surface mount components on both sides of printed circuit boards. This is provided by a sturdy frame having on the inside lip a stepped recess for receiving the edge of a printed circuit board, the frame being provided as a kit of parts including four corner frame segments. Longitudinal tracks in the arms of the corner frame segments slidably receive side bars which are adjustably locked in place by screws. Locater devices, clamps and intermediate board support posts are additionally disclosed for attachment to the frame.

Abstract: Apparatus and methods for a system and process for applying a flux coating to a circuit board by pulsing an airless spray gun on and off to achieve excellent circuit board through-hole penetration and uniform film thickness. An overspray collection system is provided which reduces overspray and increases material utilization and transfer efficiency. A gun positioning mechanism, which can be automated, accurately locates the gun relative to the circuit board.

Abstract: Apparatus for installation of honeycomb core seals in jet engine mounting rings, including spray deposition of brazing alloy in seals and establishment of compressive relationships between seal and ring prior to brazing of seal in ring.

Abstract: A muffle furnace assembly for brazing aluminum heat exchanger workparts comprises a tubular muffle having a workpart conveyer extending therethrough. A pair of fans disposed inside the muffle circulate high temperature atmosphere through the workparts. The muffle is surrounded by an insulative outer shell spaced to form an interstitial cavity therebetween. High temperature combustion gasses are directed into the interstitial cavity and flow in a helical path about the muffle. Louvers are provided in the muffle, between the workparts and the fans, for regulating the amount of inert gas flow within the muffle. Inlet and exit vestibules usher workparts into and out of the furnace assembly to minimize oxygen contamination within the muffle.

Abstract: A dispensing apparatus for applying a thin stream of flux to a surface of a printed circuit board. The dispensing head travels at a high rate of speed relative to the board during the dispensing of flux to apply thin layers of flux thereto. Preferably, the dispensing head moves transversely to the work path of a conveyor that transports the board through a flux station, at a rate of approximately 20 to 90 inches per second. Tips that dispense the flux are angularly disposed relative to the board and, if desired, make multiple passes over the surface to coat selected regions twice. Either the board is incrementally advanced through the flux station or the dispensing head is incrementally advanced relative to the board so that flux is applied when the board is stationary.

Abstract: A solder coating apparatus for coating lead sections of a lead frame, including a liquid solder bath and a coating block having a first slit-like passage therethrough for permitting a lead frame to pass through the block and a second passage of enlarged cross section communicating with and extending along the first passage for permitting the lead frame package to pass through the block. A pair of liquid solder supply slits are formed in the block and communicates with the first passage along the length thereof and on opposite sides of the second passage. A pump at least partially immersed in the liquid solder bath provides for positive supply of liquid solder to and through the slits into the first passage to coat the lead sections. A conduit connects between the delivery side of the pump and the liquid solder supply slits.

Abstract: A convection muffle furnace for brazing and/or annealing a workpiece includes a muffle having towers formed integrally therewith and being mounted movable relative to a top wall of a furnace. Circulation fans are mounted in the towers so as to move along with the muffle during its expansion and contraction for producing forced convection heat transfer.

Abstract: An automatic reflow soldering apparatus for soldering a printed circuit board having a plurality of electronic elements mounted thereon to be soldered while the printed circuit is heated, wherein transporting means transports a carrier carrying the printed circuit board to be soldered, positioning means arranged on the carrier position the printed circuit board on the carrier and support means arranged on the carrier support the printed circuit board to prevent the latter from being warped when heated to be soldered. The printed circuit board is transported through all of the soldering processes from a heating process to a cooling process while the printed circuit board is thus positioned and supported. Further provided is means which is automatically operated to position and support the printed circuit board on the carrier.

Abstract: Apparatus for soldering, leveling and cooling printed circuit panels including a preheater, a fluxer, and soldering, leveling and cooling stations. The cooperation of the soldering, leveling and cooling stations provides for efficient processing of printed circuit panels. The soldering station, which includes a solder immersion chamber through which the panels are conveyed, provides an oil coating on the solder to minimize formation of dross. Automatic replenishment of oil through use of suitable flux on the panels to be soldered provide continuous cleaning of the soldering system to permit extended operation. A cooling table transports the soldered panels on a cushion of air to prevent marring.

Abstract: An apparatus capable of solder-plating only on lead-regions of a lead-frame carrying a multiplicity of electronic parts or components. It comprises a block made of a heat-resistant and solder-wettable metal immersed in a bath of molten solder. The block is provided with a horizontal path for the lead-frame at a plane sufficiently above a level of said molten solder, and a plurality of vertical conduits, extending from the bottom of the block, open at the horizontal path. The conduits are capable of replenishing the molten solder on a plateau provided on a lower inside face of the path by capillary action. The lead-regions of lead-frame which travels through the path contacts with the molten solder on the plateau.

Abstract: A convection braze furnace for brazing aluminum heat exchangers in an inert gas rich atmosphere includes entrance and exit vestibules forming atmosphere barriers of suspended stainless steel strips. The interior of the braze furnace is divided into multiple zones for progressively heating the heat exchangers to a brazing temperature and then cooling the heat exchangers in the final zone. An impeller circulates the heated intent gas atmosphere within each zone to accelerate heat transfer. A chain type conveyor supports the heat exchangers as they are moved through the braze furnace. An isolated return tube surrounds the lower return side of the conveyor chain as it passes through the braze furnace. The braze furnace housing is comprised of inner and outer shells having an inert gas pressurized interstitial cavity therebetween. The inner shell includes a plurality of expansion strips having generally ellipsoidal corner expansion joints.

Abstract: A process for forming a layer of metal on a substrate which comprises the steps of: (a) forming a bath of a molten metal in a vessel; (b) circulating said molten metal in said bath such that said molten metal is projected above the upper surface of said vessel (c) transporting a substrate along a path which traverses the upper surface of said vessel; and (d) transferring said molten metal to one surface of said substrate by directly or indirectly contracting said molten metal with said surface of said substrate, and an apparatus for performing the method is disclosed.

Abstract: An apparatus for solder joining metal tapes to form laminated metal tapes comprises a channel means having a base, and sidewall means extending therefrom to a cover extending over the sidewall means. The sidewall means define converging channels having an entrance end for admitting the tapes spaced apart, and an exit end where facing tape surfaces can come into contact. The sidewall means separate the base and cover by a distance selected to align the tapes in the width dimension. The cover having a first section extending from the exit end, and a second section extending from the first section to the entrance end, the second section being formed with a cavity facing the channel that permits a solder flow therethrough that minimizes accumulation of particles in the channels. A solder duct means mounted on the channel means for directing molten solder into the channels to flow from the exit end to the entrance end. The solder duct means having a slot extending therethrough and aligned with the exit end.

Abstract: A reflow furnace has a tunnel through which a conveyor for printed circuit boards passes. A plurality of pairs of panel-type blowers capable of blowing hot gas are disposed in the tunnel. The two panel-type blowers in each pair are disposed opposite one another above and below the conveyor. Each panel-type blower has an inlet and a discharge port. The discharge ports of opposing panel-type blowers partially overlap one another in the longitudinal direction of the furnace. When a printed circuit board is present between a pair of panel-type blowers, gas discharged from the discharge ports simultaneously heats both sides of the printed circuit board.

Abstract: An infrared soldering machine has an inert gas atmosphere to prevent oxidation of the solder. Heaters positioned within the machine housing above a conveyor have through apertures and fans direct inert gas down through the heaters onto the conveyor. The forced convection assists in maintaining uniform temperature across the conveyor. In order to prevent leakage of ambient air into the housing where the fan shafts protrude for connection to electric motors, a gas seal is provided at each fan shaft. The seal extends between two spaced bearings rotatably securing the fan shaft. Each electric motor is mounted away from the heat of the machine and is connected to the respective fan shaft by means of a belt drive. A novel gas curtain, which may be clamped at different angles, improves the gas seal at entry and exit locations of the conveyor.

Abstract: An automatic soldering machine for soldering a rope chain comprises a pair of gears, each with a peripheral surface defining a trench which engages one of the strands of the rope chain and which is rotatable to precisely feed and place successive link junctions of the chain relative to hollow solder applying needles. The needles are reciprocally movable and serve to apply a premeasured amount of solder paste at the link junctions of the rope chain. A heater, for example, an induction heater, heats the chain, causing the solder to flow and then set and thereby secure the chain links together.

Abstract: An infrared soldering machine has an inert gas atmosphere to prevent oxidation of the solder. Heaters positioned within the machine housing above a conveyor has through apertures and fans direct inert gas down through the heaters onto the conveyor. The forced convection assists in maintaining uniform temperature across the conveyor. In order to prevent leakage of ambient air into the housing where the fan shafts protrude for connection to electric motors, a gas seal is provided at each fan shaft. The seal extends between two spaced bearings rotatably securing the fan shaft. Each electric motor is mounted away from the heat of the machine and is connected to the respective fan shaft by means of a belt drive.

Abstract: An apparatus for supporting printed circuit boards during processing provides a peripheral frame, a multiplicity of support members having interfacing flat surfaces defining an imaginary reference plane from both sides thereof and clips for supporting printed circuit boards parallel and in reference to the imaginary plane which clips engage the support members along either of the interfacing surfaces defining the reference plane.

Abstract: A wave soldering apparatus and process occurs in an atmosphere which substantially excludes oxygen. By providing a pressurized effect on an element to be soldered while passing through a solder wave, fluxless soldering is accomplished avoiding the necessity to remove flux residues. The element is preheated in a shield gas atmosphere substantially excluding oxygen, moved in a predetermined path so that at least a portion of the element passes through the solder wave which is oscillated while the element is in the solder wave and maintained in the shield gas until solder on the element has solidified.

Abstract: An apparatus for soldering, leveling and cooling printed circuit panels including a preheater, a fluxer, and soldering, leveling and cooling stations. The cooperation of the soldering, leveling and cooling stations provides for efficient processing of printed circuit panels. The soldering station, which includes a solder immersion chamber through which the panels are conveyed, provides an oil coating on the solder to minimize formation of dross. Automatic replenishment of oil through use of suitable flux on the panels to be soldered provide continuous cleaning of the soldering system to permit extended operation. A cooling table transports the soldered panels on a cushion of air to prevent marring.

Abstract: The present invention relates to a soldering machine, comprising: a soldering chamber wherein the soldering process is performed; a first lock chamber connecting to the soldering chamber; a second lock chamber connecting to the soldering chamber; two openings each arranged between a lock chamber and the soldering chamber; two openings each connecting a lock chamber to the outside wherein each opening is closable by a door; means for creating a vacuum in the lock chambers; means for transporting objects for soldering from the outside through the first lock chamber, the soldering chamber and the second lock chamber.

Abstract: An automatic jet soldering apparatus comprising: a solder bath for holding molten solder therein; a nozzle body having an open top and an open bottom through which the molten solder rises from the solder bath; a punched panel having numerous holes and disposed inside of the nozzle body in such a way to be opened and closed; and a jet source connected to the lower part of the nozzle body, the molten solder rising upward through the nozzle body via the open bottom and the open top of the nozzle body by means of jet power from the jet source. The soldering apparatus further comprises a back rectifying plate mounted on the rear portion of the top opening of the nozzle body, the sloping angle of the back rectifying plate being adjustable, thereby attaining an easy removal of solder residues from the punched panel and achieving a zero relative speed between a printed circuit board and the solder flow velocity, so that the reliability of soldering can be enhanced.

Abstract: A roller-type solder coating device for applying a coating of liquid solder to a workpiece. The device has a solder bath tank, a coating roller, and a nozzle connected to a pumping chamber provided in the tank to provide a flow of the solder bath to the coating roller. A trough is positioned underneath the coating roller and similarly connected to the nozzle so as to prevent direct re-entry of the solder delivered from the nozzle into the solder bath. The tank may be sealed and inert gas introduced therein to prevent oxidation of the solder contained within the tank. A second coating roller may be provided so as to permit simultaneous coating of opposite sides of a workpiece during its passage between the coating rollers.

Abstract: An apparatus for the application of foam flux in a system for soldering printed boards, including a flux tank, a partition possessing a top portion rising above the fixed level of flux liquid and containing near the bottom portion thereof a perforated portion, serving to divide the interior of the flux tank into an inner tank portion and an outer tank portion, and a plurality of porous tubes disposed inside the inner tank portion having one end thereof communicating with an external compressed air feed mechanism and the other end thereof closed, the improvement wherein the porous tubes are porous ceramic tubes and are each obtained by molding an aggregate of uniform and fine ceramic-forming particles into the shape of a tube with the aid of an organic plasticizer and an inorganic binder and calcining, the porous tubes possessing pore diameters in the range of 10 to 30 microns and a porosity in the range of 35 to 55%.

Abstract: A solder leveller for tinning exposed metal on printed circuit boards comprises a solder bath and paired rollers therein for carrying a board in a curvilinear path downwardly into, through and upwardly out of the bath. At least one pair of rollers having a board engaging nip within the bath is driven. The bath includes means for providing a solder-oxidation inhibiting oil over the solder.

Abstract: The soldering arrangement has a lengthwise extending tunnel arrangement (1) with a soldering tunnel (3) through which a conveyor arrangement (10) for the work pieces extends. A soldering tunnel (3) which is inclined upwardly in the conveying direction is provided with a floor opening which is surrounded by a downwardly protruding sealing skirt (18) which is immersed in the molten liquid solder material (20) in a tub (19) below the soldering tunnel (3). The soldering nozzles (24, 25) arranged within the soldering tunnel (3) are supplied through riser channels within the sealing skirt (18). A protective gas conduit (41) for supplying nitrogen opens into the soldering tunnel (3). The soldering tunnel (3) and the conveyor path of the conveyor arrangement (10) extending within the soldering tunnel (3), are tiltable about a horizontal crosswise axis (47), whereby the inclination of the soldering tunnel (3) is adjustable.

Abstract: A controlled amount of flux is applied to a circuit board (10) by first directing liquid flux through a nozzle (54) containing means for disintegrating the flux into a very fine fog of tiny flux droplets (62). The fog of flux droplets is injected into a laminar gas stream (52), thereby creating a laminar flux stream which is directed at the circuit board to coat the board with flux. As the flux spray is being directed at the circuit board, the concentration of flux solids on the board is being regulated, typically by controlling the rate of flux pumped into the nozzle.

Abstract: An improved fixture is provided for use in supporting a plurality of components, particularly such as electrical or electronic components having elongated conductive terminals, during solder dip process steps or the like. The fixture comprises a generally U-shaped frame adapted to support a stacked group of channel members each having a generally U-shaped cross section to include opposed side walls with aligned slots therein. The channel members are assembled on the frame with a plurality of electrical components or the like supported between the channel member side walls and with the component terminals projecting outwardly through the side wall slots. When assembled, the fixture can be oriented as required to dip the terminals into a solder or other bath while maintaining the components in spaced relation against immersion into the bath.

Abstract: The invention is an improved drag soldering machine for printed wiring boards (PWB) for providing a uniform vertical velocity at the point of separation between the solder and the PWBs. The improved drag soldering machine has a molten solder bath, an entry guide for directing the PWB to a horizontal position partially submerged in the solder bath, a drag guide for horizontally directing the PWB across the solder bath, an exit guide for separating the PWB from the solder bath by directing the PWB up and away from the solder bath and a transport means for advancing the PWB in the guide means, wherein the improvement comprises an exit guide providing an approximately uniform vertical velocity at the point of separation between the PWB and the solder bath thereby promoting a uniform soleder distribution over the length of the PWB.

Abstract: A pair of catches (74) is mounted on a sliding carriage (20) which is movable forwards and back along a guide (18) between a rear and a front dead centre (C,F), the catches being pivotable backwards and forwards between a working position and a position of rest. In order to move the sliding carriage (20) along the guide (18), a crank drive is provided. This has a crank (30), which can be driven in rotation, and a connecting rod (40), which is connected by a crank pivot joint (36) to the crank (30) and by a connecting-rod pivot point (42) to the sliding carriage (20). A control mechanism allows the catches (74) to assume their working position near the rear dead centre (C) of the sliding carriage (20) for its forward movement and to assume their position of rest near the front dead centre (F) of the sliding carriage (20) for its backward movement.

Abstract: A controlled amount of flux is applied to a circuit board (10) by first directing liquid flux through a nozzle (54) containing means for disintegrating the flux into a very fine fog of tiny flux droplets (62). The fog of flux droplets is injected into a laminar gas stream (52), thereby creating a laminar flux stream which is directed at the circuit board to coat the board with flux. As the flux spray is being directed at the circuit board, the concentration of flux solids on the board is being regulated, typically by controlling the rate of flux pumped into the nozzle.

Abstract: To match the soldering of an assembled printed-circuit board (13) to its assembly configuration, the circuit board (13) is brought in contact with a soldering wave (21) for a first time along a predetermined path (57, 58), and thereupon the circuit board is rotated about a vertical axis and is brought into contact, preferably with the same soldering save (21), a second time, along predetermined paths from the same direction during its motion along the paths (57, 58). The printed circuit board (13) may be rotated by an angle (.alpha.) depending on the assembly configuration relative to the direction of flow (56) of the soldering wave (21).

Abstract: A soldering machine with two parallel guide profiles for revolving chains provided for with soldering fingers, include a succession of a fluxer, a preheater and a solder bath along with the guide profiles extend. One profile is mounted fixed laterally above the succession and the other is adjustable directly above the succession. Thereby the adjustable guide profile is heated up more, especially under the action of the preheater, whereby, due to elongations of the guide profile, problems arise in the conduction of printed circuit boards held at the revolving chains by means of soldering fingers. To eliminate this problem, the invention provides that each guide profile is provided with at least one longitudinally extending coolant duct and that each coolant duct is connected to a pump for a coolant. Thereby the temperature actions on the adjustable guide profile 5 are compensated.

Abstract: The present invention is directed to a method for soldering each of a plurality of members (40), arranged in one or more parallel rows, to a separate one of a plurality of metallized pads (42) on a substrate (10), each pad being contiguous with a corresponding member. The method is initiated by tilting the substrate so that one end of each row of members and the metallized pads contiguous therewith are at a higher elevation than the other end. A stream (80) of molten solder and a dripping stream (88) of flux droplets are directed onto the substrate into the regions where the members are contiguous with the metallized pads. Simultaneously, the substrate is displaced relative to the streams along a path (96) inclined with respect to the horizontal and parallel to the rows of members so that the members and the metallized pads are successively coated with solder and then flux.

Abstract: An electronic component tinning apparatus comprising a longitudinal base unit having two longitudinally extending sides connected to a first end and an opposing second end, a top portion connected to and bounded by said sides and ends with an open longitudinal central cavity, and two spaced-apart, parallel longitudinally extending rails mounted on the top portion on opposing sides of said central cavity; a flux tank mounted in said central cavity approximate said first end to hold a liquid flux for flux-coating electronic component leads; a heated pot mounted in said central cavity approximate said second end to hold a hot molten solder bath for tinning the electronic component leads; a powered, wheeled electronic-component transport adapted to ride on said rails to carry electronic components from said first end over the flux tank to the second end over said solder pot and back again; two powered cam means mounted in said transport, rotatable to a high transport position and a low processing position, said c

Abstract: A carrier for holding a circuit board while passing round an automated insertion line has a rectangular frame with support members extending in from the inner periphery. In a particular example, the support members on three sides have support surfaces and lateral locating surfaces. Spring retaining members are provided, one above each support surface. On the fourth side, support members only have support surfaces in the example. At each end of the fourth side, a laterally deflectable cantilever spring member holds down the circuit board along the fourth side. An external flange provides a support for the carrier on a conveyor. The inner periphery is shaped to avoid interference with the solder wave and to avoid causing turbulence.

Abstract: Process for manufacturing reinforced panel, including corrosion resistant panel, comprising preheating a galvanized or zinc coated metal sheet, applying a molten aluminum coating to a strip or plate of metal mesh and pressing the thus heated materials together to effect interdiffusion of the zinc and aluminum. An embodiment of the process is characterized by the immersion of the mesh into an aluminum bath and the passing of the molten aluminum coated mesh and galvanized strip between pinch rolls. The molten aluminum coated mesh may also be sandwiched between two zinc coated strips.

Abstract: A method of and apparatus for controlling automatic soldering system in which respective units of the automatic soldering system are controlled preparatorily to reduce the waiting time until main driving to zero. In the soldering driving time, the temperature of the work itself is precisely controlled to the predetermined value by means of directly measuring the temperature of the work and controlling the preheater to bring the soldering characteristic in the next soldering step into the most optimal value in compliance with the size and the like of the work to be soldered.

Abstract: A process for soldering circuit boards comprising the steps of:(a) applying a solder flux coating to the solder side of a board;(b) drying the flux on the board and preheating the solder side of the board by sequentially(i) directing a stream of warm gas over the solder side of the board,(ii) positioning the solder side of the board over a hot molten solder bath,(c) soldering the solder junctions on the board by immersing the solder side of the board into the surface of the hot molten solder bath by sequentially(i) immersing a first edge of the board into the surface of the solder bath,(ii) lowering the remainder of the board into the surface of the solder bath,(iii) longitudinally moving the board in the solder bath, and(iv) lifting the board from the surface of the solder bath at an angle to the surface of the solder bath to drain excess hot molten solder from the board.

Abstract: Device for soldering a printed board, equipped with a printed substrate conveyor, which effects soldering of chip parts on a printed substrate by moving the printed substrate through a molten solder wave formed by providing a nozzle in a solder tank accommodating molten solder, and a vibration imparter for giving vibration to the printed substrate when it is passing through the molten solder wave.

Abstract: An automated program controlled discrete soldering system for plated holes of a printed wiring board, having a crucible for holding a discrete amount of solder and operable to travel in a substantial vertical path to a soldering position beneath the board. The solder is metered and deposited in the crucible prior to each application of laser energy to the crucible for melting the solder.

Abstract: Printed circuit boards bearing chip type electric parts on its underside surface and travelling along a predetermined path are soldered by contact with a progressive wave of a molten solder progressing in a direction transverse to the path of travel of the printed circuit board. A nozzle member provided with an array of molten solder overflowing ports arranged in a direction transverse to the travelling path is moveable in the same direction so as to form the progressive wave of molten solder.

Abstract: Pressurized molten solder 71 is flowed along a confined first channel 86 and forced through a series of spaced, aligned apertures 88 as solder jets which rise, fall and merge to form a solder stream which flows along a second channel defined by channel walls 93 and 94. Spring held printed circuit boards 10 are advanced by a conveyor 21 which is tilted to move a far section of each board into engagement with the top of channel wall 93 and then a near section of each board into engagement with the top of channel wall 94 whereafter the board is spring held to ride along the tops of channel walls while a thin stripe of solder is applied to the board.

Abstract: Carriers each carrying a printed circuit board is conveyed successively through a soldering zone to dip each printed circuit board in molten solder contained in a vessel disposed below a space defined by two pairs of parallel front and rear rails. The four rails are engageable with four wheels of the carrier simultaneously and are vertically moveable so the printed circuit board carried on the carrier on the rails are contacted with the molten solder when the rails are in their lowered positions. Engaging means is provided for movement with one of the rails and for supporting engagement with the carrier. The engaging means is horizontally moveable so that the carrier engaged by the engaging means is horizontally moved forward and backward. By suitably moving the rails and the engaging means, the printed circuit board may alight on and leave from the surface of the molten solder in any desired tilted state.

Abstract: Carriers each holding a printed circuit board are conveyed successively through a soldering zone to dip each printed circuit board into molten solder contained in a vessel. The vessel is disposed between a pair of laterally spaced apart track members which are engageable with two front and two rear wheels of the carrier to support the carrier and the printed circuit board generally in the horizontal state throughout the movement thereof along the track members. Each track member has a first and a second depression at such locations that the two front and the two rear wheels can simultaneously be positioned in the first and second depressions, respectively. Each depression has a depth sufficient to permit the printed circuit board to be dipped into the molten solder when the four wheels travel therealong.

Abstract: An apparatus for soldering printed circuit boards includes a carrier adapted to support a printed circuit board and to be moved along a predetermined transfer path, preferably in the form of a closed loop; a pair of laterally spaced movable rails defining a part of the transfer path and adapted for supporting engagement with the carrier; a vessel containing molten solder placed beneath the space between the rails; and driving means for moving the rails up and down to allow the printed circuit board to be dipped in the molten solder.

Abstract: An apparatus for soldering printed circuit boards includes carriers each adapted for holding a printed circuit board and conveyed successively through a soldering zone to dip each printed circuit board into molten solder contained in a vessel. The vessel is disposed between a pair of laterally spaced apart track members which are engageable two front and two rear wheels of the carrier to support the carrier and the printed circuit board generally in the horizontal state throughout the movement thereof along the track members. Each track member has a first and a second depression at such locations that the two front and the two rear wheels can simultaneously position in the first and second depressions, respectively. Each depression has a depth sufficient to permit the printed circuit board to be dipped into the molten solder when the four wheels travel therealong.