Abstract: A support unit provided in an apparatus for treating a substrate using plasma includes a dielectric plate on which the substrate is placed, an electrode plate disposed under the dielectric plate, a power supply rod that applies power to the electrode plate, and a flange that has a shape surrounding the power supply rod and that is spaced apart from the power supply rod.

Abstract: A flexure-based continuous ejector pin mechanism for Mini/Micro chip mass transfer includes a first drive frame, a second drive frame, a mounting base, a first thorn die attach drive device, a second thorn die attach drive device, first flexible hinges, second flexible hinges, and a pricking pin. The second drive frame and the first drive frame are connected through the first flexible hinge. The mounting base is connected to a left side and a right side of the second drive frame through the second flexible hinges. Compared with a laser transfer technology, the flexible movable thorn die attach device has lower cost and higher accuracy; compared with a vacuum nozzle transfer technology, the flexible movable thorn die attach device has higher transfer efficiency and quality; and compared with a conventional thorn die attach device, the flexible movable thorn die attach device has higher transfer efficiency and precision.

Abstract: A bonding device for bonding an electronic element includes an engaging component. The engaging component has a first surface and a second surface opposite to the first surface. The engaging component includes a plurality of recesses at the second surface. The plurality of recesses are configured to cover a plurality of projections of an electronic element. The engaging component is coupled to a heating component.

Abstract: The disclosure relates to a method for producing a stator, where, for one or both layers of a two-layer winding, a tool with receiving regions is respectively provided on an end face of a laminated core. A relative arrangement of the receiving regions corresponds to a relative end position for conductor ends of the conductor elements. In a positioning process, the tool is moved into a first turning position and each conductor end of a first group of the conductor elements is respectively inserted into one of the receiving regions. Then the tool is turned into at least one further turning position and each conductor end of a further group of the conductor elements is respectively inserted into one of the receiving regions until the conductor ends of all the conductor elements of the layer are in the relative end position in relation to one another.

Abstract: The disclosure relates to a method for producing a stator. Electrical conductor elements are arranged in slots of a laminated core of a two-layer winding. The conductor ends of the conductor elements are moved relative to one another on an end side of the sheet metal packet at one or both of the layers by a positioning process by axially plugging together a normal helix tool with the axial conductor ends of some of the conductor elements and subsequent relative rotation of the normal helix tool relative to the sheet metal packet, and by axially plugging together a selective skewing tool with the axial conductor ends of the remaining conductor elements, such that they have a provided relative end position with respect to each other for a connection of a part of the conductor ends with corresponding conductor ends of the other layer.

Abstract: Provided are methods and devices for assessing biological particles for use in cell immunotherapy. By utilizing a microfluidic chip device together with optical force measurement and cell imaging, the methods enable comprehensive assessment and characterization of biological particles with regard to morphology, motility, binding affinities, and susceptibility to external forces, including but not limited to, chemical, biochemical, biological, physical and temperature influences. The methods enable the selection and production of biological particles, such as engineered T-cells, for use in immunotherapy and biomanufacturing.

Abstract: A stator manufacturing apparatus is equipped with spindles as twisting and bending jigs, an inner guide having a first supply flow path and a suction flow path formed in the interior thereof, and an outer guide having a second supply flow path formed in the interior thereof. Further, the spindles have receiving members in which insertion recesses are formed. Through holes are formed in the receiving members, and the receiving members are formed with lateral holes therein which allow the interiors of the insertion recesses to communicate with each other.

Abstract: A display may have a pixel array such as a liquid crystal pixel array. The pixel array may be illuminated with backlight illumination from a backlight unit. The backlight unit may include a printed circuit board, a plurality of light-emitting diodes mounted on the printed circuit board, at least one light spreading layer formed over the printed circuit board that spreads light received from the plurality of light-emitting diodes, a partially reflective layer formed over the at least one light spreading layer, a color conversion layer formed over the partially reflective layer, a collimating layer formed over the color conversion layer, a brightness enhancement film formed over the collimating layer, and a diffuser formed over the brightness enhancement film. The at least one light spreading layer may include two light spreading layers with elongated protrusions that are rotated relative to each other.

Abstract: A method of operating a wire bonding machine is provided. The method includes the steps of: (a) supporting a substrate on a material handling system of the wire bonding machine; (b) changing a bend profile of the substrate; and (c) securing, after step (b), the substrate against a support structure of the wire bonding machine using a clamping element of the wire bonding machine, the support structure for supporting the substrate during a wire bonding operation, and the clamping element for securing the substrate to the support structure during the wire bonding operation.

Abstract: A bonding method of a die bonder with a single conveyance lane and a single bonding head, or a plurality of conveyance lanes and a plurality of bonding heads includes the steps of generating a classification map of class dies with different electric properties on the wafer, which are classified in accordance with a plurality of grades, picking up the die from the wafer, bonding the die onto a substrate or the die using a bonding head, conveying a class substrate corresponding to the class die on the conveyance lane in a unit of the class substrate, and further bonding the class die to the corresponding class substrate based on the classification map.

Abstract: A component mounting machine includes a board conveyance device, a component supply device, a component transfer device which includes a mounting head and a head driving mechanism, and a mounting order control device. The component mounting machine partitions a long printed circuit board of a length exceeding a mounting station into a plurality of mounting areas, sequentially positions each mounting area in the mounting station, and mounts the electronic components. The mounting order control device performs control to change the mounting order of the electronic components.

Abstract: A bonding apparatus of substrate manufacturing equipment includes an upper stage, a lower stage facing the upper stage and which is configure and dedicated to support a processed substrate on which semiconductor chips are stacked (set), and an elevating mechanism for raising the lower stage relative to the upper stage to provide pressure for pressing the substrate and chips towards each other.

Abstract: A bonding apparatus configured to bond a component on a substrate is presented. The apparatus includes a stage, a push member, a support member and a compression member. The stage fixes the substrate in place and by using at least one first suction part formed in the stage. The push member is disposed above the stage and pushes the substrate fixed to the stage to support the substrate on the stage. At least one second suction part is formed in the support member to attach to a pad part of the substrate. The compression member compresses the component into the pad part fixed to the support member.

Abstract: Devices and methods for assembling co-planar electrical contacts in a connector are provided herein. In one aspect, an exemplary method of assembly comprises depositing solder in a connector plug enclosure, positioning electrical contacts on the solder deposits, advancing the hotbar toward the enclosure contacting each of the electrical contacts so as to planarize a top surface of each of the electrical contacts with the enclosure and melting the solder with the heated hotbar to solder the electrical contacts to the enclosure. In one aspect, an exemplary hotbar device includes a magnet for releasably coupling the electrical contacts to the hotbar. In another aspect, the hotbar includes metallic portions for heating the electrical contacts and insulated ceramic portions for contacting the enclosure. In another aspect, an electrically conductive hotbar includes side portions that extend away from the bottom heating surface facilitating more uniform current flow through the hotbar.

Abstract: An element pressing apparatus includes: a base casing having first and second bases couplable to or separable from each other to form an arrangement space where a board and a plurality of electronic components having different heights are arranged while the first and second bases are coupled to each other; oil encapsulated in the arrangement space; an oil seal member deformed depending on a pressure of the oil; and a hydraulic pressure change portion that changes the pressure of the oil, wherein the pressure of the oil changes by the hydraulic pressure change portion to press the oil seal member to a plurality of electronic components and press the electrode terminals against the electrodes when the board and a plurality of electronic components are arranged in the arrangement space by positioning and placing each of the electrode terminals on each of the electrodes.

Abstract: In certain embodiments, a system includes a deposition system and a plasma/bonding system. The deposition system deposits a solder outwardly from a substrate of a number of substrates. The plasma/bonding system comprises a plasma system configured to plasma clean the substrate and a bonding system configured to bond the substrates. The plasma/bonding system at least reduces reoxidation of the solder. In certain embodiments, a method comprises depositing solder outwardly from a substrate, removing metal oxide from the substrate, and depositing a capping layer outwardly from the substrate to at least reduce reoxidation of the solder.

Abstract: An element pressing apparatus includes: a base casing having first and second bases couplable to or separable from each other to form an arrangement space where a board and a plurality of electronic components having different heights are arranged while the first and second bases are coupled to each other; oil encapsulated in the arrangement space; an oil seal member deformed depending on a pressure of the oil; and a hydraulic pressure change portion that changes the pressure of the oil, wherein the pressure of the oil changes by the hydraulic pressure change portion to press the oil seal member to a plurality of electronic components and press the electrode terminals against the electrodes when the board and a plurality of electronic components are arranged in the arrangement space by positioning and placing each of the electrode terminals on each of the electrodes.

Abstract: An object of the invention is to provide an electronic component mounting system which can execute component mounting work on a plurality of boards simultaneously, concurrently and efficiently so that high productivity and responsiveness to production of many items can be achieved consistently.

Abstract: A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining.

Abstract: A method includes performing a hybrid bonding to bond a first package component to a second package component, so that a bonded pair is formed. In the bonded pair, first metal pads in the first package component are bonded to second metal pads in the second package component, and a first surface dielectric layer at a surface of the first package component is bonded to a second surface dielectric layer at a surface of the second package component. After the hybrid bonding, a thermal compressive annealing is performed on the bonded pair.

Abstract: An object of the invention is to provide an electronic component mounting system and an electronic component mounting method which can execute component mounting work on a plurality of boards simultaneously, concurrently and efficiently so that high productivity and responsiveness to production of many items can be achieved consistently.

Abstract: In aspects of the assembly jig and method of the invention, when a packaging substrate is curved concaving upward at temperatures of melting solder, the gap between the assembly jig and the packaging substrate can be made smaller than the dimension of the sum of the thickness of the semiconductor chip and the thickness of the melted solder by allowing a part of the bottom surface of the chip positioning piece to become always, or substantially always, in contact with the upper surface of the packaging substrate owing to the weight of the chip positioning jig itself. As a consequence, the semiconductor chip does not slip aside out of the opening of the chip positioning piece. Therefore, the semiconductor chip can be positioned accurately on the packaging substrate.

Abstract: A production line for producing electronic modules including a printed-circuit board, at least one first-type component, and at least one second-type component, wherein the production line includes a unit for putting the first-type component in place, a general heating unit for melting a solder placed between the at least one first-type component and the circuit, a unit for putting the second-type component in place, and a local heating unit for melting a solder placed between the at least one second-type component and the circuit.

Abstract: An automatic soldering machine adapted for soldering cables with electronic products includes a main frame module, a man-machine control interface, a sliding tray located in front of the man-machine control interface, a loading tool slidably disposed in the sliding tray, a feeding module close to a bottom of the sliding tray, a removing module located between the man-machine control interface and a reforming module, a container, a loading tool combination module located above the sliding tray, a spraying module located in rear of the sliding tray, and a loading tool reflow module mounted on a rear of the main frame module. The man-machine control interface is connected with and controls the loading tool, the feeding module, the removing module, the reforming module, the loading tool combination module, the spraying module and the loading tool reflow module for realizing an automatic soldering process of the electronic products and the cables.

Abstract: An apparatus for aligning a bonding tool of a die bonder with respect to a bond stage is disclosed. The apparatus comprises: a connecting member to which the bonding tool is coupleable such that the connecting member is located between the bonding tool and a main body of a die bonder; and a plurality of actuators engaged to the connecting member. In particular, the plurality of actuators are actuable to rotate the connecting member and the bonding tool relative to the main body of the die bonder about a plurality of axes, to align the bonding tool with respect to the bond stage.

Abstract: A minute ball array apparatus includes: an array jig including insert parts, into which minute balls are to be inserted, and which are formed in a predetermined pattern; a ball moving unit, which comprises a thrust surface, and which moves the thrust surface along an upper surface of the array jig so as to move the minute balls supplied onto the upper surface of the array jig to drop the minute balls into the insert parts of the array jig; a collapsing member, which is provided in a vicinity of the thrust surface, and which collapses a buildup of the minute balls rising along the thrust surface when the thrust surface is moved by the ball moving unit; and a motion imparting unit that imparts the collapse member with motion for collapsing the rising buildup of the minute balls.

Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.

Abstract: An arrangement for mounting a multiplicity of components (9, 10), particularly with irregular surface topography, on a support (7) using an assembly tool which has a tool substructure (5) and a tool superstructure (6), where the tool substructure (5) is designed to receive the support and the components which are to be mounted thereon, and the tool superstructure (6) has, in addition to an arrangement (11, 12) for transmitting assembly forces, an arrangement for compensating for tilts between the components and the support and/or an arrangement for compensating for irregular surface topologies.

Abstract: A bonding apparatus for bonding substrates having metal bonding portions, includes: a processing container having an opening formed on the bottom of the processing container; a thermal treating plate disposed within the processing container, the thermal treating plate allowing for substrates to be mounted thereon and allowing for thermal treatment of the substrates; a pressing mechanism disposed within the processing container opposite the thermal treating plate and which presses the substrates to the thermal treating plate; an annular supporter which is disposed in an inner side of the processing container along the opening of the processing container, the annular supporter providing an airtight seal between the processing container and the thermal treating plate, and supporting the thermal treating plate; and a cooling mechanism which is disposed in an inner side of the supporter below the thermal treating plate, the cooling mechanism cooling the thermal treating plate.

Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.

Abstract: A method of bonding includes providing a first work piece, and attaching a second work piece on the first work piece, with a solder bump disposed between the first and the second work pieces. The second work piece is heated using a heating head of a heating tool to melt the solder bump. After the step of heating the second work piece, one of the first and the second work pieces is allowed to move freely in a horizontal direction to self-align the first and the second work pieces. After the step of allowing one of the first and the second work pieces to move, a temperature of the heating head is lowed until the first solder bump solidifies to form a second solder bump.

Abstract: Techniques for linear cell stringing are disclosed. In some embodiments, a plurality of sets of solar cells are linearly positioned, a plurality of tabbing ribbon segments are placed in contact with the plurality of sets of solar cells, and the plurality of sets of solar cells and corresponding plurality of tabbing ribbon segments are soldered together to form a plurality of solar cell strings. In some cases, the plurality of solar cell strings is substantially simultaneously formed in parallel.

Abstract: Disclosed are an electronic component mounting system and an electronic component mounting method capable of reducing the space occupied by equipment and equipment cost and ensuring high connection reliability. An electronic component mounting system (1) includes a solder printing device (M1), a coating/inspection device (M2), a component mounting device (M3), a bonding material supply/substrate mounting device (M4), and a reflow device (M5). The electronic component mounting system (1) mounts an electronic component on a main substrate (4) and connects a module substrate (5) to the main substrate (4). A cream solder is printed on the main substrate (4) to mount an electronic component, a bonding material in which solder particles are contained in thermosetting resin is supplied to a first connection portion of the main substrate (4), and a second connection portion of the module substrate (5) is landed on the first connection portion through the bonding material.

Abstract: In a method of attaching a solder ball, a first material is coated on a solder ball. A second material is coated on a pad of a substrate where the solder ball is to be attached to exothermically react with the first material. The solder ball makes contact with the pad such that the first material and the second material exothermically react with each other to release heat to adhere the solder ball to the pad using the heat.

Abstract: An object of the invention is to provide an electronic component mounting system which can execute component mounting work on a plurality of boards simultaneously, concurrently and efficiently so that high productivity and responsiveness to production of many items can be achieved consistently.

Abstract: A base apparatus includes a base and two finger devices. The base has a first surface and two opposite sides. The finger devices are respectively mounted on the sides of the base, are made of conductive material, and each of the finger devices has multiple fingers. The fingers are extended on the first surface of the base, wherein the fingers of a first finger device are arranged respectively corresponding to the fingers of a second finger device whereby each pair of corresponding fingers supports an illuminating device. The base has a height, each of the fingers has a width and the width is smaller than the height. When the LED is mounted onto a substrate, the LED can be mounted on the substrate by its side so that an entire assembly height of the LED is reduced and is equal to the width of the LED.

Abstract: A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.

Abstract: A soldering apparatus includes a base body, an actuator connected to the base body, and a pair of soldering arms connected to the actuator, each of the pair of soldering arms including a heating member and a soldering tip thermally coupled to the heating member. The pair of soldering arms is moveable and the actuator is controllable to move one soldering arm relative to the other soldering arm.

Abstract: A quick-loading soldering apparatus for soldering PCBs comprises a rotatable deck which has a plurality of angularly spaced PCB work sites. While a first PCB work site is angularly positioned for pre-loading and pre-heating PCB components at a pre-loading station, a second PCB work site is angularly positioned for soldering pre-loaded PCB components at a soldering station. Correct rotation of the deck is ensured by a sensor mounted on the deck. If the rotation angle is correct, locator pins provided externally of the deck become actionable by an operator to register the deck prior to the PCB being soldered.

Abstract: A method and a device for the mutual contacting of two wafer-type component composite configurations made of multiple identical components which are implemented coherently, in particular a semiconductor wafer (12) with a functional component wafer (14), to produce electronic assemblies on the wafer level, in which the component composite configurations are each situated on a receptacle unit (11; 13) and the contact pressure necessary for the contacting between contact metallizations of the component composite configurations to be connected to one another is generated in such a way that a vacuum is generated in a contact chamber which receives the component composite configurations and is delimited by the receptacle units, and the contacting of the contact metallizations is performed by a rear energy impingement of a component composite configuration.

Abstract: An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber, wherein the component and the substrate to be connected are displaceable separate from one another in the chamber, and the chamber comprises a combined transfer and pressing unit being displaceable between a current position of the component and a current position of the substrate, for placing and pressing the component on the substrate, and the combined transfer and pressing unit comprises a rotatable element, which, in response to the placing and pressing of the component on the substrate, assumes an angle between the normal of a lower side of the component to be connected and a pressing direction of the component, the angle corresponding to an angle between the normal of a surface area of the substrate to be connected and the pressing direction of the component.

Abstract: The present invention provides a system and method for providing a improved device for dismounting integrated circuits for rework tools in the fabrication and manufacture of hard disk drives. Embodiments of the present invention include a vacuum cap with suction capabilities for dismounting the integrated circuits. The vacuum cap includes a cylindrical portion with a vacuum path for holding a rod-like vacuum cylinder which when pressurized causes the integrated circuit to dismount. Embodiments of the present invention further include a light weight aluminum heat-shield that is disposed around the vacuum cap to protect the vacuum cap from excessive heat and to preserve the suction capabilities of the vacuum cap. In one embodiment the heat shield acts as a stopper to prevent the vacuum cap from moving upwards and helps the vacuum cap from absorbing multiple mechanical stress in order to protect the vacuum cylinder from being damaged.

Abstract: A solderable cover for solder attachment to an electronic substrate comprises a non-solderable cover defining an attachment pattern, a solderable metal layer in the shape of the attachment pattern, and a layer of adhesive bonding the solderable metal layer to the attachment pattern of the non-solderable cover, wherein the adhesive exhibits bond strength and resiliency sufficient to maintain the solderable metal layer attached to the non-solderable cover when raised in temperature to a melting temperature of a solder.

Abstract: A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anistropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×102 mPa·s or more and 1.0×105 mPa·s or less.

Abstract: An apparatus and a method for applying a conductive paste, for forming electrodes, onto an electronic component, such as a micro chip device. The apparatus includes a first jig unit provided with paste holes, which are filled with the conductive paste; and a second jig unit being movable and provided with extruding pins, which are inserted into the paste holes of the first jig unit, for allowing the conductive paste to be applied onto the electronic component. The conductive paste is applied onto the electronic component, while the electronic component is loaded onto or unloaded from the first jig unit.

Abstract: An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip mount process. A processing object that a process is completed in the first treating unit is received in a magazine so as to be vertically stacked and a plurality of magazines each having one or more processing objects is stored in an input stacker. The heating unit performs a reflow process on the processing objects in the magazine stored in the input stacker by an induction heating method. A processing object that a reflow process is completed is received in a magazine and then stored in an output stacker.

Abstract: There is provided a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of connection pads formed on a substrate. The conductive ball mounting apparatus includes: an outer frame; an inner cylinder provided in the outer frame, wherein an upper surface and a lower surface of the inner cylinder are opened; a sieve provided in the inner cylinder, wherein the inner cylinder is partitioned into an upper space and a lower space by the sieve; an inlet port for supplying an air from an outside to the lower space of the inner cylinder; a mask provided to a lower end of the outer frame and having openings, the openings being provided to correspond to conductive ball mounting positions; and an exhaust port for exhausting an air from an upper surface of the mask to the outside and being provided to the lower end of the outer frame, wherein the inner cylinder is adapted to vibrate without being restricted by the outer frame.

Abstract: The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.

Abstract: When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection portion, is connected to the board with interposition of connection material between the electrode of the board and the connection portion, a cooling member is brought into contact with the weak heat-resistant portion or its neighborhood while heating the connection material by heating the board brought in contact with a placement member, and a quantity of heat conducted to the weak heat-resistant portion via the board is reduced by being conducted to the cooling member, thereby performing fusing of the connection material while preventing occurrence of thermal damage to the weak heat-resistant portion.

Abstract: A die bonding apparatus for die bonding at least two members, which are heated in a heat treatment furnace, comprising a first member having a surface to be die bonded on which solder is disposed and a second member disposed to face the first member in a state in which the solder disposed on the surface of the first member to be die bonded is interposed therebetween, and a base portion for mounting the first member thereon in a predetermined position, wherein the base portion has a temperature distribution so that a temperature of a vicinity of a central portion in a predetermined direction of the base portion is higher than that of a vicinity of an end portion of the base portion in a state in which heating is effected in the heat treatment furnace to, so that it is possible to suppress the occurrence of bubbles in the solder.