Abstract: A system for manufacturing an aluminum alloy roof for a railway car includes a welding station, a welding unit moveably coupled to the welding station, the welding unit for applying a weld, a roof retainer for selectively holding roof components thereto and for removably coupling to a portion of the welding station, and a rotator unit coupled to the roof retainer for selectively rotating the roof retainer to allow the welding unit to weld the roof components with an orientation substantially perpendicular with respect to gravity. A method of manufacturing a railcar roof includes placing roof carlines and roof sheets on a roof retainer, aligning and clamping the roof carlines and roof sheets to the roof retainer, rotating the roof retainer with respect to a welding to unit, and welding desired weld locations between the roof sheets and roof carlines during rotation of the roof retainer with a desired orientation.

Abstract: A work holder assembly is provided for bonding wire to an electronic component in a package. The work holder assembly includes a base having a front wall and a back wall extending between a first end and a second end. The work holder assembly includes a fixture for removably securing the package to the base and a linear slide extending between the first and second ends of the base for moving the fixture between a wire bonding position, a heating position and a load/unload position. The work holder assembly also includes a gas heater supported by the base for directing heated gas onto the package when the fixture is in the heating position and a fixture heated connected to the fixture for heating and maintaining the fixture at a predetermined fixture temperature.

Abstract: The top and bottom parts of a one-piece cover of a PCMCIA card are snapped together to form lap-joint seams which are welded together with a laser, under argon gas. Only a few small tack welds are required to substantially increases the mechanical strength and moisture resistance and to eliminate the risk of accidentally opening the card. The operation can be done at a high rate with minimal cost. Also, an internal frame may be made much narrower to allow more card area, while still meeting structural requirements for PCMCIA cards. The weld penetrates fully through the first layer of the seam and only partially through a second layer. During welding a fixture holds the seams in reasonably precise position and tightly closed so the seams are much tighter after welding than when the card is only snap closed. The precise positioning of the seams also allows the size of the weld to be minimized which reduces the risk of burn through which may damage electronic components enclosed within the card during welding.

Abstract: A method of bonding a semiconductor chip, including step of photographing a surface of a semiconductor chip, on which an electrode is formed, and detecting a relative position of the electrode with respect to the semiconductor chip, a bonding step of making the electrode of the semiconductor chip to face a circuit pattern provided on a substrate, and bonding the electrode to the circuit pattern, a step of photographing the substrate on which the semiconductor chip is formed, and detecting a relative position of the semiconductor chip with respect to the substrate. Also included is a step of evaluating a bonding accuracy by calculating a relative position of the electrode with respect to the substrate from the relative position of the semiconductor chip with respect to the substrate and the relative position of the electrode with respect to the semiconductor chip.

Abstract: A semiconductor die bonder (10) has a height adjuster (13) that is positioned next to the die bonding head (11). The height adjuster (13) assist in ensuring that die bonding head (11) positions a semiconductor die (36) at the desired bond line thickness.

Abstract: The present invention relates to controls for a multi-zone reflow oven. In the present invention a plurality of infra red thermal scanners are located at critical points along the path which a substrate passes in a reflow oven so as to generate an actual solder paste time/temperature profile as a substrate passes through the zones of the reflow oven. The actual temperature of the solder paste is determined at critical zones for generating feedback control signals. The time/temperature profile is stored for transfer to a different reflow oven so as to effect the identical solder paste time/temperature curve on the same or a different oven.

Abstract: A debridging tool incorporated into an automated wave soldering system adjacent to and after a wave soldering station removes bridges and/or excess solder formed during the wave soldering process by emitting, at a desired temperature which can be set using a heater and one or more thermo measuring devices, a pressurized stream of air, inert gas or other fluid only under selected areas of a printed circuit board, including a flexible circuit. The tool comprises a movable nozzle from which the stream is emitted and a means for transporting the nozzle under the printed circuit board. The tool targets only those areas of the board where bridges or excess solder repeatedly form during the soldering process without disturbing solder joints where no bridges or excess solder form.

Abstract: By providing a mechanism for removing static electricity, even slight electric charge caused by natural electrification is removed before holding solder balls. A necessary number of solder balls are held securely. The solder balls attracted by vacuum suction are brought close to pads until the solder balls come in contact with flux surfaces of pads. While continuously holding the solder balls using vacuum suction, the solder balls are pressed against the pads. The solder balls are embedded in the flux having adherence power and held. In a solder ball mounting apparatus, therefore, solder balls can be mounted on pads of a substrate securely without using electrostatic force which is difficult to control.

Abstract: An object of the invention is to surely bond a semiconductor chip onto a chip substrate by heat-melting a brazing filler metal as required. A die bonding apparatus which is provided with a substrate holder for holding a chip substrate, a collet for conveying and pressing a semiconductor chip onto the chip substrate held by the substrate holder, a heater for heat-melting a brazing filler metal interposed between the chip substrate and the semiconductor chip, a temperature sensor for detecting the heating temperature of the brazing filler metal, and controlling means for controlling the heater based on the temperature detected by the temperature sensor. The temperature sensor is disposed in the collet.

Abstract: A system and method that permits the accuracy of alignment of a transparent substrate relative to a second substrate to which it is bonded to be evaluated on-line, after the two substrates have been bonded together. The alignment of the two substrates is viewed through the transparent substrate as the bonded-together substrates are being transported between the station at which the bonding occurred and another processing station.

Abstract: With the present invention, a circuit card assembly having a nonvertically approaching device may be manufactured with reflow soldering. The circuit card assembly includes a circuit card and a nonvertically approaching device such as an edge connector, which is soldered to the circuit card with reflowed solder. The device is soldered to the circuit card by initially heating the circuit card, along with included reflow solder, prior to mating the device to the circuit card. Once the solder has melted and while it is in a liquidus state, the device is mated with the circuit card. In this manner, the nonvertically approaching leads of the device slide into the solder as they are positioned onto their circuit card soldering surfaces. Once cooled, the solder solidifies to conductively mount the device to the circuit card.A mating pallet is provided for soldering a device having nonvertically approaching leads to a circuit card.

Abstract: A temperature control system for obtaining a desired soak temperature of a workpiece driven through the brazing and annealing system includes a convection muffle for heating the workpiece within a brazing zone of the brazing and annealing system. The temperature control system also includes a first thermocouple positioned above the workpiece and measures a first real-time temperature of an atmospheric convection current directed towards the workpiece before the workpiece absorbs heat from the atmospheric convection current. A second thermocouple is positioned beneath the workpiece and measures a second real-time temperature of the atmospheric convection current after the workpiece has absorbed the heat from the atmospheric convection current.

Abstract: Disclosed are methods and apparatuses for forming solder bumps on integrated circuit chips (and other similar circuitized units) and apparatuses. A screening stencil is laid over the surface of the substrate and solder paste material is deposited into the stencil's apertures with a screening blade. The stencil is placed in such a manner that each of its apertures is positioned over a substrate pad, upon which a solder bump is to be formed. Next, a flat pressure plate is laid over the exposed top surface of the stencil, which creates a fully enclosed, or "captured", cell of solder paste within each stencil aperture. Then, with the stencil and plate remaining in place on top of the substrate, the substrate is heated to a temperature sufficient to reflow the solder paste material. After reflow, the substrate is cooled, and the pressure plate and stencil are thereafter removed, leaving solder bumps on the substrate.

Abstract: A bonding apparatus for manufacturing, for instance, a semiconductor device including a computer system which calculates a limit value of a driving current that flows to a linear motor controlling a bonding arm, and the computer system including a memory which stores correction current values that are used to correct the driving force of a plate spring at various height positions of the bonding arm, and limit values of the driving current according to a bonding load.

Abstract: The present invention provides a wire bonding apparatus for performing a wire bonding operation on a workpiece having a planar upper surface. The wire bonding apparatus includes a capillary for performing wire bonding and a drive unit for positioning the capillary. The wire bonding apparatus also includes a controller that controls the drive unit and the capillary. This controller generates an equation that defines the plane of the workpiece. Further, the controller determines the difference in height between the home position of the capillary and a selected bonding position on the workpiece based on the equation of the plane. The controller also determines a speed profile for moving the wire bonding apparatus toward the selected bonding position. This speed profile divides the difference in height into first and second sections. Preferably, the second section associated with each bonding position has the same heights.

Abstract: A method for preparing and assembling a planar reinforcement for a concrete element according to a pre-determined design plan, wherein a full-sized plan including the position and type of each element in the reinforcent to be achieved is mapped onto a working surface (30) having two reference directions, a suitable reinforcement element is positioned in each of a plurality of crossing points. The method is characterised in that one or both of the mapping and assembling operations are performed by a tool attached to the carriage of a robot (10), said carriage (10) having at least two degrees of freedom parallel to the reference directions. The method further comprises storing all the design plan data in a storage area of the robot, and using the robot to move the carriage (10) automatically in accordance with said data.

Abstract: An apparatus (400) used for indexing and affixing components to a substrate includes a vacuum conveyor and a controller (816) for controlling operation of the apparatus (400). The conveyor includes pallets (102), first and second tracks (414, 416), first and second motors (502, 503), a vacuum source, a plenum (110), and first and second elevators (404, 405). The pallets carry the substrate, while the first and second tracks guide the pallets. The first motor is used for driving a pallet in a first direction on the first track, while the second motor is used for driving a pallet in a direction opposite to the first direction on the second track. The plenum is coupled to the vacuum source and at least one pallet for applying adhering forces to the substrate. The first and second elevators are used for transferring a pallet between the first and second tracks.

Abstract: A helical weld servo controller for controlling the diameter of helically formed welded pipes adjusts the auxiliary hold down wheel position and the helix angle based on information provided by transducers regarding outgoing pipe diameter and by a laser vision device which generates weld gap and offset information.

Abstract: A device for fusing a shank and a cutting edge to form a bit is composed of a bottom plate on which a shank locating apparatus, a heater, a cutting edge locating apparatus, a collection apparatus, and a pneumatic-electro control apparatus are mounted. The device can be manually or automatically operated through the pneumatic-electro control apparatus such that a plurality of shanks are arranged and located one after another at a first fusion position, and that a plurality of cutting edges are arranged and located one after another at a second fusion position. The shank located at the first fusion position is heated by the heater before the shank is fused with the cutting edge located at the second fusion position.

Abstract: In a pick and place machine of the type having an X-Y movable bond head there is provided a vertically movable pick up tool in the bond head having a tip for picking up and placing a device. The tip of the bonding tool is mounted opposite a radiant heating element which is juxtaposed and separated from the tip of the bonding tool. The tip of the bonding tool is heated to a predetermined control temperature with the radiant energy heating element and during a bonding operation it incurs some cooling. The amount of cooling is calculated by the time and the length of the extension of the bonding tool from its heating element and a computer controller calculates a compensation factor over a predetermined fixed time which includes retracting the bonding tool tip a predetermined vertical distance into the heater to reheat the tool and compensate for the amount of cooling that occurred during the pick and place operation.

Abstract: A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.

Abstract: A gas flow rate control device disposed between a gas burner and a combustible gas source and a burning-supporting gas source connected to the gas burner has gas flow rate setting means for setting a flow rate of the combustible gas to be supplied to the gas burner, gas ratio setting means for setting a gas ratio between the flow rate of the combustible gas and a flow rate of the burning-supporting gas to be supplied to the gas burner, a first control valve for controlling the amount of combustible gas supplied to the gas burner, a second control valve for controlling the amount of burning-supporting gas supplied to the gas burner, and control means for controlling the first and second control valves on the basis of the set flow rate of the combustible gas and the set gas ratio so that the amounts of the combustible gas and the burning-supporting gas supplied to the gas burner correspond to the flow rates set.

Abstract: A circuit board for detecting disconnection of a bonding wire, includes a circuit board body; a pattern layer having a die pad region formed on an upper surface of the circuit board body for mounting a semiconductor chip thereon, and respective conductive wire patterns formed on the upper surface and an opposite lower surface of the circuit board body for electrically connecting the semiconductor chip; and via holes perforating through the circuit board body for connecting the conductive wire patterns. The pattern layer further includes bonding leads formed at one end of the conductive wire patterns and connected to the semiconductor chip by bonding wires for electrical connection between the semiconductor chip and the circuit board, and earth terminals formed outside of the die pad region and connected to a device for clamping the circuit board during electrical connection between the semiconductor chip and the circuit board by wire bonding.

Abstract: An auto-adjusting pin tool for friction stir welding is presented wherein the pin tool automatically adjusts for welding materials of varying thicknesses, and the pin can be incrementally withdrawn from the workpieces thus eliminating any crater or keyhole in the weld. The inventive apparatus is comprised of a welding head housing a motor connected to a controller instrument package and an arbor supported by bearings. The arbor forms an interior cylinder and is encircled by a stationary slip ring though which are ported hydraulic passageways into the interior cylinder of the arbor such that a piston housed therein may be moved axially. Coupled to the piston is a pin tool which is treaded on its lower end and which is moveably seated in, and extending through, a shoulder housing having concave lower face. When welding, the rotating treaded end of the pin enters and stirs the workpieces while the lower face of the shoulder housing compacts the workpieces.

Abstract: An ultrasonic vibration bonding chip mounter includes a chip carrying unit arranged above a chip supply unit, a prealignment unit and a mounting unit which are arranged in a row and having a movable table which can move back and forth in a direction parallel to a direction where these units are arranged, a pick-up unit, attached to the movable table, for transferring a chip from the chip supply unit to the prealignment unit, and an ultrasonic vibration bonding unit, attached to the movable table, for transferring the chip from the prealignment unit to a mounting unit so that the chips are transferred from the chip supply unit to the prealignment unit and further to the mounting unit by the reciprocation of the movable table one by one.

Abstract: A method and apparatus for continuously finishing hot-rolling steel strips include partially joining a rear end of a preceding steel strip and a leading end of a succeeding steel strip after the strips have passed through a rough hot-rolling step. The joint is flattened. The joint is rolled with a first stand of a tandem rolling mill. The mill is provided with a plurality of stands that includes a pair of work rolls and backup rolls and/or intermediate rolls, so that a compression stress acts at the unjointed section of the strips in the longitudinal direction of the joint while tracking the joint. Shape-control-rolling is performed on the joint with a second and succeeding stands so that a section of the steel strip other than the joint is subjected to the shape-control-rolling at all the stands.

Abstract: A conductive ball mounting apparatus and a mounting method for mounting a conductive ball for forming a bump without erroneously mounting an additional conductive ball in a workpiece, comprising a workpiece positioning section, a conductive ball feeding section, a mounting head provided with a plurality of suction holes each of which has a recess capable of storing one conductive ball on the bottom surface of the head, a moving device for moving the mounting head between the workpiece positioning section and the conductive ball feeding section, and a detecting device for detecting conductive balls erroneously additionally attached to the bottom surface of the mounting head without being stored in recesses arranged on the moving route of the mounting head.

Abstract: A multiple-tool ball bonder includes a first tool (50, 150) and a second tool (52, 152) mounted on a single head (82, 182) requiring only one vision system (78, 178), one positioning system (68, 168), and one computer system (56, 228). The ball bonder (44, 144) allows for the single head (82, 182) to create interconnections between semiconductor devices (10, 148) and lead frame fingers (12, 148) in a first direction with the first tool (50, 150) and the second tool (52, 152) allows interconnections in a second direction (40) without requiring additional equipment or processing runs.

Abstract: A spin-welding apparatus utilizing a servo motor assembly has a closed-loop control circuit for rotating one part of the workpiece being welded relative to the other. In use, the servo motor immediately rotates the first part up to a set speed at which welding will occur, and a power cylinder moves the first part into frictional contact with the second part. Contact between the two parts is observed by a microprocessor interrogating a signal from the servo output corresponding to an increase in the load on the servo motor due to frictional drag between the parts, with "contact" being identified as surpassing a predetermined threshold error or variance value between the closed-loop system's input and output values. The microprocessor then counts a predetermined number of revolutions, and terminates rotation of the servo motor and first part.

Abstract: A wire bonding apparatus comprises an X-Y table for placing thereon a die pad, on which a rectangular semiconductor chip with a plurality of first bonding pads is mounted, and a package component with a plurality of second bonding pads, a bonding tool for bonding, using a wire, each of the first bonding pads to a corresponding one of the second bonding pads, the bonding tool being movable between a reference position and a bonding level in a Z-direction, a camera system having an auto-focusing function for detecting the Z-directional position of each of the first and second bonding pads, thereby creating Z-directional data concerning the first and second bonding pads, a bonding level computer for calculating bonding levels of the bonding tool on the basis of the Z-directional position data, a bonding sequence computer for determining the motion sequence of the bonding tool on the basis of the calculated bonding levels, and a position/load control selector for selecting, on the basis of the determined motion s

Abstract: The invention provides an automated system for welding a first metal part to a second metal part. The system includes a trainable articulated arm, and a moving mechanism for moving the arm. The moving mechanism comprises servos connected to the arm for moving the arm, and a robot controller connected to the mechanized means for controlling the movement of the articulated arm. The system further includes a welding torch, and a probe with physical dimensions comparable to the torch. The probe includes a seam tracking mechanism for tracking the location of a weld seam in response to movement of the probe along the seam, and a connector for transmitting probe movement to the controller. The system further includes a holder mounted on the articulated arm for interchangeable receiving the torch and the probe so that the torch and the probe assume essentially the same position relative to the arm. The invention also provides a method of welding a first metal part to a second metal part using the above system.

Abstract: An automated sensor transport system for non-destructive inspection of a weld through the use of ultrasonic waves produced by an electromagnetic acoustic transducer (EMAT). The system includes: a computer control unit; a transport apparatus having a first EMAT for producing an ultrasonic SH shear wave and a second EMAT for receiving an ultrasonic SH shear wave reflected from a weld and a calibration means. The computer control unit, which is in electrical communication with a welding apparatus, the transport apparatus and a data acquisition unit, coordinates the weld test with completion of the weld. An edge detection sensor, which is affixed to the transport apparatus is used to automatically position the transport apparatus for a weld scan and to signal completion of the scan. The system includes an electrostatic shield to protect the second EMAT from electromagnetic and radio frequency interference.

Abstract: In the attachment of surface mounted devices, melting of solder is monitored so that immediately thereafter heating may be stopped. The solder paste, which is stump-grey below the melting point, will radically change its reflectance upon melting, this being detectable by means of a video camera.

Abstract: A method of injecting a filler in controlled manner into a protective tube for protecting optical fibers, the method consisting in regulating the delivery rate of the filler being injected as the closed tube advances. In the method, the delivery rate is regulated by detecting the position of the front of the filler contained in the protective tube relative to at least one detection point on the line for advancing the closed protective tube.

Abstract: An ultrasonic wirebonder has a horn and a transducer for vibrating the horn at a predetermined frequency. A magnet affixed to the horn generates a magnetic field. A coil coupled to the magnet has an output signal induced from the magnetic field moving relative to said coil. A filtering means filters the output signal from the coil to determine the reliably of the ultrasonic bond. An output device is used to monitor the output signal and determine whether the bond is reliable.

Abstract: A lightweight, portable automated fusion bonding apparatus consistently permits the accomplishment of fine grain, forged friction weld fusion bonding with the use of pressurized air sources commonly available at industrial facilities, automotive repair shops, and other manufacturing plants. The automated fusion bonding apparatus includes the following integrally coupled components: a drive-pressure mechanism, a passive fusion bonding mechanism, a stationary workpiece clamping mechanism, a rotatable workpiece and a stationary workpiece.

Abstract: An IC component mounting method includes sucking each of different types of IC components at a supply position to which the IC component having an electrode-provided face thereof to be bonded to a circuit board, recognizing an image of the IC component to detect a sucking position at which a sucking nozzle does not interfere with an electrode of the IC component, detecting a height of the sucking position, positioning the sucking nozzle at the sucking position while the position of the sucking nozzle in a vertical direction is controlled, sucking the IC component by a mounting head, recognizing a position of the IC component sucked by the mounting head, and recognizing a reference position of the circuit board or an IC component-mounting position thereof, and positioning the IC component at the IC component-mounting position of the circuit board and then mounting the IC component on the circuit board.

Abstract: A mount apparatus according to this invention has a mount head for pressing a semiconductor chip on a mount substrate through an adhesive layer. A position sensor for discretely detecting the position of the mount head in a pressing process every predetermined time interval is arranged in the mount head. A non-defect/defect determination unit is also arranged, and the non-defect/defect determination unit performs non-defect/defect determination of the adhesive layer on the basis of the position detected by the position sensor.

Abstract: To present means for bonding two types of devices on a display panel at high speed and at high precision.A first feed section comprising first devices and a second feed section comprising second devices are provided. Among the display panel, first feed section, and second feed section, a turntable comprising a first nozzle for picking up first devices and a second nozzle for picking up second devices is provided.Between the turntable and display panel, a first head for bonding the first device sucked in vacuum to the first nozzle to a longer side of the display panel, and a second head for bonding the second device sucked in vacuum to the second nozzle to a shorter side of the display panel are provided.

Abstract: In this invention, a designed value of a lead width is previously input and a bonding load suitable for the designed lead width is previously input before the step of continuously bonding a TAB tape on a semiconductor chip is effected. Next, the TAB tape and chip are carried to preset positions, and after recognition of the positions of the tape and chip and the alignment of the tape and chip by use of a CCD camera are completed, the inner lead width is actually measured by use of the CCD camera. The measured lead width is compared with the designed lead width, and when a difference therebetween exceeds a preset reference value, the bonding load is changed to a bonding load suitable for the measured lead width of the lead to be actually bonded based on the ratio of the measured lead width to the designed lead width and then the bonding operation is effected by the suitable bonding load.

Abstract: A production system for mounting components on circuit boards includes a solder printing unit having a solder printing device for printing solder onto lands of a circuit board and a solder printing inspecting device for inspecting a printing state the solder, a component mounting unit having a component mounting device for mounting a component to a predetermined position of the printed solder on the circuit board and a component mounting inspecting device for inspecting a mounting state of the component, and a soldering unit having a soldering device for melting and hardening the printed solder and a soldering inspecting device for inspecting a soldering state of the soldering.

Abstract: A cost efficient, highly reliable method to remove electronic devices and components from substrates eliminates separate tooling for every substrate and device or component size. The apparatus which implements the method allows for multiple device or component removal simultaneously, or in a single sequential operation, in a nondestructive action in a very low cost environment. A box oven and vacuum system and is used with different device or component and substrate sizes providing a simple, low cost, molten device removal procedure, eliminating the need for thermal monitor build and associated profiling for each product. The apparatus works independently of chip type or size, utilizing universal fixturing, and can be set up to pull multiple devices and/or components in a single run.

Abstract: An apparatus for aiding in welding a pipe structure is provided. The apparatus includes first and second expandable spaced apart seals adapted to be positioned in the pipe structure and on opposed sides of a region subjected to a welding process. Each of the spaced apart seals has a circular exterior surface selectively expandable to contact and form a seal with an interior surface of the piping structure, and a circular inner surface. A light-transmitting tubular shield support extends between the first and second seals and mates with the circular inner surfaces to position the first and second seals in spaced relationship with each other. An optical device has a selectable field of view supported within the interior of the tubular support, and is rotatable about the major axis of the tubular support for producing an image of the portion of the inner surface of the piping structure that is within the field of view of the optical device.

Abstract: A electronic chip removal and replacement system to be used to remove and replace a surface mounted or edge connected electronic chip from a circuit board, the system including a heater assembly having a heater unit which produces a quantity of heat, thereby heating an air flow which passes thereover to produce heated air which exits the heater assembly through an outlet nozzle. The hot air flow is applied to the electronic chip in a specific controlled pattern as directed through a microprocessor which directs a timed and ramped increase and decrease of a temperature of the heater unit in accordance with a specific type of chip being heated.

Abstract: The present invention relates to an apparatus for welding profile bodies onto planar bodies, in particular flat bodies, with at least one welding torch head. To simplify the welding of profile bodies to planar bodies, the positional assignment of the welding torch head to the weld seam is defined according to the invention by a profiled seam detector whose profile shape is adapted to the profile of the profile body, the seam detector being adapted to be activated towards the profile body and being provided with rolls through which it can be supported on the profile body.

Abstract: A system for teaching bonding coordinates of pads provided on a semiconductor chip including: a first arithmetic control unit for processing images of pads obtained by a camera and calculates the amount of shift of centers of the images of the pads; and a second arithmetic control unit which, for the first and second pads, corrects the bonding coordinates, thus producing new bonding coordinates for the first and second pads, and for the third and subsequent pads, the second arithmetic control unit moves the camera a distance between new coordinates of two preceding pads and corrects the coordinates of the moved camera, producing new bonding coordinates to be stored in a bonding coordinate memory.

Abstract: In wire bonding used in manufacturing, for example, semiconductor devices, inputting of the coordinates of the first and second leads of a lead frame, on which a semiconductor chip is installed, into an operation controller makes it possible that the coordinates of all of the remaining leads are automatically calculated by an image processor and the bonding coordinates for such leads are also automatically calculated.

Abstract: A welding apparatus is provided which includes a rail member 5 installed along a side and a corner portion of a steel frame post, a pinion 46 mounted to a horizontally movable shifting member 50 such that even at the corner portion of the steel frame post 1 the pinion 46 is constantly held in mesh engagement with a rack 6 disposed on a side of the rail member 5, and a position holding roller 57 for guiding the shifting member 50 in a horizontal direction so that the distance between the rack 6 and the pinion 46 is kept constant. During the movement of the carriage, the distance between the rack and the pinion is kept constant to enable welding operations to be performed in succession with respect to side and corner portions of the steel frame post. Therefore, after a face-to-face welding operation at one side is completed, such a welding operation at the other side may be carried out without the necessity of removing the carriage from the rail member.

Abstract: The present invention provides an apparatus and its method that is able to effectively use positional data such as coordinates and so forth stored in advance in a bonder.This wire bonder is able to compare and evaluate at least one set of image data of either a first bonding point or second bonding point in the form of bonded sites, or a wire spread between said first and second bonding points, with the positional data into which said image data has been incorporated in advance, and automatically perform inspection and make corrections.

Abstract: An artificial neural network is trained to recognize inputted thermal and physical features of a printed circuit board, for providing settings for a reflow oven for obtaining acceptable soldering of the printed circuit board.