Plural Photosensitive Image Detecting Element Arrays Patents (Class 250/208.1)
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Patent number: 11182916Abstract: In various examples, a deep neural network (DNN) is trained to accurately predict, in deployment, distances to objects and obstacles using image data alone. The DNN may be trained with ground truth data that is generated and encoded using sensor data from any number of depth predicting sensors, such as, without limitation, RADAR sensors, LIDAR sensors, and/or SONAR sensors. Camera adaptation algorithms may be used in various embodiments to adapt the DNN for use with image data generated by cameras with varying parameters—such as varying fields of view. In some examples, a post-processing safety bounds operation may be executed on the predictions of the DNN to ensure that the predictions fall within a safety-permissible range.Type: GrantFiled: December 27, 2019Date of Patent: November 23, 2021Assignee: NVIDIA CorporationInventors: Yilin Yang, Bala Siva Sashank Jujjavarapu, Pekka Janis, Zhaoting Ye, Sangmin Oh, Minwoo Park, Daniel Herrera Castro, Tommi Koivisto, David Nister
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Patent number: 11184565Abstract: An object of the present invention is to obtain an image having a better S/N ratio in accordance with gain settings in an image pickup apparatus that enables amplifying a signal based on output of a photoelectric conversion unit, with a plurality of gains. An image pickup element provided in an image pickup apparatus has a photoelectric conversion unit in which unit pixels are arranged in a matrix and a signal voltage is generating by photoelectric conversion. A column amplifier of the image pickup element can amplify the signal voltage photoelectrically converted with a plurality of gains. An image pickup element control unit performs drive control of the image pickup element to perform gain settings. An image composition unit performs image composition by using a plurality of image signals having different gains.Type: GrantFiled: March 26, 2020Date of Patent: November 23, 2021Assignee: CANON KABUSHIKI KAISHAInventor: Takenori Kobuse
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Patent number: 11183540Abstract: An imaging element according to an embodiment of the present disclosure includes: a first electrode and a second electrode facing each other; and a photoelectric conversion layer including a p-type semiconductor and an n-type semiconductor, and provided between the first electrode and the second electrode, in which the photoelectric conversion layer has an exciton charge separation rate of 1×1010 s?1 to 1×1016 s?1 both inclusive in a p-n junction surface formed by the p-type semiconductor and the n-type semiconductor.Type: GrantFiled: May 5, 2020Date of Patent: November 23, 2021Assignee: SONY CORPORATIONInventors: Hajime Kobayashi, Yuichi Tokita
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Patent number: 11183490Abstract: Various embodiments of energy storage elements for use in power converters are described. In one example embodiment, briefly, an integrated circuit (IC) for use with a power converter may comprise a first layer comprising a first set of devices disposed on a device face thereof; a second layer comprising a second set of devices disposed on a device face thereof; a first interconnect structure to be disposed between the first layer and an electrical interface, the first interconnect structure to electrically couple the first set of devices to one or more thru vias; and a second interconnect structure to be disposed between the first layer and the second layer, the second interconnect structure to electrically couple the second set of devices to the one or more thru vias. Likewise, in some instances, one or more thru vias may extend through at least one of the following: the first layer; the second layer; or any combination thereof.Type: GrantFiled: September 3, 2019Date of Patent: November 23, 2021Assignee: pSemi CorporationInventor: David Giuliano
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Patent number: 11178351Abstract: A readout circuit is provided. The readout circuit is coupled to a pixel circuit for reading out signals from the pixel circuit. The readout circuit includes a biasing circuit. The biasing circuit includes a cascode transistor and a biasing transistor. A first terminal of the cascode transistor is coupled to an output terminal of the biasing circuit and the pixel circuit. A second terminal of the cascode transistor is coupled to a first terminal of the biasing transistor. A second terminal of the biasing transistor is coupled to a negative voltage.Type: GrantFiled: May 7, 2020Date of Patent: November 16, 2021Assignee: Novatek Microelectronics Corp.Inventors: Kuo Wei Cheng, Chi-Ting Chen
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Patent number: 11178759Abstract: To enhance reliability of an electronic component. There is provided an electronic component including a base material having a first face and a second face, a first layer provided on the first face of the base material and including a plurality of pads connected to a plurality of bumps of a chip flip-chip mounted on the first face of the base material, respectively, and a second layer provided on the second face of the base material, in which a contacting member arranged at apart contacting with the second face of the base material at a position corresponding to each of the plurality of pads in the second layer is made of the same material.Type: GrantFiled: November 21, 2017Date of Patent: November 16, 2021Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Ryo Itotani, Yuta Momiuchi, Hirokazu Nakayama, Tooru Kai, Miyoshi Togawa
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Patent number: 11177408Abstract: A light detection device is disclosed. A first cell and a second cell are set in the light detection device. The first cell and the second cell are mutually adjacent. The device includes: a first semiconductor layer of a first conductivity type; a second semiconductor layer provided on the first semiconductor layer, the second semiconductor layer being of a second conductivity type; a first member provided between the first cell and the second cell; a second member provided between the first member and the first cell; and a third member provided between the first member and the second cell. The first to third members are made of a material different from the first semiconductor layer and the second semiconductor layer.Type: GrantFiled: September 10, 2019Date of Patent: November 16, 2021Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATIONInventors: Kensuke Yasuda, Nobuyuki Toda, Shinji Kawahara, Kazuaki Yamaura, Takeshi Yamamoto
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Patent number: 11178349Abstract: A lens-free imaging system for generating an image of a scene includes an electromagnetic (EM) radiation sensor; a mask disposed between the EM radiation sensor and the scene; an image processor that obtains signals from the EM radiation sensor while the EM radiation sensor is exposed to the scene; and estimates the image of the scene based on, at least in part, the signals and a transfer function between the scene and the EM radiation sensor.Type: GrantFiled: January 29, 2016Date of Patent: November 16, 2021Assignee: William Marsh Rice UniversityInventors: Aswin Sankaranarayanan, Ashok Veeraraghavan, Lisa A. Hendricks, Richard Baraniuk, Ali Ayremlou, M. Salman Asif
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Patent number: 11175404Abstract: Embodiments of a system and method are disclosed. In an embodiment, a LiDAR (Light Detection and Ranging) system that can include a sensor circuit comprising a controller unit, a transmitter, a gating circuit, and a receiver element, wherein the gating circuit is connected to the controller unit and to the receiver element, wherein signals detected by the sensor circuit correspond to at least one physical object located in an operating region with respect to a location of the sensor circuit and based on multiple measurements. The gating circuit can range-gate the receiver element based on a range-gating waveform, and the controller unit can provide a phase-delay parameter for phase shifting the range-gating waveform with different phase values relative to a light signal transmitted by the transmitter for different measurements by the sensor circuit.Type: GrantFiled: November 30, 2018Date of Patent: November 16, 2021Assignee: NXP B.V.Inventors: Mark Steigemann, Maxim Kulesh
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Patent number: 11177161Abstract: A method of manufacturing a semiconductor device includes bonding a first semiconductor wafer including a first substrate and a first insulating layer formed to contact one surface of the first substrate, and a second semiconductor wafer including a second substrate and a second insulating layer, forming a third insulating layer, performing etching so that the second insulating layer remains on a second wiring layer, forming a first connection hole, forming an insulating film on the first connection hole, performing etching of the second insulating layer and the insulating film, forming a second connection hole, and forming a first via formed in inner portions of the connection holes and connected to the second wiring layer, wherein a diameter of the first connection hole formed on the other surface of the first substrate is greater than a diameter of the first connection hole formed on the third insulating layer.Type: GrantFiled: May 12, 2020Date of Patent: November 16, 2021Assignee: SONY CORPORATIONInventor: Masaki Okamoto
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Patent number: 11175387Abstract: An optical sensor configured to reduce a measurement time while the accuracy of the optical sensor is maintained is realized. An initial configuration circuit (19) includes a counter configured to perform counting of the number of pulse outputs from a first light-receiving unit (11) in first to nth regions obtained by dividing each cycle of a reference clock into n equal parts, determines, among the first to nth regions, a region in which a counter value is largest, and the initial configuration circuit causes a first DLL circuit (17) to perform a converging operation to the region determined.Type: GrantFiled: June 9, 2017Date of Patent: November 16, 2021Assignee: SHARP KABUSHIKI KAISHAInventors: Hideki Sato, Yoshiki Ikuta, Takayuki Shimizu, Takuma Hiramatsu
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Patent number: 11177304Abstract: A method for forming a light-sensing device is provided. The method includes forming a light-sensing region in a semiconductor substrate. The semiconductor substrate has a front surface and a light-receiving surface opposite to the front surface. The method also includes forming a first dielectric layer over the front surface and forming a second dielectric layer over the first dielectric layer. The second dielectric layer has a different refractive index than that of the first dielectric layer, and the first dielectric layer and the second dielectric layer together form a (or a part of a) light-reflective element. The method further includes partially removing the first dielectric layer and the second dielectric layer to form a contact opening. In addition, the method includes forming a conductive contact to partially (or completely) fill the contact opening.Type: GrantFiled: December 27, 2019Date of Patent: November 16, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee, Hsun-Ying Huang
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Patent number: 11170231Abstract: An electronic device is disclosed. The disclosed electronic device comprises: a camera module; one or more processors electrically connected to the camera module; and a memory electrically connected to the processors, wherein, when the electronic device operates, the memory can store instructions for making the processors generate an image by using the camera module, calculate angles formed by a virtual horizontal line and a plurality of straight lines included in the image, and select two straight lines on the basis of the calculated angles. Additional various examples are possible.Type: GrantFiled: February 28, 2018Date of Patent: November 9, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Sangmin Shin, Gangheok Kim, Yongwook Kim
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Patent number: 11169360Abstract: The present disclosure discloses a camera lens assembly. The camera lens assembly includes, sequentially along an optical axis from an object side to an image side: a first lens having a positive refractive power, a second lens having a negative refractive power and at least one subsequent lens. A lens closest to the image side of the camera lens assembly is a negative lens having a negative refractive power, and a lens adjacent to the negative lens is a positive lens having a positive refractive power. The camera lens assembly further includes a curved image plane, and a radius of curvature RI of the image plane and a total effective focal length f of the camera lens assembly satisfy: |f/RI|?0.35.Type: GrantFiled: February 12, 2019Date of Patent: November 9, 2021Inventor: Kaiyuan Zhang
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Patent number: 11170193Abstract: An object identifying method, suitable for an object identifying circuit configured to be disposed under a display panel, includes the following operations: displaying a black pattern by the display panel; generating a plurality of first sensing signals of a plurality of first sensor pixels of the display panel arranged in the black pattern; generating a plurality of second sensing signals of a plurality of second sensor pixels of the display panel arranged in a contact area with which the display panel contacting an object to be identified; adjusting voltage levels of the plurality of second sensing signals according to the plurality of first sensing signals; and generating an image corresponding to the object to be identified from the adjusted plurality of second sensing signals.Type: GrantFiled: April 5, 2020Date of Patent: November 9, 2021Assignee: NOVATEK Microelectronics Corp.Inventor: Chi-Ting Chen
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Patent number: 11165436Abstract: This application relates to time-encoding modulators (TEMs). A TEM receives an input signal (SIN) and outputs a time-encoded output signal (SOUT). A filter arrangement receives the input signal and also a feedback signal (SFB) from the TEM output, and generates a filtered signal (SFIL) based, at least in part, on the feedback signal. A comparator receives the filtered signal and outputs a time-encoded signal (SPWM) based at least in part on the filtered signal. The time encoding modulator is operable in a first mode with the filter arrangement configured as an active filter and in a second mode with the filter arrangement configured as a passive filter. The filter arrangement may include an op-amp, capacitance and switch network. In the first mode the op-amp is enabled, and coupled with the capacitance to provide the active filter. In the second mode the op-amp is disabled and the capacitance is coupled to a signal path for the feedback signal to provide a passive filter.Type: GrantFiled: September 18, 2020Date of Patent: November 2, 2021Assignee: Cirrus Logic, Inc.Inventor: John Paul Lesso
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Patent number: 11163150Abstract: A driving optical system is used to observe a disturbance of a wavefront of reference light received from a target and generate a wavefront in a conjugate relationship with the wavefront. A plurality of control signals are generated on a basis of a plurality of Zernike coefficients calculated as a Zernike polynomial which approximates the wavefront disturbance in order to respectively drive a plurality of deformable mirrors included in the driving optical system. An adaptive optical system is provided which can optically compensate a wavefront disturbance derived from an atmospheric fluctuation even in a case of radiating laser light to a target moving at a high speed.Type: GrantFiled: April 25, 2018Date of Patent: November 2, 2021Assignees: MITSUBISHI HEAVY INDUSTRIES, LTD., RIKENInventors: Masashi Iwashimizu, Hiroyuki Daigo, Shingo Nishikata, Kazunori Masukawa, Atsushi Ochiai, Toshikazu Ebisuzaki, Satoshi Wada, Yoshiyuki Takizawa
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Patent number: 11159740Abstract: There is provided with an image capturing device. An image capturing unit is capable of controlling an exposure condition for each region. A first acquisition unit acquires information representing a moving object region within an imaging range of the image capturing unit. A second acquisition unit acquires brightness information of each region within the imaging range of the image capturing unit. A setting unit sets the exposure condition used by the image capturing unit for each region by using the information representing the moving object region and the brightness information.Type: GrantFiled: December 9, 2019Date of Patent: October 26, 2021Assignee: CANON KABUSHIKI KAISHAInventor: Hisato Sekine
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Patent number: 11158664Abstract: In some embodiments, the present disclosure relates to an integrated chip structure. The integrated chip structure includes a first image sensor disposed within a first substrate and a second image sensor disposed within a second substrate. The second substrate has a first side facing the first substrate. The first side includes angled surfaces defining one or more recesses within the first side. A band-pass filter is arranged between the first substrate and the second substrate and is configured to reflect electromagnetic radiation that is within a first range of wavelengths.Type: GrantFiled: April 1, 2020Date of Patent: October 26, 2021Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Hau Wu
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Patent number: 11156453Abstract: A measurement apparatus for measuring a laser focus spot size, which includes a two-dimensional image detector and an imaging system which forms a magnified image of a focus spot located an object plane onto the image detector. The imaging system includes at least an objective lens. A sealed liquid container is secured over a part of the objective lens such as the optical surface of the objective lens is immersed in the liquid (e.g. water) within the container. The liquid container has a window through which the laser beam enters. An image processing method is also disclosed which processes the image obtained by the image detector to obtain the focus spot size while implementing an algorithm that corrects for the effect of ambient vibration.Type: GrantFiled: June 19, 2020Date of Patent: October 26, 2021Assignee: AMO Development, LLCInventors: Zheng Sun, Daniel Bray, Zenon Witowski, Timothy Slotterback, Hong Fu
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Patent number: 11159757Abstract: A pixel array includes a plurality of pixel blocks each formed of a plurality of pixels. A signal processing unit and a corresponding one of the pixel blocks are connected by a plurality of first signal lines. The signal processing unit and a corresponding one of transfer units are connected by a plurality of second signal lines. The signal processing unit includes a conversion circuit that sequentially performs analog-to-digital conversion on first signals input from the plurality of first signal lines during an identical period. The transfer units are disposed in a direction different from a first direction in which the first signal lines are provided, with respect to the circuit array in a second substrate.Type: GrantFiled: March 26, 2020Date of Patent: October 26, 2021Assignee: CANON KABUSHIKI KAISHAInventor: Mineo Uchida
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Patent number: 11156701Abstract: Disclosed herein is a method and apparatus for determining time of arrival of incident photons. The time of arrival may be determined with high time accuracy based on characteristics of the rate of change of a voltage across a capacitor being charged by charge carriers generated from the incident photons.Type: GrantFiled: December 21, 2020Date of Patent: October 26, 2021Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.Inventors: Peiyan Cao, Yurun Liu
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Patent number: 11158661Abstract: An image sensor includes a two-dimensional photodiode-array formed in a semiconductor substrate, a first waveguide, and a first color filter. The first waveguide is aligned to a first photodiode of the photodiode-array, located above a top substrate surface of the semiconductor substrate. A first core of the first waveguide has a first core width that is less than a pitch of the photodiode-array in a first direction and a second direction corresponding to respective orthogonal dimensions of the photodiode-array. The first color filter is on a top waveguide surface of the first waveguide and has a first non-uniform thickness above the first core. The first waveguide is between the top substrate surface and the first color filter.Type: GrantFiled: September 19, 2019Date of Patent: October 26, 2021Assignee: OmniVision Technologies, Inc.Inventors: Alireza Bonakdar, Zhiqiang Lin
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Patent number: 11153524Abstract: The present invention provides a pixel circuit. A first S/H stage and the second S/H stage are connected in cascade between a buffer amplifier and an amplifier circuit. During a first and a second time period, a buffered output signal having a first voltage and a second voltage generated by the buffer amplifier are stored serially to the first S/H stage and the second S/H stage. The amplifier circuit senses the first voltage and the second voltage stored in the first S/H stage and the second S/H stage independently for generating a first output signal and a second output signal correspondingly. A calibrated signal is generated according to the first output signal and the second output signal.Type: GrantFiled: September 22, 2020Date of Patent: October 19, 2021Assignee: PIXART IMAGING INCORPORATIONInventors: Wen-Cheng Yen, Ren-Chieh Liu
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Patent number: 11150390Abstract: An optical filter may include a substrate. The optical filter may include a first mirror. The optical filter may include a second mirror. The optical filter may include a spacer. The first mirror, the second mirror, and the spacer may form a plurality of component filters. A first component filter, of the plurality of component filters, may be associated with a first cross-sectional area and a second component filter, of the plurality of component filters, is associated with a second cross-sectional area. The first cross-sectional area and the second cross-sectional area may be configured to response balance the first component filter and the second component filter.Type: GrantFiled: May 20, 2020Date of Patent: October 19, 2021Assignee: VIAVI Solutions Inc.Inventors: William D. Houck, Steven Saxe
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Patent number: 11151698Abstract: The present disclosure relates to an image processing apparatus and a method that allow suppression of a reduction in the subjective image quality. An inverse filter of a filter configured to transform an input image to be projected by a plurality of projection sections into a projection image projected by the plurality of projection sections is generated on the basis of an individual-blur amount and a superimposition-blur amount. The individual-blur amount indicates a magnitude of optical blur generated in an individual projection image projected by each of the plurality of projection sections. The superimposition-blur amount indicates a magnitude of optical blur generated from superimposition of a plurality of the projection images. The input image is transformed using the generated inverse filter to generate a phase image.Type: GrantFiled: March 15, 2018Date of Patent: October 19, 2021Assignee: SONY CORPORATIONInventor: Takaaki Suzuki
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Patent number: 11150362Abstract: The present disclosure discloses a pixel circuit and a method for controlling the same, and a flat panel detector. The pixel circuit includes: a plurality of pixel units arranged in an M×N array, wherein each of the pixel units is configured to sense an optical signal and generate induced current based on the sensed optical signal, where M and N are integers greater than or equal to 1; and N storage circuits connected to N columns of pixel units respectively, wherein each of the storage circuits has an input signal terminal connected to a respective column of pixel units, a control signal terminal and an output signal terminal, and is configured to receive induced current from the respective column of pixel units at the input signal terminal, store a voltage based on the received induced current, and provide the stored voltage at the output signal terminal under control of a signal at the control signal terminal.Type: GrantFiled: August 22, 2019Date of Patent: October 19, 2021Assignees: BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Liye Duan, Yanzhao Li
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Patent number: 11152412Abstract: An image sensor including a plurality of pixels, each including: a semiconductor photodetection region; a metal region arranged on a first surface of the semiconductor region; a band-pass or band elimination interference filter arranged on a second surface of the semiconductor region opposite to the first surface; and between the semiconductor region and the metal region, a portion of the absorbing layer made of a material different from that of the semiconductor region, the absorbing layer being capable of absorbing, in a single passage, more than 30% of an incident radiation at the central wavelength of the pass band or of the stop band of the interference filter.Type: GrantFiled: December 18, 2019Date of Patent: October 19, 2021Assignee: Commissariat à l'Énergie Atomique et aux Énergies AlternativesInventors: Laurent Frey, Yvon Cazaux
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Patent number: 11153521Abstract: A solid-state image sensor includes a pixel array including pixel cells arranged in a matrix. Each of the pixel cells includes an avalanche photodiode, a floating diffusion which accumulates charges, a transfer transistor which connects a cathode of the avalanche photodiode to the floating diffusion, a first reset transistor for resetting charges collected in the cathode of the avalanche photodiode, a second reset transistor for resetting charges accumulated in the floating diffusion, an amplification transistor for converting a charge amount of charges accumulated in the floating diffusion into a voltage, a memory which accumulates charges, and a count transistor which connects the floating diffusion to the memory.Type: GrantFiled: November 19, 2019Date of Patent: October 19, 2021Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Shigetaka Kasuga, Manabu Usuda, Kentaro Nakanishi
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Patent number: 11152282Abstract: An IC device package includes an IC device that is connected to a lid by a thermal interface material (TIM). A catalyst material is formed upon one or more regions upon an upper surface of the IC device and/or an under surface of the lid. The catalyst material increases the rate of crosslinking of polymer chains of the TIM during TIM curing and/or increases the strength of crosslinks that link polymer chains of the TIM during TIM curing. The catalytically enhanced regions have a higher coefficient of heat transfer relative to non-catalytically enhanced regions. Therefore, the catalytically enhanced regions efficiently transfer heat from the IC device to the lid.Type: GrantFiled: June 19, 2020Date of Patent: October 19, 2021Assignee: International Business Machines CorporationInventors: Charles Leon Arvin, Kevin Drummond, Kenneth Charles Marston, Chris Muzzy, Sushumna Iruvanti
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Patent number: 11148141Abstract: The present invention generally relates to a solid-state, multi-well plate reader including an emitter assembly having a plurality of emitters and a receptor assembly having a plurality of receptors, where the positions of these assemblies are not fixed relative to each other but are temporarily aligned for measurement by way of two alignment trays.Type: GrantFiled: September 9, 2020Date of Patent: October 19, 2021Assignee: Cerillo, Inc.Inventors: Kevin Seitter, Kristin Schmidt, Thomas Moutinho, Jr.
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Patent number: 11152413Abstract: A structure has a color filter having two or more different types of pixels and an absorption layer including at least one selected from a yellow colorant or a colorant having a maximum absorption wavelength in a wavelength range of 400 to 500 nm, in which the structure has the absorption layer on an optical path of at least one pixel of the pixels of the color filter and on the side through which light is incident on the pixel.Type: GrantFiled: December 11, 2019Date of Patent: October 19, 2021Assignee: FUJIFILM CorporationInventors: Hirotaka Takishita, Shoichi Nakamura, Hiroshi Taguchi
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Patent number: 11148669Abstract: A method for providing lane change assistance information to the driver of a subject vehicle moving on a lane of a roadway in a driving direction, includes the following steps: detecting another vehicle which is approaching the subject vehicle; checking whether changing to another lane of the same roadway is possible and permissible for the subject vehicle; and informing the driver of the subject vehicle that the other vehicle is approaching to trigger a manual lane change, or initiating an automatic lane change of the subject vehicle, when the lane change to the other lane is possible and permissible.Type: GrantFiled: November 24, 2016Date of Patent: October 19, 2021Assignee: Continental Automotive GmbHInventor: Victor Tomescu
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Patent number: 11152407Abstract: An image sensor includes a first column line and a second column line configured to extend in a first direction, a plurality of pixel groups configured to connect to the first column line or the second column line and to comprise a plurality of pixels in each of the plurality of pixel groups, a bias circuit configured to comprise a first current circuit and a second current circuit configured to output different bias currents in a first operational mode, and a switching circuit configured to connect the first column line to the first current circuit and connect the second column line to the second current circuit during a first time period, and to connect the first column line to the second current circuit and connect the second column line to the first current circuit during a second time period subsequent to the first time period in the first operational mode.Type: GrantFiled: March 15, 2019Date of Patent: October 19, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Jae Hong Kim, Dae Hwa Paik, Seung Hyun Lim, Sin Hwan Lim
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Patent number: 11152418Abstract: There is provided a solid-state imaging device including first, second, and third substrates stacked in this order. The first substrate includes a first semiconductor substrate and a first wiring layer. A pixel unit is formed on the first semiconductor substrate. The second substrate includes a second semiconductor substrate and a second wiring layer. The third substrate includes a third semiconductor substrate and a third wiring layer. A first coupling structure couples two of the first, second, and third substrates to each other includes a via. The via has a structure in which electrically-conductive materials are embedded in one through hole and another through hole, or a structure in which films including electrically-conductive materials are formed on inner walls of the through holes. The one through hole exposes a first wiring line in one of the wiring layers. The other through hole exposes a second wiring line in another wiring layer.Type: GrantFiled: March 23, 2018Date of Patent: October 19, 2021Assignee: Sony Semiconductor Solutions CorporationInventors: Takatoshi Kameshima, Hideto Hashiguchi, Ikue Mitsuhashi, Hiroshi Horikoshi, Reijiroh Shohji, Minoru Ishida, Tadashi Iijima, Masaki Haneda
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Patent number: 11151727Abstract: Image processing devices utilize computationally efficient operations based on exposure time and object speed to detect and estimate motion blur. These operations include determining, from a plurality of image frames of an object, a representative length of movement associated with at least one feature point of the object, which undergoes movement between the plurality of image frames. This representative length of movement is converted to an estimate of motion blur for a respective image frame, using operations that are function of length of movement and exposure time.Type: GrantFiled: August 24, 2017Date of Patent: October 19, 2021Assignee: SONY GROUP CORPORATIONInventors: Johannes Elg, Fredrik Mattisson, Lars Novak, Fredrik Olofsson, Pal Szasz
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Patent number: 11141971Abstract: An image forming apparatus includes a conveyance part, an image forming part, a sheet detection sensor, a sensor unit, and a controller. The sheet detection sensor, in which a plurality of sensor blocks each with a plurality of sensor elements mounted thereon at specified intervals are arrayed in a sheet width direction, detects an edge position in the sheet width direction on a basis of scanning image data formed by reading of the sheet. The controller is enabled to execute a calibration of inserting, into the scanning image data, interpolation pixels for compensating an error between an edge position detected by the scanning image data and an actual edge position.Type: GrantFiled: February 3, 2020Date of Patent: October 12, 2021Assignee: KYOCERA DOCUMENT SOLUTIONS INC.Inventor: Katsuo Mikashima
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Patent number: 11138398Abstract: A mobile device may include a camera assembly, a processor, memory, and a barcode-reading application. The camera assembly may include an image sensor. Pixels in a predetermined location of the image sensor may be defective pixels that provide the same output values regardless of actual characteristics of incident light. The barcode-reading application may be stored in the memory. The barcode-reading application may be executable by the processor to enable at least one enhanced mode of operation of the barcode-reading application conditional upon confirming that the image sensor comprises the defective pixels in the predetermined location.Type: GrantFiled: January 21, 2019Date of Patent: October 5, 2021Assignee: The Code CorporationInventors: George Powell, Ryan Hoobler
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Patent number: 11139651Abstract: An imaging panel includes multiple photoelectric conversion elements respectively mounted in multiple pixels defined by multiple gate lines and data lines formed on a substrate. The imaging panel further includes, outside pixel regions defined by the pixels, multiple first non-linear elements respectively connected to the data lines, multiple first protective wiring respectively connected to the data lines, and a first common wiring connected to the first non-linear elements. Each of the first non-linear elements is connected in a reverse-biased state between the data line connected to the first non-linear element and the first common wiring. Each of the first protective wiring extends to the edge of the substrate.Type: GrantFiled: March 26, 2020Date of Patent: October 5, 2021Assignee: SHARP KABUSHIKI KAISHAInventors: Hiroyuki Moriwaki, Makoto Nakazawa, Akinori Kubota, Fumiki Nakano
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Patent number: 11140347Abstract: This disclosure relates to an imaging element, an imaging element control method, an imaging apparatus, and an electronic device adapted to suppress the drop in yield of the imaging element with an ever-higher density of circuitry. Multiple transfer paths are configured to transfer, bit by bit, a time code of a predetermined number of bits for use in converting into a digital signal a pixel signal reflecting the intensity of light received by a pixel. The transfer paths are provided with a relief transfer path that is switched for use in the case where an error has occurred on the multiple transfer paths. This disclosure may be applied to the imaging element.Type: GrantFiled: January 5, 2018Date of Patent: October 5, 2021Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventor: Katsumi Honda
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Patent number: 11137284Abstract: Provided is a position detection sensor. In a first pixel part, as an incident position is closer to a first end of a first pixel pair group in a second direction, an intensity of a first electric signal decreases. In a second pixel part, as the incident position is closer to the first end, an intensity of a second electric signal increases. In a third pixel part, as the incident position is closer to a second end of a second pixel pair group in a first direction, an intensity of a third electric signal decreases. In a fourth pixel part, as the incident position is closer to the second end, an intensity of a fourth electric signal increases. A calculation unit calculates a second position on the basis of the first and second electric signals, and calculates a first position on the basis of the third and fourth electric signals.Type: GrantFiled: August 21, 2018Date of Patent: October 5, 2021Assignee: HAMAMATSU PHOTONICS K.K.Inventors: Munenori Takumi, Haruyoshi Toyoda, Yoshinori Matsui, Kazutaka Suzuki, Kazuhiro Nakamura, Keisuke Uchida
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Patent number: 11131841Abstract: A scanning light field microscopic imaging system includes: a microscope configured to magnify a sample and image the sample onto a first image plane of the microscope; a relay lens configured to magnify or minify the first image plane; a 2D scanning galvo configured to rotate an angle of a light path in the frequency domain plane; the microlens array configured to modulate a beam with a preset angle to a target spatial position at a back focal plane of the microlens array and modulate the first image plane to obtain a modulated image; an image sensor configured to record the modulated image; and a reconstruction module configured to reconstruct a 3D structure of the sample based on the modulated image acquired from the image sensor.Type: GrantFiled: March 19, 2019Date of Patent: September 28, 2021Assignee: TSINGHUA UNIVERSITYInventors: Qionghai Dai, Zhi Lu, Jiamin Wu
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Patent number: 11133346Abstract: A stacked-die image sensor may be provided with an array of image pixels. The stacked-die image sensor may include at least first and second integrated circuit dies stacked on top of one another. Some of the pixel circuitry in each pixel may be formed in the first integrated circuit die and some of the pixel circuitry in each pixel may be formed in the second integrated circuit die. Coupling structures such as conductive pads may electrically couple the pixel circuitry in the first integrated circuit die to the pixel circuitry in the second integrated circuit die. A shielding structure may partially or completely surround each conductive pad to reduce parasitic capacitive coupling between adjacent conductive pads. The shielding structure may be a metal wire coupled to a ground voltage. The shielding structure may extend between columns of image pixels and/or between rows of image pixels.Type: GrantFiled: December 30, 2019Date of Patent: September 28, 2021Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Raminda Madurawe, Richard Mauritzson
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Patent number: 11134166Abstract: A document management facility may process volumes of physical documents for digital imaging. The document management facility may utilize robotic apparatus to perform the various functions for processing the documents, which may include document intake, document storage, document digitization, and/or document removal. Digital versions of the documents may be accessed with a document management system.Type: GrantFiled: January 18, 2019Date of Patent: September 28, 2021Assignee: Ripcord Inc.Inventors: Alex Fielding, Kevin C. Hall, Kirk H. Knight, Kimberly Lembo
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Patent number: 11131758Abstract: The disclosure relates to a demodulator including a pinned photodiode; at least one storage node; at least one transfer gate connected between the storage node and the pinned photodiode. The pinned photodiode includes a p-doped epitaxial semiconductor layer; a n-doped semiconductor region formed within the epitaxial semiconductor layer; a p+ pinning layer formed on top of said semiconductor region. The pinning layer is split into at least two separate regions spaced apart by electrical insulating element, each region being arranged for being biased independently by a respective biasing signal for creating a gradient of potential within the semiconductor region.Type: GrantFiled: August 11, 2017Date of Patent: September 28, 2021Assignee: Sony Depthsensing Solutions SA/NVInventor: Ward Van Der Tempel
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Patent number: 11133343Abstract: An imaging device comprises a first chip that includes a first semiconductor substrate including a photoelectric conversion region. The first chip includes a first insulating layer including a first multilayer wiring electrically connected to the photoelectric conversion region. The first multilayer wiring includes a first vertical signal line (VSL1) to output a first pixel signal, and a first wiring. The imaging device includes a second chip including a second semiconductor substrate including a logic circuit. The second chip includes a second insulating layer including a second multilayer wiring electrically connected to the logic circuit. The second multilayer wiring includes a second wiring. The first chip and the second chip are bonded to one another, and, in a plan view, the first wiring and the second wiring overlap with at least a portion of the first vertical signal line (VSL1).Type: GrantFiled: May 2, 2018Date of Patent: September 28, 2021Assignee: Sony Semiconductor Solutions CorporationInventors: Hajime Yamagishi, Shota Hida, Yuusaku Kobayashi
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Patent number: 11133345Abstract: An active matrix substrate includes a first electrode, a photoelectric conversion element, and a second electrode on a substrate. The first electrode, the photoelectric conversion element, and the second electrode are covered with a first inorganic insulating film including a first opening on the second electrode. The first organic insulating film including a second opening is provided on the first inorganic insulating film, and a surface of the first organic insulating film inside the second opening is covered with a second inorganic insulating film including a third opening overlapping the first opening in a plan view. A conductive film in contact with the second electrode in the first opening is provided on the second inorganic insulating film.Type: GrantFiled: November 12, 2019Date of Patent: September 28, 2021Assignee: SHARP KABUSHIKI KAISHAInventor: Katsunori Misaki
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Patent number: 11132091Abstract: A touch driving circuit includes: a first sensing driver including a first sensing capacitor connected to a first touch electrode; a second sensing driver including a second sensing capacitor connected to a second touch electrode; and a touch sensing unit connected to the first and second sensing drivers to sense a voltage charged in each of the first and second sensing capacitors. A charging time point of the first sensing capacitor is different from a charging time point of the second sensing capacitor, and a discharging time point of the first sensing capacitor is different from a discharging time point of the second sensing capacitor.Type: GrantFiled: March 23, 2020Date of Patent: September 28, 2021Assignee: Samsung Display Co., Ltd.Inventor: Jeon Kyoo Kim
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Patent number: 11131882Abstract: A light source control assembly, a display device and a method for manufacturing a light source control assembly are provided in embodiments of the disclosure. The light source control assembly, comprises: a photoelectric converter; at least one light-emitting unit; and a light controlling structure arranged opposite to and spaced apart from the at least one light-emitting unit, and configured to pass therethrough a portion of and to block another portion of light, which light is emitted by various light-emitting units of the at least one light-emitting unit, and to generate a plurality of controlled light beams separated from one another with the portion of light passing therethrough; the another portion of light blocked by the light controlling structure from the various light-emitting units is received by the photoelectric converter.Type: GrantFiled: August 25, 2017Date of Patent: September 28, 2021Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Can Zhang, Xiaochuan Chen
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Patent number: 11134207Abstract: An electronic device includes a reset circuit and a first image sensing circuit. The reset circuit has a first node used to receive a reset signal, and a second node. The first image sensing circuit is coupled to the reset circuit and includes a photodiode, a first transistor and a second transistor. The photodiode has a first terminal coupled to the second node, and a second terminal. The first transistor has a control terminal coupled to the second terminal of the photodiode via a third node, a first terminal and a second terminal. The second transistor has a control terminal configured to receive a row selection signal and a first terminal coupled to the second terminal of the first transistor.Type: GrantFiled: March 5, 2020Date of Patent: September 28, 2021Assignee: InnoLux CorporationInventors: Hui-Ching Yang, Tao-Sheng Chang, Te-Yu Lee