Abstract: A semiconductor device includes: a sidewall insulating film; a gate electrode; source and drain regions; a first stress film; and a second stress film.

Abstract: The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate, a stacked gate structure positioned on the substrate; first spacers attached on two sides of the stacked gate structure; and second spacers attached on two sides of the first spacers; wherein the first spacers comprise graphene.

Abstract: An SGT is formed that includes Si pillars. The SGT includes WSi2 layers serving as wiring alloy layers and constituted by first alloy regions that are connected to the entire peripheries of impurity regions serving as sources or drains located in lower portions of the Si pillars, are formed in a self-aligned manner with the impurity regions in a tubular shape, and contain the same impurity atom as the impurity regions and a second alloy region that is partly connected to the peripheries of the first alloy regions and contains the same impurity atom as the impurity regions.

Abstract: A surround gate MOS transistor (SGT) includes a silicon pillar and tungsten silicide or cobalt silicide wiring alloy layers constituted by first alloy regions connected to the entire peripheries of impurity regions serving as sources or drains in lower portions of the silicon pillar. The first alloy regions are formed in a self-aligned manner with the impurity regions in a tubular shape, and contain the same impurity atoms as the impurity regions. A second alloy region is partly connected to the peripheries of the first alloy regions and contains the same impurity atoms as the impurity regions.

Abstract: A radiofrequency switch device includes an insulation layer, a semiconductor layer, a gate structure, a first doped region, a second doped region, an epitaxial layer, a first silicide layer, and a second silicide layer. The semiconductor layer is disposed on the insulation layer. The gate structure is disposed on the semiconductor layer. The first doped region and the second doped region are disposed in the semiconductor layer at two opposite sides of the gate structure respectively. The epitaxial layer is disposed on the first doped region. The first silicide layer is disposed on the epitaxial layer. The second silicide layer is disposed in the second doped region.

Abstract: An array of memory cells includes buried access lines having conductively doped semiconductor material. Pillars extend elevationally outward of and are spaced along the buried access lines. The pillars individually include a memory cell. Outer access lines are elevationally outward of the pillars and the buried access lines. The outer access lines are of higher electrical conductivity than the buried access lines. A plurality of conductive vias is spaced along and electrically couple pairs of individual of the buried and outer access lines. A plurality of the pillars is between immediately adjacent of the vias along the pairs. Electrically conductive metal material is directly against tops of the buried access lines and extends between the pillars along the individual buried access lines. Other embodiments, including method, are disclosed.

Abstract: A vertical Metal-Oxide-Semiconductor (MOS) transistor includes a substrate and a nano-wire over the substrate. The nano-wire comprises a semiconductor material. An oxide ring extends from an outer sidewall of the nano-wire into the nano-wire, with a center portion of the nano-wire encircled by the oxide ring. The vertical MOS transistor further includes a gate dielectric encircling a portion of the nano-wire, a gate electrode encircling the gate dielectric, a first source/drain region underlying the gate electrode, and a second source/drain region overlying the gate electrode. The second source/drain region extends into the center portion of the nano-wire. Localized oxidation produces a local swelling in the structure that generates a tensile or compressive strain in the nano-wire.

Abstract: An SGT production method includes a first step of forming a fin-shaped semiconductor layer on a semiconductor substrate and forming a first insulating film; a second step of forming a pillar-shaped semiconductor layer, a first dummy gate, and a first hard mask formed from a third insulating film; a third step of forming a second hard mask on a side wall of the first hard mask, and forming a second dummy gate; a fourth step of forming a sidewall and forming a second diffusion layer; a fifth step of depositing an interlayer insulating film, exposing upper portions of the second dummy gate and the first dummy gate, removing the second dummy gate and the first dummy gate, forming a first gate insulating film, and forming a gate electrode and a gate line; and a sixth step of forming a first contact and a second contact.

Abstract: A semiconductor device includes a first gate electrode provided in a jumper region of a substrate and extending in a first direction, first source/drain regions provided at both sides of the first gate electrode, and a connecting contact electrically connecting the first gate electrode and the first source/drain regions to each other. The connecting contact includes first sub-contacts disposed at both sides of the first gate electrode and connected to the first source/drain regions, and a second sub-contact extending in a second direction intersecting the first direction. The second sub-contact is connected to the first sub-contacts and is in contact with a top surface of the first gate electrode. In the first direction, each of the first sub-contacts has a first width and the second sub-contact has a second width smaller than the first width.

Abstract: One illustrative method disclosed includes, among other things, forming a vertically oriented semiconductor structure above a doped well region defined in a semiconductor substrate, the semiconductor structure comprising a lower source/drain region and an upper source/drain region, wherein the lower source/drain region physically contacts the upper surface of the substrate, forming a counter-doped isolation region in the substrate, forming a metal silicide region in the substrate above the counter-doped isolation region, wherein the metal silicide region is in physical contact with the lower source/drain region, and forming a lower source/drain contact structure that is conductively coupled to the metal silicide region.

Abstract: A memory device comprising a doped conductive polycrystalline layer having an electrically resistive portion, is described herein. By way of example, ion implantation to a subset of the conductive polycrystalline layer can degrade and modify the polycrystalline layer, forming the electrically resistive portion. The electrically resistive portion can include resistive switching properties facilitating digital information storage. Parametric control of the ion implantation can facilitate control over corresponding resistive switching properties of the resistive portion. For example, a projected range or depth of the ion implantation can be controlled, allowing for preferential placement of atoms in the resistive portion, and fine-tuning of a forming voltage of the memory device. As another example, dose and number of atoms implanted, type of atoms or ions that are implanted, the conductive polycrystalline material used, and so forth, can facilitate control over switching characteristics of the memory device.

Abstract: An object is to provide a semiconductor device having improved reliability by preventing, in forming a nonvolatile memory and MOSFETS on the same substrate, an increase in the size of grains in a gate electrode. The object can be achieved by forming the control gate electrode of the nonvolatile memory and the gate electrodes of the other MOSFETs from films of the same layer, respectively, and configuring each of the control gate electrode and the gate electrodes from a stack of two polysilicon film layers.

Abstract: An integrated circuit structure includes a gate stack over a substrate. The integrated circuit structure also includes a gate spacer over a sidewall of the gate stack. The integrated circuit structure further includes a contact etch stop layer (CESL) having a bottom portion over the substrate and a sidewall portion over a sidewall of the gate spacer. The sidewall portion has a first thickness less than a second thickness of the bottom portion.

Abstract: Embodiments of mechanisms for forming an image sensor device are provided. The image sensor device includes a semiconductor substrate and an isolation structure in the semiconductor substrate. The image sensor device also includes an active region in the semiconductor substrate and surrounded by the isolation structure. The active region includes a light sensing region and a doped region, and the doped region has a horizontal length and a vertical length. A ratio of the horizontal length to the vertical length is in a range from about 1 to about 4.

Abstract: The present disclosure provides a method of forming a semiconductor device structure with selectively fabricating semiconductor device structures having fully silicided (FuSi) gates and partially silicided gates. In aspects of the present disclosure, a semiconductor device structure with a first semiconductor device and a second semiconductor device is provided, wherein each of the first and second semiconductor devices includes a gate structure over an active region, each of the gate structures having a gate electrode material and a gate dielectric material. The gate electrode material of the first semiconductor device is recessed, resulting in a recessed first gate electrode material which is fully silicided during a subsequent silicidation process. On the gate electrode material of the second semiconductor device, a silicide portion is formed during the silicidation process.

Abstract: An apparatus including a resistor capacitor network that includes an integrated high resistance resistor on top of a MOS capacitor. The resistor capacitor network includes a metal oxide semiconductor capacitor portion that includes a high-k gate oxide layer. The value of k is in a range of 4.0 to 100.0. The resistor capacitor network further includes a high resistance polysilicon gate layer formed over the high-k gate oxide layer. The resistance of the polysilicon gate layer is in a range of 100 to 2000 ohms per square.

Abstract: One method disclosed herein includes, among other things, forming sidewall spacers adjacent opposite sides of a sacrificial gate electrode of a sacrificial gate structure, forming a tensile-stressed layer of insulating material adjacent the sidewall spacers, removing the sacrificial gate structure to define a replacement gate cavity positioned between the sidewall spacers, forming a replacement gate structure in the replacement gate cavity, forming a tensile-stressed gate cap layer above the replacement gate structure and within the replacement gate cavity and, after forming the tensile-stressed gate cap layer, removing the tensile-stressed layer of insulating material.

Abstract: In one embodiment, a semiconductor device includes a semiconductor substrate, and a gate insulator arranged on the semiconductor substrate. The device further includes a gate electrode including a semiconductor layer and a metal layer which are sequentially arranged on the gate insulator. The device further includes a contact plug arranged on the gate electrode to penetrate the metal layer, and having a bottom surface at a level lower than an upper surface of the semiconductor layer.

Abstract: Semiconductor devices are provided. A semiconductor device may include a transistor area and a resistor area. The transistor area may include a gate structure. The resistor area may include an insulating layer and a resistor structure on the insulating layer. A top surface of the gate structure and a top surface of the resistor structure may be substantially coplanar.

Abstract: A semiconductor device comprises a semiconductor substrate; a channel layer of at least a first III-V semiconductor compound above the semiconductor substrate; a gate stack structure above a first portion of the channel layer; a source region and a drain region comprising at least a second III-V semiconductor compound above a second portion of the channel layer; and a first metal contact structure above the S/D regions comprising a first metallic contact layer contacting the S/D regions. The first metallic contact layer comprises at least one metal-III-V semiconductor compound.

Abstract: A semiconductor device includes a fin-shaped silicon layer on a semiconductor substrate and extending in a first direction and a first insulating film around the fin-shaped semiconductor layer. A pillar-shaped silicon layer resides on the fin-shaped silicon layer. A width of the pillar-shaped semiconductor layer, perpendicular to the first direction is equal to a width of the fin-shaped semiconductor layer perpendicular to the first direction. A gate insulating film is around the pillar-shaped semiconductor layer and a metal gate electrode is around the gate insulating film. A metal gate line extends in a second direction perpendicular to the first direction of the fin-shaped semiconductor layer and is connected to the metal gate electrode. A metal gate pad is connected to the metal gate line, where the width of the metal gate electrode and the width of the metal gate pad are larger than the width of the metal gate line.

Abstract: Provided are a semiconductor device and a method of fabricating the same. According to the semiconductor device, a silicide layer is formed on at least a part of both sidewalls of a gate pattern on a device isolation layer, thereby reducing resistance of the gate pattern. This makes an operation speed of the device rapid. According to the method of the semiconductor device, a sidewall spacer pattern is formed on at least a part of both sidewalls of the gate pattern in following salicide process by entirely or partially removing remaining portions of the sidewall spacer except for portions which are used as an ion implantation mask to form source/drain regions. This can reduce resistance of the gate pattern, thereby fabricating a semiconductor device with a rapid operation speed.

Abstract: Semiconductor devices are provided which have a tensile and/or compressive strain applied thereto and methods of manufacturing. The structure includes a gate stack comprising an oxide layer, a polysilicon layer and sidewalls with adjacent spacers. The structure further includes an epitaxially grown straining material directly on the polysilicon layer and between portions of the sidewalls. The epitaxially grown straining material, in a relaxed state, strains the polysilicon layer.

Abstract: In one embodiment, first and second pattern structures respectively include first and second conductive line patterns and first and second hard masks sequentially stacked, and at least portions thereof extends in a first direction. The insulation layer patterns contact end portions of the first and second pattern structures. The first pattern structure and a first insulation layer pattern of the insulation layer patterns form a first closed curve shape in plan view, and the second pattern structure and a second insulation layer pattern of the insulation layer patterns form a second closed curve shape in plan view. The insulating interlayer covers upper portions of the first and second pattern structures and the insulation layer patterns, a first air gap between the first and second pattern structures, and a second air gap between the insulation layer patterns.

Abstract: The metal gate structure of the present invention can include a TiN complex, and the N/Ti proportion of the TiN complex is decreased from bottom to top. In one embodiment, the TiN complex can include a single TiN layer, which has an N/Ti proportion gradually decreasing from bottom to top. In another embodiment, the TiN complex can include a plurality of TiN layers stacking together. In such a case, the lowest TiN layer has a higher N/Ti proportion than the adjusted TiN layer.

Abstract: A structure and method to fabricate a body contact on a transistor is disclosed. The method comprises forming a semiconductor structure with a transistor on a handle wafer. The structure is then inverted, and the handle wafer is removed. A silicided body contact is then formed on the transistor in the inverted position. The body contact may be connected to neighboring vias to connect the body contact to other structures or levels to form an integrated circuit.

Abstract: A method for producing a semiconductor device includes a first step including forming a planar silicon layer and forming first and second pillar-shaped silicon layers; a second step including forming a gate insulating film around each of the first and second pillar-shaped silicon layers, forming a metal film and a polysilicon film around the gate insulating film, the thickness of the polysilicon film being smaller than half of a distance between the first and second pillar-shaped silicon layers, forming a third resist, and forming a gate line; and a third step including depositing a fourth resist so that a portion of the polysilicon film on an upper side wall of each of the first and second pillar-shaped silicon layers is exposed, removing the exposed portion of the polysilicon film, removing the fourth resist, and removing the metal film to form first and second gate electrodes.

Abstract: A method for forming gate, source, and drain contacts on a MOS transistor having an insulated gate including polysilicon covered with a metal gate silicide, this gate being surrounded with at least one spacer made of a first insulating material, the method including the steps of a) covering the structure with a second insulating material and leveling the second insulating material to reach the gate silicide; b) oxidizing the gate so that the gate silicide buries and covers the a silicon oxide; c) selectively removing the second insulating material; and d) covering the structure with a first conductive material and leveling the first conductive material all the way to a lower level at the top of the spacer.

Abstract: An integrated circuit structure has a substrate comprising a well region and a surface region, an isolation region within the well region, a gate insulating layer overlying the surface region, first and second source/drain regions within the well region of the substrate. The structure also has a channel region formed between the first and second source/drain regions and within a vicinity of the gate insulating layer, and a gate layer overlying the gate insulating layer and coupled to the channel region. The structure has sidewall spacers on edges of the gate layer to isolate the gate layer, a local interconnect layer overlying the surface region of the substrate and having an edge region extending within a vicinity of the first source/drain region. A contact layer on the first source/drain region in contact with the edge region and has a portion abutting a portion of the sidewall spacers.

Abstract: A method of manufacturing a microelectronic device including forming a dielectric layer surrounding a dummy feature located over a substrate, removing the dummy feature to form an opening in the dielectric layer, and forming a metal-silicide layer conforming to the opening. The metal-silicide layer may then be annealed.

Abstract: An apparatus is disclosed for a memory cell having a floating body. A memory cell may include a transistor over an insulation layer, the transistor including a source, and a drain. The memory cell may also include a floating body including a first region positioned between the source and the drain, a second region positioned remote from each of the source and drain, and a passage extending through the insulation layer and coupling the first region to the second region. Additionally, the memory cell may include a bias gate at least partially surrounding the second region and configured for operably coupling to a bias voltage. Furthermore, the memory cell may include a plurality of dielectric layers, wherein each outer vertical surface of the second region has a dielectric layer of the plurality adjacent thereto.

Abstract: In one exemplary embodiment of the invention, a method (e.g., to fabricate a semiconductor device having a borderless contact) including: forming a first gate structure on a substrate; depositing an interlevel dielectric over the first gate structure; planarizing the interlevel dielectric to expose a top surface of the first gate structure; removing at least a portion of the first gate structure; forming a second gate structure in place of the first gate structure; forming a contact area for the borderless contact by removing a portion of the interlevel dielectric; and forming the borderless contact by filling the contact area with a metal-containing material.

Abstract: A method for fabricating a transistor gate with a conductive element that includes cobalt silicide includes use of a sacrificial material as a place-holder between sidewall spacers of the transistor gate until after high temperature processes, such as the fabrication of raised source and drain regions, have been completed. In addition, semiconductor devices (e.g., DRAM devices and NAND flash memory devices) with transistor gates that include cobalt silicide in their conductive elements are also disclosed, as are transistors with raised source and drain regions and cobalt silicide in the transistor gates thereof. Intermediate semiconductor device structures that include transistor gates with sacrificial material or a gap between upper portions of sidewall spacers are also disclosed.

Abstract: Since a first and a second source-follower PMOS transistor in a pixel have gates connected to a first and a second capacitor and are used always in on state, respectively, only respective threshold voltages in the first and second source-follower PMOS transistors are set to be +0.5 V and put in normally-on state. A current value in each of the first and second source-follower PMOS transistors is controlled by a constant current load transistor, and on/off thereof is controlled by the constant current load transistor and each of first and second switching NMOS transistors. Further, each of the first and second switching NMOS transistors intermediates to limit an outputtable voltage range and thereby optimization is performed so as to maximize a range where linearity is secured by shifting the respective threshold voltages of the first and second source-follower PMOS transistors.

Abstract: An electrostatic discharge (ESD) protection structure comprising a polysilicon gate on an insulating layer on a substrate, said gate having first and second sides, a first heavily doped P-region in the substrate on the first side of the gate, a first heavily doped N-region in the substrate on the second side of the gate, and a shallow trench isolation isolating said first P-region and said first N-region from other structures in the substrate. In a first embodiment, the heavily doped regions are formed in a well having opposite conductivity to that of the substrate and a diode is formed at a PN junction between one of the heavily doped regions and the well. To minimize capacitance between the well and the substrate, the substrate is doped at a level of native doping and the well is isolated so that no other wells or heavily-doped regions are nearby in the substrate. Doping levels in the well and the dimensions of the gate are controlled to minimize on resistance (Ron) of the diode.

Abstract: Semiconductor devices are formed without zipper defects or channeling and through-implantation and with different silicide thicknesses in the gates and source/drain regions, Embodiments include forming a gate on a substrate, forming a nitride cap on the gate, forming a source/drain region in the substrate on each side of the gate, forming a wet cap fill layer on the source/drain region on each side of the gate, removing the nitride cap from the gate, and forming an amorphized layer in a top portion of the gate. Embodiments include forming the amorphized layer by implanting low energy ions.

Abstract: A semiconductor device includes a gate electrode formed over a semiconductor substrate, and a sidewall spacer formed on a sidewall of the gate electrode. The sidewall spacer formed along the sidewall parallel to a gate length direction of the gate electrode has a first thickness, and the sidewall spacer formed along the sidewall parallel to a gate width direction of the gate electrode has a second thickness that is greater than the first thickness.

Abstract: A method for producing a semiconductor device includes a step of forming a first insulating film around a fin-shaped silicon layer and forming a pillar-shaped silicon layer in an upper portion of the fin-shaped silicon layer; a step of implanting an impurity into upper portions of the pillar-shaped silicon layer and fin-shaped silicon layer and a lower portion of the pillar-shaped silicon layer to form diffusion layers; and a step of forming a polysilicon gate electrode, a polysilicon gate line, and a polysilicon gate pad. The polysilicon gate electrode and the polysilicon gate pad have a larger width than the polysilicon gate line. After these steps follow a step of depositing an interlayer insulating film, exposing and etching the polysilicon gate electrode and the polysilicon gate line, and depositing a metal layer to form a metal gate electrode and a metal gate line, and a step of forming a contact.

Abstract: A method of manufacturing a metal silicide is disclosed below. A substrate having a first region and a second region is proviced. A silicon layer is formed on the substrate. A planarization process is performed to make the silicon layer having a planar surface. A part of the silicon layer is removed to form a plurality of first gates on the first region and to form a plurality of second gates on the second region. The height of the first gates is greater than the height of the second gates, and top surfaces of the first gates and the second gates have the same height level. A dielectric layer covering the first gates and the second gates is formed and exposes the top surfaces of the first gates and the second gates. A metal silicide is formed on the top surfaces of the first gates and the second gates.

Abstract: The invention describes a semiconductor cell including a gate, a dielectric layer, a channel layer, a source region, a drain region and an oxide region. The dielectric layer is adjacent to the gate. The channel layer is adjacent to the dielectric layer and is formed above a source region, a drain region, and an oxide region.

Abstract: A manufacturing method for semiconductor device having metal gate includes providing a substrate having a first semiconductor device and a second semiconductor device formed thereon, the first semiconductor device having a first gate trench and the second semiconductor device having a second gate trench; sequentially forming a high dielectric constant (high-k) gate dielectric layer and a multiple metal layer on the substrate; forming a first work function metal layer in the first gate trench; performing a first pull back step to remove a portion of the first work function metal layer from the first gate trench; forming a second work function metal layer in the first gate trench and the second gate trench; and performing a second pull back step to remove a portion of the second work function metal layer from the first gate trench and the second gate trench.

Abstract: An integrated circuit structure has a substrate comprising a well region and a surface region, an isolation region within the well region, a gate insulating layer overlying the surface region, first and second source/drain regions within the well region of the substrate. The structure also has a channel region formed between the first and second source/drain regions and within a vicinity of the gate insulating layer, and a gate layer overlying the gate insulating layer and coupled to the channel region. The structure has sidewall spacers on edges of the gate layer to isolate the gate layer, a local interconnect layer overlying the surface region of the substrate and having an edge region extending within a vicinity of the first source/drain region. A contact layer on the first source/drain region in contact with the edge region and has a portion abutting a portion of the sidewall spacers.

Abstract: A method for fabricating a transistor gate with a conductive element that includes cobalt silicide includes use of a sacrificial material as a place-holder between sidewall spacers of the transistor gate until after high temperature processes, such as the fabrication of raised source and drain regions, have been completed. In addition, semiconductor devices (e.g., DRAM devices and NAND flash memory devices) with transistor gates that include cobalt silicide in their conductive elements are also disclosed, as are transistors with raised source and drain regions and cobalt silicide in the transistor gates thereof. Intermediate semiconductor device structures that include transistor gates with sacrificial material or a gap between upper portions of sidewall spacers are also disclosed.

Abstract: A device includes a metal-oxide-semiconductor (MOS) device, which includes a gate electrode and a source/drain region adjacent the gate electrode. A first and a second contact plug are formed directly over and electrically connected to two portions of a same MOS component, wherein the same MOS component is one of the gate electrode and the source/drain region. The same MOS component is configured to be used as a resistor that is connected between the first and the second contact plugs.

Abstract: A structure and a process for a microelectromechanical system (MEMS)-based sensor are provided. The structure for a MEMS-based sensor includes a substrate chip. A first insulating layer covers a top surface of the substrate chip. A device layer is disposed on a top surface of the first insulating layer. The device layer includes a periphery region and a sensor component region. The periphery region and a sensor component region have an air trench therebetween. The component region includes an anchor component and a moveable component. A second insulating layer is disposed on a top surface of the device layer, bridging the periphery region and a portion of the anchor component. A conductive pattern is disposed on the second insulating layer, electrically connecting to the anchor component.

Abstract: Structures and methods of forming self aligned silicided contacts are disclosed. The structure includes a gate electrode disposed over an active area, a liner disposed over the gate electrode and at least a portion of the active area, an insulating layer disposed over the liner. A first contact plug is disposed in the insulating layer and the liner, the first contact plug disposed above and in contact with a portion of the active area, the first contact plug including a first conductive material. A second contact plug is disposed in the insulating layer and the liner, the second contact plug disposed above and in contact with a portion of the gate electrode, the second contact plug includes the first conductive material. A contact material layer is disposed in the active region, the contact material layer disposed under the first contact plug and includes the first conductive material.

Abstract: A semiconductor component includes a semiconductor body, in which are formed: a substrate of a first conduction type, a buried semiconductor layer of a second conduction type arranged on the substrate, and a functional unit semiconductor layer of a third conduction type arranged on the buried semiconductor layer, in which at least two semiconductor functional units arranged laterally alongside one another are provided. The buried semiconductor layer is part of at least one semiconductor functional unit, the semiconductor functional units being electrically insulated from one another by an isolation structure which permeates the functional unit semiconductor layer, the buried semiconductor layer, and the substrate. The isolation structure includes at least one trench and an electrically conductive contact to the substrate, the contact to the substrate being electrically insulated from the functional unit semiconductor layer and the buried layer by the at least one trench.

Abstract: A method for producing a semiconductor device includes a first step including forming a planar silicon layer and forming first and second pillar-shaped silicon layers; a second step including forming a gate insulating film around each of the first and second pillar-shaped silicon layers, forming a metal film and a polysilicon film around the gate insulating film, the thickness of the polysilicon film being smaller than half of a distance between the first and second pillar-shaped silicon layers, forming a third resist, and forming a gate line; and a third step including depositing a fourth resist so that a portion of the polysilicon film on an upper side wall of each of the first and second pillar-shaped silicon layers is exposed, removing the exposed portion of the polysilicon film, removing the fourth resist, and removing the metal film to form first and second gate electrodes.

Abstract: A method for fabricating a semiconductor integrated circuit and resulting structure. The method includes providing a semiconductor substrate with an overlying dielectric layer and forming a polysilicon gate layer and an overlying capping layer. The gate layer is overlying the dielectric layer. The method also includes patterning the polysilicon gate layer to form a gate structure and a local interconnect structure. The gate structure and the local interconnect structure include a contact region defined therebetween. The gate structure also includes the overlying capping layer. The method includes forming sidewall spacers on the gate structure and the local interconnect structure and removing the sidewall spacer on the local interconnect structure. The method also includes forming contact polysilicon on the contact region and implanting a dopant impurity into the contact polysilicon.

Abstract: A field effect transistor (FET) with an adjacent body contact, a SOI IC with circuits including the FETs and a method of fabricating the ICs. Device islands are formed in the silicon surface layer of a SOI wafer. Gates are defined on the wafer. Body contacts are formed in a perimeter conductive region adjacent to the gates. The body contacts may be either a silicide strap along the gate sidewall at one side of the FET or a separate contact separated from the gate by a dielectric stripe at one side of the FET. Separate contacts may be connected to a bias supply.