Abstract: A clip (10) includes a body (12) and a fastener (14). The body has a leg (26) depending at an end thereof for engaging with a retention module (50), and a central pressing tab (24) for being received in a groove (76) defined in a heat sink (70). The body further has a joint portion (28) at another end thereof. Cutouts (33) are defined in the joint portion to form a pair of deformable protrusions (35) and a U-shaped head (36). A rib (38) is formed on the body for reinforcing the clip. The fastener has a retaining portion (42). The retaining portion includes a slot (44) for receiving the head, and an aperture (46) for engaging with an ear (64) formed on the retention module. The protrusions are deformed to secure the fastener to the body.

Abstract: A transistor which has a stable characteristic and which can prevent tilted ions from penetrating through a grain boundary to a channel region when ions are implanted at an angle so as to form impurity layers while a gate electrode is used as a mask. A gate electrode comprises a two-layer structure of a lower film and an upper film formed on a gate insulation film on the surface of a semiconductor substrate. The thickness of the lower film is made greater than the range of ions in the thicknesswise direction in the film when the ions are implanted to the sidewalls of the lower film.

Abstract: An improved multichip semiconductor module compatible with existing SIMM memory sockets comprising a molded module frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly or subassembly(s) comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the subassembly(s) includes a composite substrate which comprises a thin metal cover plate and thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components.

Abstract: A heat sink apparatus for drawing heat from one or more devices and a method of attaching such a heat sink to one or more devices is provided. The heat sink includes a mounting surface, which draws heat into the heat sink where it is dissipated by fins. The heat sink can be mounted next to the device to be cooled with minimum insertion force since the weight of the heat sink is borne by the printed circuit board upon which the electronic device is installed. A rotatable cam is turned by the user, which engages a pivot arm. The pivot arm rotates a number of spring clips against the device thereby holding it in place. Once in a fully closed position, the cam locks into place to prevent the pivot arm and spring clips from rotating back to an open position. The spring clips affix the heat sink and maintains contact between the mounting surface and the device being cooled.

Abstract: An electronic component assembly includes an electronic component mounted on a socket, a heatsink seated on top of the electronic component for removing at least some of the heat produced by the electronic component during use and a pair of clips for retaining the heatsink in place on top of the electrical component. The heatsink includes a plurality of spaced apart parallel fins. Each clip serves to hold down one end of the heatsink onto the electrical component and comprises an elongated, generally C-shaped member having a base which includes a pair of tabs having holes and a pair of arms, one on each side of the base. Each arm has a hook at its outer end which extends over a fin at one end of the heatsink while the holes on the tabs lockingly engage fingers on one side of the socket.

Abstract: A semiconductor component (31) and a method for coupling a semiconductor device (36) to a substrate (81). The semiconductor component (31) includes a saddle (34) and the semiconductor device (36). The saddle (34) has a plurality of sides (51, 52, 53, 54, 55) that form a semiconductor device receiving area (58). The semiconductor device (36) is inserted into the semiconductor device receiving area (58) and secured in the semiconductor device receiving area (58) using tabs (66, 67). The saddle (34) is coupled to the substrate (81) by fasteners (82,83).

Abstract: It is intended to provide a heat sink unit and an electronic apparatus capable of efficiently cooling a plurality of semiconductor devices and taking action for unnecessary electromagnetic waves. There are provided a plurality of fan units and electromagnetic shielding means for cutting off electromagnetic waves on a heat sink substrate. It is also provided a heat sink substrate, a unit having a fan for supplying fluid to the heat sink substrate and driving means for rotating the fan, and electromagnetic shielding means provided for the heat sink substrate.

Abstract: The present invention is drawn to a system and a method for attaching and tightening a mechanism onto an IC package such that a load-balanced thermal contact is formed securely between the mechanism and the IC package without risking damages to the IC package. The mechanism is then used to support a heat sink that utilizes the thermal contact formed for dissipating heat away from the IC package. Specifically, the mechanism is modified in stages. During the tightening stage, the mechanism is modified from a first configuration into a second configuration in order to trigger the process of tightening the mechanism securely onto the IC package. More specifically, in its first configuration during the attaching stage, the mechanism includes a spring compressed within a first spacing formed by a bearing plate and a compression screw.

Abstract: An apparatus is disclosed for attaching a thermal solution to a mini-cartridge. The apparatus comprises: a bracket adapted to be snapped into position around the mini-cartridge; two or more threads formed in the bracket, the threads positioned such that when the bracket is snapped into position around the mini-cartridge the threads are located on the side of the mini-cartridge opposite from the side adjacent to the thermal solution; and screws adapted to run through holes in the mini-cartridge to engage with the threads and to fixedly attach the thermal solution to the mini-cartridge.

Abstract: A cooling system for dissipating heat from a heat source is disclosed. The cooling system comprises a heat sink associated with a divider member. The heat sink includes a heat conductive base portion having a surface adapted to contact the heat source. The base portion has a peripheral wall member extending from the heat conductive base portion wherein the peripheral wall member defines a chamber therewithin and a heat sink device exterior located on the opposite side of the peripheral wall member from the chamber. A plurality of openings extend through the peripheral wall member between the heat sink device exterior and the chamber. An intake airflow path extends from the heat sink device exterior through a first portion of the plurality of openings to the chamber. An exhaust airflow path extends from the chamber through a second portion of the plurality of openings to the heat sink device exterior.

Abstract: Leads 106 provided at an electronic part connectors 110 of an electronic part 100, which are electrically connected to a surface of a substrate 120 are structured in such a manner that they are directly connected to a substrate connector formed at the surface of the substrate 120 through a pressing force or a bonding force applied to the electronic part 100. This lead structure makes it possible to preclude the use of connectors including additional members such as contact pins, to achieve a reduction in the length of the communicating path of the electrical signals, and in addition, since electrical connection is achieved at one location, i.e., between the leads 106 and the substrate connector at the substrate 120, the contact resistance is minimized.

Abstract: A method and apparatus are provided for mounting a Very Large Scale Integration (VLSI) chip such as a microprocessor on the back plane of a computer chassis. In one embodiment, the mounting on the computer chassis is configured to provide a current supply connection for delivering a high level of current to the microprocessor from a current source through the computer chassis. Also provided are a method and apparatus for mounting a VLSI chip such as a microprocessor on the chassis of a computer system in order to dissipate heat from the VLSI chip to the ambient outside the computer system through the computer chassis. Also provided are a method and apparatus for signal interconnections among one or several VLSI chips such as microprocessors mounted on the chassis of a computer to provide signal capacity with strong integrity. Also provided are a method and apparatus for mounting a power supply for a VLSI chip package on the back chassis of a computer.

Abstract: A heat sink assembly includes a heat sink having torque bars, the torque bars including lips and guides extending from the lips. A package is located between the heat sink and a circuit board. A heat sink retainer includes riser arms and ends connected to the riser arms, where the ends press against the lips. The riser arms press the guides towards the package and press apertures of the heat sink away from the package. In this manner, the retainer imparts torque on the heat sink which causes the heat sink to impart a downward force on the package. This downward force creates the thermal contact between the heat sink and the package.

Abstract: A leadless IC or other electronic circuit package socket is provided which is of simple construction providing low profile mounting of an IC package on a circuit board. The socket comprises a relative thin socket carrier having a plurality of resilient conductive columns extending between the top and bottom surfaces of the carrier and having alignment elements which are cooperative with elements on a circuit board on which the carrier is mounted to position the carrier on the circuit board such that the conductive columns are in registration and electrical contact with corresponding ones of contacts on the circuit board. An IC package or other circuit package has contacts on the bottom surface thereof in a pattern corresponding to the pattern of the resilient conductive columns of the socket carrier, and also has alignment elements cooperative with elements on the socket carrier to provide alignment of the package contacts and the conductive columns when the package is mounted on the socket carrier.

Abstract: An molded heat sink assembly includes an integrally molded attachment clip for securing the assembly to a semiconductor package to be cooled. The assembly removes heat from a semiconductor device package having opposing side wall edges. The heat sink assembly also includes a heat conductive base member having a substantially flat bottom surface adapted to be positioned in flush thermal communication with a heat generating semiconductor device package. A number of heat dissipating elements are connected to and extend upwardly from the thermally conductive base member. A pair of semiconductor package engaging clips downwardly depend from and are integrally connected to opposing sides of the heat conductive base member. The engaging clips are disposed in gripping communication with respective opposing side wall edges of the semiconductor device package.

Abstract: An improved multichip semiconductor module compatible with existing SIMM memory sockets comprising a molded module frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly or subassembly(s) comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the subassembly(s) includes a composite substrate which comprises a thin metal cover plate and thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components.

Abstract: Heat is removed from electronic components located within a closed housing by the use of a heat-conducting metal clip mounted on the housing cover so as to be in pressure contact with the electronic components. The metal clip includes a U-shaped mounting portion firmly clamped to a clip-mounting wall projecting from the cover, and a series of spring arms extending through a slot opening in the cover into pressure contact with individual electronic components. The clamp force of the clip on the mounting wall is designed to act independently of the pressure exerted by each spring arm on an associated electronic component.

Abstract: A pressure assembled power module is provided with first and second die, the first and second die being stacked atop one another and sandwiched between first and second conductive sheets, where the die are separated by a relatively flat central conductive lead. Integral to the central conductive lead are spring elements which bias the die against both the conductive sheets and the central conductive lead. Consequently, electrical and thermal interconnections are achieved between semiconductor devices and between the semiconductor devices and a heat sink or substrate.

Abstract: A pin-less retainer for mounting a press-pack device, which includes circumscribing fins for preventing arc formation between terminal faces thereof, onto the rods of a clamping mechanism used to stack a plurality of such devices and heat sinks together. The retainer is constructed out of a semi-flexible sheet having two mirrored sections, each section having a void therein and at least two extending tabs. The voids are sized such that the retainer may be press-fitted into interstices between the fins, and the tabs are shaped and sized to suspend the press-pack device from the rods and axially align the press-pack device with other elements of the stack. The retainer, being a pin-less mount, facilitates the easy and rapid removal of a press-pack device from a stack without having to completely disassemble it.

Abstract: A heat transfer device for use with a retention assembly is herein disclosed. The retention assembly is mounted over one or more connectors attached to a circuit board. The retention assembly houses one or more processor modules that mount into the connectors. The processor modules include a heat transfer device. The heat transfer device has a pair of rail guides that cover the outer edges of the processor module. The rail guides enable the processor module to slide in and out of the retention assembly thereby enabling the processor module to be securely mounted into the connector.

Abstract: A shield case is formed by bending one sheet of a magnetic metal plate that is generally in a T-character form, which has a top plate, two side plates sandwiching the top plate, and a back plate extending from a rear edge of the top plate and sandwiched between the side plates. A semiconductor optical device is placed between the side plates, and elastically held at its side surfaces by clamp pieces formed in the side plates. By inwardly bending the back plate to a position in parallel to the top plate, the semiconductor optical device at its back and bottom surfaces is shielded. The side surfaces and light-receiving/light-emitting surface of the semiconductor optical device are respectively shielded by the side plates and the top plate.

Abstract: Spring clips with nesting end portions are disclosed for use in securing heat generating electrical devices to a support surface, such as a heat sink. The nesting end portions of the clips depend downwardly below the main body portion to prevent contact with edges of electrical devices of varying height and width. Thickness and temper of the clips provide some flexibility so there is less variability in clamping force applied to the clamped devices by the clip in response to tightening of the attachment means and torquing of the fastening means becomes less critical.

Abstract: The present invention relates to a type of chips radiating structure, there being a radiating plate on the chips on an interface card, and a fixing unit on the radiating plate; wherein said fixing unit has a main unit to be mounted on the radiating plate and a number of pressing arms that extend from the main unit, said pressing arm has a through hole, serving to be inserted by a fastener which penetrates said hole and the fixing hole on the interface card, so that the radiating plate is fastened onto the chips; said fixing unit serves to securely fasten the radiating plate onto the chips, so designed that the radiating plate will quickly dissipate the heat energy generating from the chips, to ensure the normal operation of the chips.

Abstract: The present invention is directed to a semiconductor package and its method of manufacture. Conductors mounted on a flexible polymer tape are used to connect a semiconductor chip to a substrate. The flexible polymer tape can be folded back under the chip to reduce the size necessary for mounting the assembly to almost that of the chip itself. The polymer tape also provides flexibility to reduce stresses on the electrical connections caused by thermal expansion and compression. Additionally, the present invention allows for the stacking of semiconductor chips on top of one another, reducing signal propagation delays between them.

Abstract: A gasket sealed integrated circuit package (10) including a top member (12) clamped to a bottom member (18) with a gasket seal ring (26) sealed therebetween. Seal ring (26) encompasses an active portion (30) of an integrated circuit (22) to seal an active portion (30) from the ambient without inducing warp or stress on the circuit (30). The package further includes a glass lid (16) clamped within the package. The integrated circuit (22) preferably comprises a micromechanical device (30) formed on a ceramic substrate (24), such as a DMD type spatial light modulator, but can comprise of other devices as well. The package can be easily disassembled to change out the glass lid (16) or integrated circuit substrate (24) and allows sealing of the substrate (24) without subjecting the integrated circuit die (30) to elevated temperatures. The present invention is especially suited for elongated integrated circuits (30).

Abstract: The replaceable power module includes a power section positioned between a cover and a frame. The cover is provided with clips to permit the attachment and detachment of the cover to the base as well the attachment and detachment of the power module to a surface mounted integrated circuit. The frame is provided with an opening for receiving the integrated circuit, and electrical contacts for electrically connecting the power module to the leads of an integrated circuit. The power section is electrically coupled to the frame and includes a battery and a crystal oscillator for controlling the integrated circuit.

Abstract: A semiconductor multichip module includes a plurality of semiconductor chips, a static plate having a plurality of insertion holes for receiving the plurality of chips, a shield cap attached onto the lower surface of the static plate for preventing the chips from deviating downward through the insertion holes, an external terminal unit formed over the chips for externally transmitting electrical signals of the chips, and a plurality of clip-type clamp springs clamping the shield cap and the external terminal unit for preventing the chips from externally deviating. The multichip module improves productivity by decreasing production hours and enables effective chips to be easily replaced with normal chips by disassembling and reassembling the clamp springs.

Abstract: Grid array device packages are mounted on a circuit board or other substrate with a socket having a base member, a retaining member and an array of bent contact pins. The ends of the contact pins are displaced by insertion of a device package and then respond with a small spring force to hold the device package in place against ledges on the retaining member. The contact ends of the pins make electrical connection with terminals on the device package. A sufficient portion of each pin is implanted within the base member to prevent stress from passing through the base member. The retaining member leaves a significant portion of the upper surface of the device package exposed so that packages with attached heat sinks may be mounted therein.

Abstract: An electronic semiconductor device package, the package comprising: a substrate having traces; a die attached to the substrate; first level interconnects of the die to the traces of the substrate; and a stiffener attached to the substrate, wherein the stiffener comprises at least one hole. A system for attaching a heat dissipater to an electronic semiconductor device package, the system comprising: a stiffener of the electronic package comprising at least one hole, wherein the stiffener is attachable to the electronic package; a heat dissipater comprising at least one pin, wherein the pin is engagable with the hole.

Abstract: A plurality of connecting leads, each consisting of an internal lead and an external lead, are provided so as to extend inward from a lead frame main body, and are then cut off the lead frame main body. The connecting leads are electrically connected with an aluminum electrode of the semiconductor chip. A plurality of fixing leads, each having a distal end bent toward the semiconductor, are provided so as to extend inward from the lead frame main body and thereafter are cut off the lead frame main body. The semiconductor chip is clamped by the distal ends of the fixing leads. The semiconductor chip, the plural connecting leads and the plural fixing leads are sealed together into a resin package.

Abstract: An electrical cartridge of the present invention includes a spring that pushes an integrated circuit package into a thermal plate. The integrated circuit package and substrate are attached to a substrate such as a printed circuit board. A cover may be attached to an opposite side of the substrate. There is typically a space between the integrated circuit package and the thermal plate that is filled with a thermal grease. The spring is located between the cover and the substrate in a manner which deflects the spring and exerts a force on the substrate. The spring force pushes the substrate and the integrated circuit package into the thermal plate. The spring may be designed to always provide a sufficient force to ensure a minimum space between the integrated circuit package and the thermal plate for assemblies produced in a mass production process.

Abstract: An apparatus and method are provided for removing heat generated by the operation of electronic devices to allow for a more densely packed arrangement of the electronic devices on a parent board. The apparatus comprises a metallic housing that encloses a flexible backplane with a pair of rigid supports mounted on its bottom surface and at least one electrical device connected to the top surface of the backplane that is supported by the rigid supports. The flexible backplane is folded and positioned within the housing such that the rigid supports face inwardly with respect to the housing and the electronic devices face outwardly with respect to the housing. A biasing member is positioned between the rigid supports for biasing the electronic devices against the housing. The flexible backplane is a flexible circuit board that supports a PC card array and the loading device is a cylindrical elastomeric compressor.

Abstract: A fixing device for securing a heat sink to a CPU module includes a base plate, two elastic side plates respectively extending from two distal ends of the base plate, two curved portions formed between the base plate and the two elastic side plates for increasing elasticity of the fixing device when the two elastic side plates are expanded outward with respect to a central axis therebetween, two hooks respectively formed at free ends of the elastic side plates for securing to a backplane of the CPU module thereby sandwiching the heat sink between the fixing device and the CPU module, and two is engagement tabs respectively formed on the elastic side plates for allowance of an external tool to release the fixing device from the CPU module.

Abstract: A stiffener device for use with a flip chip packaging assembly including a generally rectangular, plate-like member having a substantially uniform thickness. At each of the rectangular plate-like member is a curved chamfer portion extending from an upper surface to a lower surface thereof, and defined by a chamfer edge commencing at one side edge forming the respective corner and terminating at an opposite side edge of the respective corner. Each curved chamfer portion is adapted to receptively accommodate a respective mounting bolt therethrough. The fabrication of the stiffener device is formed from a single stamping or punching operation in a manner maintaining a substantially planar upper surface and lower surface.

Abstract: A heat dissipating device which can provide multiple levels of pressure to a semiconductor package, having an outer peripheral ceramic region and an inner silicon region, is provided. A top cover member is provided with a central female-threaded bore. The top member is secured, without the use of tools, to the ceramic portion of the semiconductor package by a pair of upwardly standing legs with inwardly turned flanges where the flanges engage the marginal opposing portions of the top member. A heat dissipating member, having male-threaded base, is threadably inserted into the female-threaded bore to engage the upper surface of the silicon portion of the semiconductor package. The pressure of the heat dissipating member is independently adjustable, by hand, relative to the preset pressure of the top member onto the ceramic portion of the semiconductor package.

Abstract: An adjustable pressure mount heatsink subassembly (10) is provided for use with an electronic chip component (16). The system (10) includes a heatsink portion (12) having a block (28) which has a formed thereon to extend the lateral dimension of the circuit board portion (20) of the chip component (16). A mounting subassembly (14) is, in the preferred embodiment, disposed substantially within the transverse channel (34) and includes a spring clip (40) having a threaded aperture (44) centrally located in a pretensioned arc portion (46) and a pair of opposed end portions (48) for engaging the circuit board portion board edges (26). The pressure of attachment is adjusted by a threaded screw (42) which extends through the threaded aperture (44) and engages the channel floor (36) of the heatsink block (28). An optional nonconductive coating (52) is provided on the clip ends (48) in order to prevent unintended electrical conductance.

Abstract: A clipping device for attaching a heat sink to an electrical device comprises an elongate biasing strip and a pivotal grasp pivotally connected to an end of the biasing strip. Interconnecting retaining device between the biasing strip and the pivotal grasp to pivotally attach the pivotal grasp to the biasing strip, includes a slot defined in the latch tab and a head portion formed on the biasing strip. The head portion includes a tongue portion and a neck portion. The tongue portion includes at least a wing extending transversely therefrom, wherein the wing is deformed to offset from a horizontal side of the slot after insertion thereof, thereby securely retaining the head portion within the slot.

Abstract: A mounting assembly for thermally coupling a heat sink to a surface mounted heat generating electronic device package. The mounting assembly essentially comprises a heat generating device package, a mounting attachment, and a heat sink. The mounting attachment and heat generating device package are surface mounted to a PCB or other substrate in mutual thermal communication with a thermal pad on the substrate. The mounting attachment is adapted to facilitate the effective dissipation of heat from surface mounted heat generating electronic device packages while allowing for the post-manufacture installation and exchange of heat sinks.

Abstract: A heat sink for heat-generating electronic packages wherein the multiple heat-generating circuit packages are mounted on at least one surface of a heat sink and wherein the covers for the heat sink have protrusions thereon which, when the covers are in the closed position, engage the heat-generating circuit packages and hold them in heat transfer relationship with the heat sink.

Abstract: A power semiconductor module having a power circuit unit; a metal base for sealing the bottom of the module; an insulation substrate for electrically insulating the metal base from the power circuit unit; external input and output terminals connected to the power circuit unit; a resin case in which the external input and output terminals are inserted by integral molding; and a resin encapsulant material has been improved substantially in its reliability through provision of a nut integrally molded with the resin case for fastening the external input and output terminals with a screw; a metal base inserted in the resin case by integral molding; and a recess to receive the end of the screw located immediately below the nut, the recess extending without penetrating the resin case, and the metal base extending to an area below the recess.

Abstract: An assembly comprising a substrate, a thermally conductive member which is spaced from the substrate, and a semiconductor chip located on a side of the substrate facing the thermally conductive member. A resilient component is compressed between the substrate and the thermally conductive member so that a force clamping the substrate and the thermally conductive member together is shared by at least the semiconductor chip and the component.

Abstract: A semiconductor device test socket for connecting an external circuit to external leads of a semiconductor device to permit testing of the semiconductor device includes a body having a positioning base for supporting roots of external leads of a semiconductor device to be tested. A plurality of movable contact terminals are supported by the body and disposed opposite to the external leads of the semiconductor device when the semiconductor device is supported by the positioning base. The contact terminals are movable between a first position electrically contacting the external leads and a second position spaced from the external leads. The contact terminals are configured so as to be moved to their second positions when a conveyance tool for supporting the semiconductor device to be tested is moved towards the test socket and pressed against the contact terminals, and so as to move to their first positions when the conveyance tool is moved away from the test socket out of contact with the contact terminals.

Abstract: A diode holder with spring clamped heat sink includes a unitary holder having spaced apart pockets for the diodes, a heat sink plate, a compression coil spring and connector such as a rivet for clamping the holder and plate with the diodes engaging the plate with the clamping force being applied through the spring.

Abstract: The present invention involves a heat sink clip which engages a slot of a heat sink to press a power component into a heat sink of an electronic module, such as a power converter circuit for a vehicle. A power converter module for a vehicle comprises a casing having at least one heat sink with a plurality of fins, power converter circuitry disposed within the casing and including at least one power component; and a clip for pressing the power component into the heat sink. The clip has a first end engaging a slot of the casing and a second end extending from the first end with a resilient biasing that presses the power component into thermal contact with the heat sink. The casing slot includes a lip which retains the clip within the slot, and a sloped surface which facilitates entry of the clip. The clip has a generally L-shaped configuration for engaging the slot, with a corner that abuts a lip of the casing slot to retain the corner within the slot.

Abstract: The semiconductor package including a semiconductor element 11 having a first face 21a and a second face 21b which is opposite to the first face 21a, an electrode 22 provided on the first face 21a, and a conductive lead 23 connected to the electrode 22 comprises an insulating film member 24 provided on the second face 21b for connecting the other end of the lead, the lead 23 is bent as oppose to a side face of the semiconductor element 11, and is connected each other with an elastic force between the electrode 22 and the film member 24, a bent part of the lead between the electrode 22 and the film member 24 turns to be a terminal part 23a. The circuit board has a connection means, connecting to the terminal unit 23a, and having an adequate size for placing the semiconductor package 11. The connection means is constituted of an accommodation groove part 46 or a frame part 50, and a plurality of pattern electrodes 47a, 47b, and the terminal part 23a is connected between the pattern electrodes 47a, 47b.

Abstract: A device with power semiconductor components includes, in combination: a stack alternately comprising at least one power semiconductor component and at least one heatsink to dissipate heat and to provide an electrical connection, at least a first system for clamping the power semiconductor components, at least a second system for clamping components protecting the power semiconductor components, at least one spacer for insulating the semiconductor components from the framework of the various modules and at least one conductive block replacing heatsinks that are rendered unnecessary by the arrangement chosen for the inverter and auxiliary chopper functions.

Abstract: A semiconductor device is provided which includes a plurality of semiconductor chips each of which has a first main electrode and a control electrode on a first main surface and a second main electrode on a second main surface, and a plurality of support plates each of which is secured to the second main surface of the corresponding semiconductor chip. These semiconductor chips and support plates constitute individual semiconductor elements. The semiconductor elements are accommodated in the flat package that includes first and second common electrode plates and an insulating sleeve interposed between the common electrode plates, such that the semiconductor chip and the support plates are positioned by positioning guides. The first common electrode plate is in contact under pressure with the support plates.

Abstract: A heat sink spring clip having a linearly displaceable deflection member that operatively engages a biasing member for thermally and mechanically connecting a heat sink to an electronic component. The deflection member is moveable in a generally linear manner on and relative to the biasing member between a first position of nonengagement in which the biasing member is substantially undeflected and a second position in which the biasing member is deflected and the deflection member is contactingly and operatively engaged with the heat sink for thermally and mechanically connecting the heat sink to an electronic component. As the deflection member is moved from the disengaged position to the engaged position, complementary elements on the biasing member and deflection member engage one another and cause portions of the deflection and biasing members to move relatively apart.

Abstract: A top surface of a protective cover of an IC component package is provided with a centered-protrusion, e.g., such as a cylindrical peg, that extends above the cover. A retaining-spring is formed by twisting a resilient (e.g., metal) metal strip into a ribbon-like shape having opposing ends that extend from a curvelinear bottom surface. The bottom surface of the retaining-spring is provided with an opening configured to mate with the centered protrusion on the package cover, such that the opposing ends of the retaining-spring extend away from the package cover at substantially the same, albeit reverse angles. In order to mount the IC package to a heat sink, the bottom surface of the retaining-spring may be compressively mated onto the package cover at the same time the package is inserted between two substantially parallel walls protruding from the heat sink surface, wherein the walls are distanced from each other.

Abstract: An integral semiconductor package and mounting structure in which a lid for sealing a semiconductor chip on a platform includes flanges extending beyond the platform with the flanges having holes for receiving screws for mounting the package to a heat sink. The flanges are flexed into engagement with a heat sink thereby maintaining the package in yieldable pressure engagement with the heat sink.