Separating Insulating Layer Is Laminate Or Composite Of Plural Insulating Materials (e.g., Silicon Oxide On Silicon Nitride, Silicon Oxynitride) Patents (Class 257/760)
-
Patent number: 8237280Abstract: The present invention proposes a dummy metal fill structure which makes it possible to reduce variations in transistor characteristics as much as possible even if mask misalignment occurs, as well as to ensure the intended planarizing effect of the metal CMP process. The dummy metal fill formed above the gate electrode extends in the gate length direction with both ends thereof protruding from a region corresponding to the gate electrode. Even if a mask for forming a wiring layer is misaligned and the position of the dummy metal fill is misaligned from an intended position, the shape of the dummy metal fill within a region of the gate electrode is kept symmetric with respect to the center of the gate electrode.Type: GrantFiled: September 2, 2010Date of Patent: August 7, 2012Assignee: Panasonic CorporationInventor: Akio Kiyota
-
Patent number: 8232650Abstract: A semiconductor device wherein destruction of a sealing ring caused by cracking of an interlayer dielectric film is difficult to occur, as well as a method for manufacturing the semiconductor device, are provided. A first laminate comprises first interlayer dielectric films having a first mechanical strength. A second laminate comprises second interlayer dielectric films having a mechanical strength higher than the first mechanical strength. A first region includes first metallic layers and vias provided within the first laminate. A second region includes second metallic layers and vias provided within the second laminate. When seen in plan, the second region overlaps at least a part of the first region, is not coupled with the first region by vias, and sandwiches the second interlayer dielectric film between it and the first region.Type: GrantFiled: July 11, 2011Date of Patent: July 31, 2012Assignee: Renesas Electronics CorporationInventors: Hiroyuki Chibahara, Atsushi Ishii, Naoki Izumi, Masahiro Matsumoto
-
Patent number: 8222740Abstract: A transparent, electrically conductive composite includes a layer of molybdenum oxide or nickel oxide deposited on a layer of zinc oxide layer. The molybdenum component exists in a mixed valence state in the molybdenum oxide. The nickel component exists in a mixed valence state in the nickel oxide. The composite may be utilized in various electronic devices, including optoelectronic devices. In particular, the composite may be utilized as a transparent conductive electrode. As compared to conventional transparent conduct oxides such as indium tin oxide, the composite exhibits superior properties, including a higher work function.Type: GrantFiled: October 23, 2009Date of Patent: July 17, 2012Inventor: Jagdish Narayan
-
Patent number: 8211790Abstract: A multilayered circuitized substrate including a plurality of dielectric layers each comprised of a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin including an inorganic filler but not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on a first of the dielectric layers. A method of making this substrate is also provided.Type: GrantFiled: March 2, 2009Date of Patent: July 3, 2012Assignee: Endicott Interconnect Technologies, Inc.Inventors: Robert M. Japp, Voya R. Markovich, Kostas I. Papathomas, Mark D. Poliks
-
Publication number: 20120161325Abstract: A semiconductor device package is provided. The semiconductor device package includes a laminate comprising a first metal layer disposed on a dielectric film; a plurality of vias extending through the laminate according to a predetermined pattern; one or more semiconductor devices attached to the dielectric film such that the semiconductor device contacts one or more vias; a patterned interconnect layer disposed on dielectric film, said patterned interconnect layer comprising one or more patterned regions of the first metal layer and an electrically conductive layer, wherein a portion of the patterned interconnect layer extends through one or more vias to form an electrical contact with the semiconductor device. The patterned interconnect layer comprises a top interconnect region and a via interconnect region, wherein the package interconnect region has a thickness greater than a thickness of the via interconnect region.Type: ApplicationFiled: January 13, 2012Publication date: June 28, 2012Applicant: GENERAL ELECTRIC COMPANYInventors: Paul Alan McConnelee, Arun Virupaksha Gowda
-
Patent number: 8203210Abstract: The reliability of a semiconductor device having an embedded wire in the lowest layer wire is improved. In a main surface of a semiconductor substrate, MISFETs are formed and over the main surface, insulating films 10, 11 are formed. In the insulating films 10, 11 a contact hole is formed and a plug is embedded therein. Over the insulating film 11 in which the plug is embedded, insulating films 14, 15, 16 are formed and an opening is formed in the insulating films 14, 15, 16 and a wire is embedded therein. The insulating film 15 is an etching stopper film when etching the insulating film 16 in order to form the opening, containing silicon and carbon. The insulating film 11 has a high hygroscopicity and the insulating film 15 has a low moisture resistance, however, by interposing the insulating film 14 therebetween and making the insulating film 14 have a higher density of the number of Si (silicon) atoms than that of the insulating film 11, an electrically weak interface is prevented from being formed.Type: GrantFiled: September 15, 2010Date of Patent: June 19, 2012Assignee: Renesas Electronics CorporationInventors: Takeshi Furusawa, Takao Kamoshima, Masatsugu Amishiro, Naohito Suzumura, Shoichi Fukui, Masakazu Okada
-
Patent number: 8193642Abstract: This invention provides an interlayer insulating film for a semiconductor device, which has low permittivity, is free from the evolution of gas such as CFx and SiF4 and is stable, and a wiring structure comprising the same. In an interlayer insulating film comprising an insulating film provided on a substrate layer, the interlayer insulating film has an effective permittivity of not more than 3. The wiring structure comprises an interlayer insulating film, a contact hole provided in the interlayer insulating film, and a metal filled into the contact hole. The insulating film comprises a first fluorocarbon film provided on the substrate layer and a second fluorocarbon film provided on the first fluorocarbon film.Type: GrantFiled: June 20, 2006Date of Patent: June 5, 2012Assignees: Tohoku University, Foundation for Advancement of International ScienceInventor: Tadahiro Ohmi
-
Patent number: 8188602Abstract: To provide a semiconductor device having copper wiring layers and organic insulating resin layers with less separation and its manufacture method. A semiconductor device has: a semiconductor substrate formed with a number of semiconductor elements; a first interlayer insulating film formed above the semiconductor substrate and having a first wiring recess; a first copper wiring embedded in the first wiring recess; a second interlayer insulating film having a second wiring recess, the second interlayer insulating film including a copper diffusion preventing layer formed on the first copper wiring and the first interlayer insulating film, an oxide film formed on the copper diffusion preventing layer, and an organic insulating resin layer formed on the oxide film; and a second copper wiring embedded in the second wiring recess.Type: GrantFiled: January 24, 2003Date of Patent: May 29, 2012Assignee: Fujitsu Semiconductor LimitedInventors: Satoshi Otsuka, Shun-ichi Fukuyama
-
Patent number: 8178436Abstract: Interconnect structures having improved adhesion and electromigration performance and methods to fabricate thereof are described. A tensile capping layer is formed on a first conductive layer on a substrate. A compressive capping layer is formed on the tensile capping layer. Next, an interlayer dielectric layer is formed on the compressive capping layer. Further, a first opening is formed in the ILD layer using a first chemistry. A second opening is formed in the tensile capping layer and the compressive capping layer using a second chemistry. Next, a second conductive layer is formed in the first opening and the second opening.Type: GrantFiled: December 21, 2006Date of Patent: May 15, 2012Assignee: Intel CorporationInventors: Sean King, Jason Klaus
-
Patent number: 8169071Abstract: A semiconductor device includes a substrate, a first recessed conductive layer embedded and recessed into a first surface of the substrate, and a first raised conductive layer disposed above the first surface. A first vertical offset exists between an upper surface of the first recessed conductive layer and an upper surface of the first raised conductive layer. The device includes a second recessed conductive layer embedded and recessed into a second surface of the substrate. The second surface of the substrate is opposite the first surface. The device includes a second raised conductive layer disposed beneath the second surface and an interconnect structure disposed on the first recessed and raised conductive layers and the second recessed and raised conductive layers. A second vertical offset exists between a lower surface of the second recessed conductive layer and a lower surface of the second recessed conductive layer.Type: GrantFiled: February 2, 2011Date of Patent: May 1, 2012Assignee: STATS ChipPAC, Ltd.Inventors: KiYoun Jang, SungSoo Kim, YongHee Kang
-
Patent number: 8158476Abstract: A method for defining patterns in an integrated circuit comprises defining a plurality of features in a first photoresist layer using photolithography over a first region of a substrate. The method further comprises using pitch multiplication to produce at least two features in a lower masking layer for each feature in the photoresist layer. The features in the lower masking layer include looped ends. The method further comprises covering with a second photoresist layer a second region of the substrate including the looped ends in the lower masking layer. The method further comprises etching a pattern of trenches in the substrate through the features in the lower masking layer without etching in the second region. The trenches have a trench width.Type: GrantFiled: August 4, 2010Date of Patent: April 17, 2012Assignee: Micron Technology, Inc.Inventors: Luan C. Tran, John Lee, Zengtao “Tony” Liu, Eric Freeman, Russell Nielsen
-
Patent number: 8143175Abstract: The invention provides a dry etching method for performing a wiring process on a semiconductor substrate using a plasma etching apparatus, wherein the wiring process is performed without causing disconnection or deflection of the wiring. The invention provides a dry etching method for performing a wiring process on a semiconductor substrate using a plasma etching apparatus, wherein during a step for etching a material 12 to be etched using a mask pattern composed of a photoresist 15 and inorganic films 14 and 13 made of SiN, SiON, SiO and the like formed on the material 12 to be etched, a mixed gas formed of a halogen-based gas such as chlorine-containing gas or bromine-containing gas and at least one fluorine-containing gas selected from a group of fluorine-containing gases composed of CF4, CHF3, SF6 and NF3 is used to reduce the mask pattern and the processing dimension of the material to be etched substantially equally during processing of the material 12 to be etched.Type: GrantFiled: May 5, 2009Date of Patent: March 27, 2012Assignee: Hitachi High-Technologies CorporationInventors: Satoshi Une, Masamichi Sakaguchi, Kenichi Kuwabara, Tomoyoshi Ichimaru
-
Patent number: 8138607Abstract: Vertically-staggered-level metal fill structures include inner contiguous metal fill structures and outer contiguous metal fill structures. A dielectric material portion is provided between each contiguous metal fill structure. Vertical extent of each contiguous metal fill structure is limited up to three vertically adjoining metal interconnect levels, thereby limiting the capacitance of each contiguous metal fill structure. Capacitive coupling between the contiguous metal fill structures and the metal interconnect structures is minimized due to the fragmented structure of contiguous metal fill structures.Type: GrantFiled: December 8, 2009Date of Patent: March 20, 2012Assignee: International Business Machines CorporationInventors: David S. Collins, Howard S. Landis, Anthony K. Stamper, Janet M. Wilson
-
Patent number: 8129844Abstract: Electronic devices and design structures of electronic devices containing metal silicide layers. The devices include: a thin silicide layer between two dielectric layers, at least one metal wire abutting a less than whole region of the silicide layer and in electrical contact with the silicide layer.Type: GrantFiled: June 20, 2008Date of Patent: March 6, 2012Assignee: International Business Machines CorporationInventors: Felix Patrick Anderson, Zhong-Xiang He, Thomas Leddy McDevitt, Eric Jeffrey White
-
Patent number: 8125085Abstract: A semiconductor device includes an interlayer film formed over a semiconductor substrate. A groove is formed in the interlayer film. A wiring formed in the groove is a copper alloy including copper and a metal element. An oxide layer of the metal element is formed over the surface of the wiring. The oxide layer is formed in a first region along a grain boundary of a copper crystal and a second region surrounded by the grain boundary, over the surface of the wiring. The oxide layer formed in the first region has a thickness greater than that of the oxide layer formed in the second region.Type: GrantFiled: June 9, 2009Date of Patent: February 28, 2012Assignee: Renesas Electronics CorporationInventors: Kazuyoshi Maekawa, Kenichi Mori, Kazuyuki Omori, Yuki Koyama
-
Patent number: 8110880Abstract: Systems and methods for single lithography step interconnection metallization using a stop-etch layer are described. A method that includes depositing a stop-etch layer over a semiconductor device, depositing an interconnect metallization material over the stop-etch layer, performing a single lithography step to pattern a mask over the interconnect metallization material, etching the interconnect metallization material in non-masked areas, and removing the stop-etch layer. A system comprises a stop-etch layer material for deposit into a stop-etch layer over a wafer, an interconnect metallization material for deposit over the chrome layer, a lithography operation for patterning a mask over the interconnect metallization material, a first etching compound for etching the interconnect metallization material, where the etching stops at the stop-etch layer, and a second etching compound for removing the stop-etch layer.Type: GrantFiled: February 27, 2009Date of Patent: February 7, 2012Assignee: Northrop Grumman Systems CorporationInventor: John V. Veliadis
-
Patent number: 8084863Abstract: A circuitized substrate including a dielectric layer having a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin and not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on the dielectric layer. A method of making this substrate is also provided.Type: GrantFiled: April 10, 2008Date of Patent: December 27, 2011Assignee: Endicott Interconnect Technologies, Inc.Inventors: Robert M. Japp, Voya R. Markovich, Kostas I. Papathomas, Mark D. Poliks
-
Patent number: 8084142Abstract: The invention comprises methods of forming a conductive contact to a source/drain region of a field effect transistor, and methods of forming local interconnects. In one implementation, a method of forming a conductive contact to a source/drain region of a field effect transistor includes providing gate dielectric material intermediate a transistor gate and a channel region of a field effect transistor. At least some of the gate dielectric material extends to be received over at least one source/drain region of the field effect transistor. The gate dielectric material received over the one source/drain region is exposed to conditions effective to change it from being electrically insulative to being electrically conductive and in conductive contact with the one source/drain region. Other aspects and implementations are contemplated.Type: GrantFiled: September 21, 2006Date of Patent: December 27, 2011Assignee: Micron Technology, Inc.Inventors: Cem Basceri, Gurtej S. Sandhu, H. Montgomery Manning
-
Patent number: 8084860Abstract: The present invention includes a liquid crystal display device having an oxide film having high adhesiveness to a substrate to thereby prevent oxidation of a wiring material or the like, and includes, an electrode or a terminal electrode having high conductivity, and a manufacturing method therefor. Consequently, in the present invention, a liquid crystal display device has an electrode terminal of a TFT substrate, wherein the electrode is formed on an insulator and is comprised of a conductive layer mainly consisting of copper and an oxide covering an outer part, further the oxide is a layered structure of transparent electrodes, the layered portion having ohmic contact, and the oxide mainly consists of manganese oxide.Type: GrantFiled: September 23, 2009Date of Patent: December 27, 2011Assignee: Advanced Interconnect Materials, LLCInventors: Junichi Koike, Hideaki Kawakami
-
Patent number: 8080878Abstract: Provided is a semiconductor device, which includes an interlayer insulating film formed on a semiconductor substrate, a wiring layer filled in a recess formed in the interlayer insulating film, and a cap insulating film. The interlayer insulating film includes a first SiOCH film and a surface modification layer including an SiOCH film formed by modifying a surface layer of the first SiOCH film, the SiOCH film having a lower carbon concentration and a higher oxygen concentration than the first SiOCH film has. The cap insulating film contacts with surfaces of the metal wiring and the surface modification layer.Type: GrantFiled: September 11, 2009Date of Patent: December 20, 2011Assignee: Renesas Electronics CorporationInventors: Makoto Ueki, Takahiro Onodera, Yoshihiro Hayashi
-
Publication number: 20110304048Abstract: A semiconductor apparatus has a configuration in which multiple copper wiring layers and multiple insulating layers are alternately layered. A low-impedance wiring is formed occupying a predetermined region. A first wiring pattern includes multiple copper wiring members arranged in parallel with predetermined intervals in a first copper wiring layer, each of which has a rectangular shape extending in a first direction. A second wiring pattern includes multiple copper wiring members arranged in parallel with predetermined intervals in a second copper wiring layer adjacent to the first copper wiring layer, each of which has a rectangular shape extending in a second direction orthogonal to the first direction. The region occupied by the first wiring pattern and that occupied by the second wiring pattern are arranged such that they at least overlap. The first wiring pattern and the second wiring pattern are electrically connected so as to have the same electric potential.Type: ApplicationFiled: August 22, 2011Publication date: December 15, 2011Applicant: ROHM CO., LTD.Inventor: Jun MAEDE
-
Patent number: 8076780Abstract: A semiconductor device is provided having a pad with an improved moisture blocking ability. The semiconductor device has: a circuit portion including a plurality of semiconductor elements formed on a semiconductor substrate; lamination of insulator covering the circuit portion, including a passivation film as an uppermost layer having openings; ferro-electric capacitors formed in the lamination of insulator; wiring structure formed in the lamination of insulator and connected to the semiconductor elements and the ferro-electric capacitors; pad electrodes connected to the wiring structure, formed in the lamination of insulator and exposed in the openings of the passivation film; a conductive pad protection film, including a Pd film, covering each pad electrode via the opening of the passivation film, and extending on the passivation film; and stud bump or bonding wire connected to the pad electrode via the conductive pad protection film.Type: GrantFiled: June 27, 2008Date of Patent: December 13, 2011Assignee: Fujitsu Semiconductor LimitedInventors: Kaoru Saigoh, Kouichi Nagai
-
Patent number: 8072075Abstract: The present invention relates to an integrated-circuit device that has at least one Copper-containing feature in a dielectric layer, and a diffusion-barrier layer stack arranged between the feature and the dielectric layer. The integrated-circuit device of the invention has a diffusion-barrier layer stack, which comprises, in a direction from the Copper-containing feature to the dielectric layer, a CuSiN layer and a SiN layer. This layer combination provides an efficient barrier for suppressing Copper diffusion from the feature into the dielectric layer. Furthermore, a CuSiN/SiN layer sequence provides an improved adhesion between the layers of the diffusion-barrier layer stack and the dielectric layer, and thus improves the electromigration performance of the integrated-circuit device during operation. Therefore, the reliability of device operation and the lifetime of the integrate-circuit device are improved in comparison with prior-art devices.Type: GrantFiled: August 29, 2007Date of Patent: December 6, 2011Inventors: Nicolas Jourdan, Laurant Georges Gosset, Joaquin Torres
-
Patent number: 8072070Abstract: A barrier layer is deposited over a layer of passivation including in an opening to a contact pad created in the layer of passivation. A column of three layers of metal is formed overlying the barrier layer and aligned with the contact pad and having a diameter that is about equal to the surface of the contact pad. The three metal layers of the column comprise, in succession when proceeding from the layer that is in contact with the barrier layer, a layer of pillar metal, a layer of under bump metal and a layer of solder metal. The layer of pillar metal is reduced in diameter, the barrier layer is selectively removed from the surface of the layer of passivation after which reflowing of the solder metal completes the solder bump of the invention.Type: GrantFiled: June 29, 2009Date of Patent: December 6, 2011Assignee: Megica CorporationInventors: Jin-Yuan Lee, Mou-Shiung Lin, Ching-Cheng Huang
-
Patent number: 8062974Abstract: Conductions and vias between different, stacked metallic layers of a semiconductor device may be mechanically damaged by mechanical strain. According to an exemplary embodiment of the present invention, this mechanical strain may be transferred through the layer structure to the substrate by a grid of grounding structures and isolation and passivation layers which are connected by the grounding structures. This may provide for an enhancement of the lifetime of the semiconductor devices.Type: GrantFiled: July 31, 2006Date of Patent: November 22, 2011Assignee: NXP B.V.Inventors: Soenke Habenicht, Ansgar Thorns, Heinrich Zeile
-
Patent number: 8053777Abstract: A detector including an electrode formed from a first layer of conductive material, a readout line formed from a second layer of conductive material, and a via electrically connecting the readout line and the electrode. In one embodiment, the detector includes a source electrode and a drain electrode formed from the first layer of conductive material, and a data line formed from the second layer of conductive material, such that the source and drain electrodes are vertically offset from the data line. Alternatively, in another embodiment, the detector includes a gate electrode formed from the first layer of conductive material, and a scan line formed from the second layer of conductive material, such that the gate electrode is vertically offset from the scan line.Type: GrantFiled: March 31, 2005Date of Patent: November 8, 2011Assignee: General Electric CompanyInventors: Douglas Albagli, William Andrew Hennessy
-
Patent number: 8053893Abstract: The reliability of wirings, each of which includes a main conductive film containing copper as a primary component, is improved. On an insulating film including the upper surface of a wiring serving as a lower layer wiring, an insulating film formed of a silicon carbonitride film having excellent barrier properties to copper is formed; on the insulating film, an insulating film formed of a silicon carbide film having excellent adhesiveness to a low dielectric constant material film is formed; on the insulating film, an insulating film formed of a low dielectric constant material as an interlayer insulating film is formed; and thereafter a wiring as an upper layer wiring is formed.Type: GrantFiled: June 22, 2009Date of Patent: November 8, 2011Assignee: Renesas Electronics CorporationInventors: Junji Noguchi, Takayuki Oshima, Noriko Miura, Kensuke Ishikawa, Tomio Iwaskai, Kiyomi Katsuyama, Tatsuyuki Saito, Tsuyoshi Tamaru, Hizuru Yamaguchi
-
Patent number: 8053892Abstract: A method and system is provided for efficiently varying the composition of the metal interconnects for a semiconductor device. A metal interconnect according to the present disclosure has an intermediate layer on a dielectric material, the intermediate layer having a relatively higher concentration of an impurity metal along with a primary metal, the impurity metal having a lower reduction potential than the primary metal. The metal interconnect has a main layer of the metal alloy interconnect on top of the intermediate layer and surrounded by the intermediate layer, the main layer having a relatively higher concentration of the primary metal than the intermediate layer, wherein the intermediate and main layers of the metal alloy interconnect each maintains a material uniformity.Type: GrantFiled: January 27, 2006Date of Patent: November 8, 2011Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ting-Chu Ko, Ming-Hsing Tsai, Chien-Hsueh Shih
-
Patent number: 8039924Abstract: A semiconductor device includes a first wiring layer which is provided above a semiconductor substrate and includes a first insulating film and a wiring buried in the first insulating film, a second insulating film provided above the first wiring layer, a third insulating film provided on the second insulating film, and a capacitor element provided on the third insulating film. The wiring includes an upper surface having a protruding portion. The capacitor element includes a lower electrode provided on the third insulating film, a capacitor insulating film provided on the lower electrode, and an upper electrode provided on the capacitor insulating film.Type: GrantFiled: July 8, 2008Date of Patent: October 18, 2011Assignee: Renesas Electronics CorporationInventors: Masayuki Furumiya, Takeshi Toda
-
Patent number: 8030779Abstract: A multi-layered metal interconnection includes a diffusion barrier directly formed on a conductive layer, an etching stop layer directly formed on the diffusion barrier, at least one dielectric layer formed over the etch stop layer, at least one of a via formed in the at least one dielectric layer and a trench formed in the at least one dielectric layer.Type: GrantFiled: May 22, 2009Date of Patent: October 4, 2011Assignee: Dongbu HiTek Co., Ltd.Inventor: Hyuk Park
-
Patent number: 8030778Abstract: An integrated circuit structure is provided. The integrated circuit structure includes a dielectric layer, a conductive structure, a low-k dielectric layer and a plug. The conductive structure is disposed in the dielectric layer, having a recess portion. The low-k dielectric layer is disposed on the dielectric layer. The plug is disposed in the low-k dielectric layer and has a protruding bonding portion on the bottom of the plug. The bonding portion is extended into the dielectric layer and connected to the recess portion of the conductive structure.Type: GrantFiled: July 6, 2007Date of Patent: October 4, 2011Assignee: United Microelectronics Corp.Inventor: Ping-Chang Wu
-
Patent number: 8026166Abstract: Interconnect structures comprising capping layers with low dielectric constants and good oxygen barrier properties and methods of making the same are provided. In one embodiment, the integrated circuit structure comprises: an interlevel dielectric layer disposed above a semiconductor substrate; a conductive interconnect embedded in the interlevel dielectric layer; a first capping layer comprising SiwCxNyHz disposed upon the conductive interconnect; a second capping layer comprising SiaCbNcHd (has less N) having a dielectric constant less than about 4 disposed upon the first capping layer; and a third capping layer comprising SiwCxNyHz disposed upon the second capping layer, wherein a+b+c+d=1.0 and a, b, c, and d are each greater than 0 and less than 1, and wherein w+x+y+z=1.0 and w, x, y, and z are each greater than 0 and less than 1.Type: GrantFiled: August 12, 2008Date of Patent: September 27, 2011Assignees: International Business Machines Corporation, Samsung Electronics Co., Ltd., Chartered Semiconductor Manufacturing Ltd.Inventors: Griselda Bonilla, Tien Cheng, Lawrence A. Clevenger, Stephan Grunow, Chao-Kun Hu, Roger A. Quon, Zhiguo Sun, Wei-tsui Tseng, Yiheng Xu, Yun Wang, Hyeok-sang Oh
-
Patent number: 8022545Abstract: A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.Type: GrantFiled: February 25, 2008Date of Patent: September 20, 2011Assignee: Megica CorporationInventor: Mou-Shiung Lin
-
Patent number: 8022442Abstract: A semiconductor device has: a silicon substrate; trench formed downward from the surface of the silicon substrate, the trench defining active regions on the surface of the silicon substrate; a first liner layer of a silicon nitride film covering an inner wall of the trench; a second liner layer of a silicon nitride layer formed on the first liner layer; an element isolation region of an insulator formed on the second liner layer; a p-channel MOS transistor formed in and on one of the active regions; a contact etch stopper layer of a silicon nitride layer not having a ultraviolet shielding ability, formed above the silicon substrate, and covering the p-channel MOS transistor; and a light shielding film of a silicon nitride layer having the ultraviolet shielding ability and formed above the contact etch stopper layer.Type: GrantFiled: October 26, 2004Date of Patent: September 20, 2011Assignee: Fujitsu Semiconductor LimitedInventor: Yoshiyuki Ookura
-
Patent number: 8022520Abstract: A system for hermetically sealing devices. The system includes a substrate, which includes a plurality of individual chips. Each of the chips includes a plurality of devices and each of the chips are arranged in a spatial manner as a first array. The system also includes a transparent member of a predetermined thickness, which includes a plurality of recessed regions arranged in a spatial manner as a second array and each of the recessed regions are bordered by a standoff region. The substrate and the transparent member are aligned in a manner to couple each of the plurality of recessed regions to a respective one of said plurality of chips. Each of the chips within one of the respective recessed regions is hermetically sealed by contacting the standoff region of the transparent member to the plurality of first street regions and second street regions using at least a bonding process to isolate each of the chips within one of the recessed regions.Type: GrantFiled: August 29, 2006Date of Patent: September 20, 2011Assignee: Miradia Inc.Inventors: Xiao Yang, Dongmin Chen
-
Patent number: 8018060Abstract: A system and method for forming post passivation metal structures is described. Metal interconnections and high quality electrical components, such as inductors, transformers, capacitors, or resistors are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer.Type: GrantFiled: January 16, 2008Date of Patent: September 13, 2011Assignee: Megica CorporationInventors: Mou-Shiung Lin, Chiu-Ming Chou, Chien-Kang Chou
-
Patent number: 8018061Abstract: An integrated circuit processing system is provided including a substrate having an integrated circuit; an interconnect layer over the integrated circuit; a low-K dielectric layer over the interconnect layer; a hard mask layer over the low-K dielectric layer; a via opening through the hard mask layer and the low-K dielectric layer to the interconnect layer; and an interconnect metal in the via opening.Type: GrantFiled: September 25, 2009Date of Patent: September 13, 2011Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.Inventors: Wuping Liu, Michael Beck, John A. Fitzsimmons
-
Patent number: 8017522Abstract: A mechanically robust semiconductor structure with improved adhesion strength between a low-k dielectric layer and a dielectric-containing substrate is provided. In particular, the present invention provides a structure that includes a dielectric-containing substrate having an upper region including a treated surface layer which is chemically and physically different from the substrate; and a low-k dielectric material located on a the treated surface layer of the substrate. The treated surface layer and the low-k dielectric material form an interface that has an adhesion strength that is greater than 60% of the cohesive strength of the weaker material on either side of the interface. The treated surface is formed by treating the surface of the substrate with at least one of actinic radiation, a plasma and e-beam radiation prior to forming of the substrate the low-k dielectric material.Type: GrantFiled: January 24, 2007Date of Patent: September 13, 2011Assignee: International Business Machines CorporationInventors: Qinghuang Lin, Terry A. Spooner, Darshan D. Gandhi, Christy S. Tyberg
-
Patent number: 8008777Abstract: An etching stopper film is formed on top of a first insulating film. The etching stopper film is a film formed by depositing at least two films, made of constituent materials identical in quality to each other, one another. Subsequently, a first opening pattern is formed in the etching stopper film. Subsequently, a second insulating film is formed on top of the etching stopper film. Subsequently, a mask pattern is formed on top of the second insulating film. Subsequently, the second insulating film is etched with the use of the mask pattern as a mask to be followed by etching of the first insulating film with the use of the etching stopper film as a mask.Type: GrantFiled: June 2, 2009Date of Patent: August 30, 2011Assignee: Renesas Electronics CorporationInventor: Ken Ozawa
-
Patent number: 8008775Abstract: A system and method for forming post passivation metal structures is described. Metal interconnections and high quality electrical components, such as inductors, transformers, capacitors, or resistors are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer.Type: GrantFiled: December 20, 2004Date of Patent: August 30, 2011Assignee: Megica CorporationInventors: Mou-Shiung Lin, Chiu-Ming Chou, Chien-Kang Chou
-
Patent number: 8004083Abstract: An integrated circuit chip includes a silicon substrate, a first circuit in or over said silicon substrate, a second circuit device in or over said silicon substrate, a dielectric structure over said silicon substrate, a first interconnecting structure in said dielectric structure, a first pad connected to said first node of said voltage regulator through said first interconnecting structure, a second interconnecting structure in said dielectric structure, a second pad connected to said first node of said internal circuit through said second interconnecting structure, a passivation layer over said dielectric structure, wherein multiple opening in said passivation layer exposes said first and second pads, and a third interconnecting structure over said passivation layer and over said first and second pads.Type: GrantFiled: September 29, 2007Date of Patent: August 23, 2011Assignee: Megica CorporationInventors: Mou-Shiung Lin, Jin-Yuan Lee, Chien-Kang Chou
-
Patent number: 7994641Abstract: A semiconductor device according to one embodiment includes: a substrate having an element region where a semiconductor element is formed; a via hole formed in a portion of the substrate adjacent to the element region; a conducting portion provided in the via hole via an insulating layer; and a buffer layer provided between the substrate and the insulating layer, wherein the buffer layer is made of a material in which a difference in thermal expansion coefficient between the substrate and the buffer layer is smaller than that between the substrate and the insulating layer.Type: GrantFiled: June 26, 2009Date of Patent: August 9, 2011Assignee: Kabushiki Kaisha ToshibaInventor: Masahiro Inohara
-
Patent number: 7989954Abstract: An integrated circuit chip includes a silicon substrate, a first circuit in or over said silicon substrate, a second circuit device in or over said silicon substrate, a dielectric structure over said silicon substrate, a first interconnecting structure in said dielectric structure, a first pad connected to said first node of said voltage regulator through said first interconnecting structure, a second interconnecting structure in said dielectric structure, a second pad connected to said first node of said internal circuit through said second interconnecting structure, a passivation layer over said dielectric structure, wherein multiple opening in said passivation layer exposes said first and second pads, and a third interconnecting structure over said passivation layer and over said first and second pads.Type: GrantFiled: September 29, 2007Date of Patent: August 2, 2011Assignee: Megica CorporationInventors: Mou-Shiung Lin, Jin-Yuan Lee, Chien-Kang Chou
-
Patent number: 7982315Abstract: A semiconductor device is provided. An amorphous silicon layer that acts as a UV blocking layer replaces a conventional silicon-rich oxide (SRO) layer or the super silicon-rich oxide (SSRO) layer. By doing this, the process window is increased. In addition, silicon nitride sidewall spacer is formed inside the contact hole to prevent charge loss.Type: GrantFiled: June 30, 2008Date of Patent: July 19, 2011Assignee: Nanya Technology Corp.Inventors: Yinan Chen, Hsien-Wen Liu, Tzu-Ching Tsai
-
Patent number: 7982312Abstract: The process of producing a dual damascene structure used for the interconnect architecture of semiconductor chips. More specifically the use of imprint lithography to fabricate dual damascene structures in a dielectric and the fabrication of dual damascene structured molds.Type: GrantFiled: August 7, 2008Date of Patent: July 19, 2011Assignee: International Business Machines CorporationInventors: Matthew E. Colburn, Kenneth Raymond Carter, Gary M. McClelland, Dirk Pfeiffer
-
Patent number: 7982313Abstract: By dividing a single chip area into individual sub-areas, a thermally induced stress in each of the sub-areas may be reduced during operation of complex integrated circuits, thereby enhancing the overall reliability of complex metallization systems comprising low-k dielectric materials or ULK material. Consequently, a high number of stacked metallization layers in combination with increased lateral dimensions of the semiconductor chip may be used compared to conventional strategies.Type: GrantFiled: July 22, 2009Date of Patent: July 19, 2011Assignee: Advanced Micro Devices, Inc.Inventors: Michael Grillberger, Matthias Lehr
-
Patent number: 7977792Abstract: A semiconductor device including a first insulating layer having a hydroxyl radical formed over a semiconductor substrate; a line layer having a plurality of line patterns formed over the first insulating layer, the plurality if line patterns being arranged such that a spatial gap is provided therebetween; a fluorine-doped second insulating layer formed in the spatial gap between respective line patterns; and a multilayered diffusion prevention layer including a first oxide layer for suppressing an increase of a dielectric constant between the plurality of line patterns and a second oxide layer for preventing the diffusion of fluorine from the fluorine-doped second insulating layer into the first insulating layer.Type: GrantFiled: October 17, 2007Date of Patent: July 12, 2011Assignee: Dongbu HiTek Co., Ltd.Inventor: Jong Taek Hwang
-
Patent number: 7977797Abstract: The present invention is a semiconductor contact formation system and method. Contact insulation regions are formed with multiple etch stop sublayers that facilitate formation of contacts. This contact formation process provides relatively small substrate connections while addressing critical lithographic printing limitation concerns in forming contact holes with small dimensions. In one embodiment, a multiple etch stop insulation layer comprising multiple etch stop layers is deposited. A contact region is formed in the multiple etch stop insulation layer by selectively removing (e.g., etching) some of the multiple etch stop insulation layer. In one embodiment, a larger portion of the multiple etch stop insulation layer is removed close to the metal layer and a smaller portion is removed closer to the substrate.Type: GrantFiled: August 11, 2009Date of Patent: July 12, 2011Assignee: Spansion LLCInventors: Wenmei Li, Angela T. Hui, Dawn Hopper, Kouros Ghandehari
-
Patent number: 7973410Abstract: Since a power source voltage is generated from a communication signal in a wireless chip, there is a risk that a large amount of voltage be generated in the wireless chip to electrically destroy a circuit in the case of supplying a strong communication signal. Therefore, the present invention is made with an aim to provide a wireless chip having resistance to a strong communication signal. A wireless chip of the present invention has an element in which a power source wire and a grounding wire are electrically short-circuited if a power source voltage exceeds a voltage at which an electric circuit is destroyed, i.e., exceeds the specified voltage range. Accordingly, a wireless chip of the present invention has resistance to a strong communication signal.Type: GrantFiled: September 27, 2006Date of Patent: July 5, 2011Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventor: Yoshiyuki Kurokawa
-
Patent number: 7968456Abstract: A semiconductor interconnect structure and method providing an embedded barrier layer to prevent damage to the dielectric material during or after Chemical Mechanical Polishing. The method employs a combination of an embedded film, etchback, using either selective CoWP or a conformal cap such as a SiCNH film, to protect the dielectric material from the CMP process as well as subsequent etch, clean and deposition steps of the next interconnect level.Type: GrantFiled: May 20, 2008Date of Patent: June 28, 2011Assignee: International Business Machines CorporationInventors: Paul S. McLaughlin, Sujatha Sankaran, Theodorus E. Standaert