Deposition Of Semiconductive Layer, E.g., Poly - Or Amorphous Silicon Layer (epo) Patents (Class 257/E21.297)
  • Patent number: 7084000
    Abstract: A solid-state imaging device according to the present invention includes a semiconductor substrate; a photoelectric conversion portion formed on the semiconductor substrate; a gate insulating film formed on the semiconductor substrate and covering the photoelectric conversion portion; a vertical transfer portion for transferring a charge generated at the photoelectric conversion portion in a vertical direction; and a multilayer transfer gate electrode for transferring the charge of the vertical transfer portion. At least one layer of the multilayer transfer gate electrode is made of at least two impurity doped amorphous silicon films of different impurity concentration.
    Type: Grant
    Filed: December 7, 2004
    Date of Patent: August 1, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Naoki Iwawaki