Abstract: A lighting structure including a light-transmitting cap, a wire, a light emitting diode (LED) and a transparent adhesive. Two guide pieces project in parallel and protrude from the bottom of a body of the light-transmitting cap, and an opening of the body is located between the two guide pieces. Two lugs extend from the body, and correspond to two ends of a guide trench between the two guide pieces. A soldering surface of the LED is soldered on a soldering section of the wire. The transparent adhesive wraps around the soldering section, the guide trench and the two lugs, and wraps around a light emitting surface of the LED. The light-transmitting cap covers the LED with the LED at the opening. The soldering section is located between the two guide pieces, and the transparent adhesive attaches the LED to the light-transmitting cap.

Abstract: A display device includes: a light source; a display panel capable of receiving the light from a first surface side and transmitting the light to a second surface side; and a light guiding member. The display panel is inclined with respect to an orthogonal plane orthogonal to an optical axis of the light. The light guiding member has an output surface framed by an output port of the light and inclined with respect to the orthogonal plane. An inclination direction of the display panel is identical to an inclination direction of the output surface. The light guiding member has such a shape that a distance between inner surfaces of the light guiding member and the optical axis increases toward the first surface side from the light source side, and the inner surfaces opposing each other at positions orthogonal to the optical axis are not uniform in curvature.

Abstract: The present invention provides a light emitting diode(s), LED, light strip arranged for providing improved color consistency over its length. The LED light strip comprises LED strings positioned along the length of the LED light strip and powered in parallel, for emitting, for example, red, green, blue and white light. The resistance of the supply and return traces, in combination with variations in the current drawn by or the forward voltage of the various LED and resistors used in the LED strings of different color, causes a voltage drop along these traces leading to inconsistent color rendering. By adjusting the resistivity of the traces, such as through providing return paths having different resistances for LED strings of different color, the consistency of the color rendering can be improved.

Abstract: A light-emitting module includes a carrier, a plurality of light-emitting units, and a protection layer. The carrier has a lighting portion and an extending portion. The plurality of light-emitting units is disposed on the lighting portion. The protection layer covers the plurality of light-emitting units and the lighting portion, and exposes the extending portion.

Abstract: Provided is a vehicular lamp including a lamp housing, a bracket installed on one side of the lamp housing, and a lamp attachable to and detachable from the bracket to be fastened. Here, the lamp includes a light source module, a guide portion to which the light source module is slidably coupled, and a socket portion installed inside the guide portion and to which the light source module is slidably coupled to establish electrical conduction.

Abstract: The present disclosure is directed to a lighting system, the lighting system comprising at least two lighting modules. Each lighting modules includes a plurality of light emitting elements which are electrically coupled to one another. The lighting system further comprises a suspension assembly which is configured for longitudinally attaching to the at least two lighting modules to be arranged as two lighting modules adjacent to each other. The suspension assembly includes a first section configured for attaching to one of the two adjacent lighting modules, and a second section configured for attaching to the other one of the two adjacent lighting modules. The first section and the second section are mechanically connected for adjusting the longitudinal distance between the two adjacent lighting modules.

Abstract: A module array includes a light emitting device module. The light emitting device module includes a light source unit, a body provided at one surface thereof with a seat on which the light source unit is seated, a plurality of radiation fins disposed on the other surface of the body opposite to one surface of the body, and an air hole perforated in the body from the seat to the radiation fins for the flow of air.

Abstract: In a first aspect of the subject invention, an LED light assembly is provided comprising: a housing; and, a plurality of LED light modules coupled together in axial end-to-end fashion so as to define an elongated lighting strip, each said light module including at least one heat dissipation block and at least one LED element, wherein, said lighting strip is secured to said housing.

Abstract: Self-adaptable light source and methods to make various types of a light source for the benefit of a user. One embodiment is a method of making a self-adaptable light source. A second embodiment is a self-adaptable light source that has a data processor. A third embodiment is a self-adaptable light source that has two accelerometers. Various embodiments have one or no buttons needed to change the operational state of the light source.

Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb comprises: a first light-emitting device comprising a first light-emitting unit and a first cover covering the light-emitting unit; a second cover comprising a bottom end and a lateral portion surrounding the first light-emitting device; a first opening provided in the bottom end of the second cover; and a second opening provided in the lateral portion of the second cover.

Abstract: There is provided a display device including a jig that is provided with an insertion port into which a tip portion of an eccentric driver having the tip portion on an axis different from a central axis of a grip is inserted, a substrate that is provided with a long hole into which the grip is inserted, the long hole being long and narrow, a position of the substrate relative to the jig being movable within a predetermined movable range by rotation of the eccentric driver, the tip portion and the grip of the eccentric driver being inserted, and a base position fixing unit that fixes the substrate to a predetermined base position within the movable range.

Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.

Abstract: A randomly bendable and shapeable LED light bar is provided, including a plurality of LED light strings in parallel, a shaping metal rod and an insulating wrapping layer, wherein each LED light string includes two fine leads in parallel and a plurality of LED light emitting units; an anode and a cathode of each LED light emitting unit are welded/soldered with the two fine leads; the two fine leads are electrically connected with an anode and a cathode of a power supply; the plurality of LED light strings are parallel to the shaping metal rod and are both wrapped by the insulating wrapping layer. Compared with the prior art, the randomly bendable and shapeable LED light bar disclosed is relatively flexible, can be formed into various rich shapes, and is convenient to mount and shape, reliable in light emission, relatively high in practicability and relatively wide in application range.

Abstract: In a LED lamp having an optically transmissive enclosure and a base connected to the enclosure a plurality of LEDs are operable to emit light when energized through an electrical path from the base. A reflector has an enclosed wall shape and is disposed such that LEDs are mounted inside of and outside of the reflector. The reflector includes a reflective outer surface where in cross-section the reflective outer surface is disposed at an angle relative to the longitudinal axis of the lamp such that the reflective outer surface diverges away from the longitudinal axis as it extends away from the base. The reflective outer surface may be disposed at an angle of between approximately 83 and 89 degrees relative to the plane of the LEDs.

Abstract: Provided is a light source unit including a base unit formed on a front surface thereof with a first circuit pattern by irradiating laser light to a resin molded article, and a light emitting element mounted on the base unit and electrically connected to the first circuit pattern. The base unit includes a mounting surface portion directed in a prescribed direction such that the light emitting element is mounted thereon, and a sidewall surface portion connected to the mounting surface portion in a plane intersection state, and the sidewall surface portion is formed as an inclined surface intersecting with the mounting surface portion at an obtuse angle.

Abstract: A light fixture is disclosed herein. The light fixture can include a base having at least one wall that forms a cavity, where the at least one wall includes at least one lens mating surface. The light fixture can also include a lens having at least one base mating surface that forms a hermetic seal with the at least one lens mating surface, where the hermetic seal encapsulates the cavity. The light fixture can further include at least one solid state light source disposed within the cavity.

Abstract: A circuit board (10) for carrying at least one light source (16) of a lighting device and a method of manufacturing such a circuit board are provided. The circuit board comprises a substrate (1), wherein the substrate comprises at least one fold (9) forming a projecting portion and extending from a periphery (3) of the substrate up to an inner portion (2) of the substrate, whereby the substrate has a polygonal funnel shape. The present aspects use the concept of folding the substrate in order to obtain a polygonal funnel shape of the circuit board, whereby shaping of the substrate without requiring removal of material of the substrate is allowed.

Abstract: A lighting device includes a housing, a light emitting device, and an optical array. The housing has a base and the light emitting device is connected to the base for producing a light output. The optical array includes a lens and removably connects to the base. The optical array is repositionable on the base to modify the light output.

Abstract: The invention relates to a light guide unit (3) for a light-emitting unit (1) for a projector lamp, in particular a motor vehicle headlamp, wherein the light-emitting unit (1) comprises a plurality of light sources (2), the light guide unit (3), and a downstream projection lens (4), wherein the light guide unit (3) has a plurality of light guides (30), wherein each light guide (30) has a light exit surface (30a), and wherein each light source (2) couples light precisely into a light guide (30) assigned thereto, and wherein adjacent light guides (30) are separated from one another by separating walls (31, 32).

Abstract: A shape-retaining film which allows a flexible wiring board to retain its shape after the flexible wiring board is deformed by bending or the like, and a shape-retaining flexible wiring board including the shape-retaining film, is disclosed herein. A shape-retaining film includes a plastic-deformable metal layer and an adhesive layer which is formed on one surface side (lower side) of the metal layer 3 and is joined with a flexible wiring board. The shape-retaining film makes it possible to retain the shape of a deformed flexible wiring board. With this arrangement, the occurrence of a repellent force in the deformed flexible wiring board is prevented.

Abstract: A lighting module (150) and a method (100) of manufacturing a lighting module, wherein the method comprises the steps of providing a heat sink material (120) in a fluid state and providing a light-source assembly (110) comprising a plurality of light sources (111) being electrically connected to a carrier (112), wherein each of the light sources has a light-emitting surface (113). The method further comprises the steps of embedding (130) the light-source assembly into the heat sink material such that the carrier and a part of each of the light sources are covered by the heat sink material while the light-emitting surface of each of the light sources is uncovered by the heat sink material, and solidifying (140) the heat sink material.

Abstract: A mount for a light assembly in a luminaire has a base section and mounting arms upstanding from the base section. Each mounting arm has an upward length and a width and has a lower portion and an upper portion. Mounting pads for light sources are unitary with or attached to the mounting arm upper portions and have an upward length and a width. The width of the mounting pads extends in a direction oblique to the width of the mounting arm lower portions. Preferably, the length of the mounting pads extends in a direction oblique to the length of the mounting arm lower portions. Light sources mounted on the mounting pads may emit beams of light directed obliquely away from each other and obliquely towards the base.

Abstract: A light assembly includes a cover having an upper portion and a redirection portion. The cover has a longitudinal axis and a housing that is coupled to the cover. A lamp base is coupled to the housing. A circuit board is disposed within the housing. The circuit board has a plurality of light sources thereon. An internal redirection element is coupled to the circuit board and has a curvilinear shaped surface for reflecting a first portion of light from the plurality of light sources through the redirection portion of the cover and transmitting a second portion of light therethrough.

Abstract: Illumination devices may be provided with one or more light sources that emit light of the same, similar, and/or different optical spectra within a wavelength range, for example, from the extreme ultraviolet (UV) to the far infrared (IR). One or more of the light sources may be selectively adjusted to control the overall mix of light projected onto a scene of interest. For example, one or more light sources may be used, and sometimes in conjunction with other optical elements, to provide illumination having a particular angular intensity distribution, color temperature, and/or other desired optical properties for a scene within a field of view (FOV) of the camera of a mobile device used for videography and/or photography. One or more illumination devices may also be used as flashlights and/or as sources of electrical power for recharging mobile devices. Related methods are provided.

Abstract: Techniques are disclosed for integrating the LED lead frame into the LED circuit fabrication process. The LED packages within the lead frame may be spaced according to the final spacing of the LED packages on the finished circuit board, such that multiple LED packages may be attached to a circuit board at a time by applying the lead frame to circuit board and then removing portions of the lead frame, leaving the LED packages attached to the board. The LED packages may be attached using solder or conductive epoxy, in some embodiments. Alternatively, part of the lead frame may include conductive wires forming one or more strings of LED packages. An entire string of LED packages may then be removed from the lead frame in a single motion and placement may be performed for a string of LED packages all at once rather than for individual LED packages.

Abstract: An illumination module may include at least one flexible carrier for a plurality of heat sources, including light sources, wherein the carrier is provided for being bent over at least part of its width.

Abstract: A lighting apparatus in which a light emitter (an illumination light source) can be easily reduced in size is provided. The lighting apparatus includes: a light emitter; and an inverter circuit that converts power supplied from a commercial power supply, into AC power, and outputs the AC power to the light emitter, and the light emitter includes: a capacitor; a rectifier circuit that rectifies the AC power obtained through the capacitor; and an LED that emits light using power rectified by the rectifier circuit.

Abstract: The present invention relates to an organic light-emitting element comprising a first electrode, a second electrode, and an organic layer interposed between said first electrode and said second electrode, and to a light-emitting device including the same, wherein in the organic light-emitting element, a connection electrode for electrically connecting two or more elements in serial is formed on a non-light-emitting surface of said organic light-emitting element. The invention can electrically connect a plurality of organic light-emitting elements easily, and can be implemented as a large-scale lighting or display device or the like.

Abstract: Embodiments of the invention include head and tail lights with and without heat sinks and kits made therefrom for golf carts.

Abstract: A solar powered sign assembly includes one or more light sources within a housing. The housing includes first and second sidewalls having inner surfaces and outer surfaces. The outer surfaces define oppositely facing exterior side edge portions of the housing. The light sources are spaced apart from each other such that the light sources extend from top to bottom along the inner surfaces of the first and second sidewalls. One or more light-transmissive signs are attachable to the housing so as to extend across a front and/or back portion of the housing to thereby receive light from the light sources and allow at least some of the light to pass therethrough. One or more solar panels are external to the housing for collecting solar energy for charging one or more batteries. A controller is within the housing and electrically connected to the light sources and the solar panels.

Abstract: An illumination module may include at least one flexible carrier for a plurality of heat sources, including light sources, wherein the carrier is provided for being bent over at least part of its width.

Abstract: A replacement light tube for replacing a fluorescent light tube includes an elongate tubular housing having first and second ends, first and second end caps disposed thereon, each configured to fit with a socket for the fluorescent light tube, and a rigid support structure having a planar portion having a first surface extending within the elongate tubular housing between the first and second ends and having spaced-apart sidewalls extending away from the first surface and extending within the housing between the first and second ends. At least a portion of the sidewalls are in contact with an interior surface of housing. A plurality of white light emitting diodes are supported only by a second surface of the planar portion opposite to the first surface and between the first and second ends, and are arranged to emit light through the housing.

Abstract: A light emitting device includes a light emitting structure including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, and a light extraction structure that extracts light from the light emitting structure. The light extraction structure includes at least a first light extraction zone and a second light extraction zone, where a period and/or size of first concave and/or convex structures of the first light extraction zone is different from a period and/or size of second concave and/or convex structures of the second light extraction zone.

Abstract: A light emitting device, includes a light emitting diode unit on a substrate; a gas-generating species; an inert gas; a barrier; and a sealant; wherein: the sealant, barrier, and substrate define a protective chamber; and the light emitting diode unit, the gas generating species, and the inert gas are disposed within the chamber.

Abstract: A light emitting diode package includes an electrically insulated base, first and second electrodes, an LED chip, a voltage stabilizing module, and an encapsulative layer. The base has a first surface and an opposite second surface. The first and second electrodes are formed on the first surface of the base. The LED chip is electrically connected to the first and second electrodes. The voltage stabilizing module is formed on the first surface of the base, positioned between and electrically connected to the first and second electrodes. The voltage stabilizing module connects to the LED chip in reverse parallel and has a polarity arranged opposite to that of the LED chip. The voltage stabilizing module has an annular shape and encircles the first electrode. The encapsulative layer is formed on the base and covers the LED chip.

Abstract: A structure comprises a first semiconductor substrate, a first bonding layer deposited on a bonding side the first semiconductor substrate, a second semiconductor substrate stacked on top of the first semiconductor substrate and a second bonding layer deposited on a bonding side of the second semiconductor substrate, wherein the first bonding layer is of a horizontal length greater than a horizontal length of the second semiconductor substrate, and wherein there is a gap between an edge of the second bonding layer and a corresponding edge of the second semiconductor substrate.

Abstract: A light emitting diode (LED) and a method for fabricating the same, capable of improving brightness by forming a InGaN layer having a low concentration of indium, and whose lattice constant is similar to that of an active layer of the LED, is provided. The LED includes: a buffer layer disposed on a sapphire substrate; a GaN layer disposed on the buffer layer; a doped GaN layer disposed on the GaN layer; a GaN layer having indium disposed on the GaN layer; an active layer disposed on the GaN layer having indium; and a P-type GaN disposed on the active layer. Here, an empirical formula of the GaN layer having indium is given by In(x)Ga(1?x)N and a range of x is given by 0<x<2, and a thickness of the GaN layer having indium is 50-200 ?.

Abstract: Disclosed is a semiconductor light emitting element (1), which includes: an n-type semiconductor layer (140); a light emitting layer (150), which is laminated on one surface of the n-type semiconductor layer (140) such that a part of the surface is exposed, and which emits light when a current is carried therein; a p-type semiconductor layer (160) laminated on the light emitting layer (150); a multilayer reflection film (180), which is configured by alternately laminating low refractive index layers (180a) and high refractive index layers (180b) that have a refractive index higher than that of the low refractive index layers (180a) and also have transparency with respect to light emitted from the light emitting layer (150), and which is laminated on the exposed portion of the n-type semiconductor layer (140), the exposed portion being on one side of the n-type semiconductor layer; an n-conductor portion (400), which is formed by penetrating the multilayer reflection film (180), and which has one end thereof c

Abstract: An object of the invention is to provide a lighting device which can suppress luminance nonuniformity in a light emitting region when the lighting device has large area. A layer including a light emitting material is formed between a first electrode and a second electrode, and a third electrode is formed to connect to the first electrode through an opening formed in the second electrode and the layer including a light emitting material. An effect of voltage drop due to relatively high resistivity of the first electrode can be reduced by electrically connecting the third electrode to the first electrode through the opening.

Abstract: A COB-typed LED light board for providing mixing light includes a substrate and a plurality of COB light bodies. The COB light bodies, which are provided on a mounting surface of the substrate, emit light with two or more different spectrums. A space distance between the adjacent two LED chips is smaller than 20 mm and is larger than a width of a single LED chip, the outer surface of a glue body which does not contact the mounting surface is provided to contact external atmosphere, and a middle portion of the glue body, formed by cohesion, is higher than a periphery portion thereof, to thus have the COB light bodies with excellent heat dissipation and an even mixing light.

Abstract: An organic light-emitting device cutting off ambient light while keeping emission intensity includes a pair of first and second electrodes opposed to each other; and a plurality of organic semiconductor layers layered and disposed between the first and second electrodes, wherein the organic semiconductor layers include an organic light-emitting layer, the organic semiconductor device further comprising a light-scattering layer layered and disposed between the organic light-emitting layer and at least one of the first and second electrodes. The light-scattering layer includes: organic materials having carrier injection and transport characteristics of transporting electrons and/or holes; and plural particles dispersed among the organic materials so that light emitted from the organic light-emitting layer is passed therethrough.

Abstract: An (Al,Ga,In)N-based light emitting diode (LED), comprising a p-type surface of the LED bonded with a transparent submount material to increase light extraction at the p-type surface, wherein the LED is a substrateless membrane.

Abstract: The embodiment of the present invention provides an LED device, a manufacturing method of the LED device and a mounting structure of the LED device. In order to manufacture the LED device with low manufacturing cost through simple process capable of overcoming thermal fatigue due to heat generation, breaking of wire due to mechanical stress, the method comprises etching a wafer; forming a conductive metal layer from an upper surface to a lower surface of the wafer; bonding a light emitting diode chip to the metal layer which is disposed on the upper surface of the wafer; filling a resin into a space over the light emitting diode chip; and forming an electrode pad on the metal layer which is disposed on the lower surface of the wafer.

Abstract: A light emitting diode package includes a mount, a plurality of LED chips, and a first and a second sealants made of different materials. The mount has an accommodation space and at least one partition member to divide the accommodation space into a plurality of separate cavities. The LED chips are placed in the cavities, and emitting beams of the LED chips exiting through the cavities include a first emission with a first wavelength band and a second emission with a second wavelength band, and the second wavelength band is different to the first one. The first and the second sealants are respectively used for sealing at least one of the LED chips placed in at least one of the cavities through which the first or the second emission exits. The first and the second sealants are separate from each other by the partition member.

Abstract: A light emitting device package is provided. The light emitting device package may include a main body having a cavity including side surfaces and a bottom, and a first reflective cup and a second reflective cup provided in the bottom of the cavity of the main body and separated from each other. A first light emitting device may be provided in the first reflective cup, and a second light emitting device may be provided in the second reflective cup.

Abstract: Disclosed is a light emitting device including a substrate, a light emitting structure arranged on the substrate, the light emitting structure including a first semiconductor layer, a second semiconductor layer and an active layer arranged between the first semiconductor layer and the second semiconductor layer, a first electrode electrically connected to the first semiconductor layer, and a second electrode electrically connected to the second semiconductor layer, wherein the light emitting structure has a top surface including a first side and a second side which face each other, and a third side and a fourth side which face each other.

Abstract: An object of the invention is to provide a lighting device which can suppress luminance nonuniformity in a light emitting region when the lighting device has large area. A layer including a light emitting material is formed between a first electrode and a second electrode, and a third electrode is formed to connect to the first electrode through an opening formed in the second electrode and the layer including a light emitting material. An effect of voltage drop due to relatively high resistivity of the first electrode can be reduced by electrically connecting the third electrode to the first electrode through the opening.

Abstract: A light emitting diode and a fabricating method thereof are provided. The method including the steps of sequentially forming a first-type semiconductor layer, a light emitting layer and a second-type semiconductor layer with a first region and a second region on a substrate. Next, an ion implantation process is performed to make the resistance of the first region be larger than of the second region. Afterward, a first electrode is formed above the first region of the second-type semiconductor layer. Since the method uses the ion implantation process to make the inner resistance of the second-type semiconductor layer various, the light emitting intensity and efficiency may both be increased.

Abstract: A method of manufacturing a light emitting device comprises: mounting and electrically connecting a plurality of solid-state light emitters onto a substrate in a known configuration; screen printing a pattern of at least one photo luminescent material onto a surface of a light transmissive carrier such that there is a respective region of photo luminescent material corresponding to a respective one of the light emitters and mounting the carrier to the substrate such that each region of photo luminescent material overlays a respective one of the light emitters. Where the light transmissive carrier comprises a thermo formable material the method can further comprise heating and vacuum molding the carrier such as to form an array of hollow features configured such that a respective feature corresponds to a respective light emitter and is capable of housing a respective light emitter.

Abstract: An light emitting diode includes an n-type nitride semiconductor layer, a multiple quantum well layer, a p-type nitride semiconductor layer, a window electrode layer, a p-side electrode, and an n-side electrode, which are stacked in this order. The n-side electrode is electrically connected to the n-type nitride semiconductor layer. The window electrode layer comprises an n-type single-crystalline ITO transparent film and an n-type single-crystalline ZnO transparent film. The p-type nitride semiconductor layer is in contact with the n-type single-crystalline ITO transparent film. The light-emitting diode further comprises a plurality of single-crystalline ZnO rods formed on the n-type single-crystalline ZnO transparent film. The respective lower portions of the single-crystalline ZnO rods have a shape of an inverted taper, which sharpens from the single-crystalline n-type ZnO transparent film toward the n-type nitride semiconductor layer.