Abstract: A display array which can reduce the row connections between the display and the driver circuit and methods of manufacturing and operating the same are disclosed. In one embodiment, a display device comprises an array of MEMS display elements and a plurality of voltage dividers coupled to the array and configured to provide row output voltages to drive the array, wherein each row is connected to at least two inputs joined by a voltage divider.

Abstract: A device for emitting white-color light comprises: a light emitting diode including: an LED chip comprising a gallium nitride compound semiconductor containing indium and being capable of emitting a blue color light, and a phosphor capable of absorbing a part of the blue color light and emitting a light having longer wavelength than the blue color light, the blue color light and the light from the phosphor being mixed to make the white-color; a control unit for converting an input to pulse signals; and a driver receiving the pulse signals from the control unit to drive the LED chip, wherein the brightness of the white-color light from the light emitting diode is controlled by a width of the pulse signals.

Abstract: The invention relates to a double sided light emitting diode device (1) comprising a transparent substrate layer (2) with a layer system, featuring at least a first emitting layer (3) and at least a second emitting layer (4).

Abstract: A method of manufacturing an organic thin film transistor, comprising: providing a substrate comprising source and drain electrodes defining a channel region; forming a patterned layer of insulting material defining a well surrounding the channel region; depositing a protective layer in the well; subjecting exposed portions of the patterned layer of insulating material to a de-wetting treatment to lower the wettability of the exposed portions; removing the protective layer; and depositing organic semiconductive material from solution into the well.

Abstract: A system for displaying images is provided. The system includes a tandem electroluminescent device having a first electrode. N electroluminescent units are disposed on the first electrode in sequence, wherein N is an integral and not less than 2. A second electrode is disposed on the Nth electroluminescent unit. N-1interconnecting electrodes are provided, wherein each of the interconnecting electrodes is disposed between two adjacent electroluminescent units. The first electroluminescent unit includes a first emitting layer and a second emitting layer in sequence from the first electrode, and the first and second emitting layer have different physical quantities. The Nth electroluminescent unit includes a third emitting layer and a fourth emitting layer in sequence from the first electrode. The physical quantity of the third emitting layer is the same as that of the second emitting layer. The physical quantity of the fourth emitting layer is the same as that of the first emitting layer.

Abstract: A first layer is formed over a substrate, a light absorbing layer is formed over the first layer, and a layer having a light-transmitting property is formed over the light absorbing layer. The light absorbing layer is selectively irradiated with a laser beam via the layer having a light-transmitting property. When the light absorbing layer absorbs energy of the laser beam, due to emission of gas that is within the light absorbing layer, or sublimation, evaporation, or the like of the light absorbing layer, a part of the light absorbing layer and a part of the layer having a light-transmitting property in contact with the light absorbing layer are removed. By using the remaining part of the layer having a light-transmitting property or the remaining part of the light absorbing layer as a mask and etching the first layer, the first layer can be processed into a desired shape.

Abstract: An integrated circuit including ESD device is disclosed. One embodiment includes a semiconductor region being electrically isolated from adjacent semiconductor regions by an isolating region. Both an ESD device and a device configured to emit radiation are formed within the semiconductor region.

Abstract: An aspect of the present invention provides a semiconductor device, in which densely packaging and high performance of optical elements are realized by a simple manufacturing process. The semiconductor device includes: a first chip module, a second chip module and a bonding layer. The first chip module includes a plurality of optical chips that are bonded within a substantially same plane with a first resin layer. The second chip module includes a plurality of control semiconductor chips and a plurality of connecting chips. The connecting chips include conductive materials piercing through the connecting chips. The control semiconductor chips and the connecting chips are bonded within a substantially same plane with a second resin layer. And the optical chips and the control semiconductor chips are electrically connected through the connecting chips.

Abstract: The present invention provides a semiconductor device by which a light-emitting device that is unlikely to cause defects such as a short circuit, can be manufactured. One feature of a semiconductor device of the present invention is to include an electrode that serves as an electrode of a light-emitting element. The electrode includes a first layer and a second layer. Further, end portions of the electrode are covered with a partition layer having an opening portion. Moreover, a part of the electrode is exposed by the opening portion of the partition layer. One feature of a semiconductor device of the present invention is to include an electrode that serves as an electrode of a light-emitting element and a transistor. The electrode and the transistor are connected electrically to each other. The electrode includes a first layer and a second layer. Further, end portions of the electrode are covered with a partition layer having an opening portion.

Abstract: To provide a semiconductor device with high performance and low cost and a manufacturing method thereof. A first region including a separated (cleavage) single-crystal semiconductor layer and a second region including a non-single-crystal semiconductor layer are provided over a substrate. It is preferable that laser beam irradiation be performed to the separated (cleavage) single-crystal semiconductor layer in an inert atmosphere, and laser beam irradiation be performed to the non-single-crystal semiconductor layer in an air atmosphere at least once.

Abstract: An organic light emitting display device includes: a first substrate; a plurality of organic light emitting diodes on the first substrate; a plurality of spacers spaced apart from each other on sides of light emitting regions corresponding to the plurality of organic light emitting diodes; and a second substrate facing the first substrate and spaced apart from the first substrate at an interval by the plurality of spacers.

Abstract: A method for manufacturing a light emitting device according to the present invention has the steps of: preparing a first member which has an emission layer on a substrate having a compound semiconductor layer through an etch stop layer and a sacrifice layer; forming a bonded structure by bonding the first member on a second member including a silicon layer so that the emission layer is positioned in the inner side; providing a through groove in the substrate so that the etch stop layer is exposed, by etching the first member from the reverse side of the emission layer; and removing the substrate having the through groove provided therein from the bonded structure by etching the sacrifice layer.

Abstract: Provided are a light emitting element array that can perform a time-division driving operation with a small number of driving ICs and a small-sized light emitting device employing the light emitting element array and an image forming apparatus having the light emitting device. A light emitting element array chip (1) includes n pieces of switch thyristors (S) (n is an integer of 2 or more), n pieces of horizontal gate lines (GH) respectively connected to N gate electrodes of the n pieces of switch thyristors (S), a plurality of light emitting thyristors (T) whose N gate electrodes (b) each is connected to any one of the n horizontal gate lines (GH). One ends of CS resistors (RCS) are connected to the N gate electrodes (d) of the n pieces of switch thyristors (S), and the another ends of the CS resistors (RCS) are connected to a common selection signal input terminal (CS).

Abstract: A semiconductor device comprising a plurality of regions of semiconductor material forming a junction at an interface there-between, the junction including a depletion region having a width which varies spatially in at least one direction along the depletion region. Without limitation, the spatial variation in depletion region width is provided by ionised dopants having a concentration which varies spatially along said at least one direction. Alternatively, or in addition, the spatial variation in depletion region width is achieved by varying the thickness of the region(s) of semiconductor spatially along said at least one direction, for example by creating a plurality of cells within said region(s) devoid of said semiconductor material. A method of fabricating a semiconductor device comprising the step of varying the width of the depletion region spatially there-within in at least one direction along the depletion region.

Abstract: According to an embodiment, there is provided a thin film transistor substrate divided into a display area displaying the image and a non-display besides the display area, the thin film transistor substrate comprising: a common voltage line for MPS (mass production system) test and a grounding line for MPS (mass production system) test formed at the edge of the non-display area in parallel; an insulating layer covering the common voltage line for MPS (mass production system) test and the grounding line for MPS (mass production system) test; and an electrode layer formed on the insulating layer corresponded to the common voltage line for MPS (mass production system) test and the grounding line for MPS (mass production system) test. Thus, the present invention provides a thin film transistor substrate and a fabricating method thereof for minimizing defects due to static electricity.

Abstract: A light emitting device containing a semiconductor light emitting component and a phosphor, the phosphor is capable of absorbing a part of light emitted by the light emitting component and emitting light of a wavelength different from that of the absorbed light, is provided. A straight line connecting a point of chromaticity corresponding to a spectrum generated by the light emitting component and a point of chromaticity corresponding to a spectrum generated by the phosphor is substantially along a black body radiation locus in a chromaticity diagram.

Abstract: For an infrared imaging catheter, means of achieving a spread of wavelengths or multiple wavelengths through a stacking arrangement of “monochromatic” laser diodes or LED's are disclosed. Since a stack of diodes or LED's have different temperatures, they produce a wavelength spread many times greater than a single laser diode or LED. The wavelength spread reduces speckle in the corresponding image. Adding wavelengths also improves the corresponding infrared image, since different wavelengths have different light penetration capabilities and can emphasize different biological entities.

Abstract: A light-emitting element array with the improvement of the light-emitting efficiency and the improvement of the uneven amount of light is provided. A light-emitting element array comprises a light-emitting portion array consisting of a plurality of light-emitting portions linearly arranged in a main scanning direction, and a micro-lens formed on each of the light-emitting portions, wherein the micro-lens has a shape of the length of a sub-scanning direction different from the length of the main scanning direction, and the length of the sub-scanning direction is longer than the length of the main scanning direction, and is 3.5 times or less of the length of the main scanning direction.

Abstract: A surface mountable device having a circuit device and a base section. The circuit device includes top and bottom layers having a top contact and a bottom contact, respectively. The base section includes a substrate having a top base surface and a bottom base surface. The top base surface includes a top electrode bonded to the bottom contact, and the bottom base surface includes first and second bottom electrodes that are electrically isolated from one another. The top electrode is connected to the first bottom electrode, and the second bottom electrode is connected to the top contact by a vertical conductor. An insulating layer is bonded to a surface of the circuit device and covers a portion of a vertical surface of the bottom layer. The vertical conductor includes a layer of metal bonded to the insulating layer.

Abstract: A method for laterally dividing a semiconductor wafer (1) comprises the method steps of: providing a growth substrate (2); epitaxially growing a semiconductor layer sequence (3), which comprises a functional semiconductor layer (5), onto the growth substrate (2); applying a mask layer (10) to partial regions of the semiconductor layer sequence (3) in order to produce masked regions (11) and unmasked regions (12); implanting ions through the unmasked regions (12) in order to produce implantation regions (13) in the semiconductor wafer (1); and dividing the semiconductor wafer (1) along the implantation regions (13), wherein the growth substrate (2) or at least one part of the growth substrate (2) is separated from the semiconductor wafer.

Abstract: A light-emitting diode (LED) package having electrostatic discharge (ESD) protection function and a method of fabricating the same adopt a composite substrate to prepare an embedded diode and an LED, and use an insulating layer in the composite substrate to isolate some individual embedded diodes, such that the LED device has the ESD protection.

Abstract: A wiring pattern forming method which is a method of forming a wiring pattern by using a liquid droplet ejection method on a preset area on a substrate, includes: forming a bank on the preset area on the substrate; ejecting a functional liquid including a wiring pattern material on an area surrounded by the bank and drying the functional liquid to form the wiring pattern; and removing part of the bank so as to make a height of the bank and a thickness of the wiring pattern approximately the same.

Abstract: A plurality of transistors are formed on a substrate in a plurality of columns. Each transistor has a first conductivity type region and second conductivity type regions provided on both sides thereof in a column direction, and has an active layer on the side of each second conductivity type region closer to the substrate. Between two columns adjacent to each other, the second conductivity type region on a first side in the column direction of each transistor arranged on a first column, the second conductivity type region on a second side in the column direction of the transistor adjacent to this transistor on the first side in the column direction and the first conductivity type region of each transistor arranged on a second column are electrically connected by a first wire.

Abstract: A system for displaying images includes a thin film transistor array substrate including a substrate with thin film transistors array and at least one light-sensing element containing an amorphous silicon layer formed on the substrate, wherein the light-sensing element has a current flow direction perpendicular to the substrate.

Abstract: Emissive quantum photonic imagers comprised of a spatial array of digitally addressable multicolor pixels. Each pixel is a vertical stack of multiple semiconductor laser diodes, each of which can generate laser light of a different color. Within each multicolor pixel, the light generated from the stack of diodes is emitted perpendicular to the plane of the imager device via a plurality of vertical waveguides that are coupled to the optical confinement regions of each of the multiple laser diodes comprising the imager device. Each of the laser diodes comprising a single pixel is individually addressable, enabling each pixel to simultaneously emit any combination of the colors associated with the laser diodes at any required on/off duty cycle for each color. Each individual multicolor pixel can simultaneously emit the required colors and brightness values by controlling the on/off duty cycles of their respective laser diodes.

Abstract: An active matrix type display device having a plurality of pixel circuits (1) arranged in a matrix shape. The pixel circuit has: a display device (EL); a drive transistor (M1) of a first conductivity type for controlling a current flowing in the display device; a capacitor (C1) provided at a control electrode of the drive transistor; and a switch (M2a, M2b), connected to the control electrode of the drive transistor, for holding a drive control signal at the capacitor. The switch includes a switching transistor (M2a) of the first conductivity type and a switching transistor (M2b) of a second conductivity type in which one main electrode of the switching transistor of the first conductivity type and one main electrode of the switching transistor of the second conductivity type are connected serially.

Abstract: The present invention relates to an organic light emitting element and an organic light emitting device including the same. An impurity layer close to an electrode is doped with a small amount, and an impurity layer for a p-n junction is doped with a large amount, such that a high current may flow under a low voltage.

Abstract: A semiconductor light-emitting device includes: a substrate; a first conductivity type layer formed on the substrate and including a plurality of group III-V nitride semiconductor layers of a first conductivity type; an active layer formed on the first conductivity type layer; and a second conductivity type layer formed on the active layer and including a group III-V nitride semiconductor layer of a second conductivity type. The first conductivity type layer includes an intermediate layer made of AlxGa1?x?yInyN (wherein 0.001?x<0.1, 0<y<1 and x+y<1).

Abstract: A light emitting diode (80) includes a first and a second semiconductor structures (30, 40), and an adhesive layer (34, 46) between the first and the second semiconductor structures. The first semiconductor structure includes a n-type AlGaInP cladding layer (13), a p-type AlGaInP cladding layer (17), an AlGaInP active layer (15) between the n-type and the p-type AlGaInP cladding layers, a transparent conducting layer (62) on the n-type AlGaInP cladding layer, a first electrical contact (82) on the transparent conducting layer, ohmic electrodes (21) ohmic contact the p-type AlGaInP cladding layer, and a reflecting layer (32) on an opposite side of the p-type AlGaInP cladding layer to the AlGaInP active layer. The second semiconductor structure includes a carrier substrate (42), an ohmic contact layer (44) on the carrier substrate, and a second electrical contact (74) on an opposite side of the carrier substrate to the ohmic contact layer.

Abstract: An organic light emitting display device includes a substrate, a display unit that is formed on the substrate, and includes a plurality of organic light emitting regions that emit light, a sealing member disposed above the display unit, and one or more light absorption pattern units formed on a plurality of non-light emitting regions of the display unit.

Abstract: An LED chip package structure with multifunctional integrated chips includes a substrate unit, a light-emitting unit, a chip unit, and a package colloid unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The chip unit is electrically arranged on the substrate unit, and the chip unit is arranged between the light-emitting unit and a power source. The package colloid unit covers the LED chips. The package colloid unit is a strip fluorescent colloid corresponding to the LED chips.

Abstract: A system, structure, and method of making the structure are disclosed for generating a large chemical potential difference between spin-up and spin-down electrons in non-magnetic materials. The device includes an inverse spin valve of a sandwiched layer structure with alternating non-magnetic and magnetic layers. In an embodiment of the invention, the structure is a tri-layer device with a magnetic layer sandwiched by two non-magnetic metals. Once the inverse spin valve structure is provided, an external electric field is applied to the inverse spin valve to generate a large chemical potential difference between the spin-up and spin-down electrons. In an embodiment of the invention, this feature is exploited to create a tunable light emitting diode or laser. In an embodiment of the invention, a dynamical magnetism is induced and controlled in the valve by an electric field. The dynamical magnetization may be used as spin source, or in electronic storage devices.

Abstract: The present invention relates to a semiconductor device in which energy band gap can be reversibly varied. An idea of the present invention is to provide a device, which is based on a semiconducting material (306) in mechanical contact with a material that exhibits a reversible volume change when properly addressed, e.g. a phase change material (307). The device can, for example, be implemented in light emitting, switching and memory in applications. The semiconducting material can be reversibly strained by applying a local volume expansion to the phase change material. The resulting band gap variation of the semiconducting material can be utilized to tune the color of the light emitted from e.g. an LED or a laser. In other fields of application, contact resistance in semiconductor junctions can be controlled, and this feature is highly advantageous in memories and switches.

Abstract: The present invention provides a composite multi-color light emitting diode device comprising a first light emitting diode unit and a second light emitting diode unit that is arranged on top of the first light emitting diode unit. Thereby, a composite light emitting diode device, capable of emitting two different wavelengths of electromagnetic radiation is provided. It is furthermore possible to arrange a third light emitting diode unit. The third light emitting diode unit can be arranged on top of the second light emitting diode unit, thereby providing a stack of three light emitting diode units, or it can be arranged on the first light emitting diode unit, thereby providing two light emitting diode units side-by-side on top of the first light emitting diode unit.

Abstract: A display device includes a plurality of light emitting elements arranged in a matrix. A scan signal is made to flow into a gate signal line and a data signal is made to flow into a source signal line so that the data signal is applied to a source electrode and the scan signal is supplied to a gate electrode of a control TFT arranged at a portion where the both signal lines intersect when viewed from above. Thus, when the control TFT is turned ON, a drive TFT having a gate electrode connected to the drain electrode is turned ON, so that current is supplied from a power supply line via the source electrode and the drain electrode of the drive TFT to an organic EL element and the organic EL element emits light. A holding capacity is present between the control TFT and the drive TFT. Even when the scan signal becomes LOW level and the control TFT turns OFF, the gate potential of the drive TFT is held for a predetermined period of time by the holding capacity and the organic EL element continues to emit light.

Abstract: This invention details how a low cost opto coupler can be made on Silicon On Insulator (SOI) using conventional integrated circuit processing methods. Specifically, metal and deposited insulating materials are use to realize a top reflector for directing light generated by a silicon PN junction diode to a silicon PN junction photo diode detector. The light generator or LED can be operated either in the avalanche mode or in the forward mode. Also, side reflectors are described as a means to contain the light to the LED-photo detector pair. Furthermore, a serpentine junction PN silicon LED is described for the avalanche mode of the silicon LED. For the forward mode, two LED structures are described in which hole and electrons combine in lightly doped regions away from heavily doped regions thereby increasing the LED conversion efficiency.

Abstract: To provide a long lifetime light-emitting element, in particular, to provide a long lifetime white light-emitting element, and to provide a light-emitting element having high luminous efficiency, in particular, to provide a white light-emitting element having high luminous efficiency. In a light-emitting element having, between an anode and a cathode, a first light-emitting layer containing a first light-emitting substance and a second light-emitting layer containing a second light-emitting substance which is provided to be in contact with the first light-emitting layer, the first light-emitting layer is divided into a layer provided on the anode side and a layer provided on the cathode side. At this time, a host material having a hole-transporting property is used for the layer provided on the anode side, and a host material having an electron-transporting property is used for the layer provided on the cathode side.

Abstract: Light emitting diode (LED) structures are described that include a first layer and a light-generating layer, wherein light generated in the light-generating layer generally emerges from the LED structure through the upper surface of the first layer. The coupling out of light generated by spontaneous emission is enhanced by the presence of patterning in the first layer, which may take the form of an embedded photonic quasicrystal, a photonic structure comprising an amorphous array of subregions, or a zone plate structure. The invention provides the benefit of improved light extraction from the LED without undesirable far field illumination patterns.

Abstract: A display device and method for fabricating includes patterning a field shield dielectric layer to expose conductors and form a cavity over the conductors. InkJet printing a semiconductor material fills a portion of the cavity in contact with the conductors. An insulation material is deposited on the semiconductor material. A pixel pad is formed over the insulation material and the field shield dielectric layer. A pixel is formed which includes a thin film transistor with an ink jet printed semiconductor layer.

Abstract: Disclosed is a polarized light emitting diode (LED) capable of emitting polarized light in the front direction thereof by forming a first grating layer on a quantum well layer and forming a second grating layer on a substrate. The polarized LED includes a nitride thin film formed on a substrate, a quantum well layer formed on the nitride thin film, a first grating layer formed on the quantum well layer to allow a part of light generated from the quantum well layer to pass through the first grating layer and to reflect remaining light, and a second grating layer formed on the substrate to rotate the light reflected from the first grating layer such that the reflected light passes through the first grating layer.

Abstract: A sealed infrared radiation source includes an emitter membrane stimulated by an electrical current conducted through the membrane, which acts like an electrical conductor, wherein the membrane is mounted between first and second housing parts, at least one being transparent in the IR range, each housing part defining a cavity between the membrane and the respective housing part of each side of the membrane. The housing parts are at least partially electrical conductive, and a first of the housing parts is electrically coupled to a first end of the electrical conductor and insulated from the second end of the electrical conductor, the second housing part being electrically coupled to a second end of the electrical conductor and being insulated from the first end of the electrical conductor, thus allowing a current applied from the first housing part to the second housing part to pass through and heat the membrane.

Abstract: A method for fabricating a thin film pattern on a substrate, includes the steps of: forming a concave part on the substrate that conforms to the thin film pattern; and applying a function liquid into the concave part.

Abstract: A method for testing a status of a light unit is provided, wherein the method includes electrically coupling the light unit to a controller and transmitting a negative voltage from the controller to the light unit. The method also includes detecting at least one of current and voltage passing through the light unit and determining a status of the light unit based on at least one of the detected current and detected voltage.

Abstract: A surface mountable device having a circuit device and a base section. The circuit device includes top and bottom layers having a top contact and a bottom contact, respectively. The base section includes a substrate having a top base surface and a bottom base surface. The top base surface includes a top electrode bonded to the bottom contact, and the bottom base surface includes first and second bottom electrodes that are electrically isolated from one another. The top electrode is connected to the first bottom electrode, and the second bottom electrode is connected to the top contact by a vertical conductor. An insulating layer is bonded to a surface of the circuit device and covers a portion of a vertical surface of the bottom layer. The vertical conductor includes a layer of metal bonded to the insulating layer.

Abstract: The invention provides light emitting diode illumination source having excellent properties as an illumination source such as a flat spectral distribution in the wavelength region from green to red and a sufficient emission intensity in the red region, comprising a light emitting diode having multiple peaks with a half-value width of 20 nm or more within a range from 480 to 700 nm in a spectral distribution, wherein the minimum of the intensities of the valleys between the peaks in the wavelength range from 480 to 700 nm is 65% or more of the maximum peak intensity in the same range, and an illuminator and a backlight for a liquid crystal display using the illumination source.

Abstract: A method for the production of a stop zone in a doped zone of a semiconductor body having a first side and a second side, comprises the following method steps: applying a mask having cutouts to one of the sides of the semiconductor body, irradiating the side having the mask with proton radiation, carrying out a heat treatment method in order to produce hydrogen-induced donors in the semiconductor body.

Abstract: The present invention relates to the emission of light which occurs in proportion with an electrical signal, an optical signal, or the combination of both. The emission of light may occur due to the passage of current through a light-emitting polymer, or due to energy transfer of excitons from this polymer to light-emitting quantum dots. Optical sensitivity is achieved through the inclusion of another species of quantum dots whose absorption is generally at longer wavelengths relative to the light-emitting material. Light incident upon the device results in an enhanced current flow in the presence of an applied bias, and thus enhanced excitation of the light-emitting moity is achieved in proportion with the optical power absorbed by the light-absorbing moity. Two device architectures are presented, one based on a mutilayer structure in which the functions of light absorption and light emission are separated, and the other in which these functions are integrated within a single active region.

Abstract: An array substrate includes an insulating substrate, pixel circuits arranged in a matrix on the insulating substrate, and video signal lines arranged correspondently with columns which the pixel circuits form. Each pixel circuit includes a drive transistor whose source is connected to a power supply terminal, a pixel electrode, an output control switch connected between a drain of the drive transistor and the pixel electrode, a selector switch connected between the drain and the video signal line, a diode-connecting switch including switching elements connected in series between the drain and a gate of the drive transistor, a first capacitor including an electrode connected to the gate, and a second capacitor including an electrode to which two of the switching elements are connected in parallel.