Abstract: A fuel filter assembly for an internal combustion engine includes a molded plastic housing defining an interior filter chamber. A filter element is operatively supported in the filter chamber. Fuel is passed through the filter chamber to remove impurities. At least one sensor is operatively supported by the housing for sensing at least one condition of the fuel passing through the fuel filter. The sensor includes an element that is exposed to the fuel. A common connector terminal is adapted to provide electrical communication with a source of power. Leads extend between the element and the common connector terminal. The leads are encased in plastic substantially between the element and the common connector terminal such that the leads are sealed from contact with the fuel. The present invention is also directed toward a method of manufacturing a fuel filter for an internal combustion engine.

Abstract: An electrical apparatus according to the present disclosure comprises a molded device having a molded portion and being formed via an overmolding process. The electrical apparatus includes a wire set at least partially overmolded within the device, the wire set having an outer sheath surrounding a plurality of wires. The molded portion surrounds a portion of the wire set. The electrical apparatus further includes polyurethane bonding material occurring between the outer sheath and the molded portion. The polyurethane bonding material bonds at least a portion of the wire set to the molded portion during the overmolding process.

Abstract: A method of producing an electronic module having an electronic part and a mounting part for mounting the electric module to an external apparatus, includes a step of disposing the electronic part in a cavity of a die, a step of disposing the mounting part in the die with a first portion of the mounting part being positioned in the cavity and a second portion of the mounting part being outside of the cavity, a step of supplying a resin into the cavity of the die, a step of curing the resin while the electronic part and the first portion of the mounting part are immersed in the resin in the cavity of the die, and a step of extracting the resin from the cavity after the resin is cured in the step of curing.

Abstract: In order for light conductor pins (6) in dead hole channels (5) of a plastic cover not to be melted together at their entire side walls with the cover they are produced through a particular injection molding tool in the same tool as the cover and the tool slide (104) which is a component of the injection molding tool (100) is aligned in the injection molding tool (100) with the dead hole channels (5) and inserted into the dead hole channels. The front plate is integrally molded with the base component before or after the light conductor pins are inserted into the base component. When the integral molding is performed after inserting the light conductor pins (6) the integral molding is also provided e.g. at a face of the inserted light conductor pins (6).

Abstract: Injection-molding processes and systems are described herein. An exemplary method involves: (a) holding one or more inserts in a desired position within a mold cavity by contacting a retractable core to at least a portion of each insert, wherein the retractable core is a feature of a mold plate; (b) while the one or more inserts are being held in the desired position by the retractable core, initiating an injection of molten plastic into the mold cavity; (c) retracting the retractable core from the one or more inserts while continuing the injection of molten plastic into the mold cavity, wherein retracting the retractable core creates additional cavity space within the mold cavity between the retractable core and the one or more inserts; and (d) continuing the injection of molten plastic into the mold cavity until the mold cavity, including the additional cavity space, is filled.

Abstract: First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port of the horizontal nozzle. Thus, the liquid resin is supplied into a cavity. Thereafter the upper mold section and the lower mold section are closed. Consequently, an electronic component mounted on a substrate is dipped in the liquid resin stored in the cavity. Therefore, the electronic component is resin-sealed on the substrate by compression molding.

Abstract: According to one embodiment, a resin supply device is configured to supply granular resins to a resin mold device including a first mold provided with a cavity and a second mold mated to the first mold. The resin supply device includes a first mechanism and a second mechanism. The first mechanism is configured to juxtapose multiple granular resins on an adsorption surface by adsorbing the multiple granular resins on the adsorption surface larger than the granular resins, and form an adsorbed resin body with a uniform thickness. The adsorbed resin body is made of the adsorbed multiple granular resins on the adsorption surface. The second mechanism is configured to drop the multiple granular resins adsorbed on the adsorption surface into the cavity by adsorption-release of the adsorption surface.

Abstract: The invention relates to an electric motor with an outer rotor and an inner rotor, wherein the stator carrying the excitation coils is formed as a hollow cylinder and is arranged between the cup-shaped outer rotor and the inner rotor and is rigidly connected on the front to the housing or to a part of the electric motor rigidly connected to the housing, wherein the stator comprises a plurality of stator teeth which rest against supports extending in the axial direction, wherein the supports are formed by an injection moulding composition of plastics material, in particular a thermosetting plastics material which fills the space between the respectively adjacent excitation coils and the stator teeth, the supports extending into and/or through the metallic housing or a metallic part rigidly connected to the housing and rest against it.

Abstract: Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition; (c) contacting the first and second polymerizable compositions; (d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and (e) optionally separating the mold from the second polymerized composition. Light emitting devices prepared according to the method are also described.

Abstract: A housing (1) for an optoelectronic component is indicated. The housing (1) comprises a housing body (2) and first and second electrical terminal strips (11, 12), which extend in part inside the housing body (2) and are guided out of the housing body (2) at a first side face (4a). Outside the housing body (2) the two terminal strips (11, 12) are bent in such a way that they comprise a first portion (11c, 12c), which extends at an angle to the first side face (4a), and a second portion (11d, 12d), which extends with spacing (D) along the first side face (4a). A method for producing such a housing (1) is also indicated.

Abstract: A method for making a marine electromagnetic survey streamer includes affixing connectors to longitudinal ends of a strength member. At least one signal communication line is extended along the length of the strength member. The strength member, connectors, and at least one signal communication line form a mechanical harness. Electrodes are affixed to the mechanical harness at selected positions. The mechanical harness is drawn through a co-extruder. The co-extruder fills void spaces in the harness with a void fill material. The co-extruder applies a jacket to an exterior of the void filled harness.

Abstract: A resin sealing device includes a lower die, an upper die which is arranged over the lower die, on a lower surface side of which a concave portion is provided, and to a bottom surface peripheral portion of the concave portion of which a projection portion projecting toward an opening portion side of the concave portion to raise partially a bottom surface is provided, and a protection film provided on a lower surface side of the upper die and adhered along a concave surface of the concave portion by adsorbing, wherein the stacked wiring substrate is sealed with a resin by making a fused resin flow into a cavity including a space between the stacked wiring substrate from a resin supplying portion, in a state that the stacked wiring substrate in which a plurality of wiring substrates are stacked via connection bumps is arranged and sandwiched between the lower die and the concave portion of the upper die.

Abstract: There is provided a case of an electronic device having an antenna pattern embedded therein, the case including: a radiator frame injection molded so that a radiator including an antenna pattern part formed of a metal sheet is exposed on one surface thereof; a case frame injection molded upward of the radiator frame, such that the radiator is embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inward of the case frame.

Abstract: An electrolytic cell includes a plate stack including a plurality of plates spaced apart to define a plurality of channels extending therebetween, a housing arranged around the plurality of plates, and a plurality of terminals connected to the plate stack for placing an electrical potential thereacross. The cell can also include a plurality of adhesive strips arranged between the plurality of plates and further defining the plurality of channels. A method of making an electrolytic cell includes arranging a manifold section mold having a plurality of openings therein over a plurality of pins, arranging a first end of a plate stack in the mold such that the plurality of pins extend into the plurality of channels, and molding a first manifold section.

Abstract: The invention relates to an electric component and a pin header. The component includes a first member including a first side and a second side, wherein the first member includes one or more openings extending between the first side and the second side. A body portion of moulding material is provided on the first side of the first member. A frame containing one or more electrical leads extending from the frame through the corresponding openings of the first member is provided, such that the first member and the frame cooperate to substantially closes said openings around one or more of said one or more electrical leads. Consequently, moulding material cannot pass through the openings.

Abstract: A junction box comprising: a back wall and at least one side wall integrally formed as a single unit, the back wall supported by the at least one side wall, wherein the back wall and side wall define an inner cavity when the junction box is placed against a surface; and one or more pass holes formed on at least one of the back wall and side wall for providing access to the inner cavity when the junction box is placed against the surface.

Abstract: Plug connections are proposed on radar sensors having plug pins which are inserted into plastic, in which the plastic (5, 6; 11) which surrounds the plug pins (4) is at least partially provided with a granulate which absorbs radar waves, such that the electrical impedance of the plastic (5; 11) has a high value in the low-frequency range, and the plastic (6) has a characteristic which absorbs radar waves in the region of higher-frequency radar waves. For this purpose, the plug pins (4) can be surrounded by a layer of plastic (5; 11) without radar-absorbent granulate, and the rest of the area surrounding the plug pins (4) consists of the plastic (6) with the granulate which absorbs radar waves.

Abstract: The present invention relates to a method of manufacturing a light emitting unit including mounting at least one light emitting element on a printed circuit board (PCB), connecting at least one terminal to the PCB, the at least one terminal to provide power to the at least one light emitting element, and molding a housing to enclose a light emitting part including the PCB and the at least one terminal.

Abstract: An electric motor includes: a rotor configured to rotate about a rotating shaft; a stator having a coil; a mold resin configured to mold the stator, and a case body configured to hold the stator molded by the mold resin. The stator comprises a bus ring which is provided along a circumferential direction of the stator and which is connected to the coil. The bus ring is provided on a side opposite to the case body.

Abstract: A method for manufacturing a sensor in which a sensor element, which comprises at least a first housing, is at least partially encapsulation-molded in an encapsulation-molding process. As a result of the encapsulation-molding process a sensor housing is formed. The sensor element is mechanically connected to a support element and/or accommodated by the support element, after which the sensor element and the support element are encapsulation-molded in a common encapsulation-molding process for forming the sensor housing.

Abstract: A crash sensor for use in a safety system of an automotive vehicle is molded directly into a body component, with no intervening housing being provided. The body component may be a vehicle cross member, such as for reinforcing a radiator grill opening. The crash sensor is molded into the body component together with connections and/or connecting lines and/or plug-in connections and/or electronic circuit board. The crash sensor may be encased in a protective layer prior to being molded into the body component.

Abstract: Method of encapsulating optoelectronic components, by embedding the components to be encapsulated between a first transparent polymer layer and a second polymer layer, which is filled with unactivated foaming agent, and then activating the foaming agent, so that the two polymer layers join to one another, in particular weld to one another, and the components are enclosed between the two polymer layers.

Abstract: The objective of the invention is to provide a method of manufacturing a semiconductor device that allows individual molding of plural semiconductor chips carried on a surface of the substrate. It includes the following process steps: a process step in which plural semiconductor elements 102 are arranged on the surface of substrate 100; a process step in which the inner side of substrate 102 is fixed on lower die 130; a process step in which liquid resin 114 is supplied from nozzle 112 onto each of the semiconductor elements in order to cover at least a portion of each of semiconductor chips 102; a process step in which the upper die having plural cavities 144 formed in one surface is pressed onto the lower die, and liquid resin 114 is molded at a prescribed temperature by means of plural cavities 144; and a process step in which cavities 144 of upper die 140 are detached from the substrate, and plural molding resin portions are formed individually.

Abstract: A method of manufacturing a medical electrical lead includes molding a lead body pre-form, stringing an electrode onto the pre-form and overmolding the pre-form with a polymer to form a lead body portion. The pre-form has a proximal end, a distal end and at least one lumen extending between the proximal and distal ends. At least one asymmetric region of the pre-form has a transverse cross-section that has a non-circular outer dimension. The overmolding causes the asymmetric region to become substantially circular.

Abstract: A substrate member is a manufacturing component of a module including electronic components mounted on a substrate and sealed with resin. The substrate member has substantially a plate-like shape and is to be the substrate later. A manufacturing process of the modules includes a mounting step of mounting electronic components on a component side of the substrate member, and a sealing step of supplying resin to flow on the component side so that the mounted electronic components are sealed with the resin. The mounting step includes mounting a first electronic component having substantially a flat mounting surface in a first mounting region specified on the component side so that a gap is formed between the mounting surface and the component side. The component side is provided with a first groove for boosting the resin to fill up the gap in the sealing step. Thus, insufficient filling of the resin in the gap between the substrate member and the electronic component is suppressed.

Abstract: An electronic circuit device comprises: a printed circuit board mounted with electronic components; a resin-molded portion formed of resin so disposed that the electronic components are covered therewith; a convex connector that has metal terminals for connection and is exposed from the resin-molded portion; and a sealing member wrapped around the resin-molded portion.

Abstract: Device for identifying articles such as animals, comprising a male part and a female part, which male part comprises an arrow-shaped element and which female part is provided with a passage with a front end and a rear end, wherein the arrow-shaped element can be inserted into the passage along the front end, wherein the passage is provided close to the front end with at least one protruding element, and wherein the passage is partly closed close to the rear end by a closing part, wherein the partly closed passage, including the protruding element, are manufactured integrally from a hard material; method for manufacturing such a device.

Abstract: A LED illuminating arrangement with a plurality of illuminating devices connected in parallel with wires aligned at a one-plane manner. The illuminating device comprises a shell formed by injection molding of ABS plastic, an illuminating unit and a sealing arrangement. The shell has a top side, two sidewalls defining two guiding slots for wires passage and one or more chambers indented from the top side. The illuminating unit includes a printed circuit board and one or more diodes mounted on an exposed portion of the circuit board within the chamber in series for providing illumination. The sealing arrangement is made of thermosetting polymer sealing at each chamber, protecting the diode and the exposed portion of the circuit board against water.

Abstract: A method for manufacturing an integrated solar cell and concentrator. The method includes providing a first photovoltaic region and a second photovoltaic region disposed within a first mold member. A second mold member is coupled to the first mold member to form a cavity region. The cavity region forms a first concentrator region overlying a vicinity of the first photovoltaic region and a second concentrator region overlying a vicinity of the second photovoltaic region. The method includes transferring a molding compound in a fluidic state into the cavity region to fill the cavity region with the molding compound and initiating a curing process of the molding compound to form a first concentrator element and a second concentrator element overlying the respective photovoltaic regions.

Abstract: Lighting apparatus includes a casing (401) moulded from an electrically insulating and thermally conductive plastics material. It also includes a plurality of light emitting diode devices (501) configured to emit light in response to receiving electrical power. A plurality of metallic assemblies (601) are provided, in which each one provides electrical power to a respective one of the light emitting diodes. In addition, these assemblies conduct heat away from their respective light emitting diode to the casing. They are directly supported by the casing and allow each light emitting diode to be individually replaced.

Abstract: A current interrupter assembly includes an insulating structure, a current interrupter embedded in the structure, a conductor element embedded in the structure, a current interchange embedded in the structure and connected to create a current path between the current interrupter and the conductor element, and a semiconductive layer covering at least a portion of the conductor element so as to reduce voltage discharge between the conductor element and the structure.

Abstract: An exemplary embodiment of a temperature sensor includes housing, and a solid state temperature sensing device disposed within the housing. A first wiring conductor makes electrical connection from outside the housing to a first terminal of the sensing device. A second wiring conductor makes electrical connection outside the housing to a second terminal of the device. The housing is an over-molded plastic structure encapsulating the sensing device and portions of the first and second wiring conductors. The plastic structure is fabricated of a thermally conductive material. A method for fabricating a temperature sensor positioning a sensor assembly including an elongated circuit board, a solid state sensing device mounted to a tip of the circuit board, and a portion of a cable assembly electrically connected to the circuit board within a mold assembly defining a housing cavity.

Abstract: An over-molded harness including a plurality of bundled flexible electric wires, an electrical or electronic element electrically connected between at least two of the wires, and at least a portion of the bundled electrical wires having an over-molded insulative covering, whereby the electrical or electronic element is unsupported by other than primarily by the over-molded insulative covering and secondarily by the flexible electric wires, the electrical or electronic element being both precisely located and completely enclosed within the insulative covering.

Abstract: An electrical connector for a coaxial cable with a solid outer conductor, the connector in combination with a cable and a method for manufacturing. The electrical connector having a connector body with a bore between a connector end and a cable end. The bore having an inner diameter shoulder at the cable end. A cylindrical sleeve positioned in the bore abutting the inner diameter shoulder. An annular groove open to the cable end, between the cylindrical sleeve and the cable end of the connector body. The annular groove dimensioned to receive an end of the solid outer conductor.

Abstract: A waterproof connector with sealing capability includes a connector housing with a plurality of conductive terminals mounted therein. The terminals are arranged around the perimeter of a circle with contact portions exposed at the radial outermost extents along the circle. The housing has a central opening around which the terminals are arranged and the terminals are each bent into a circular arc in their mounting on the housing. The housing is over molded around the terminal at intermediate portions thereof to provide a liquid proof barrier.

Abstract: A conductivity sensor is described in which electrodes are held in a desired position within a housing of the sensor by a number of slots accurately positioned within the housing. In one embodiment the slots are integrally formed within the housing. Once the electrodes have been inserted into the slots a thermoset resin is poured into the housing and cured. A through bore is then drilled through the housing, the electrodes and the cured resin to form a flow conduit through the sensor. A dual frequency excitation technique is also described that allows a measurement tote obtained of a polarisation resistance of the electrodes. In one embodiment this measurement is stored and used to correct subsequent conductivity measurements.

Abstract: An electronic control unit includes a printed wiring board (50), electronic components (51 to 53) mounted on the printed wiring board (50), and a synthetic resin coating (57) formed by injection molding to cover the printed wiring board (50) and the electronic component (51 to 53). The electronic components (51 to 53) are housed in a protective case (75) that can resist pressure and heat during the injection molding of the coating (57). Thus, in the electronic control unit, an electronic component is not damaged by formation of a coating by injection molding so that the electronic control unit can always function normally.

Abstract: The invention relates to a potting method and a device (100) for potting an excitation circuit that is arranged inside a rotor body. Said excitation circuit has a circuit board (102, 103) having contacts (103, 103?) on the edge of said circuit board (102, 103), the contacts (103, 103?) being arranged in a tolerance zone (109) around a cylindrical peripheral surface (110) that is concentric to the rotor body. The excitation circuit is located inside a potting zone (101) which is sealed in a liquid-tight manner by a toroidal elastic ring (111) in such a manner that surfaces of the contacts (103, 103?) lying within the tolerance zone (109) are at the same time in contact with the toroidal elastic ring (112).

Abstract: A water and/or airtight electrical socket for portable electronic devices includes sealing elements that are shaped like an arc, and arranged to seal only a portion of the perimeter of the socket-plug interface. When this arc element experiences pressure, it will mechanically relay the force caused by the pressure only to that section of the perimeter of the socket-plug interface that it is arranged to seal. It will not relay mechanical forces any further. This way, the mechanical effect of any extra asymmetric pressure will simply be limited to increasing the pressure of the seal in the perimeter section of that particular sealing element, thereby tightening the seal further still. This allows the socket opening to be sealed in a water- and/or airtight manner even in asymmetric pressure conditions, both when there is no plug in the socket and also when a plug is inside the socket.

Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.

Abstract: An electronic module assembly (EMA) for an implantable medical device is disclosed. The EMA includes conductive strips connected to a non-conductive block. The non-conductive block possesses, a top side, a bottom side, a front side and a back side. A seamless non-conductive barrier extends from the bottom side and between the front side and the back side. The barrier prevents a pin from contacting another pin and eliminates welding of the ground pin to the side of the ferrule.

Abstract: An hermetic sealing apparatus is discussed. The apparatus may include one or more of the following a glass mask disposed on an upper surface of a first substrate, a support member disposed on an upper surface of the glass mask, a laser irradiation member positioned spaced on the upper surface of the glass mask, a plurality of lower support members disposed in a contour region of a lower surface of the second substrate, and pressing members disposed on a lower surface of the lower support members.

Abstract: A connector includes a socket having a generally rectangular shape, the socket including socket contacts, lock mechanisms and retainer mechanisms; and a header having a generally rectangular shape, the header including header contacts and lock mechanisms and being couplable with the socket. The lock mechanisms of the socket and the header are respectively formed from the socket contacts and the header contacts, the lock mechanisms of the socket being formed by cutting away a portion of the socket contacts. The lock mechanisms of the header also serve as retainer mechanisms thereof. The lock mechanisms of the socket and the header are arranged substantially in the same row as the socket contacts and the header contacts and positioned near four corners of the socket and the header, respectively. The lock mechanisms of the socket and the header are configured to keep the socket and the header in a coupled state.

Abstract: An apparatus comprising: a substrate; an electronics module mounted on the substrate; and an injection molded layer in contact with the substrate; wherein the substrate and the injection molded layer form a portion of a rigid housing.

Abstract: In a method of manufacturing an electronic device, an electronic element is disposed on a wiring plate that is electrically coupled with a connector terminal, a first surface of the wiring plate is covered with a first casing element and a second surface of the wiring plate is covered with a second casing element to form an electronic circuit part, the electronic circuit part is disposed in a case cavity of a molding tool, and a resin is filled into the case cavity to form the resin-molded case while keeping a state where a first pressure that pushes the first casing element toward the wiring plate and that changes with time is substantially equal to a second pressure that pushes the second casing element toward the wiring plate and that changes with time.

Abstract: The case mold type capacitor has a capacitor element, a pair of terminals, and molding resin. Each terminal of the pair is connected to a first electrode and a second electrode of the capacitor element, respectively. The capacitor element is embedded in the molding resin in a manner that a terminal section disposed at an end of each of terminals are partially exposed to outside. The molding resin has epoxy resin containing inorganic filler and a moisture absorbent mixed in the epoxy resin.

Abstract: A method of manufacturing an electronic component minimizes the occurrence of voids and degradation of characteristics in a resin-sealed portion, while reducing the costs thereof. A sealing step for sealing surface acoustic wave elements by a sealing resin member formed from a resin film is performed by mounting the surface acoustic wave elements on a collective mounting substrate and the resin film in a bag with a gas-barrier property, and causing the resin film to infiltrate between the surface acoustic wave elements mounted on the reduce-pressured-packed collective mounting substrate to be hermetically sealed by the pressure difference between the inside and the outside of the bag.

Abstract: A mold resin molding method is provided with: providing a semiconductor device including a first wiring board and a second wiring board electrically connected to the first wiring board through a solder ball; providing a metal mold including a die plate which is independently provided to enable an approach/separation to/from the second wiring board; inserting the semiconductor device into a cavity of the metal mold; abutting the die plate on a surface side of the second wiring board through a release film; injecting a mold resin in a void between the first wiring board and the second wiring board while applying a first pressure from the die plate to the second wiring board; and further injecting the mold resin in the void while applying a second pressure which is higher than the first pressure from the die plate to the second wiring board.

Abstract: A method of sealing, by low-pressure injection of reactive resin, an electronic sensor placed in a housing consisting of at least two attached elements, includes the following steps: i. assembly of the sensor within the elements of the housing, ii. locking of the elements of the housing, in order to form an injection jacket, iii. low-pressure injection of a reactive resin through at least one filling orifice of the injection jacket, iv. continuing injection until the reactive resin overflows into at least one overflow container provided to contain the excess reactive resin, characterized in that filling orifice(s) and overflow container(s) are incorporated in the injection jacket.

Abstract: The invention relates to a method for producing a plastic housing, where at least one first plastic housing part with at least one guide or bearing for at least one mechanically movable component, in particular a sensor, is produced in a first molding step, the at least one first plastic housing part is overmolded in a second molding step while a second plastic housing part is being formed, in order to form an integral plastic housing. Moreover, the invention relates to a plastic housing with at least one first plastic housing part including at least one guide or bearing for at least one mechanically movable component, where the at least one plastic housing part is entirely or partially overmolded by a second plastic housing part so that the integral plastic housing is formed.