Abstract: A method of molding a substrate containing a plurality of electronic devices by providing a carrier comprising a frame which includes an adhesive film. The substrate is mounted onto the adhesive film of the carrier such that the frame surrounds the substrate. The carrier is placed in a mold such that the frame is located at a clamping area of the mold and the substrate is located at a molding area of the mold where molding cavities are located. The frame is clamped at the clamping area while the electronic devices are located in the molding cavities for molding with an encapsulant.

Abstract: A method of making a plastic container having an RFID tag in a wall of the container includes providing a mold having a mold core and mounting an insert on the core. The insert includes an RFID tag surrounded by a plastic housing, which preferably is retained on the core for example by heat of the core partially melting the housing. A plastic preform is formed in the mold around the core and the insert, preferably by injection molding, such that the insert is embedded in a wall of the preform. The preform is then blow molded into a plastic container having the insert embedded in a wall of the container. The insert preferably is mounted on an end of the core such that the insert is in the base wall of the container following blow molding. The RFID tag preferably is externally covered by plastic material in the preform as molded, and in the container as blow molded, so that the RFID tag is not externally exposed in the preform or the container.

Abstract: The present invention relates to a double layer injection mould LED bulb, in which the main improvements are: the epoxy resin light body at the top of the conducting bracket of a traditional LED light is specially designed as one epoxy resin injection mould body integrated with a PC or injection mould shell; two positioning grooves are provided on the right and left of the opening at the lower part of the shell so that the two shoulders of the conducting bracket may slide into the grooves for positioning and a small quantity of injection mould body may be condensed and moulded shortly after injection.

Abstract: A resin sealing device includes a lower die, an upper die which is arranged over the lower die, on a lower surface side of which a concave portion is provided, and to a bottom surface peripheral portion of the concave portion of which a projection portion projecting toward an opening portion side of the concave portion to raise partially a bottom surface is provided, and a protection film provided on a lower surface side of the upper die and adhered along a concave surface of the concave portion by adsorbing, wherein the stacked wiring substrate is sealed with a resin by making a fused resin flow into a cavity including a space between the stacked wiring substrate from a resin supplying portion, in a state that the stacked wiring substrate in which a plurality of wiring substrates are stacked via connection bumps is arranged and sandwiched between the lower die and the concave portion of the upper die.

Abstract: There is provided an electronic device case having a low frequency antenna pattern embedded therein, the case including: a radiator frame injection molded using a polymer mixture containing a magnetic substance component so that a radiator including a low frequency antenna pattern part is formed on one surface thereof; a case frame injection molded upwardly of the radiator frame and provided with the radiator embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inwardly of the case frame.

Abstract: An electronic component mounting structure includes a flexible circuit board having terminal connection patterns formed thereon and a light-emitting component provided with electrodes. The light-emitting component is placed on the flexible circuit board, and a synthetic resin casing is injection-molded to cover the light-emitting component and a portion of the flexible circuit board surrounding the light-emitting component placed thereon, whereby the electrodes of the light-emitting component and the terminal connection patterns of the flexible circuit board are connected in abutting contact with each other.

Abstract: An insert molding apparatus includes a first mold and a second mold. The first mold has at least two cavity plates which cooperatively define at least one receiving groove therebetween. At least two connecting elements each have its one end positioned in one of the at least two cavity plates while the other end passing through the other cavity plate for movably connecting the at least two cavity plates with each other. At least one elastic element is compressibly disposed between and against the cavity plates in such a manner such that the at least two cavity plates are capable of contacting with each other or separating from each other. The second mold is engaged with the first mold for compelling one of the at least two cavity plates to move toward the other cavity plate so that the at least two cavity plates are in contact with each other.

Abstract: To provide an assembly which is as small as possible which contains a well-protected component and effectively dissipates heat, and to provide a device and a method for use in the rapid manufacture of such an assembly, an assembly includes a component and a housing from which the component is partially separated by narrow casting gaps filled with a casting compound containing a relatively large amount of filler. For the manufacture of such an assembly, a device is used for filling with casting compound and which includes a mounting for securing the assembly in a position which permits air to escape from the casting gaps, which have an external connection during filling. Also there are supply containers and supply lines for the casting compound which open into the casting gaps, and an apparatus for generating pressure. A method which is used to fill narrow casting gaps with casting compound by using such a device.

Abstract: A plug assembly comprises a molded plug first and second ends, front and back surfaces, and extending along a longitudinal axis. The plug includes a socket extending from the front surface at least partially through the plug along a width axis. The socket defines at least one hole extending at least partially therethrough. The plug assembly also includes a retainer at least partially molded within the plug, with a first end adjacent the first end of the plug and a second end adjacent the second end of the plug. Additionally, the plug assembly includes a first wire set connected to the socket within the plug. The plug assembly further includes a first securing member securing the first wire set to the retainer within the plug, adjacent the first end of the retainer, to hold the first wire set in a fixed position within the plug during the overmolding process.

Abstract: A method for forming an enclosure for enclosing internal electronic components of an electronic device is provided, which comprises: performing a first injection molding process, the first injection molding process forming at least a first wall of the enclosure; allowing the at least a first wall of the enclosure to solidify; thereafter performing a second injection molding process, the second injection molding process forming at least a second wall of the enclosure, the at least a second wall of the enclosure fusing with the at least a first wall of the enclosure during the second injection molding process, the at least second wall of the enclosure forming at least one different side of the enclosure than the at least first wall of the enclosure; and allowing the at least a second wall of the enclosure to solidify, the at least a second wall of the enclosure being integrally formed with the at least a first wall of the enclosure to thereby form a single-piece multi-walled enclosure.

Abstract: A device for providing the edge of a starting sheet of an electrode used in the electrolytic refining or recovery of metals with a dielectric part comprises a die space, in which the edge of the starting sheet of the electrode can at least partly be fitted, and a feeding device of the dielectric material for feeding the dielectric material into the die space. The device comprises changing members of the volume of the die space for pressing the dielectric material in the die space to that edge of the starting sheet of the electrode, which is at least partly fitted in the die space.

Abstract: A molding apparatus for an electronic device comprises a first mold chase, a second mold chase and a middle plate which is configured to be clamped together with the electronic device between the first mold chase and second mold chase during molding. A molding cavity formed in the middle plate is configured for receiving molding compound. A package pin is mounted on the middle plate to be movable with the middle plate, and a portion of the package pin is positioned to protrude into the molding cavity to form a mark in the molding compound when molding compound is molded around the said portion of the package pin.

Abstract: Compression molded cable structures and systems and methods for manufacturing molded cable structures are disclosed.

Abstract: Compression molded cable structures and systems and methods for manufacturing molded cable structures are disclosed.

Abstract: The present invention encompasses a method of forming a housing that locates an internal element. This method is instigated by firstly the steps of locating an internal element within a mould, and then introducing a plastic material into the mould. Next the mould is rotated to form a plastic exterior surface of a housing on the internal surface of the mould with said internal element being located inside the exterior surface of the housing formed.

Abstract: A sealing frame for delimiting a surface of a component which is to be covered with a molding compound includes an upper frame part and a lower frame part which may be detachably joined together. The component to be covered with the molding compound is enclosable by the upper frame part and the lower frame part in such a way that a cavity is formed by the sealing frame and the component. The component is inserted into the upper frame par and lower frame part, and the upper and lower frame part are joined to form the sealing frame, so that the cavity is formed which is enclosed by the component and the upper frame part, and a molding compound is introduced into the cavity and cured to form a cover.

Abstract: Method of encapsulating optoelectronic components, by embedding the components to be encapsulated between a first transparent polymer layer and a second polymer layer, which is filled with unactivated foaming agent, and then activating the foaming agent, so that the two polymer layers join to one another, in particular weld to one another, and the components are enclosed between the two polymer layers.

Abstract: A device configured to maintain an electric circuit in a fixed position during an overmolding process comprises a wire retainer configured to hold the electric circuit taut and in a fixed position while being molded within a molded item. The retainer has a first end and an opposite second end, and includes a first bushing defining a mounting hole for the molded item extending along a width axis. The built-in bushing includes front and back surfaces configured to be aligned and substantially co-planar with the front and back surfaces of the molded item. The device also includes a first securing member configured to secure a portion of the electric circuit to the retainer within the molded item, to hold the electric circuit in a fixed position within the molded item during the overmolding process.

Abstract: A housing includes a first main body, a second main body, and a antenna. The second main body is attached to the first main body. The antenna is formed between the first main body and the second main body by an injection molding process. The antenna is partially exposed from the first main body and the second main body to form a terminal. The present disclosure further discloses a method for making the housing.

Abstract: A resin molded article (1) is formed such that a primary molded article (10), collars (40) and a metal flat plate (50) are molded integrally as inserts in a secondary molded portion (30). A rib (12) extends in a longitudinal direction along a surface of the primary molded article (10) that is adjacent to a surface facing a gate (62), but not a terminal surface (13). Supports (61) are provided intermittently along the longitudinal direction on a cavity inner surface (63) of a molding die (60) for supporting the rib (12). The primary molded article (10) is reinforced by the rib (12), and is not likely to be deformed by resin injected from the gate (62) and is not likely to be displaced.

Abstract: A method for manufacturing an integrated solar cell and concentrator. The method includes providing a first photovoltaic region and a second photovoltaic region disposed within a first mold member. A second mold member is coupled to the first mold member to form a cavity region. The cavity region forms a first concentrator region overlying a vicinity of the first photovoltaic region and a second concentrator region overlying a vicinity of the second photovoltaic region. The method includes transferring a molding compound in a fluidic state into the cavity region to fill the cavity region with the molding compound and initiating a curing process of the molding compound to form a first concentrator element and a second concentrator element overlying the respective photovoltaic regions.

Abstract: A vacuum mandrel for use in fabricating an implantable electrode comprises a hollow body member and a first groove provided radially on an outer surface of the hollow body member. The first groove is adapted to receive an implantable electrode and retain the electrode in place with a vacuum pressure during an elastomeric encapsulation of the electrode. The vacuum mandrel further comprises a vacuum port provided in the first groove.

Abstract: A sensing device for detecting a physical quantity includes a molded part and a sensor element in the molded part. The sensor element includes an enclosure that is formed from the molded part and an injection-molding compound. A connection element may be connected to the sensor element. An interface may be between the sensor element and the connection element.

Abstract: A current interrupter assembly includes an insulating structure, a current interrupter embedded in the structure, a conductor element embedded in the structure, a current interchange embedded in the structure and connected to create a current path between the current interrupter and the conductor element, and a semiconductive layer covering at least a portion of the conductor element so as to reduce voltage discharge between the conductor element and the structure.

Abstract: An antenna pattern frame includes an antenna radiator receiving an external signal and transmitting the received external signal to an electronic device, a radiator frame having the antenna radiator on a surface thereof, and a guide boss protruding from the radiator frame and preventing the radiator frame from moving vertically in a mold for manufacturing an electronic device case having an inner space having a shape corresponding to that of an electronic device case.

Abstract: Two catalyst electrode layers (CEL) are separately formed on two surfaces of a proton exchange membrane (PEM). The structure and processes are simple in the present invention for obtaining a membrane exchange assembly (MEA) with its thickness controllable. The MEA obtained can have a structure of CEL+PEM+CEL?. If a gas diffusion layer (GDL) is added before obtaining the CEL, a MEA having a structure of GDL+CEL+PEM+CEL?+GDL? is obtained.

Abstract: The manufacture of a hearing instrument having a hard inner shell and a softer outer covering, for insertion into the ear canal of the user, may be accomplished using rapid manufacturing and prototyping techniques. Starting with a digital model of the ear canal, a mold for the softer outer covering may be fabricated using a process such as stereo lithography.

Abstract: An RFID assembly includes a base having a peripheral wall, an RFID inlay including an RFID tag disposed within the peripheral wall, and a disk having a periphery engaged by the peripheral wall to capture the inlay between the base and the disk within the peripheral wall. One of the base and the disk has external fingers for releasably securing the assembly to a support structure, such as a projection on a mold core for disposition within a mold cavity to mold a container preform around the mold core within which the RFID assembly is embedded. The container preform can be blow molded into a hollow plastic container within which the RFID assembly is embedded. The projection preferably is on an end of the mold core, so that the RFID assembly is embedded in an end wall of the preform and a bottom wall of the container.

Abstract: A seal is provided around a vacuum interrupter and an air-filled cavity, and a tube is provided within the seal. The tube has a first end open to the air-filled cavity and a second end open to an exterior of the seal. The seal, the vacuum interrupter, and the air-filled cavity are encapsulated.

Abstract: A cast grid array (CGA) package comprises shaped solder posts which may be reflowed and connected directly to a circuit board, such as mother board, or remain in a solid state with the shape allowing them to be secured within a CGA socket which, in turn, may be connected to the a board. Embodiments of the CGA allows for a lower cost socket and package combination by using solder post to interface the socket and not requiring a loading mechanism on every socket.

Abstract: Methods for making and using vacuum switching devices are disclosed. A vacuum switching device has an operating rod for actuating a movable electrical contact within the device. The operating rod may be a hollow epoxy glass tube with an electrical sensor disposed within it, and there may be an elastomeric polymer filling compound disposed within the tube and encasing the sensor. The operating rod may be attached to the movable electrical contact on one end by a steel end-fitting that has been press-fit into the tube and secured with at least one cross pin. In this way, a very secure electromechanical connection may be made between the operating rod and the rest of the vacuum switching device, and the sensor is protected from shock associated with the operation of the device. Moreover, the vacuum switching device is compact and easy to construct.

Abstract: A device connector producing method includes a primary molding step of forming a primary molded body (20) formed with pilot holes (24), a terminal press-fitting step of press-fitting intermediate terminals (11) into the pilot holes (24) to form an intermediate product (40), and an insert molding step of setting the intermediate product (40) in a secondary molding die (50) and forming a device connector. The primary molded body (20) includes a resin inflow opening (21) that enables resin from a gate (52) to flow through the primary molded body (20) during secondary molding, and a supporting projection (23) to contact an inner surface of the secondary molding die (50). Thus, resin flow during secondary molding is good and the intermediate product (40) will not displace.

Abstract: A method for manufacturing of a permanent magnet pole piece comprising at least one magnet which is fixed to a base plate, a protective cover and a filling mass is provided, comprising the steps of fixing of the protective cover to the base plate so that it covers the magnet and so that the protective cover and the base plate are hermetically sealed jointed, evacuating of the interior cavity between the protective cover and the base plate through an opening, injecting of the filling mass through an opening into the interior cavity between the protective cover and the base plate and curing of the filling mass.

Abstract: Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece are disclosed. A method in accordance with one aspect includes placing a semiconductor workpiece and an encapsulant in a mold cavity and driving some of the encapsulant from the mold cavity to an overflow chamber. The method can further include applying pressure to the encapsulant in the mold cavity via pressure applied to the encapsulant in the overflow chamber.

Abstract: A method of producing an electric power device including a tubular shell of an electrically insulating polymer in which there is provided a screen of an electrically conducting material, wherein the screen is placed in a mould, the mould is filled with a resin, and the resin is permitted to solidify in the mould. The screen is positioned in the mould such that a peripheral surface thereof is in supporting contact with a part of the mould.

Abstract: A tapping tee assembly (10) comprises an integrally moulded saddle (12), body (14) and socket (16). The tapping tee assembly can be mounted on a pipeline thereby enabling a cutter to travel through the body of the fitting in order to cut a hole in the pipeline. The saddle (12) is provided with a saddle-shaped electrofusion element mat (18) and the socket (16), which is integral with the body (14) and in fluid connection with the axial bore (20) of the body, is provided with a second electrofusion element (22). The electrofusion elements (22,30) are connected by an integrated anvil-shaped connector (26) and connecting pin (28) such that both electrofusion elements (22,30) can be energised simultaneously using two electrical terminals (24,38), and the device can be manufactured with relative ease.

Abstract: A method and system for molding an electronic device which is located next to a molding cavity and clamped to the molding cavity during molding, comprising providing molding compound in a mold supply pot, discharging the molding compound from the mold supply pot into a runner, and distributing the molding compound through the runner into the molding cavity in order to fill the molding cavity. A movable surface comprised in the molding cavity is positioned to form a first gap between the movable surface and the electronic device when the molding cavity is being filled. After filling the molding cavity with molding compound, the movable surface is driven to form a second gap between the movable surface and the electronic device which is smaller than the first gap, thereby compressing the molding compound in the molding cavity. A molded electronic device thus produced is then separated from the molding cavity.

Abstract: An antenna pattern frame according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; a connection portion partially forming the radiator and connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; and a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion is provided on one side of the radiator frame and the connection terminal portion is provided on the other side thereof while the antenna pattern portion is embedded in the electronic device case.

Abstract: The present invention is a toneable conduit that can transmit a signal and that can therefore be readily detected by toning equipment. In addition, the conduit of the invention can be readily coupled with other conduit to provide extended lengths of conduit. The toneable conduit includes an elongate polymeric tube having a wall with an interior surface, an exterior surface, and a predetermined wall thickness. A channel preferably extends longitudinally within the wall of the elongate polymeric tube and a stabilizing rib extends longitudinally along the interior surface of the wall of the elongate polymeric tube and is located radially inward from the channel. A continuous wire is coincident with the channel in the elongate polymeric tube and is preferably coated with a coating composition that prevents the wire from adhering to the polymer melt used to form the elongate polymeric tube.

Abstract: Provided is a method for manufacturing a semiconductor device in which movement of an island in resin sealing is prevented. A molding die includes an upper die and a lower die. The upper and lower dies are fitted together to form cavities and runners. In the lower die, a pod is provided. After heating and melting of a tablet made of a solid resin and housed in the pod, the melted sealing resin is pressurized by a plunger, and is supplied to each of the cavities. Specifically, a liquid sealing resin is supplied from the pod to the cavities, sequentially, from the upstream of the flow of the sealing resin supplied from the pod. The cavities communicate with each other through the runners. Furthermore, the runners through which the cavities communicate are provided to be tilted with respect to a path for supplying the sealing resin.

Abstract: A method for production of a pole part of a medium-voltage switching device, and a pole part are provided. To obviate costly pressure reinforcements at least on the switching contact side of the vacuum interrupt chamber in the area of the mold core, while also achieving an optimum injection-molded result, a compensation ring is positioned, before the encapsulation process, as a separate injection-molded seal on or close to the external circumferential line of a vacuum interrupt chamber cover, between the lower cover of the vacuum interrupt chamber and the mold core. The positioned compensation ring is also encapsulated so as to remain in the encapsulation, and the mold core is then removed.

Abstract: In a method of manufacturing an electronic device, an electronic element is disposed on a wiring plate that is electrically coupled with a connector terminal, a first surface of the wiring plate is covered with a first casing element and a second surface of the wiring plate is covered with a second casing element to form an electronic circuit part, the electronic circuit part is disposed in a case cavity of a molding tool, and a resin is filled into the case cavity to form the resin-molded case while keeping a state where a first pressure that pushes the first casing element toward the wiring plate and that changes with time is substantially equal to a second pressure that pushes the second casing element toward the wiring plate and that changes with time.

Abstract: A method of manufacturing an electronic component minimizes the occurrence of voids and degradation of characteristics in a resin-sealed portion, while reducing the costs thereof. A sealing step for sealing surface acoustic wave elements by a sealing resin member formed from a resin film is performed by mounting the surface acoustic wave elements on a collective mounting substrate and the resin film in a bag with a gas-barrier property, and causing the resin film to infiltrate between the surface acoustic wave elements mounted on the reduce-pressured-packed collective mounting substrate to be hermetically sealed by the pressure difference between the inside and the outside of the bag.

Abstract: A method for manufacturing a physical quantity sensor includes the steps of: preparing a lead frame comprising a rectangular frame portion, a plurality of leads protruding out from this rectangular frame portion in the inward direction, and a stage portion that is connected to the rectangular frame portion by connecting leads; fixing a physical quantity sensor chip to the stage portion; inclining the stage portion and the physical quantity sensor chip with respect to the rectangular frame portion; and integrating the inclined physical quantity sensor chip and the leads within a metallic mold using a resin.

Abstract: A method for producing electric contact parts includes the following stages: a) stamping a strip of electric conducting parts connected together in the longitudinal direction (X-X) by a continuous strip; b) inserting said strip inside a mould; c) over-moulding the conducting parts with insulating material depending on the final form envisaged for the electric contact part; d) cutting the continuous strip in the region of the flat pins; e) extracting the finished parts.

Abstract: An electronic module includes a printed circuit board with a heat producing electrical component assembled in an insulating housing. The component is adjacent a thermally conducting heat sink with a thermally conductive material disposed therebetween. Integral with the heat sink is a thermally conductive runner, partially encased in the housing wall, connecting the heat sink to a thermally conductive port. The port is coupled to a base structure when the housing is attached to the base, forming a heat conduction path from the component to the base. This conductive path may also provide an electrical ground path from the printed circuit board to the base.

Abstract: The present invention provides an electronic component which can reduce the size of a capacitor and the number of constitutional parts of the capacitor without using a case. The electronic component of the present invention includes a capacitor element, an outer package made of a norbornene resin covering the capacitor element, and external connection terminal portions electrically connected to the capacitor element and protruded from the outer package.

Abstract: A method for forming an enclosure for enclosing internal electronic components of an electronic device is provided, which comprises: performing a first injection molding process, the first injection molding process forming at least a first wall of the enclosure; allowing the at least a first wall of the enclosure to solidify; thereafter performing a second injection molding process, the second injection molding process forming at least a second wall of the enclosure, the at least a second wall of the enclosure fusing with the at least a first wall of the enclosure during the second injection molding process, the at least second wall of the enclosure forming at least one different side of the enclosure than the at least first wall of the enclosure; and allowing the at least a second wall of the enclosure to solidify, the at least a second wall of the enclosure being integrally formed with the at least a first wall of the enclosure to thereby form a single-piece multi-walled enclosure.

Abstract: This invention teaches methods of making a hermetic terminal assembly comprising the steps of: inserting temporary stops, shims and jigs on the bottom face of a terminal assembly thereby blocking assembly core open passageways; mounting the terminal assembly inside a vacuum chamber using a temporary assembly perimeter seal and flange or threaded assembly interfaces; mixing a seal admixture and hardener in a mixer conveyor to form a polymer seal material; conveying the polymer seal material into a polymer reservoir; feeding the polymer seal material from the reservoir through a polymer outlet valve and at least one polymer outlet tube into the terminal assembly core thereby filling interstitial spaces in the core adjacent to service conduits, temporary stop, and the terminal assembly casing; drying the polymer seal material at room temperature thereby hermetically sealing the core of the terminal assembly; removing the terminal assembly from the vacuum chamber, and; removing the temporary stops, shims.

Abstract: A method of fabricating a photovoltaic panel is disclosed which is formed by arranging a number of granular photovoltaic devices in an array and forming the array into the shape of a panel from a transparent resin and includes each photovoltaic device having a part protruding from the resin.