Abstract: A pre-mold part is formed by pre-molding the insert with the pre-molded part, and then the pre-molded part is inserted into the over-molded part composed of thermo plastic resin. After applying a heat treatment with the temperature lower than a crystalline melting point of the pre-molded part to the pre-molded part surrounding the insert formed as the composite mold part surrounding the pre-mold part, a firm contact between the insert and the resin surrounding the insert part without no gap at the interface between those parts is obtained.

Abstract: A tubesheet is formed at the end of a module containing polymeric material for gas separation, by immersing the end of the module in an epoxy material, or its equivalent. A vacuum, or partial vacuum, applied at or near the opposite end of the module, tends to draw the epoxy material towards the source of the vacuum, and results in a tubesheet having a desired thickness, even though the epoxy material may have relatively high viscosity. The method produces effective tubesheets, while minimizing the degree to which the tubesheet covers the otherwise useful surface area of the polymeric material. The method thus produces gas-separation modules having enhanced productivity.

Abstract: Method for fabricating a conductive elastomeric seal, which includes a set of springs plated with an electrically conductive material. Initially, the set of springs can be held in a z-axis position in a mold cavity shaped like a seal. A liquid elastomer can be injected into the mold cavity in such a manner that the elastomer can be over molded around and through coils of each spring. Finally, the elastomer seal with the springs can be removed from the mold cavity, when the elastomer is cured. Ends of each spring can be kept free from the elastomer during over-molding such that the elastomeric seal can provide an electrical contact with a pressure sensor die and electrical leads molded into a sensor housing. Such a conductive elastomeric seal can prevent a die-edge shorting with the sense die in order to achieve long-term sensor reliability and performance.

Abstract: A process for manufacturing an elastomeric sleeve of a joint for electrical cables. The sleeve has an electric field-control element, an electrical insulating element surrounding the electric field-control element, and at least a semiconductive element having two stress control screens. The process includes providing the electric field-control element and the two stress control screens on a supporting element; introducing the supporting element into a mold provided for molding the electrical insulating element; filling with the electrical insulating material the space radially external to the electric field-control element and the stress control screens, the step of filling being carried out during the step of introducing; curing the electrical insulating material to obtain the electrical insulating element of the elastomeric sleeve. An apparatus for carrying out the process for manufacturing is also disclosed.

Abstract: The invention provides a cover adapted to a communication device, a communication device including the same and a method for manufacturing the same. The cover according to the invention includes a cover body and an antenna. The cover body has a bottom surface. Particularly, the antenna is fixed at a predetermined position on the bottom surface by an insert molding process.

Abstract: Electrical components mounted onto a circuit board may be sealed within a frame tray upon the addition of a curable material that encapsulates the circuit board. The electrical components of the circuit board are positioned and sealed within the frame tray such that the cured material does not affect an airflow path which dissipates heat produced by the electrical components during use. The curing of the curable material shields the circuit board from moisture, dust and other environmental contaminates.

Abstract: In connection with a memory card of a block molding type there is provided a method able to prevent the occurrence of a chip crack in transfer molding. The method includes a first step wherein a substrate having plural chips constituting plural memory cards and mounted on a surface of the substrate and further having connecting terminals in recesses formed on a substrate surface opposite to the chips-mounted surface is sandwiched between a first die (upper die) installed on the chips-mounted surface side and a second die (lower die) installed on the surface side where the connecting terminal are formed. The method further includes a second step of injecting sealing resin between the first die and the substrate to seal at a time the plural chips mounted on the substrate. Projecting portions (terminal supporting elements) projecting from the surrounding portion are formed in regions of the second die which regions are positioned just under the connecting terminals.

Abstract: First, a plurality of wiring boards are fabricated at separate steps. The first wiring board includes a Cu post formed on a wiring layer on one surface of a substrate, and a first stopper layer formed at a desired position around the Cu post. The second wiring board includes a through hole for insertion of the Cu post therethrough, a connection terminal formed on a wiring layer on one surface of a substrate, and a second stopper layer that engages the first stopper layer and functions to suppress in-plane misalignment. The third wiring board includes a connection terminal formed on a wiring layer on one surface of a substrate. Then, the wiring boards are stacked up, as aligned with one another so that the wiring layers are interconnected via the Cu post and the connection terminals, to thereby electrically connect the wiring boards. Thereafter, resin is filled into gaps between the wiring boards.

Abstract: Provided is a mounting method making it possible to, when an object such as an element, or more particularly, a microscopic object is mounted on a substrate, achieve mounting readily and reliably with high positional precision by: forming an element holding layer 12, which is made of a material whose viscosity can be controlled, on a substrate 11; controlling the viscosity of a first part 12a of the element holding layer 12, which includes a mounting region for an element, into a viscosity making the element naturally movable, and controlling the viscosity of a second part 12b of the element holding layer 12 outside the first part 12a into a viscosity making the element naturally immovable; and after mounting one element 13 in the first part 12a, controlling the viscosity of the first part 12a into the viscosity making the element 13 naturally immovable.

Abstract: An upper mold, a lower mold, a middle mold, and a release film are used in a method of resin sealing of an electronic component. The release film is sandwiched between the lower mold and the middle mold and held under a prescribed tension to cover a cavity of the lower mold. A cavity side surface is also covered with the release film. Therefore, releasability of a cured resin from the cavity side surface is increased. As a result, the cured resin is prevented from being damaged near the cavity side surface.

Abstract: An over-molded electronic module (2) includes a frame (10), an electronic assembly (20), and a polymeric body (32). The frame (10) includes a sidewall (14) that defines an opening (12) to provide a position for the electronic assembly (20), and includes an upper face (16) and a lower face (18) opposite the upper face (16) to act as sealing surfaces during over-molding. The polymeric body (32) is formed of a polymeric composition encapsulating both sides of the electronic assembly (20) and a portion of the frame (10).

Abstract: An electronic assembly including a vertical mount connector header is overmolded to form an encapsulated module. Conductor pins retained in the connector header are coupled to a circuit board to support the connector header with respect to the circuit board, leaving an open space between the connector header and the circuit board. The electronic assembly is then placed in a mold for plastic encapsulation. The floor of the mold has a well sized to accommodate the conductor pins and shroud of the connector header, and the connector header has a peripheral flange that seats against the floor of the mold to keep encapsulant out of the well. Encapsulant fills open spaces inboard of the connector header, and a connector insert disposed between the connector header and the floor of the well prevents distention of the connector header and circuit board due to the packing pressure of the encapsulant.

Abstract: A casing of an electronic key transmitting and receiving apparatus is formed to seal entire bodies of circuit parts, a mounting face of a printed board, on which the circuit parts are mounted, and parts of terminals while the other parts of the terminals are exposed. A rear face of the printed board opposite from the mounting face provides a part of an outer surface of the casing. When the printed board is provided in the casing through an insert molding process, the printed board is held in a cavity of a molding die such that the rear face of the printed board closely contacts an inner face of the cavity. Accordingly, deformation of the printed board due to pressure caused when the resin is poured or when the resin hardens is inhibited.

Abstract: Disclosed is a method oft by using a plastic molding process, encapsulating an air-core coil with a moldable magnetic resin material prepared by kneading a mixture of a magnetic powder and a resin. The method comprises the steps of (a) preparing a molding die assembly which includes a plurality of dies adapted to define a cavity therewithin, and a positioning pin adapted to be movable in a vertical or horizontal direction within the cavity, (b) arranging the air-core coil at a given position within the cavity by the positioning pin, (c) charging the moldable magnetic resin material into the cavity and moving the positioning pin to a given retracted position in a course of the charging.

Abstract: A system and method is disclosed for using a pre-formed film in a transfer molding process of the type that uses a transfer mold to encapsulate portions of an integrated circuit with a molding compound. A film of compliant material is pre-formed to conform the shape of the film to a mold cavity surface of the transfer mold. The pre-formed film is then placed adjacent to the surfaces of the mold cavity of the transfer mold. The mold cavity is filled with molding compound and the integrated circuit is encapsulated. The pre-formation of the film allows materials to be used that are not suitable for use with prior art methods.

Abstract: A method for making a supporting body (1) for the lock of a motor vehicle, including the steps of: forming an intermediate element (8) made of electrically insulating material provided with conductive paths (3); setting the intermediate element (8) inside a mold (23) for forming the supporting body (1); and injecting electrically insulating material in the mold (23) for carrying out co-molding of the supporting body (1). The intermediate element (8) and the conductive paths (3) are made independently, and the conductive paths (3) are fixed on opposite faces (9, 10) of the intermediate element (8) by constraint means (15, 16) of a mechanical type.

Abstract: A portable junction or outlet box is provided having an elastomeric outer layer to provide impact resistance and abrasion resistance to the electrical box. The outer layer encloses the outer surface of a rigid electrical box and overlies the side walls and end walls of the electrical box. The corners of the outer layer define a thickened portion relative to the side portions of the outer layer to increase the impact resistance.

Abstract: An electrosurgical electrode shroud including a hollow substantially cylindrical member having a first end portion and a second end portion; the first end portion defining an opening which is configured and dimensioned to receive an electrosurgical electrode assembly therein; the second end portion defining an opening which is configured and dimensioned to receive an electrode mounting portion of an electrosurgical instrument, wherein at least the second end portion is formed of a substantially translucent material. The electrosurgical electrode shroud may further include visual or tactile indicator on the second end portion for indicating a depth of penetration of the electrosurgical instrument within the second end portion when viewed by the surgeon through the translucent material.

Abstract: A device for electric connection to an energy supply conductor for intermediate and high voltage. The device includes an insulation part and an electrically conducting voltage-carrying part. The voltage-carrying part is surrounded by an outer shell formed by the insulation part. The insulation part is formed by a thermoplastic polymer. At least along a part of the length of the voltage-carrying part, the outer shell extends with a spacing between its inner periphery and the outer periphery of the voltage-carrying part.

Abstract: An electromagnetically shielded cable includes a shell having an end portion and a shield embedded in the end portion of the shell. A method of forming the electromagnetically shielded cable is also provided. The method includes the steps of inserting the end portion of the shield into a mold, and embedding the end portion of the shield in the shell. In one embodiment, the shell includes a connector extending from the shell and through an opening defined by the shield for embedding the shield in the shell. In another embodiment, the shield is embedded directly in the end portion of the shell.

Abstract: A method for packaging a light emitting diode is provided. The steps comprise: providing a material; drying the material; feeding the material into a feeding inlet; and providing a mold with pre-embedded light diodes. The material enters the feeding inlet and is injected into the mold by pressing a screw, allowing the material to combine with the light emitting diode.

Abstract: A ground coil device for a magnetic levitation railway that can be manufactured with a high productivity and exhibit less fluctuation in strength, reduced weight, and good recyclability, and a process for manufacturing the device. The ground coil device includes a coil conductor covered with a thermoplastic resin molding material containing 100 parts by mass of a thermoplastic resin, from 20 to 200 parts by mass of an inorganic filler, and from 0 to 25 parts by mass of an elastomer. A process for producing the ground coil device for magnetic levitation railway includes filling the thermoplastic resin molding material into a cavity of a metal mold into which the coil conductor is previously inserted, by an injection molding method, to obtain an integrally molded product.

Abstract: The present invention relates to a press for encapsulating electronic components, comprising: two displaceable mould parts (5,6), feed means for encapsulating material, and a drive mechanism connecting onto the mould parts. In a first embodiment the drive mechanism is provided with a fluid bed (14) and a first fluid feed (15) whereby their connection can be interrupted by a displacer (16). In a further embodiment a displacer (28) is provided in the feed channel (26) to place the encapsulating material (25) under pressure. Furthermore, the present invention relates to methods for encapsulating electronic components with encapsulating material in such presses.

Abstract: A technique of accurately recognizing a semiconductor device and of specifying a package type thereof. By forming, on the package surface, projections having a geometric pattern such as a circle pattern using an ejector pin and by judging only presence or absence of the circular projections using an image processor, it is possible to reduce a risk of recognition failure of the geometric pattern even if the pattern has some omission in the constitutive line thereof or has any addition of a new line. For example, when the circular projections are provided on the surface of a package, an image processor reads only presence or absence of the circular projections even if disconnection of the line or addition of a line should occur, and this allows the circular projections to be always read as being “present”.

Abstract: A method for packaging a smart card is provided. The method includes steps of providing a first thermoforming plastic piece; providing a first piece on the first thermoforming plastic piece and having an aperture; disposing an electrical element on the first thermoforming plastic piece and in the aperture; providing a second thermoforming plastic piece covering the first piece and the electrical element; and heating the first and the second thermoforming plastic pieces.

Abstract: An insert (2) is arranged in an injection mould (1) and plastic is cast onto the insert (2). The insert (2) includes at least one electronic component and connector (4) for testing the component. The injection mould (1) is provided with a counter connector (5) which is arranged to connect to the connector (4). The condition of the insert (2) is tested by a testing device connected to the counter connector (5) during the injection moulding process.

Abstract: To provide a mold apparatus for resin encapsulation, which is small in number of components, has a simple driving mechanism, is easy in assembly or disassembly work, requires no labor for maintenance and has good workability; and a resin encapsulation method. Therefore, of a lower cavity bar 51 and an upper cavity bar 26, a plurality of groove-shaped pots 52 are provided in parallel at a predetermined pitch in a region where a substrate board is disposed, and each groove-shaped pot 52 is individually provided with a plurality of cavities 54 in parallel through runners. Then, a plunger plate 60 inserted in the grooved-shaped pot 52 in a manner so as to be able to move up and down is driven by a plunger 76, whereby a resin for encapsulation inserted into the pot 52 is melted with the plunger plate 60, and the melted resin is filled in the cavities 54 through the runners.

Abstract: An embodiment of the present invention is a technique to package flip chip molded matrix array package. An ultraviolet (UV) curable tape is laminated on die backside of a strip of array of flip chips. The UV curable tape has an adhesive strength. The strip of flip chip arrays is molded with a mold film. The molded strip of flip chip array is irradiated using UV radiation. In another embodiment, a double functional tape is mounted to backside of a wafer. The double functional tape includes a binding tape and a ultraviolet (UV) curable tape having an adhesive strength. The wafer is singulated into die. The die is attached to a substrate strip to form a strip of array of flip chips. The strip is molded with a mold film. The molded strip is irradiated using UV radiation.

Abstract: An apparatus and method for manufacturing plastic containers having RFID tags embedded therein is disclosed. The bottles are manufactured using a blow-molding technique wherein an in-mold film having an RFID tag embedded therein is positioned or placed against the parison immediately prior to the blow mold being closed and the pressurized air being used to inflate the parison. The resulting container thus has an RFID tag fused thereto to allow for tracking and tracing of the container after manufacture, as well as providing a mechanism by which the authenticity of the bottle can be verified.

Abstract: An RFID enabled waste/recycling container includes a molded plastic body; and a case containing an RFID device. The case includes a front surface and a rear surface defining a wedge-shape. The case is in-molded with the plastic body such that a substantial portion of the front surface and the rear surface are exposed. In another embodiment, the case is also designed to snap-fit to a waste/recycling container.

Abstract: The invention provides a mold for use in a compression molding apparatus that has a frame part (41) with a hole through its center; a bottom plunger (42); and a top plunger (43); wherein the plungers are fabricated to fit substantially snugly in the hole in the frame part, and wherein at least one plunger comprises at least one low-thermal conductivity insert (44, 44?). The mold is useful in compression molding processes used in the preparation of unitized membrane electrodes.

Abstract: This invention relates to an object having a display panel embedded in its top surface and processes for its manufacture. The process comprises the steps of: forming an in-mold display transfer film or foil which comprises a temporary carrier layer, a release layer, a display panel, an adhesive layer and optionally a durable layer; feeding said in-mold display transfer film or foil into a mold with the temporary carrier film in contact with the inner surface of the mold; forming an object in the mold and transferring the in-mold display transfer film or foil onto the object; removing the object formed from the mold; and simultaneously removing both temporary carrier layer and release layer.

Abstract: A method and apparatus for manufacturing fiber-reinforced products with integrated insert parts by moulding a heat-bonding resin having a viscosity of about 1-10_6 and about 30-10+6 mPas, between two joinable halves of a separable mould having an upper and lower mould parts forming a cavity therebetween, the inner moulding faces are attached to displaceable fixed parts of a pressing table. Prior to moulding, an insert part is fixed in position in the cavity, and the mould parts each have a set of a support devices displaceable in the cavity relative to the respective moulding faces. According to the method, the resin is located in the cavity before the mold is closes and the insert is in position prior to and during an initial phase of moulding. The support device is removed prior to the setting of the resin in the mould leaving holes in the material, and thereafter the mold parts are held together for filling the holes.

Abstract: The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section having a molding die for molding the work piece with the liquid resin; a product measuring section measuring thickness of a resin molded part of the molded product; a product accommodating section; and a control section for controlling the sections. The control section includes means for adjusting an amount of the liquid resin, which is supplied to the work piece by the resin supplying section, on the basis of the thickness measured by the work piece measuring section.

Abstract: A method of making a fluid cooled microelectronic package in which fluid is circulated through the package in fluid-carrying channels defined at least in part by voids in an encapsulant that surrounds the package components. Preferably, the encapsulant channels are defined in part by heat producing components of the package so that coolant fluid directly contacts such components. The coolant fluid can be electrically conductive or non-conductive depending on the type of components being cooled. The coolant channels are formed by insert-molding a form in the encapsulant, and removing the form following the molding process. Alternately, the encapsulant is formed in two or more pieces that are joined to form the package, and the coolant channels are defined by recesses formed in at least one of the encapsulant pieces.

Abstract: At least a winding of a stator stack 2 is molded by injecting a fused resin molding material into a space formed between a top mold and a bottom mold member. When the stator stack 2 of the resolver, which is annular and includes a coiled winding 7, is sandwiched between the top mold member 10 and bottom mold member 20, a movable disc 12 is urged by a spring device 13, into close engagement with the bottom mold member 20. While the movable disc 12 is closely engaged with the bottom mold member 20, the stack 2 of the resolver is sandwiched between the bottom mold member 20 and the top mold member 10. This method prevents the generation of gaps between the stator stack 2 and mold 10, 20 due to unevenness of the thickness in the stator stack 2.

Abstract: A quick connector coupling assembly comprising a conductive connector body, a tubular male member with an upset, and a primary retainer. The primary retainer releasably secures the male member within the connector body. The primary retainer body includes a pair of spaced legs connected by a cross member. The retainer body includes a conductive insert with contact surfaces exposed at the retainer legs to contact the male member and at the cross member to contact the connector body.

Abstract: The invention relates to a method of making a part (2) of thermoplastic material covered on the surface by an electrically conductive foil (4) of thickness less than 0.1 mm, the part also including a rib (6), and the method comprising a step of depositing on an inside surface of a mold defining the shape of the part (2), an electrically conductive foil (4) in such a manner as to cover at least part of a blind orifice of the mold opening out into its inside surface and defining the shape of the rib (6), a step of forming at least one opening (14) through the foil (4) leading to the orifice and shaped to allow the fluid thermoplastic material to pass therethrough, and to ensure that the foil (4) remains in a single piece, and a step of filling the mold with fluid thermoplastic material.

Abstract: An electrical component in the form of an inductor or transformer is disclosed which includes one or more coils and a magnetic polymer material located near the coils or supporting the coils to provide an electromagnetic interaction therewith. The magnetic polymer material is preferably a cured magnetic epoxy which includes a mercaptan derivative having a ferromagnetic atom chemically bonded therein. The ferromagnetic atom can be either a transition metal or rare-earth atom.

Abstract: A method and apparatus for fixedly securing a plastic encapsulated transducer to a metal interface cup for attachment with a machine includes a metal interface cup configured substantially as a cylinder defined by a cylinder wall and a bottom wall closing a bottom of the cylinder, the cylinder including a first bore corresponding to an inner diameter defined by the cylinder wall, the first bore corresponding to an outside diameter of the plastic encapsulated transducer; a second bore extending through opposing sides defining an exterior of the cylinder wall and substantially transverse to the first bore; an undercut configured in the first bore intersecting the second bore, the undercut defining a circumferential groove in the cylinder wall; a cylindrical overmold surrounding the metal interface cup having the plastic encapsulated transducer disposed in the first bore, wherein injection of plastic flows in an axial length defining the overmold toward the metal interface cup and circumferentially into the unde

Abstract: A semiconductor component includes a leadframe, a die, upper and lower body segments encapsulating the die, and dummy segments on the leadframe. The dummy segments are configured to vent trapped air in a molding compound during molding of the body segments, such that corners of the body segments do not include the trapped air.

Abstract: An electrical connector and a method for producing the same are described. A metallic wire is provided. The metallic is folded into a predetermined shape by upper and lower formation devices. One of the formation devices is replaced by a mold, and an insulative material is poured into the mold to cover part of the metallic wire and form a contact end protruding out of the insulative material. Thus, the electrical connector has an insulative housing and a plurality of metallic wires partially disposed inside the insulative housing with a contact end protruding out of the insulative housing.

Abstract: A system for degating a packaged semiconductor device that includes a tape substrate includes a first element and a second element. The first element of the system is positionable adjacent to a first major surface of the packaged semiconductor device and includes a receptacle for receiving a portion of a gate of the packaged semiconductor device. A second element of the degating system is positionable adjacent to a second major surface of the packaged semiconductor device and includes a degating element alignable with the gate. The degating element is extendable through the gate to force a portion of the gate and a sprue therein into the receptacle of the first element.

Abstract: A method of manufacturing a hearing aid preferably includes the steps of: placing a moldable material in the ear canal of a patient to cast a form; using the form to form a hollow shell with an outer surface that approximates the shape of the patient's ear canal, the shell being of a soft polymeric material providing a mounting member; mounting electronic hearing aid components to the mounting member; joining the mounting member to the hollow shell to define a mold cavity; and filling the shell with a soft polymeric material that substantially encapsulates at least one of the electronic components and bonds to the mounting member, wherein the combination of shell, electronic components and soft polymeric material define a soft structure that is compliant to ear canal movement during use.

Abstract: The invention relates to a mould for encapsulating electronic components mounted on a carrier, comprising: at least two mould parts displaceable relative to each other, at least one of which is provided with a recess, and feed means for encapsulating material, wherein at least one of the mould parts is provided with a runner which connects on one side to a wall of a mould part co-defining a mould cavity and connects on the other side to a side of the mould part remote from the mould cavity. The invention also relates to an encapsulating device of which such a mould forms parts, and to a method for encapsulating electronic components mounted on a carrier.

Abstract: A method includes a first, a second and a third step, and a circuit member is installed in a resin-molded panel simultaneously when this resin-molded panel is vacuum formed. In the first step, the circuit member to be installed is placed on an upper surface of a circuit member-installing portion formed on and projecting from a front surface of a base mold. In the second step, a heated and softened panel material is laid on the front surface of the base mold. In the third step, the air between the panel material and the base mold is drawn via notch spaces and air-drawing holes.

Abstract: A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.

Abstract: The present invention aims to improve the durability of an RFID chip inlet. A module including an RFID chip amounted to an antenna is covered with polyimide film with an adhesive layer to make up an RFID inlet. The outer surface of the RFID inlet is then covered with the surface processed to increase surface lubricity of a base part. When the RFID inlet is for use in a rubber product, it is mounted to a rubber base of the rubber product, the exposed surface of the RFID inlet is covered with an unvulcanized rubber, and the unvulcanized rubber is then pressed and heated causing the RFID inlet to be embedded in the rubber base.

Abstract: According to one embodiment of the invention, a system for packaging integrated circuits includes a mold tool for packaging integrated circuits. The mold tool includes a first mold plate that includes a first non-planar surface and a second mold plate that includes a second non-planar surface. The first and second non-planar surfaces form upper and lower surfaces of a mold cavity when the first and second mold plates are engaged. The mold tool also includes a distribution system coupled to the mold cavity. The distribution system transfers a mold compound into the mold cavity to substantially encapsulate an integrated circuit. The distribution system includes a gate runner coupled to the mold cavity. The gate runner funnels the mold compound into the mold cavity. The distribution system also includes a bridge insert that decreases wear on the gate runner as the mold compound is transferred through the gate runner.

Abstract: A method and apparatus for preventing board warpage during the application and curing or drying of liquid epoxies, or the like, on printed circuit boards using a clamping fixture assembly, which includes at least one clamping fixture support and at least one clamping fixture overlay. If desired, a plurality of printed circuit boards may be processed using an appropriate clamping fixture assembly. Furthermore, the clamping fixture maybe constructed so a slight bow or curvature thereof can counter either a convex or concave bow or curvature of the printed circuit board.