Abstract: To provide a hybrid integrated circuit device in which the rear surface of a circuit board is exposed to the outside and a method of manufacturing the same. Here, leads are fixed to the surface of the circuit board along one side thereof. A method of manufacturing a hybrid integrated circuit device includes the steps of forming an electric circuit which includes a conductive pattern formed on a surface of a circuit board and a circuit element electrically connected to the conductive pattern, fixing a lead to a pad formed of the conductive pattern, housing the circuit board in a cavity of molds, and fixedly supporting the lead by clamping the lead between the molds, and performing sealing by filling inside of the cavity with sealing resin with the rear surface of the circuit board made in contact with an inside bottom surface of the molds.

Abstract: An electronic module and method that enable circuitry required by one form of the module (e.g., a developmental unit) to be omitted in a second form of the module (e.g., a production unit), without necessitating additional changes in the module. The electronic module includes a motherboard, a multichip module (MCM) mounted to the motherboard, and a circuit unit connected to the MCM. The circuit unit comprises a flexible substrate, instrumentation circuitry mounted on the flexible substrate, and a connector coupled to the flexible substrate. The flexible substrate has signal lines that electrically communicate with the MCM, the instrumentation circuitry, and the connector. A portion of the flexible substrate is located between the MCM and the motherboard and permits electrical communication therebetween. The instrumentation circuitry does not occupy space on the motherboard.

Abstract: The elements of a tire pressure monitoring and transmitting system are encapsulated into a single package. A pressure sensitive device is covered with a flexible gel coat and then inserted into a molding tool cavity. A removable pin is incorporated into the molding tool and in its normal position is in contact with the gel. A molding compound is injected into the cavity so as to encapsulate the device and gel coat. When the pin is extracted and the device ejected from the molding cavity, an airway is left defined by the removable pin. The airway exposes the flexible gel covering the pressure sensitive device to the local air pressure, whereby the gel, being flexible, transfers the pressure to the pressure sensitive device.

Abstract: A method for making an IC package preferably includes providing a mold including first and second mold portions, and wherein the first mold portion carries a mold protrusion defining an IC-contact surface with peripheral edges and a bleed-through retention channel positioned inwardly from the peripheral edges. The method also preferably includes closing the first and second mold portions around the IC and injecting encapsulating material into the mold to encapsulate the IC and make the IC package having an exposed portion of the IC adjacent the mold protrusion. Morever, the bleed-through retention channel retains any encapsulating material bleeding beneath the peripheral edges of the IC contact surface, and prevents the encapsulating material from reaching further onto the exposed portion of the IC. The method may also include releasing the IC package with the exposed portion from the mold.

Abstract: A method of insert molding a preformed item into a molded product, the molded product being formed by injecting a moldable material into a mold, is disclosed. The method includes adhering the preformed item to a surface of the mold with an adhesive, wherein the surface to which the preformed item is adhered is free of any features provided for holding the preformed item in place on the mold surface. The method next includes injecting the moldable material into the mold such that the moldable material at least partially surrounds the preformed item, and curing the moldable material. Articles molded via the disclosed method are also described.

Abstract: The mold for a thin package uses a gate which has a high aspect ratio, about 30 degrees or greater throughout the length of the gate. Additionally, the depth of the gate goes to zero at a point outside of the area of the finished package, but within the dam bars, so that the leadframe space acts as a virtual gate. This reduces the need for trimming and lowers stress on the finished package.

Abstract: The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipater. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipater.

Abstract: Techniques for forming packaged semiconductor devices having top surfaces with flash-free electrical contact surfaces are described. According to one aspect, a molding cavity is provided which has a molding surface that is sufficiently smooth such that when placed in contact with an electrically conductive contact, gaps between the conductive contact and the mold cavity surface do not form.

Abstract: An electromagnetic oscillating type pump for oscillating diaphragms connected to an oscillator through electromagnetic oscillation of the oscillator with magnetic body by utilizing magnetic interaction between an electromagnetic portion comprising one or a plurality of iron cores and the magnetic body. A frame portion of resin mold is formed by molding resin on an outer surface of the electromagnetic portion. It is possible to obtain electromagnetic oscillating type pumps capable of decreasing manufacturing costs and of exhibiting high acoustic insulating effects.

Abstract: The invention concerns a method for making a dashboard subassembly comprising electrical and/or electronic components (1) connected to conductors (2) and attached to a rigid support (3). The invention is characterized in that it consists in: providing a flexible mat (4) provided with said conductors (2); mounting said components (1) on said mat (4), connected to said electrical conductors (2); rigidizing said mat (4) by overmoulding it with a material designed to form said support (3). The invention also concerns a dashboard subassembly, in particular a motor vehicle dashboard console, obtained by said method.

Abstract: A method is provided for planarization of structures which minimizes step heights, reduces process steps, improves cleanliness, and provides increased ease of debond. Structures are placed with working surfaces facing down onto an adhesive layer such that structures remain fixed during heating. A bi-layer encapsulating film is used to achieve planarization. A carrier is bi-laminated with a thermoplastic film layer followed by a chemically inert protective polymer film layer that can withstand etch and cleaning processes. The thermoplastic layer is laminated on top of the carrier; the polymer layer is laminated on top of the joined thermoplastic layer and carrier. The carrier with bi-layer film is then placed onto the backside of the structures to resist chemical attack from the front side during photostrip and enable planarization. When heat is applied, the bi-layer encapsulating film melts and pushes the polymer layer into the gaps between structures thereby achieving complete planarization.

Abstract: A mold apparatus for encapsulating IC chips mounted on a substrate. In an exemplary embodiment a mold is provided with an upper mold platen having a plurality of cavities for encapsulating wire bonds and related interconnections on a first side of a multi-chip carrier substrate. The mold further includes a lower mold platen with a single cavity for encapsulating substantially the entire second chip side of the carrier substrate. Support elements are provided for supporting the multi-chip carrier substrate. The support elements are configured to prevent or minimize substrate deflection during the fill of the mold cavities with encapsulant material. The support elements may be integral to a mold cavity or may be removable. The support elements may further be aligned along lines representing a series of individual device packages. The molded assembly may then be cut along marks left in the encapsulant to define individual device packages.

Abstract: A wireless ad hoc pico network is formed by eyewear and other devices such as a computer, a bracelet and a telephone having similar transceivers mounted on them. The eyewear includes a frame and connected to the frame are two temples. Temples are connected to frame via hinges. Temples have a male portion of a connector incorporated in them. Female portion of the connector is made integral with the hinges. When the male portion is inserted in the female portion the temple is attached to the frame. The temples can be removed by pulling the connector apart, and a temple with different apparatus within it can be inserted in place of the removed temples. The temple may have co-molded within its body, an apparatus such as an audio device, a camera, a speaker, and a microphone, and a display device such as liquid crystal or an alarm.

Abstract: The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. The pair of devices is positioned back-to-back within a single mold cavity for simultaneous encapsulation. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator.

Abstract: An intermediate product is formed by combining together plurality of constituent elements. The intermediate product is arranged in a mold an then molten resin is charged in the mold. An opening is formed so as to correspond to a plus terminal, a minus terminal, and a temperature detecting terminal in the intermediate product, and its periphery is covered with the resin. Whereupon, a thin enclosed outer packaging body is realized that is made compact and offers excellent dust-proof, drip-proof structure. Alternatively, the intermediate product is housed in an outer packaging case having an open end that allows insertion of the intermediate product, and resin is charged in the open end, thereby achieving sealing.

Abstract: A method and apparatus for reducing or eliminating the formation of air pockets or voids in a flowable material provided in contact with at least one substrate. The flowable material is provided in a non-horizontal direction and flows from a lower portion to an upper portion. As a result, the flowable material is provided uniformly with a single, uniform flow front due to gravity acting thereon and gravity thereby substantially preventing voids and air pockets from forming in the flowable material. In one embodiment, the at least one substrate is provided in the cavity of a transfer mold in which the cavity is filled from a gate at a lower portion of the cavity to a vent at an upper portion of the cavity. In another embodiment, a bumped semiconductor device is attached to a substrate having a gap therebetween, in which the gap is oriented longitudinally perpendicular to a horizontal plane so that the flowable material may fill the gap in a vertical direction.

Abstract: A mold has two mold halves (6, 7). One of the mold halves (6) includes a contact section (8) which is adapted to contact a surface (5) of a semiconductor chip (1) mounted in the mold, in use.

Abstract: A method is for forming a plastic protective package for an electronic device integrated on a semiconductor and comprising an electronic circuit to be encapsulated in the protective package. The electronic device may be at least partially activated from outside of the protective package. The method may include providing a mold having a half-mold with an insert abutting towards the inside of the mold and an end having an element that can be elastically deformed to abut in pressing contact against at least one portion of the integrated circuit. The method may also include injecting a resin into the mold so that the protective package has a hole by the at least one portion of the electronic circuit.

Abstract: An overmolded electronic assembly having an electromagnetic interference shield, in the form of a thin metal film or foil, coupled to the top of or within an overmolded body. The shield effectively reduces the amount of electromagnetic interference (“EMI”) emissions from penetrating within the assembly to the circuit board without substantially increasing the cost of the unit. Thus, an electronic assembly having improved vibration, moisture, and EMI emission resistance is achieved as compared with traditional overmolded or metal assemblies. Further, because the shield can be formed on the electronic assembly in one continuous processing step, a substantial savings in time and cost for the manufacturing process is also realized.

Abstract: A system is proposed for encapsulating in plastics material leadframe items comprising an IC wired to a leadframe. Dust of the plastics material is removed from the encapsulation system, and in particular from those items where dust principally accumulates, such as the surfaces of the molds. To reduce the level of dust which enters the molding region, the path along which the leadframe items are conveyed to the molding region is closed at times when the leadframe items are not being transported there. Additionally, the leadframe items are conveyed to the molding region under a cover including a vacuum source, so that the dust is continually sucked away from them.

Abstract: A strain relief for protection of electrical and other cords extending from a component. The strain relief is made from a hard plug piece which attaches to the case or housing of the component. The cord extends through this plug piece via a passageway. This plug piece has a plurality of holes therethrough which connect the passageway with its outer surface. An molded jacket is molded onto the plug piece, wherein the injected material extends through the holes, into the passageway, and surrounding the cord. The injected material is preferably softer than the material used for the plug piece. The result is a one piece strain relief which is bonded to the cord.

Abstract: Next, a shield is positioned in the mold. The shield is made of a metallic material and has a substantially tubular shape. Next, a resistor is positioned inside the shield and the mold. Once the shield and the resistor are in place in the mold, a rubber material is injected into the mold between the shield and the resistor. Once the rubber material has cooled, then the spark plug boot resistor assembly is removed from the mold.

Abstract: A resin tape substrate with a semiconductor chip mounted thereon is put to an attachment area surface of a cavity bottom surface, and a plurality of suction holes connected to a suction system are disposed in the attachment area surface, wherein the attachment area surface of the cavity is formed in a semiconductor resin mold, so that the molten resin given into the cavity does not flow into the back surface of the resin tape substrate which is sucked on the attachment area surface in the mold.

Abstract: Injection molding encapsulation processes for packaging an object or objects in microcellular foamed material, comprising the steps of providing a mold having a mold cavity, positioning at least one object in the mold cavity, providing a packaging material, introducing a fluid into the packaging material under conditions sufficient to produce a supercritical fluid-packaging material solution, introducing the solution into the mold cavity, and converting the solution into a microcellular foamed material. Such processes are advantageously employed in encapsulation of electronic or electrical components. Packaged objects produced therefrom may be completely or partially encapsulated.

Abstract: A mold (1) is for molding a one-sided encapsulated electronic device. The mold (1) includes a first mold section (2) defining a mold cavity (4), and a second mold section (3) including a first recessed portion (6) adapted to receive a layer of material (15) attached to a leadframe (10), but not the leadframe (10).

Abstract: In the method of resin molding of the present invention, air can be perfectly discharged from a specific area of a molding die including cavities, resin paths, pots, etc. so as to mold high quality products. The method comprises the steps of: covering a specific area of a molding die, in which air is left, with release film; clamping a work piece and the release film between an upper die and a lower die of the molding die so as to air-tightly seal the specific area; discharging the air from the sealed specific area; and filling a molding section with resin.

Abstract: A method of transfer molding, wherein a top-half mold and a bottom-half mold of an apparatus form a plurality of cavities interconnected, and wherein a pressure adjuster reduces the pressure of the cavities every time a specified amount of resin is supplied into any one of a plurality of cavities.

Abstract: A hearing aid instrument of the in-the-ear type (and preferably CIC) provides a receptacle with electronic hearing aid components mounted thereto. The receptacle has a cavity for holding electronic components (eg. battery, microphone, amplifier). A soft polymeric body is preliminarily formed by encapsulating a plurality of the electronic hearing aid component shaped inserts. The body is soft and is shaped to conform to the ear canal of the user. After forming, the insert is removed to provide an insert cavity that can carry electronic components. The soft polymeric body and encapsulated electronic hearing aid components define a soft structure compliant to the ear canal during use and that is substantially solid and free of void spaces between at least some of the components and the ear canal.

Abstract: A method of forming a magnetic body, alternative to a ferrite core, on a printed circuit board is provided. A printed circuit board is set in a mold and injection molding is conducted. The mold comprises a fixed plate, an intermediate plate and a movable plate. A cavity in the intermediate plate is filled with a melted material (i.e., mixture of resin and magnetic filler) supplied via a sprue and a runner. A cavity in the movable plate is also filled with the material supplied to the cavity in the intermediate plate through a hole in the printed circuit board. When a magnetic body for noise control is directly injection molded onto the printed circuit board in such a way, no gap appears between the magnetic body and the printed circuit board. As a result, the magnetic body functions well as desired.

Abstract: Method of fabricating LED assembly disclosed herein can provides a string of original colored high intensity LEDS usable for screen displaying or traffic signal lights molded by injecting harmless polyacrylic resin in a short time duration and at low temperature.

Abstract: The present invention relates (with reference to FIG. 1a) to a method of manufacture of an integrated camera and illumination device. The method comprises assembling together an optical sensor (12), illumination means (17) and associated electronic circuitry (10) into an assembled unit; placing the assembled unit into a mold; introducing an encapsulant in liquid state into the mold to surround the components therein; and the encapsulant solidifying to form an encapsulated assembly of optical sensor, illumination means and associated electronic circuitry.

Abstract: A circuit assembly comprises a substrate comprising one or more conductors. An integral frame of frame elements supports the substrate. The frame elements spaced apart to expose intervening regions of the substrate between adjacent frame elements. A dielectric layer overlies the intervening regions, as a protective barrier for at least one of the conductors, a component, and a circuit feature of the substrate.

Abstract: The invention relates to a method for producing a hybrid frame (1) or hybrid housing. According to said method, a leadframe (3) with soldering and/or bonding tags (3a), made from a plated strip, is placed into an injection mould and moulded with plastic in order to form a housing part (2) of the hybrid frame or the hybrid housing (1). According to the invention, the soldering and/or bonding tags (3a) of the leadframe (3) are kept in the injection moulding die at least during part of the injection-moulding process, by means of a plunger.

Abstract: A method of making an optical component wherein an optical component carrier is introduced through an opening (2) into a mold (1). The carrier is aligned relative to the mold (1) by means of at least one positioning means. A removable closure member (4) is introduced into a coupling portion of the mold to form an optical window surface (3). A light transmissive moldable material is filled into the mold (1) and cured. The closure member (4) is then removed to complete the optical component.

Abstract: A chip-on-flex HDI module is fabricated by dispensing encapsulant material onto the components of a populated dielectric film or sheet in an interrupted pattern which leaves the backsides of selected components free of encapsulant. The dispensing is accomplished by relative motion of the dispenser tip and the populated film, with the dispenser tip at a height slightly above the desired liquid fill height during dispensing. At the locations of the components which are to be free of encapsulant, the dispensing stops, and the tip may be raised to prevent residual viscous matter on the dispenser tip from contacting the backside of the exposed component.

Abstract: There is provided a flexible circuit module, including at least one rigid carrier, at least one solid state device mounted over a first side of the at least one rigid carrier, a flexible base supporting a second side of the at least one rigid carrier, a conductive interconnect pattern on the flexible base, and a plurality of feed through electrodes extending from the first side to the second side of the at least one rigid carrier and electrically connecting the conductive interconnect pattern with the at least one of a plurality of the solid state devices. The solid state devices may be LED chips to form an LED array module.

Abstract: A method is taught for applying and accurately locating a plurality of caps to a plurality of microfabricated devices at the wafer stage. The method involves using a two part mold to make a plurality of first hollow molded caps. The caps are made from a layer of thermoplastic material which is placed in the mold. Each cap having a central portion and a perimeter wall. The mold is opened so that the caps are carried by the first half. The caps are applied to a wafer using the first half. After the caps are applied, the wafer may be separated into individual chips.

Abstract: An apparatus and a method for populating transport tapes with electronic components includes a mold support having at least one recess over which a flat plastic strip is disposed. A heater heats the mold support and/or the plastic strip in an area of the recesses. An embossing tool, which has the electronic component in its embossing area, together with the electronic component, is embossed into the plastic strip in the direction of the recess into the mold support to form a tape pocket.

Abstract: A hearing aid instrument of the in-the-ear type (and preferably CIC) provides a plate member with electronic hearing aid components mounted thereto. The plate member is preferably of a harder material such as hard plastic. A soft polymeric body is bonded to the plate member and encapsulates preferably a plurality of the electronic hearing aid components. The body is soft and is shaped to conform to the ear canal of the user. The soft polymeric body and encapsulated electronic hearing aid components define a soft structure compliant to the ear canal during use and that is substantially solid and free of void spaces between at least some of the components and the ear canal. This combination of soft compliant structure and encapsulated electronic hearing aid components addresses problems of peripheral leakage, poor fit, pivotal displacement that occurs with jaw motion and internal cross talk of components housed in prior art hollow type hearing aids.

Abstract: A magnet structure including a magnet and an integral magnetically permeable concentrator and methods for making the same are provided. The concentrator is comprised of a plastic loaded with one or more magnetically permeable materials to a percentage suitable for providing desired magnetic field characteristics. The magnetic element may be comprised of a conventional magnetic material or a plastic loaded with one or more magnetic materials. An insert molding technique is described in which either the concentrator or magnetic element is prefabricated and inserted into a mold which is subsequently filled with a loaded plastic to provide the other component of the magnet structure. In an alternate fabrication technique, both the concentrator and magnet are sequentially formed by injection molding in the same mold. Also described is a magnet structure including a ring magnet having a central aperture in which a steel rod is disposed.

Abstract: The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipater. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipater.

Abstract: A method of producing a vehicle panel. The method comprises the steps of: laying wire on a first sheet of thermoplastic or thermoset composite material in a desired configuration; placing or forming a second sheet of thermoplastic or thermoset material on the first sheet of material thereby sandwiching the wire; and, pressing the sheets together so that they encase and insulate the wire, wherein the wire is left exposed at connection points formed by apertures in the sheets. A vehicle panel made according to the method is also disclosed.

Abstract: An encapsulated transformer includes a transformer coil assembly, a rigid core insert having an upstanding portion positioned within the hollow interior of the core and a base portion on which the core rests, and a thermoplastic rubber jacket that completely surrounds the transformer coil assembly and is bonded to the base portion of the core insert to provide a completely waterproof encapsulated transformer which is impervious to liquid and gasses that could be detrimental to the performance of the transformer. A method for producing such an encapsulated transformer includes placing a rigid core insert in a mold cavity of a mold, and positioning a transformer coil assembly in the mold cavity so that the transformer coil assembly rests on the core insert. Thermoplastic rubber is then injected into the mold cavity to completely encapsulate the transformer coil assembly in a jacket of thermoplastic rubber.

Abstract: A net-shape molded heat sink is provided which includes a thermally conductive main body and a number of thermally conductive fins integrally connected to and emanating from the main body. The heat sink is formed by overmolding a carbon-carbon matrix core plate with a thermally conductive polymer composition that is filled with thermally conductive filler material. The molded heat sink is freely convecting through the part which makes it more efficient and has an optimal thermal configuration.

Abstract: A method of forming a receptacle connector insert capable of maintaining constant distances between terminal groups even when a receptacle connector has the terminal groups of three rows or more and of being easily produced, comprising the steps of locking a terminal group (2) positioned at both ends to a pair of metal mold main bodies (4) as shown in FIG. 3(a) and holding a terminal group (2) arranged at the center in a rear core (6), moving a front core (5a) arranged on the right side of a curved part (2b) downward while bending the curved part (2b) as shown in FIG. 3(b), storing the curved part (2b) in a second storing part (10a) as shown in FIG. 3(c), moving a front core (5b) arranged on the left side toward the curved part (2b) as shown in FIG. 3(d) and storing the curved part (2b) in a second storing part (10b) as shown in FIG.

Abstract: The present invention provides a resin-molding method comprising the steps of: placing a circuit base member onto a mounting face of first one of paired dies, wherein a back face of the circuit base member is in contact with the mounting face; placing the paired dies in a closing state for clamping a peripheral region of the circuit base member with the paired dies; and injecting a molten resin into a cavity of the paired dies for filling the cavity with the injected resin, wherein, in the closing state, a first pressure effected to a front face of the circuit base member is set higher in pressure level than a second pressure effected to the back face of the circuit base member, so as to secure the circuit base member to the mounting face.

Abstract: An integrally formed single piece light strip and light strip manufacturing system. The light strip also includes a substrate populated with a plurality of LED light circuits. A plurality of bus elements are spaced apart from one another at a predetermined distance and are in electrical communication with the plurality of light circuits. A plastic material is extruded around the plurality of light circuits and the substrate to completely encapsulates the bus elements and the plurality of light circuits to provide a protective housing. In one embodiment, an electrical connector is also integrally formed as part of the light strip to eliminate the need for separate connectors. The light strip is o manufactured in a cost efficient manner, and is impervious to moisture penetration, thereby allowing the strip to be used in a variety of applications and environments.

Abstract: An integral single piece extruded LED light strip and an associated process for producing such an LED light strip. The light strip includes first and second bus elements spaced apart from one another by a predetermined distance. The light strip also includes at least one light emitting diode (LED) connected between the bus elements that is illuminated when the first bus element conducts electricity provided from a power source. An extruded plastic material completely encapsulates the first and second bus elements and the LED, thereby providing a barrier to protect the elements from damage and to make the light strip impervious to moisture.

Abstract: A resin molding die includes: a cavity; a resin inlet through which a liquid resin to be cured is injected into the cavity; and an air vent through which air is released to an exterior space of the resin molding die during injection of the resin, the air vent being provided on an opposite side from the resin inlet with respect to the cavity.

Abstract: A molding apparatus for molding semiconductor components includes a pair of opposing mold chases having mating mold cavities. The mold cavities are configured to retain polymer release films for separating the molded components from the mold cavities. The molding apparatus also includes a movable pot having a reservoir for retaining a preform of molding compound, and a plunger for moving the molding compound into the mold cavities. The movable pot is mounted for axial movement within a chamfered opening in one of the mold chases. The movable pot is configured to clamp onto the release films to prevent wrinkling of the release films, and seepage of the molding compound under the release films. A system for molding semiconductor components includes the molding apparatus, a pot drive mechanism for moving the movable pot, a plunger drive mechanism for moving the plunger, and a clamping mechanism for clamping the mold chases together.