Abstract: An ultrasonic wire bonding chuck includes first and second jaws for squeezing therebetween and clamping securely thereto said state frames utilized in forming microintegrated circuit solid state devices by ultrasonic bonding techniques. A clamping finger is provided for each lead on the frame secured by the chuck. Additionally the clamping surfaces of both jaws are roughened to provide enhanced gripping action on the member to be clamped and are arranged to substantially eliminate the effects of frame burrs and distortion on the clamping of the frame.

Abstract: This invention is directed to an apparatus and method for making a shingle from a block of wood. The block of wood is canted and a shingle is sawed from this block of wood. The shingle has a thick end and a thin end. After the shingle has been sawed, the block of wood is moved away from the saw and canted at a new angle with respect to the saw. Then, the block of wood is moved toward the saw and another shingle is sawed. This process is repeated to form shingles from a block of wood.