Abstract: The invention relates to a method for connecting a plurality of elements for a circuit board, comprising the following steps: providing the elements of a circuit board to be connected to each other, the elements having contours adapted to each other; arranging the elements to be connected to each other in close proximity in at least one of two peripheral areas that have complementary contours, while maintaining a distance between opposing peripheral areas; and mechanically connecting the opposing peripheral areas by means of at least one sub-area thereof in order to connect the elements of the circuit board to be connected to each other. Furthermore, a circuit board produced from a plurality of elements connected to each other is provided.

Abstract: An integrated heat spreader is disclosed in which grooves are formed in a recess of the heat spreader to enhance the stiffness and strength of the integrated heat spreader without increasing production costs or complexity. The integrated heat spreader may be fabricated by providing a metal strip having raised portions thereon to provide a recess therebetween, forming grooves on a bottom surface of the recess, where the grooves extend along a periphery of the bottom surface which is substantially free of the raised portions, and subsequently singulating an integrated heat spreader from the metal strip.

Abstract: A stacked display (20b) comprises superposed regions for changing between a reflective color state (R, G, B) and a transparent state, which regions form part of a˜bended substrate (20). The substrate (20) may comprise a sequence of portions (1-6) which forms regions having pre-defined color. Each portion (1-6) is electrically connected to a further portion in the sequence by interconnect regions (b?, c?, d?) which form an oversized loop between the regions (1-2, 3-4, 5-6) when the substrate (20) is bent. The regions (1-2, 3-4, 5-6) are filled with a suitable optoelectronic color material (R, G, B).

Abstract: An optical interface module includes a single flexible Printed Circuit Board (PCB) including conductive traces. An electrical connector, one or more opto-electronic transducers and ancillary circuitry are disposed on the flexible PCB. The electrical connector is configured to mate with a corresponding connector on a substrate. The opto-electronic transducers are configured to be coupled to optical fibers carrying optical signals. The ancillary circuitry is coupled by the traces to the opto-electronic transducers and the electrical connector so as to convey electrical signals corresponding to the optical signals between the opto-electronic transducers and the electrical connector.

Abstract: The present invention relates to a camera module, the camera module including a base formed at an upper surface of a PCB (Printed Circuit Board) mounted with an image sensor, and formed with an IRCF (Infrared Cut Filter) at a position corresponding to that of the image sensor, a bobbin vertically reciprocatively formed at an upper surface of the base, and having a bobbin screw thread at an upper surface, a lens barrel formed with a lens barrel screw thread at an outer surface for being screw-connected to an interior of the bobbin and mounted with at least one or more lenses, and a foreign object blocking unit formed at a screw-connected portion between the bobbin and the lens barrel to prevent sticky and adhesive foreign objects from being transmitted to an IRCF (Infrared Cut Filter) in the course of screw-connection between the lens barrel and the bobbin.

Abstract: Representative implementations of devices and techniques provide a printed circuit board (PCB) arranged to at least partly surround an electrical component having a plurality of non-coplanar outer surfaces. The PCB is arranged to fold at one or more predetermined boundaries.

Abstract: Disclosed herein is a method for assembling a circuit board which has at least one layer copper clad on one or both sides or provided with conductor tracks, wherein, in one assembly step, at least one rigid flange insert is inserted into an associated recess in the circuit board or into a component associated with the circuit board and wherein at least one semiconductor die of a semiconductor component is applied onto the inserted flange insert in a subsequent application step.

Abstract: This relates to systems and methods for providing one or more vias through a module of an electrical system. For example, in some embodiments, the module can include one or more passive elements and/or active of the electrical system around which a packaging has been plastic molded. The module can be stacked under another component of the electrical system. Vias can then be provided that extend through the module. The vias can include, for example, electrically conductive pathways. In this manner, the vias can provide electrical pathways for coupling the component stacked on top of the module to other entities of an electronic device including the electrical system. For example, the component can be coupled to other entities such as other components, other modules, printed circuit boards, other electrical systems, or to any other suitable entity.

Abstract: A method of assembling a circuit board assembly is provided. The circuit board assembly includes a circuit board assembly fixture and a plurality of fixed circuits. The method includes coupling the plurality of fixed circuits to the circuit board assembly fixture. The plurality of fixed circuits includes at least one of a fully flexible circuit, a flexible circuit having stiffeners, and a rigid circuit. The fixture includes a plurality of supporting surfaces each including a first side, configured to receive at least one of the fixed circuits, and an opposite second side. The fixture includes at least one hinge, at least one fastening mechanism extending from the first side, and at least one retainer coupled to at least one of the plurality of supporting surfaces. The method includes folding the circuit board assembly fixture into a desired alignment.

Abstract: Example appliance displays having modular light guides and methods of assembling the same are disclosed. An example appliance display includes a printed circuit board having a side-fire light emitting diode attached to a surface of the printed circuit board, a frame having a plurality of heat stakes to operatively connect the printed circuit board to the frame, and a light guide inserted into an opening defined in the frame, wherein the light guide guides light emitted by the light emitting diode through the opening defined in the frame, and wherein the printed circuit board retains the light guide in the opening when the printed circuit board is heat staked to the frame.

Abstract: Provided are a stretchable electric circuit and a manufacturing method thereof The method for manufacturing the stretchable electric circuit includes forming a mold substrate, forming a stretchable substrate having a first flat surface and a first corrugated surface outside the first flat surface on the mold substrate, removing the mold substrate, forming a corrugated wire on the first corrugated surface, and forming an electric device connected to the corrugated wire on the first flat surface.

Abstract: A method of fabricating packaging for a product comprises forming a plurality of conductive tracks on a sheet of material and forming a physical barrier, such as a hole, for impeding fluid flow between adjacent conductive tracks. The method may further comprise depositing first and second regions conductive fluid onto adjacent first and second conductive tracks either side of the physical barrier and mounting an electronic device having first and second terminals such that the electronic device forms a bridge over the physical barrier and the first ands second terminals contact the first and second conductive adjacent tracks.

Abstract: Disclosed is an electronic apparatus including a circuit element including a first main surface, a first electrode provided in the first main surface, an optical element including a second main surface and being configured to either transmit or receive an optical signal, a second electrode provided in the second main surface, a window which is provided in the second main surface and through which the optical signal passes, a wiring layer provided on the first main surface and the second main surface, the wiring layer electrically connecting the first electrode and the second electrode, and an optical waveguide, which is provided on the second main surface and optically connected to the window, the optical signal passing through the optical waveguide.

Abstract: An automatic or semiautomatic method of assembly of radiation digital imaging tiles to form a one or two dimensional imaging panel whereby the imaging tiles are provided with alignment mark(s), inherent or specific, and a mother board or substrate is also provide with alignment mark(s) and the imaging tiles are mounted on the mother board by means of mechanical pick and place mechanism, whereby the distances of corresponding alignment mark are set to predetermined values, programmed in the automatic machine.

Abstract: An electronic device is disclosed having a housing with a single opening, and an inner space accessible solely through the opening. A covering plate is positioned within the opening. An electrically conductive contact pin extends through the covering plate and into the inner space.

Abstract: According to one embodiment, a MEMS device includes a first electrode formed on a support substrate, a second electrode arranged to face the first electrode and formed to be movable in a facing direction with respect to the first electrode, a beam portion formed on the support substrate and formed to support the second electrode, a cap layer formed to cover the second electrode and beam portion, a plurality of through-holes formed in the cap layer, the through-holes being formed in a portion other than a proximity portion in which a facing distance between the cap layer and a member in the cap layer is not longer than a preset distance, and a sealing layer formed to cover the cap layer and fill the through-holes.

Abstract: A miniature oxygen sensor makes use of paramagnetic properties of oxygen gas to provide a fast response time, low power consumption, improved accuracy and sensitivity, and superior durability. The miniature oxygen sensor disclosed maintains a sample of ambient air within a micro-channel formed in a semiconductor substrate. O2 molecules segregate in response to an applied magnetic field, thereby establishing a measureable Hall voltage. Oxygen present in the sample of ambient air can be deduced from a change in Hall voltage with variation in the applied magnetic field. The magnetic field can be applied either by an external magnet or by a thin film magnet integrated into a gas sensing cavity within the micro-channel. A differential sensor further includes a reference element containing an unmagnetized control sample. The miniature oxygen sensor is suitable for use as a real-time air quality monitor in consumer products such as smart phones.

Abstract: Described herein are various embodiments of contacts that include different portions angled with respect to one another and methods of manufacturing devices that include such contacts. In some embodiments, a module may include a first portion of a contact that is disposed within a housing and a second portion that is disposed outside of the housing, with the second portion angled with respect to the first portion. Manufacturing such devices may include depositing a conductive material to electrically connect the contact to a contact pad of a substrate. In some embodiments, a deposition process for depositing the conductive material may have a minimum dimension, which defines a minimum dimension of a conductive material once deposited. In some such embodiments, a distance between a terminal end of the contact pin and the contact pad may be greater than the minimum dimension of the deposition process.

Abstract: The present description relates to the field of fabricating microelectronic structures. The microelectronic structure may include a microelectronic substrate have an opening, wherein the opening may be formed through the microelectronic substrate or may be a recess formed in the microelectronic substrate. A microelectronic package may be attached to the microelectronic substrate, wherein the microelectronic package may include an interposer having a first surface and an opposing second surface. A microelectronic device may be attached to the interposer first surface and the interposer may be attached to the microelectronic substrate by the interposer first surface such that the microelectronic device extends into the opening. At least one secondary microelectronic device may be attached to the interposer second surface.

Abstract: According to an example, a server node may include a base module and a plurality of face modules rotatably coupled to the base module to form an enclosure. The base module and a face module of the plurality of face modules may each include an inner surface that includes an electrical component. A flexible printed circuit interconnect may communicatively interconnect the electrical component on the inner surface of the base module to the electrical component on the inner surface of the face module.

Abstract: A total internal reflection sub-assembly includes a body defining at least a portion of an optical path, a lens supported by the body and positioned in the optical path, and an optical turning member supported by the body and configured to change the direction of the optical path. The total internal reflection sub-assembly also includes a carrier having a first surface coupled to the body and a second surface opposite the first surface. An active device is supported on the first surface of the carrier, which is coupled to the body on opposite sides of the active device. The body and carrier are shaped so that a space is maintained between the active device and an underside surface of the body. The lens is positioned on the underside surface and aligned with the active device.

Abstract: An electronic device includes: an electronic component including an external connection terminal; and a lead frame (metal member) connected to the external connection terminal. The lead frame is disposed with a pad. The pad overlaps the external connection terminal in plan view, and at least a portion of the pad is located outside the external shape of the electronic component in plan view. The pad and the external connection terminal are connected by means of a conductive bonding member. The pad and the electronic component are bonded together with a resin. The resin extends to a region of the pad located outside the external shape of the electronic component in plan view.

Abstract: In error coping executed when it is determined that an electronic component is a different type of component which is not a regular electronic component to be supplied from a part feeder in a component mounting process, production operation of the component mounting device is stopped, a component set timing at which the different type of component is set is specified on the basis of component set history information, all of the substrates to be target of production by the component mounting device after a specified component set timing are specified as substrates to be managed on which the different type of components are potentially mounted, and the production operation of all of the devices arranged downstream, and intended to produce the substrates to be managed is stopped.

Abstract: An apparatus that facilitates the accurate and uncomplicated placement of an adhesive circuit structure onto an integrated circuit card is described. The apparatus is configured to hold the adhesive circuit structure and an integrated circuit card such that the two components can be aligned for proper placement.

Abstract: A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure includes an electronic component having electrical contacts, sensor electrodes, and electrical interconnects between the sensor electrodes and the electrical contacts. The bio-compatible structure is fabricated such that it is fully encapsulated by a bio-compatible material, except for the sensor electrodes. In the fabrication, the electronic component is positioned on a first layer of bio-compatible material and a second layer of bio-compatible material is formed over the first layer of bio-compatible material and the electronic component. The electrical contacts are exposed by removing a portion of the second layer, a conductive pattern is formed to define the sensor electrodes and electrical interconnects, and a third layer of bio-compatible material is formed over the conductive pattern.

Abstract: A method of manufacturing a hollow surface mount type electronic component has a preparing step, a gluing step and a cutting step. The preparing step includes preparing a baseboard, a clapboard and a cover board, mounting multiple circuit segments and conducting points on two opposite faces of the baseboard at intervals and boring multiple through holes on the clapboard corresponding to the circuit segments. The gluing step includes mounting multiple electronic elements on the baseboard to connected with the circuit segments, gelatinizing glue on the boards to mount the clapboard between the baseboard and the cover board and pressing the boards by a pressing machine. The cutting step includes cutting the boards by a cutting machine to produce multiple single SDM electronic components.

Abstract: An electronic component mounting system and method is disclosed that can provide accurate operation instruction to a machine operator. The electronic component mounting system comprises a plurality of machines interlinked in series. A main screen, making up an operation instruction screen, is displayed on a display panel belonging to an operation target machine to be operated by the machine operator while a first sub-screen and a second sub-screen of the operation instruction screen are respectively displayed on display panels belonging to two adjacent machines placed adjacently on both sides of the operation target machine among the plurality of machines. Thus, even when a unit device has a small width such that a size restriction is imposed a display panel, accurate operation instruction, with a sufficient amount of information, can be provided by displaying the operation instruction screen on multiple display panels.

Abstract: Disclosed are a component mounting line and a component mounting method where it is not necessary for an operator to perform an input operation in an inspection device when substitute components are used in a component mounting device. When substitute components are mounted in place of one type of components at the mounting positions on the substrate PB, a component mounting device 4 creates substitute component related data including information specifying the substrate PB on which substitute components are mounted and the mounting positions at which the substitute components on the substrate PB are mounted and information indicating the types of substitute components and transmits the substitute component related data to the post-mounting inspection device.

Abstract: A method of making an electronic device includes forming a circuit layer on a liquid crystal polymer (LCP) substrate and having at least one solder pad. The method also includes forming an LCP solder mask having at least one aperture therein alignable with the at least one solder pad. The method further includes aligning and laminating the LCP solder mask and the LCP substrate together, then positioning solder paste in the at least one aperture. At least one circuit component may then be attached to the at least one solder pad using the solder paste.

Abstract: Provided is an electronic control device, in which positioning of a case including a connector housing portion and a pin header portion of a connector mounted on an electronic circuit board may be carried out easily with high accuracy so that ease of assembly and a water-proof property of the connector are improved. The electronic control device includes: an electronic circuit board (1) on which a pin header (30) used for electric connection to an external device is mounted together with an electronic component (11); and a case (2) for receiving the electronic circuit board therein, the case including a connector housing portion (31) provided as an opening portion (310) at a position corresponding to the pin header. A cover (20) of the case including the connector housing portion and the pin header mounted on the electronic circuit board have a first positioning structure using press-fit.

Abstract: A method of mounting a semiconductor element, the method includes: attaching a first solder joint material onto a first pad formed on a substrate supplying a second solder joint material onto the first solder joint material, a second melting point of the second solder joint material being lower than a first melting point of the first solder joint material; arranging the semiconductor element so that a second pad formed on the semiconductor element faces the first pad and a joint gap is provided between the semiconductor element and the substrate; and performing reflow at a reflow temperature lower than the first melting point and higher than the second melting point to join the first solder joint material and the second solder joint material.

Abstract: Embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer board containing the embedded capacitance is located beyond where the vias or blinds are located. This permits that via to conduct through the opening. In this way, the capacitance and the resistance will have a closer contact point to the electrical component. A resistance can also be embedded in an opening in the adaptor board and be vertically aligned within the opening to make contact with a pad on top of the adaptor board and a pad at the bottom of the adaptor board so that electricity conducts through the embedded component.

Abstract: A production method for an electronic chip component includes the steps of forming a first paste layer by applying paste onto a first end surface of an electronic component body with a second end surface being stuck onto a substrate having an adhesive surface and drying the paste, turning the electronic component body 180 degrees so as to stick the first end surface of the electronic component body onto the substrate by sliding a slider relative to the substrate in a state in which the slider is in contact with the first end surface of the electronic component body, forming a second paste layer by applying the paste onto the second end surface of the electronic component body and drying the paste, and firing the first and second paste layers.

Abstract: An assembly and method for mounting an electronic package to a printed circuit board (PCB) in which a gasket is shaped to fit tightly around and under a perimeter edge of an electronic package.

Abstract: The present invention relates to a method of manufacturing an LED module, which enhances heat dissipation efficiency of the LED module through a configuration of installing a plurality of electrically separated conductive electrode plates to be close to each other on a same plane, stacking insulation layers on the top and bottom sides of the electrode plates, forming a plurality of ground holes on one side of the insulation layers to expose the electrode plates, and then grounding both electrodes of LED chips to the separated electrode plates.

Abstract: A carrier for mounting a piezoelectric device, e.g., a surface acoustic wave (SAW) device, on a circuit board and a method of mounting a piezoelectric device on a circuit board using such a carrier are disclosed. The carrier includes a carrier bottom, a plurality of metal contacts, and a carrier lid attached to the carrier bottom. The carrier bottom has an opening extending partially through the carrier bottom from a top surface thereof and the opening is configured such that when a piezoelectric device to be mounted in the carrier is inserted into the carrier bottom, the piezoelectric device is at least partially recessed within the carrier bottom. The metal contacts include a cantilevered end configured for electrical connection to a piezoelectric device. The carrier lid is configured to retain a piezoelectric device within the carrier bottom and to apply substantially even pressure across a top surface of a piezoelectric device.

Abstract: A terminal assembly for use with an electronic device may include a first portion for secure a wire and a second portion for receiving a pin of an electronic device. The first portion and the second portion may be configured to electrically connect the pin to the wire.

Abstract: Systems and methods are disclosed for making a light segment by forming a sealed body having an interior chamber; creating a boiling enhancement surface positioned in a predetermined location on the interior chamber; filling the interior chamber with a liquid portion and thermally coupled to the liquid portion at all orientations of the light blade; and boiling the liquid portion with a light source located on the predetermined location on an exterior portion of the sealed body.

Abstract: Provided is a production method of an electrostatic capacitance element, including preparing a dielectric sheet on which a conductor is not being applied, and a mask that has at least one basic pattern shape, making a basic-pattern green sheet by applying the conductor on the dielectric sheet through the mask, making a rotated basic-pattern green sheet in which the basic-pattern green sheet is rotated, making a laminate of the basic-pattern green sheet and the rotated basic-pattern green sheet, making a reversed basic-pattern green sheet by reversing at least one of the basic-pattern green sheet or rotated basic-pattern green sheet, laminating the reversed basic-pattern green sheet on the laminate with a dielectric sheet, on which a conductor is not being applied, interposed therebetween, and performing compression-bonding and baking treatments of a laminate of the basic-pattern green sheet, the rotated basic-pattern green sheet, the dielectric sheet and the reversed basic-pattern green sheet.

Abstract: A rack mountable 1U storage unit includes a plurality of memory modules arranged in two groups. The storage unit also has control circuitry. The memory modules have a dedicated exhaust channel to draw heat away from the memory modules. The exhaust channel for the memory modules is disposed over and is physically separated from the exhaust channel for the control circuitry. The storage unit can accommodate up to 42 memory modules due to a unique method of placing the individual memory modules.

Abstract: A light emitting diode (LED) light bulb includes a base and at least one support structure coupled to the base. The support structure is formed into a shape that defines contours for a luminous surface and an open volume. The LED light bulb includes least one LED assembly comprising two or more electrically connected LEDs. The LED assembly is attached to and in physical contact with the support structure along a length of the support structure to form the luminous surface. The support structure has openings between neighboring segments of the LED assembly.

Abstract: A durable LED light engine includes an printed circuit board including LEDs mounted thereon positioned between a substantially U-shaped top enclosure and a bottom enclosure. Once assembled together using alignment holes and projections, the open spaces in the combination of the substantially U-shaped top enclosure, the printed circuit board and the bottom enclosure are filled with a plastic sealant. Once cooled, the plastic sealant holds the combination of the substantially U-shaped top enclosure, the printed circuit board and bottom enclosure together.

Abstract: A detector for a small-angle x-ray diffraction system uses curved readout strips shaped to correspond to the expected intensity distribution of x-rays scattered by the system. This expected intensity distribution may be a series of concentric circles, and each of the strips has a shape that approximates a section of an annulus. The strips may be positioned on a substrate such that a center of curvature of the curved strips is located along an edge of a readout region within which the strips are located or, alternatively, at a geometric center of the readout region. The detector may have a signal readout system that uses a delay line or, alternatively, a multichannel readout system. The detector may make use of electron generation via interaction of the diffracted x-ray beam with a gas in a gas chamber, or through interaction of the diffracted beam with a semiconductor material.

Abstract: A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set of traces and a set of through substrate vias at opposing ends of the traces. The interposer is coupled to the voltage regulator. The two-stage power delivery network also includes a semiconductor die supported by the packaging substrate. The two-stage power delivery network also includes a capacitor that is supported by the packaging substrate. The capacitor is operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulator.

Abstract: A printed circuit board has a cavity formed in at least one side thereof and an electronic component disposed at least partially within that cavity. Electromagnetic interference (EMI)-shielding material is disposed between the electronic component and at least one of the side walls and bottom of this cavity. So configured, the overall height of the combined structure is reduced as compared to a surface-mounted component.

Abstract: A method for manufacturing a printed wiring board including providing a structure having a wiring substrate having a conductor circuit, a build-up multilayer structure formed over the wiring substrate and having an outermost conductor circuit and an outermost insulative resin layer, and a solder resist layer formed over the outermost conductor circuit and outermost insulative resin layer and having openings with an opening diameter D for mounting electronic elements, forming conductor pads with a pitch of about 200 pm or less on the outermost conductor circuit in the openings of the solder resist layer, respectively, and forming solder bumps with a height H from a surface of the solder resist layer on the conductor pads on the conductor pads, respectively, such that a ratio H/D is about 0.55 to about 1.0.

Abstract: A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining.

Abstract: A printed circuit board assembly (PCBA) includes a printed circuit board (PCB) with through holes, a supporting member standing on the PCB adjacent to the through holes, and an electronic component mounted on the PCB is provided. The electronic component includes a component body and a plurality of conductive leads. Fixing ends of the conductive leads of the electronic component is received in the though hole and electrically and mechanically fixed to the PCB. The component body of the electronic component is supported by the supporting member.

Abstract: A security device for protecting stored sensitive data includes a closed housing including an array of conductor paths and tamper detecting means adapted to detect a change in impedance of the array of conductor paths above a predetermined threshold value.

Abstract: An apparatus for equalizing voltage across an electrical lighting system, particularly in low voltage landscape lighting systems. The apparatus consists of a plastic cylinder having open ends and containing two or more connectors for connecting a homerun wire from a transformer to wire leads from the various light fixtures in the lighting system. The wire leads are of uniform length to ensure that each light fixture is ecu equally distant from the transformer.