Abstract: A cut and clinch device that bends leads of a leaded component into at least one of an bent-in state, a bent-out state, or an N-bent state. The bent-in state is a state with a pair of leads bent inside by moving a pair of movable sections towards each other. The bent-out state is a state with a pair of leads bent outside by moving a pair of movable sections away from each other. The N-bent state is a state with a pair of leads bent into an N-shape by moving a pair of slide bodies towards each other, moving a pair of movable sections away from each other, and then rotating the pair of slide bodies around a center point. Thus, leads can be bent into various states, and a leaded component can be appropriately mounted on a board.

Abstract: A gradient coil device includes a major axis gradient coil, having an ellipse in a cross section generating a gradient magnetic field inclined in a major axis direction of the ellipse at a magnetic field space; and a minor axis gradient coil, having an ellipse in a cross section generating a gradient magnetic field inclined in a minor axis direction of the ellipse at the magnetic field space. A length of the minor axis field coil in the center axis direction is shorter than a length of the major axis gradient coil in the center axis direction. A maximum value of a residual magnetic field generated by the minor axis gradient coil at a space outside the magnetic field space is equal to or smaller than a maximum value of a residual magnetic field generated by the major axis gradient coil at a space outside the magnetic field space.

Abstract: A nickel strip is made from a starting material of solid cathode sheets having a minimum nickel content of 99.94% by weight and a maximum trace element content, in ppm by weight, of <35 carbon, <5 sulphur, <14 manganese, <11 magnesium, <11 aluminum, <25 titanium, and <15 silicon. The sheets are hot-rolled individually in a single layer/ply. The sheets are then joined to form the strip.

Abstract: In order to avoid cost for accommodating a shield wire in a housing while bending, and smoothly and readily accommodate within the housing while the shield electric wire is insulated, a conductive housing 1 including a rear wall 4 continuing to an annular wall 3, and a tube wall 5 continuing to down the rear wall 4, a method comprising the steps of: passing through a shield electric wire 2 from a lower opening 5a of the tube wall of the conductive housing to a front opening 3a of the annular wall while bending the shield electric wire; putting a shield terminal 9 movably around the shield electric wire from top of the shield electric wire; exposing a core wire 2b and a braid 2a of the shield electric wire by stripping a tip thereof; connecting an L-shaped terminal 11 to the core wire; mounting an L-shaped insulation inner housing 12 outside the L-shaped terminal; connecting the shield terminal to the braid; and accommodating a vertical part 14 of the inner housing within the conductive housing by pulling in t

Abstract: A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes simultaneously extruding a plurality of materials in the cross-sectional shape of the Z-directed component to form an extruded object with the plurality of materials arranged relative to each other in their operative positions for the Z-directed component. The extrusion of a first portion of at least one of the materials in the extruded object is staggered relative to the extrusion of a second portion of the at least one of the materials in the extruded object. At least a segment of the extruded object is fired. The fired segment forms the Z-directed component insertable into a mounting hole in a printed circuit board.

Abstract: A method is provided for assembling a connector assembly to a case. The case includes an inside surface defining an inside of the case, an outside surface defining an outside of the case, and an aperture therethrough providing communication from the inside surface to the outside surface. The connector assembly includes an outer connector having a body with a passage therethrough, an electromagnetic shield, and an inner connector with a terminal therein with a conductor extending from the inner connector in electrical communication with the terminal. The method includes positioning the outer connector on the outside of the case to align the passage of the outer connector with the aperture of the case. The method also includes positioning the inner connector on the inside of the case. The method also includes inserting the inner connector into the passage of the outer connector from the inside of the case.

Abstract: Methods and structures for controlling wafer curvature during fabrication of integrated circuits caused by stressed films. The methods include controlling the conductor density of wiring levels, adding compensating stressed film layers and disturbing the continuity of stress films with the immediately lower layer. The structure includes integrated circuits having compensating stressed film layers.

Abstract: The method includes forming an annular seat and main marks on a metal layer simultaneously so that the annular seat opposes with a terminal of an electronic component when the component is placed above the annular seat at a subsequent step; then positioning the electronic component in a mounting expected region using the main marks and mounting the electronic component with an adhesive layer therebetween; then burying the electronic component and the main marks in an insulating substrate; then removing part of the metal layer and thereby forming first and second windows; then irradiating the adhesive layer with laser using the exposed main marks thereby forming a laser via hole; and then filling the laser via hole with copper and forming a wiring pattern from the metal layer electrically connected to the terminal through a conductive via.

Abstract: Electrical resistance between a male part and a female part through a canted spring is disclosed using mathematical modeling. Increase or decrease in resistance can be quickly analyzed by looking at the equivalence resistance and the number of contacts at the input side, the output side, or both. The number of contacts may also be created by forming a dimple having a discontinuity.

Abstract: A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining.

Abstract: A device for separating electronic components including sawing means and positioning means, wherein between the positioning means and the sawing means at least one transfer position is defined for the purpose of transferring positioned electronic components. A separating device for electronic components including sawing means, positioning means, inspection means, and sorting means, wherein between the positioning means and the sawing means at least one transfer position is defined for the purpose of transferring positioned electronic components between the positioning means and the sawing means, and wherein between the inspection means and the sorting means at least another transfer position is defined for the purpose of transferring the inspected separated electronic components between the inspection means and the sorting means.

Abstract: Embodiments of the invention provide a method of manufacturing a printed circuit board, including: mounting a strip substrate on a fixing member; separating the strip substrate into unit substrates by performing a singulation process; attaching solder balls onto the unit substrates using a jig; and fixing the solder balls on the unit substrates by performing a reflow process. The method of manufacturing a printed circuit board is advantageous in that the solder balls can be accurately formed at the predetermined positions of the strip substrate because they are attached to the unit substrates after the warpage of the strip substrate was reduced by a singulation process.

Abstract: A method for forming cavity in substrate includes setting start position on closed loop line having circumference L for substrate, consecutively irradiating laser from laser device upon board for the substrate such that holes are formed, and moving the device in loop from the start position along the line such that penetrating hole is formed through the board. The start position of first loop is set as base position, the moving includes shifting the start position by distance d after each loop and controlling such that the moving satisfies p=?di, m?L/p and M=m×n, where i=1 to n, n represents number of loops, p represents pitch of the holes, m represents number of the holes in loop, ?di is distance from the base position for the start position after i-th loop, and M is number of the holes by the loops.

Abstract: Methods for generating tracing information for gas cylinders are provided comprising a metal cylinder body manufactured from an unrefined metal piece, wherein such a method comprises the steps of equipping the metal piece with an individual marking, identifying, during at least one transformation or control step of the piece, an identification code of the piece by reading the individual marking and associating one or more process parameters of the transformation step or control results with the identification code, and storing the process parameters and the association with the identification code in a database. Systems for generating tracing information for gas cylinders are also provided.

Abstract: Provided is a method for manufacturing an in-plane switching mode liquid crystal display, which can prevent the problem of bubble generation caused by an Ag dot during the attachment process of a liquid crystal panel and a cover substrate, and improve the yield of an Ag dot process. A method for manufacturing an in-plane switching mode liquid crystal display according to an embodiment of the present invention may comprise: forming a liquid crystal panel by interposing a liquid crystal layer between a color filter substrate and a TFT array substrate; attaching a polarizer, with a protective film attached thereon, on the color filter substrate; forming an Ag dot to be in contact with an edge of the protective film, the color filter substrate, and the TFT array substrate; removing part of the Ag dot by removing the protective film; and attaching a cover substrate on the color filter substrate.

Abstract: A layout method of a touch panel electrode includes the steps of: providing a substrate; forming a first electro-conductive layer, having pattern blocks disposed adjacently to one another, on one side of the substrate, wherein the first electro-conductive layer is transparent; forming an alignment film on the one side of the substrate; forming an second electro-conductive layer, having wires to be connected to at least one of the pattern blocks, on the one side of the substrate; and forming a protection layer on the second electro-conductive layer to protect the second electro-conductive layer. The present invention can reduce the processes of manufacturing the conventional electrode, especially do not needs to form another electro-conductive layer and another protection layer on the other side of the substrate, and can effectively prevent the electrostatic charge effect and increase the capacitance and sensitivity.

Abstract: A sensor, and methods of making, for determining the concentration of an analyte, such as glucose, in a biological fluid such as blood or serum, using techniques such as coulometry, amperometry, and potentiometry. The sensor includes a working electrode and a counter electrode, and may include an insertion monitoring trace to determine correct positioning of the sensor in a connector. The sensor is calibration-adjusted, eliminating the need for a user to enter a calibration code or for the meter to read a calibration code.

Abstract: The invention discloses methods for transferring a tactile signal through an inert piece of material. In some embodiments, clear, impact resistant covers are employed with devices including touch-sensitive screens. The instant invention, in some embodiments, describes a method for employing a plurality of magnets to allow a user to input information on a touch-sensitive screen through the inert cover. Contact of a magnet pair above the cover may allow for a signal to be delivered to the touch-sensitive display via a second magnet pair that includes a stylus adapted to activate the surface of the display.

Abstract: A wiring board has a plurality of wiring layers, a first land, a second land, a first via and a second via. The first land and the second land are formed on at least one wiring layer of the wiring board and are disposed to partially overlap with each other. The first via and the second via are formed in association with the first land and the second land, respectively. The first via and the second via electrically connect a first wiring layer and a second wiring layer of the plurality of wiring layers to each other. The wiring board has a separator that is formed by a hole that separates the first land and the second land from each other.

Abstract: A display device is provided with a touch panel includes: a base substrate; a first transparent electrode layer located on the base substrate; an ultrasonic wave guiding layer located on the first transparent electrode layer; a second transparent electrode layer located on the ultrasonic wave guiding layer; an ultrasonic wave transmitting unit and an ultrasonic wave receiving unit located on the second transparent electrode layer; and a protecting layer located on the second transparent electrode layer.

Abstract: A method of manufacturing a passive component module, comprising the steps of: providing a carrier with alignment marks; bonding passive components to the carrier based on the alignment marks, wherein each passive component has interconnection pads; forming a molding material over the carrier for molding the passive components; separating the molding material with the passive components from the carrier; exposing all interconnection pads of each passive component; and building electrical interconnections between the passive components so that the passive component module is obtained.

Abstract: A method for RF matching of an RF plug connector includes a printed circuit board having contact points for RF contacts and contact points for insulation-displacement contacts, with one contact point for the RF contacts in each case being connected to a respective contact point for the insulation-displacement contacts, and with capacitive coupling which causes near-end crosstalk occurring between the RF contacts, with at least one first conductor track being arranged on the printed circuit board and, together with at least one second conductor track which is arranged on and/or in the printed circuit board, forming a capacitor, with at least one frequency-dependent parameter of the arrangement being measured and being compared with a nominal parameter, and the conductor track with which contact is made on one side being partially removed or cut through as a function of the difference.

Abstract: A method for affixing adhesive films to a main board is provided. The main board includes a main body and a shield. The shield includes a first shield and a second shield. The second shield defines openings. When the second shield is attached to the main body, components of the main body are confined within the openings, respectively. The method includes: first absorbing a single adhesive film to an electrostatic absorbing film. Then, stamping the electrostatic absorbing film and the single adhesive film to form adhesive films that have substantially the same shape and arrangement as the openings. Next, aligning the electrostatic absorbing film with the first shield and affixing the adhesive films to the first shield. Then, removing the electrostatic absorbing film from the first shield. And, assembling the first shield to the second shield.

Abstract: Provided are an opto-electric hybrid board and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes notch portions for locating the electric circuit unit, which is formed in portions of at least one of an undercladding layer and an overcladding layer, and the notch portions are located and formed at predetermined locations with respect to one end surface of a core. The electric circuit unit includes bent portions, which fit into the notch portions, and the bent portions are located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other under a state in which the bent portions fit into the notch portions.

Abstract: In the disassembling method of a display device of the present invention, the display device has a display panel, and metal plate unit having a panel member formed of a chassis member disposed on the back surface of the display panel and a circuit board as an electric circuit member attached to the chassis member through an attaching member. The disassembling method has a mounting step of mounting metal plate unit on stage whose tilt angle can be adjusted by mechanism section and a cutting step of cutting the attaching member in parallel with the surface of stage with saw blade that abuts on the attaching member by the own weight of metal plate unit based on the tilt angle of stage.

Abstract: Disclosed are a coreless packaging substrate and a manufacturing method thereof. The substrate includes a built-up structure and a first wiring layer. The built-up structure has a first outside and an opposite second outside, and includes one or more second dielectric layers and second wiring layers, and a plurality of conductive vias. The second dielectric layers have first and second surfaces respectively facing the first and second outsides. The second wiring layers are disposed on the second surface. The conductive vias are disposed in the second dielectric layer. The outermost second wiring layer at the second outside has a plurality of second conductive pads. The first wiring layer is embedded into and exposed from the first surface of the outermost second dielectric layer at the first outside, and has a plurality of first conductive pads. The conductive vias electrically connect the first wiring layer and the second wiring layer.

Abstract: A methodology for connecting device components with circuitry located at different levels and orientations relative to one another is described. First circuitry can be located on a multi-plane rigid circuit board where the multi-plane rigid circuit board can include at least one flexible member sharing a common substrate with the multi-plane rigid circuit board that extends from a body portion of the multi-plane rigid circuit board. The flexible member can include traces used to convey power and/or data and an interface coupled to the power and/or data traces. The flexible member can be deflected or twisted to connect first circuitry on the body portion of the multi-plane rigid circuit board to second circuitry associated with another device component.

Abstract: The invention removes copper from the concave side of a flex circuit around a bendable region and replaces it with a conductive epoxy to allow it to be formed to tighter bend radii than would otherwise be possible. After the flex circuit is shaped in a tight radius and attached to a mechanical structure, the conductive epoxy is cured to act as functional replacement of the removed copper.

Abstract: A method of making a self-supporting field director structure for use in heating an article in a microwave oven comprises in any operative order, the steps of folding a first and a second elongated vane blank along a central fold line to form at least two V-shaped vane doublets; inserting each of the vane doublets into a slotted annular support member so that each vane in each vane doublet extends through an adjacent slot in the annular support member; and attaching the vane doublets at their vertices to define a vane array.

Abstract: The present invention is a method for evaluating a silicon wafer by measuring, after fabricating a MOS capacitor by forming an insulator film and one or more electrodes sequentially on a silicon wafer, a dielectric breakdown characteristic of the insulator film by applying an electric field from the electrodes thus formed to the insulator film, the method in which the silicon wafer is evaluated at least by setting an area occupied by all the electrodes thus formed to 5% or more of an area of a front surface of the silicon wafer when the one or more electrodes are formed. This provides an evaluation method that can detect a defect by a simple method such as the TDDB method with the same high degree of precision as that of the DSOD method.

Abstract: The invention provides a substrate with multi-layer interconnection structure, which includes a substrate and a multi-layer interconnection structure formed on the substrate. The multi-layer interconnection structure is adhered to the substrate in partial areas. The invention also provides a method of manufacturing and recycling such substrate and a method of packaging electronic devices by using such substrate. The invention also provides a method of manufacturing multi-layer interconnection devices.

Abstract: Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.

Abstract: An electronic sensor has a sensor housing in which a chip module having a module housing is mounted. The module housing has terminal pins that protrude laterally outward, each having a tapering at its free end. In addition, at least one metallic bearer strip is provided that is fashioned, in a first end area, as a plug contact, and that has in a second end area for at least one terminal pin a respective spring-clamp contact point that forms a flexible press-in zone for the corresponding terminal pin.

Abstract: Methods of making sensors, for determining the concentration of an analyte, such as glucose, in a biological fluid such as blood or serum, using techniques such as coulometry, amperometry, and potentiometry. The sensor includes a working electrode and a counter electrode, and may include an insertion monitoring trace to determine correct positioning of the sensor in a connector. The sensor is calibration-adjusted, eliminating the need for a user to enter a calibration code or for the meter to read a calibration code.

Abstract: A method of fabricating conducting crossover structures for power inductors comprises providing a first lead frame array including first lead frames, providing a second lead frame array including said second lead frames, stamping one side of a second lead frame array to define first and second terminals of said second lead frames, at least one of coating, spraying, applying and/or attaching an insulating material to said first lead frame array to form a first laminate, stamping said first laminate in a direction from said insulating material towards said first lead frame array to define first and second terminals of said first lead frames; and arranging said insulating material of said first laminate adjacent to and in contact with said one side of said second lead frame array to form a second laminate.

Abstract: An electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with IPO leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. The planar substrate 808 may be a flexible substrate 2016 allowing bending of an assembly 2000 to fit into various enclosures.

Abstract: To attenuate electromagnetic energy, a capacitive bond between a window and a frame is provided by a capacitive coupling. This capacitive coupling includes an elastomeric matrix and a conductive media. The elastomeric matrix provides a seal between the window and the frame. The conductive media is bound to the matrix and conducts electromagnetic energy from the window to the frame.

Abstract: Methods of making analyte sensors for determining the concentration of an analyte, such as glucose, in a biological fluid such as blood or serum, using techniques such as coulometry, amperometry, and potentiometry are provided. The sensor includes a working electrode and a counter electrode, and may include an insertion monitoring trace to determine correct positioning of the sensor in a connector. The methods provide a sensor that is calibration-adjusted, eliminating the need for a user to enter a calibration code or for the meter to read a calibration code.

Abstract: Embodiments provide a method of running cables from an already-installed cable duct to devices. According to the method, a portion of a duct from which it is desirable for cable to be dropped is selected upon consideration of a first location of a first device to which a connection is desired. The method also includes punching a first aperture in the duct proximate the first portion, snaking a first cable from the duct through the first aperture, and connecting the first cable to the first device.

Abstract: A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).

Abstract: An exemplary method for cutting a first printed circuit board (PCB) into a plurality of second PCBs, the method includes: providing a plurality of first dimension parameters of the first PCB; providing a plurality of second dimension parameters and an interval parameter of the second PCB; performing a process for selecting a best calculating mode and a corresponding cutting parameter according to the first dimension parameters, the second dimension parameters, and the interval parameter; calculating coordinate parameters of each second PCB; and cutting the first PCB into the plurality of second PCBs.

Abstract: A method is provided to manufacture a precise multi-pole magnetic component for using in magnetic encoders. A special layout of the circuit pattern is designed and formed on a printed circuit board (PCB). Alternate and regular magnetic field is induced according to Ampere's law after a current flowing through the circuit on the PCB. The multi-pole magnetic component with fine magnetic pole pitch is achieved by forming the high-density circuit patterns on a substrate using the PCB technology.

Abstract: A wiring board includes an insulating layer in which a semiconductor chip is embedded, and a wiring structure connected to the semiconductor chip. A reinforcing member reinforcing the insulating layer is embedded in the insulating layer. This enables reduction in a thickness of the wiring board and a suppression of warpage of the wiring board.

Abstract: A method for manufacturing a quartz crystal unit comprises forming a quartz crystal tuning fork resonator that is capable of vibrating in a flexural mode of an inverse phase and that has a quartz crystal tuning fork base, and first and second quartz crystal tuning fork tines connected to the quartz crystal tuning fork base. An electrode is disposed on each of two of side surfaces of each of the first and second quartz crystal tuning fork tines so that the electrodes of the first quartz crystal tuning fork tine have an electrical polarity opposite to an electrical polarity of the electrodes of the second quartz crystal tuning fork tine, a motional capacitance C1 of a fundamental mode of vibration of the quartz crystal tuning fork resonator being greater than a motional capacitance C2 of a second overtone mode of vibration thereof.

Abstract: A system contains a temperature sensitive device and a printed circuit board. The temperature sensitive device is coupled to the printed circuit board. An aperture is cut out of the printed circuit board between the temperature sensitive device and a heat generating device to act as an insulator for the temperature sensitive device.

Abstract: In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.

Abstract: Disclosed herein is a Ball Grid Array (BGA) package board. The BGA package board includes a first external layer on which a pattern comprising a circuit pattern and a wire bonding pad pattern is formed, a second external layer on which a pattern comprising a circuit pattern and a solder ball pad pattern is formed, an insulating layer formed between the first and second external layers, a first outer via hole to electrically connect the first and second external layers to each other, and a solder resist layer formed on each of the first and second external layers, with portions of the solder resist layer corresponding to the wire bonding pad pattern and the solder ball pad pattern being opened. The solder ball pad pattern is thinner than the circuit pattern of the second external layer.

Abstract: A film bulk acoustic resonator, and a method for manufacturing the same. The film bulk acoustic resonator includes a substrate, a protection layer vapor-deposited on the substrate, a membrane vapor-deposited on the protection layer and at a predetermined distance from an upper side of the substrate, and a laminated resonance part vapor-deposited on the membrane. Further, the manufacturing method includes vapor-depositing a membrane on a substrate, forming protection layers on both sides of the membrane, vapor-depositing a laminated resonance part on the membrane, and forming an air gap by removing a part of the substrate disposed between the protection layers. Accordingly, the membrane can be formed in a simple structure and without stress, and the whole manufacturing process is simplified.

Abstract: A method of making a plurality of flow sensors is provided, each flow sensor having a substrate with a sensing element and flow channel aligned over the sensing element. The sensing element senses at least one property of a fluid. The flow channel is aligned by one or more guide elements formed in an alignment layer. The flow channel across the sensing area is accurately and precisely aligned due to the guide elements provided at the wafer-level, facilitating reliable, low-cost, and consistent results among multiple flow sensors. The flow sensor is adapted for use in harsh environments.

Abstract: A multilayer wiring board having a plurality of wiring layers is proposed, which is prepared by a process having the steps of: forming, on one insulating sheet, wiring patterns for all the wiring layers, which patterns are arranged at predetermined positions; and folding the insulating sheet having formed the wiring patterns in the predetermined order and stacking the folded sheet while positioning, and then heating the resultant sheet in a vacuum under a pressure to form a three-dimensional electric wiring.