Abstract: An energetic material initiation device having a receiver assembly and an initiator assembly that includes an electronic initiator and a pellet assembly with an energetic material. The receiver assembly is configured to be coupled to a firing circuit. When the firing circuit is to be armed, the initiator assembly can be pressed into a socket in the receiver assembly to electrically couple the receiver assembly and the initiator assembly. A method for mounting an energetic material initiation device to a firing circuit is also provided.

Abstract: Xerographic micro-assembler systems and methods are disclosed. The systems and methods involve manipulating charge-encoded micro-objects. The charge encoding identifies each micro-object and specifies its orientation for sorting. The micro-objects are sorted in a sorting unit so that they have defined positions and orientations. The sorting unit has the capability of electrostatically and magnetically manipulating the micro-objects based on their select charge encoding. The sorted micro-objects are provided to an image transfer unit. The image transfer unit is adapted to receive the sorted micro-objects, maintain them in their sorted order and orientation, and deliver them to a substrate. Maintaining the sorted order as the micro-objects are delivered to the substrate may be accomplished through the use of an electrostatic image, as is done in xerography.

Abstract: A panel is mounted on the stage while the one end electrode of the FPC (flexible board) is mounted on the mounting part of one surface of the panel and the other surface of the panel is facing upward. A mounting method includes bending the other end side of the flexible board, after holding the other end portion including the other end electrode, which is positionally adjusted based on the position recognition result of the mounting portion the press tool recognizing the position of the other end electrode, matching the positions of the mounting portion and the other end electrode by relative positional adjusting, and mounting the other end electrode on the mounting portion by temporarily pressing the other end electrode on the mounting portion.

Abstract: A laser direct write method used to transfer entire single components such as semiconductor bare dies or surface mount passive and active components on a substrate or inside recess in a substrate for making embedded microelectronics is disclosed. This method laser-machine the pockets, laser-transfer the individual components inside those pockets, and then laser-print the interconnects required to “wire” the components, thus resulting in a fully assembled embedded circuit required to make a fully functional microelectronic system.

Abstract: A method of aligning electronic components comprising providing a positioning member 110 having at least one formation 120 for receiving an electronic component; said at least one formation having lateral boundaries 35, 36 for constraining movement of an electronic component; placing a first electronic component 10a in said at least one formation; and providing a force for actively aligning said first electronic component with a lateral boundary of said at least one formation. The force may, for example, be provided by tilting the positioning member, by providing suction or by using an actuator. An apparatus for aligning electronic components and a 3D system of stacked electronic components is also disclosed.

Abstract: In a method for producing an electronic subassembly, at least one electronic component is fixed in place on an insulating layer of a conductive foil in a first step, the conductive foil with the electronic component is laminated onto a circuit board substrate, and a circuit track structure is then developed by structuring the conductive foil. The expansion coefficient of the insulating layer lies between the expansion coefficient of the circuit board substrate and the expansion coefficient of the circuit track structure, and/or electronic components that require small passages for contacting with the circuit track structure are pressed deeper into the insulating layer than electronic components that require larger passages in the insulating layer.

Abstract: In a proximity communication system, transmit elements on one chip are aligned with receive elements on a second chip juxtaposed with the first chip. However, if the elements are misaligned, either statically or dynamically, the coupling between chips is degraded. The misalignment may be compensated by controllably degrading performance of the system. For example, the transmit signal strength may be increased. The bit period or the time period for biasing each bit may be increased, thereby decreasing the bandwidth. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. The granularity of symbols, such as images, may be increased by decreasing the number of bits per symbol.

Abstract: In a chip mounting apparatus, a structure is employed that a separation facilitation head keeping part is provided for detachably keeping a plurality kinds of separation facilitation heads in a wafer ring holding part and a chip separation facilitation unit is allowed to access to the separation facilitation head keeping part by a moving mechanism to automatically carry out a changing operation for changing the separation facilitation head between the separation facilitation head keeping part and a separation facilitation head attaching part provided in the chip separation facilitation unit without annoying operator's hands. Thus, the separation facilitation head can be automatically changed to improve the operation rate of the apparatus.

Abstract: A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.

Abstract: The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.

Abstract: A method for assembling a lens module with an image sensor, includes providing a holder having first and second receiving spaces, disposing the image sensor in the second receiving space, locating lens barrel at a first position in the first receiving space, casting a light beam on the lens module to allow the lens module to converge the light beam into a light spot on the image sensor, determining if the light spot is at its smallest to determine if a distance between the lens module at the first position and the image sensor is equal to a focal length of the lens module, moving the lens module to a second position in the first receiving space to achieve a predetermined distance from the first position, and positioning the lens module at the second position.

Abstract: The method for assembly of an LED lighting device comprising an LED module and a reflective and/or refractive optical unit and provided particularly as a reading or seat light for use in a vehicle such as, e.g.

Abstract: The present disclosure provides a method for identification of an electronic assembly, when used multiple times in a larger system, to change its location status in a system based on its mounting configuration. The mounting configuration dictates the identification and thus reduces incorrect identification settings and the need for complicated installation instructions. In at least one embodiment, the identification is determined by the location of a fastener, such as a grounding fastener, on the assembly.

Abstract: A transition layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10. Due to this, it is possible to electrically connect the IC chip 20 to the multilayer printed circuit board 10 without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on an aluminum pad 24, it is possible to prevent a resin residue on the pad 24 and to improve connection characteristics between the die pad 24 and a via hole 60 and reliability.

Abstract: A method of testing a proximity communication system for voltage margin by impressing a voltage upon the data link between the transmitter on one chip and the receiver on the other chip coupled to the transmitter through a capacitively coupling circuit formed by juxtaposed capacitor pads on the respective two chips. The impressed voltage is varied and the output of the receiver is monitored to determine an operational voltage margin. The floating inputs on the receiver may be continuously biased by connecting them to variable biasing supply voltages through high impedances. When the floating inputs are periodically refreshed to a refresh voltage during a quiescent data period, the refresh voltage is varied between successive refresh cycles. The variable test voltage may be applied to transmitter output when it is in a high-impedance state, and the output of the receiver is measured.

Abstract: A method is disclosed for controlling warpage in an integrated electronic panel assembly including a plurality of die embedded within an encapsulant. The method comprises determining a number of build-up layers required for the integrated panel assembly. Each build-up layer contributes an amount of concavity to the integrated electronic panel assembly. A level of global convex warpage on the integrated panel assembly is then predicted, wherein the global convex warpage is provided by the presence of an embedded ground plane (EGP) alone within the integrated panel assembly and in the absence of any build-up layers. The embedded ground plane includes openings therein for accepting at least one die within a corresponding opening and it contributes a fixed amount of global convex warpage.

Abstract: For determining the types of component holding members equipped to a plurality of holding-member equipping sections, a detection sensor having a detection optical axis in a direction intersecting with the arrayed direction of the respective holding-member equipping sections is used, and the respective holding-member equipping sections have a first detection position where interrupting of the detection optical axis is detectable only when a second component holding member is equipped and a second detection position where interrupting of the detection optical axis is detectable when the component holding member of any type is equipped. Consequently, by sequentially positioning the detection optical axis at the respective detection positions and detecting the presence of interrupting, the type of the equipped component holding member is determined only by the detection sensor.

Abstract: A printed wiring board is manufactured by a method in which a laminate body having a first insulation layer and a conductive film is provided. An alignment mark is formed in the laminate body by removing at least a portion of the conductive film. An electronic component is placed on an adhesive layer provided on the first insulation layer at a position determined based on the alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.

Abstract: An adhesive chuck, and an apparatus and method for assembling substrates using the same are disclosed. The apparatus comprises a chamber, a first adhesive chuck inside the chamber and having a plurality of adhesive protrusions to adhere to a first substrate conveyed from an outside into the chamber via an intermolecular attractive force, and a driving unit to move the first substrate adhered to the first adhesive chuck and a second substrate toward each other to be compressed and assembled to each other. The apparatus can achieve adhesion and separation of a substrate with minimal power consumption, enhancing an operating efficiency. Additionally, the adhesive chuck can overcome a problem of spot generation on a display panel caused by remaining static electricity. Furthermore, since the adhesive chuck is almost free from a problem of electric instability, it can exhibit high stability and efficiency and can be fabricated at lower costs.

Abstract: Positioning recognition marks are read by movable recognition device for positioning objects to be bonded to each other. An alignment method includes a step of reading the recognition marks during movement of the recognition device before its complete stop, and a step of identifying absolute positions of the recognition marks by correcting the mark recognition positions having been read based on a position feedback signal of the moving recognition device. A mounting method using the alignment method is also disclosed. It is possible to maintain a high alignment accuracy, eliminate necessity of assuring a settling time for complete stop of the movable recognition device, and significantly reduce the alignment time and mounting tact.

Abstract: The method of assembling a light scanning apparatus is capable of fine-adjusting a scanning angle and resonance frequency of a mirror section. The method comprises: a step of measuring the scanning angle and resonance frequency of the mirror section, with actuating a vibration source, in a state where a substrate holding member is temporarily fixed on a base member; a step of moving the substrate holding member, in the longitudinal direction of a substrate after releasing the temporarily-fixed state of the substrate holding member; a step of fine-adjusting a substrate-holding position by repeating the step of moving the substrate holding member; and a step of fixing the substrate holding member after the substrate-holding position is set.

Abstract: A method is provided to manufacture a precise multi-pole magnetic component for using in magnetic encoders. A special layout of the circuit pattern is designed and formed on a printed circuit board (PCB). Alternate and regular magnetic field is induced according to Ampere's law after a current flowing through the circuit on the PCB. The multi-pole magnetic component with fine magnetic pole pitch is achieved by forming the high-density circuit patterns on a substrate using the PCB technology.

Abstract: A production method for an electronic chip component includes the steps of forming a first paste layer by applying paste onto a first end surface of an electronic component body with a second end surface being stuck onto a substrate having an adhesive surface and drying the paste, turning the electronic component body 180 degrees so as to stick the first end surface of the electronic component body onto the substrate by sliding a slider relative to the substrate in a state in which the slider is in contact with the first end surface of the electronic component body, forming a second paste layer by applying the paste onto the second end surface of the electronic component body and drying the paste, and firing the first and second paste layers.

Abstract: The present invention is a method of mounting a plurality of components on a substrate.

Abstract: An apparatus for manufacturing a semiconductor device, includes: a collet; an alignment stage; and a sheet feeding mechanism. The collet is configured to suck a surface of a semiconductor chip. The surface is on opposite side of a bonding surface to be bonded to a bonding target. The bonding surface is provided with a film-like adhesive layer. The collet includes a heater for heating the adhesive layer. The alignment stage is configured to support the semiconductor chip and to correct position of the semiconductor chip. The sheet feeding mechanism is configured to feed a release sheet onto the alignment stage.

Abstract: A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.

Abstract: A method for manufacturing a quartz crystal unit comprises forming a quartz crystal tuning fork resonator that is capable of vibrating in a flexural mode of an inverse phase and that has a quartz crystal tuning fork base, and first and second quartz crystal tuning fork tines connected to the quartz crystal tuning fork base. An electrode is disposed on each of two of side surfaces of each of the first and second quartz crystal tuning fork tines so that the electrodes of the first quartz crystal tuning fork tine have an electrical polarity opposite to an electrical polarity of the electrodes of the second quartz crystal tuning fork tine, a motional capacitance C1 of a fundamental mode of vibration of the quartz crystal tuning fork resonator being greater than a motional capacitance C2 of a second overtone mode of vibration thereof.

Abstract: The present invention provides a printed circuit board that can suppress the positional displacement of parts mounted thereon. The printed circuit board includes resist formed on the surface of the printed circuit board, lands for receiving respective parts to be mounted, the lands being arranged off openings free from the resist, and lands for alignment, respectively alignment marks being formed on the land for alignment by means of solder.

Abstract: The invention provides for a transfer apparatus for transferring a component of integrated circuitry from a receiving location to a delivery location within an integrated circuitry assembly machine. The transfer apparatus includes a support structure that defines a transfer path between said locations, and a component carrier that defines a receiving zone configured to receive the component of integrated circuitry. The transfer apparatus also includes a retaining mechanism arranged on the component carrier to retain the component of integrated circuitry in position in the receiving zone, the retaining mechanism being operable to release the component at the delivery location, as well as a displacement mechanism engaged with the component carrier to displace the component carrier along said transfer path.

Abstract: An electronic component mounting method of thermo-compressing and mounting electronic components onto a plurality of unit boards segmented in a multi-piece board which avoids the occurrence of adverse thermal influences on the thermosetting bonding material which is placed on the unit boards before mounting the electronic components. The thermo-compression tool used in the method is removably fitted on a thermo-compression head in an electronic component mounting apparatus; the thermo-compression tool includes a base member and a suck-up member which is smaller than a lower surface of the base member and which is fixed on the lower surface of the base member at a position displaced from a center thereof.

Abstract: A component mounting apparatus includes one head unit which has a component holding member capable of holding a component and which is selected from among a plurality of types of head units according to a type of the fed component, a head moving unit which has a head fitting portion onto which the selected one head unit is removably loaded and which moves the head unit loaded on the head fitting portion in a direction extending generally along a surface of the board, and a head control unit which is provided for each of the head units and which performs control for component mounting operation by a head unit corresponding to the loaded head unit.

Abstract: A method of manufacturing a multilayer wiring structure is disclosed. The method comprises a step of forming a via post on a first metal wiring element, a step of printing an interlayer insulation film on the first metal wiring element, with use of a screen mask having a non-ejection area slightly larger than a head of the via post, such that the interlayer insulation film has an upper surface at the level lower than the head of the via post, while generally aligning the non-ejection area with the head of the via post, a step of curing the interlayer insulation film, and a step of forming a second metal wiring element in contact with the via post on the interlayer insulation film such that the first metal wiring element and the second metal wiring element are connected through the via post.

Abstract: A light receiving element (12) is mounted on a wiring board (9) with a first opening (10) formed on the wiring board (9) being aligned with a light receiving region (13). Two second openings (11) formed in the same process as used for the first opening (10) are provided on the wiring board (9). An optical waveguide having a core (3) of the optical waveguide, and two board marks having cores (5) of dummy optical waveguides are provided on an optical wiring board. At the time of optically coupling the light receiving region (13) and the core (3) of the optical waveguide, the openings (11) and the board marks are observed from the side of the light receiving element (12) on the wiring board (9) at the same time, and the wiring board (9) and the optical wiring board are aligned with each other based on the positions of the observed openings and board marks. This can ensure easy and highly accurate mounting assembly, and improve mass productivity.

Abstract: A method for manufacturing an electronic device and a device manufactured according to this method including an assembly of at least two insulating sheets, at least one electronic element, a first insulating sheet including at least one window in which the electronic element is at least partially lodged. One face of the electronic element flushes with the external surface of said first insulating sheet. The device may further include an internal module located between the two insulating sheets, a layer of filling material, an adhesive protection film extending over a region covering at least the outline of the window, said protection film being situated between the first insulating sheet and the layer of filling material covering the protection film and the internal module, conductive connection areas electrically linked to the internal module through an opening of the protection film and positioned on an internal face opposite to the external face of the electronic element.

Abstract: A method for detecting a condition of a nozzle member of a multi-nozzle type component mounting head, in which it is determined that a nozzle is pressed against a load cell when the difference between a measured vertical position of the nozzle and a reference positional information of the nozzle is equal to or greater than a determined value and the measured vertical position of the nozzle is at a lower level position than the reference positional information, and when it is determined that the nozzle is pressed against the load cell, measuring the output value of the load cell.

Abstract: In a method of partially attaching an additional attaching material for various types of printed circuit boards, the method attaches an additional attaching material partially onto circuit blocks after circuits of the circuit blocks are made on a flexible, rigid or mixed printed circuit board or an insulating layer is coated. The method sets an attaching material on a shaping material that covers the circuit blocks, uses a depth control tool to cut away areas not corresponding to those requiring to be attached onto the necessary circuit blocks, aligns the corresponding positions of the circuit blocks to perform pseudo attachment and pressing, and tears away the shaping material from the attaching material, so as to attach additional attaching materials properly onto the predetermined positions of the circuit blocks without requiring to attach the circuit blocks one by one, and achieve the effect of saving manufacturing time and avoiding misalignment.

Abstract: A magnetically-assisted chip assembly unit for assembling at least one chip having a mounting surface and an attachment surface, wherein the attachment surface supports a magnetisable layer thereon and opposes said mounting surface, onto a substrate that has a corresponding chip mounting surface. The unit comprises a template wafer having at least one recess adapted to accommodate therein said chip; and a master wafer having at least one magnetisable element; wherein the template wafer is mounted on the master wafer and said magnetisable element is located at least proximate to the at least one recess such that the magnetisable element is capable of manipulating the chip into the recess, via its magnetisable layer when the magnetisable element is magnetized and generates a magnetic field. Once in the recess, the attachment surface of the chip faces at least a portion of the recess and the mounting surface of the chip faces an opening of the recess.

Abstract: A component mounting apparatus has a stage 41 with a fixed height position for holding a substrate 5, and a mounting head 48 that releasably holds a component 2, is moved downward toward the stage 41 from a first reference height position HB1 fixedly positioned above the stage 41, and mounts the held component 2 on the substrate 5 or an already mounted component 2. A controller 14 has a mounting reference height calculation unit 103 for calculating a mounting reference height Hn corresponding to a distance from the first reference height position HB1, and a first target movement height calculation unit 104 for calculating a first target movement height ZTAGn based on at least the mounting reference height Hn and a thickness PTn of the component 2 held by the mounting head 48.

Abstract: An electronic component mounting apparatus includes a mounting device adapted such that the applying unit applies adhesive to a substrate located in a predetermined site, a mounting unit mounts an LSI onto the application of the adhesive, subsequently the applying unit applies another adhesive onto the LSI, and the mounting unit mounts a reinforcing plate onto the application of the adhesive, a conveying device which conveys the substrate with the LSI and reinforcing plate mounted in the predetermined site by the mounting device to a heating site, and a heating unit which bonds, by the application of heat, the LSI and reinforcing plate on the substrate conveyed to the heating site.

Abstract: Carriers (10) holding parts (50) for assembling complex MEMS devices are transported to a central assembly location. The parts are stacked in a pre-assigned order and later released from their carriers. Alternatively, they are positioned over the appropriate location and released so as to fall into position as needed. The assembly area (100) includes a cavity below the plane of the carriers such that the parts held within the carrier drop into the cavity. Heating elements are integrated into the cavity to assist in the release of the parts. The cavity is supplied with parts by one or more carriers which are move around by any number of MEMS drive systems (200, 250). The cavity and some of the MEMS assembled therein deliver with precision amounts of materials as required suitable for biomedical applications, or may be processed in-situ, as in an on-chip laboratory.

Abstract: A mounting method comprising the steps of (A) disposing first liquid (2) on first region (11) provided on one principal surface of substrate (1); (B) bringing member-containing liquid (5) containing second liquid (3) and at least one member (4) into contact with the first liquid (2) disposed on the first region (11); and (C) removing the first liquid (2) and the second liquid (3) from the one principal surface to thereby dispose the member (4) on the first region (11). The first liquid (2) is substantially not dissolved in the second liquid (3). The wettability of the first liquid (2) with respect to the surface of the member (4) is higher than that of the second liquid (3).

Abstract: A component-mounting apparatus and a component-positioning unit for positioning a component, having a simple structure with reduced manufacturing cost and a significantly higher component-mounting speed. The component-mounting apparatus includes a holding device that holds a component and moves horizontally and a positioning device having a sloped portion for positioning the component held by the holding device when the component comes into contact with the sloped portion. The positioning device comprises a first rotatable roller member having a sloped side surface with which the component comes into contact; and the horizontal movement speed of the holding device substantially agrees with the horizontal component of the peripheral velocity of the first roller member, with which the component comes into contact.

Abstract: The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.

Abstract: A method for bonding includes providing a first die and a second die; scanning at least one of the first die and the second die to determine thickness variations of the at least one of the first die and the second die; placing the second die facing the first die with a first surface of the first die facing a second surface of the second die; aligning the first surface and the second surface parallel to each other using the thickness variations; and bonding the second die onto the first die. The step of aligning the first surface and the second surface includes tilting one of the first die and the second die.

Abstract: This disclosure relates to a system and method for bonding an interconnect to a dense circuit device with a mechanically clamping substrate.

Abstract: A method of installing a piston position sensor proximate to a closed end of a hydraulic cylinder is provided. The sensor is attached to the face of a piston and that piston/sensor combination is inserted into the cylinder tube to position the sensor in the desired location. When properly located within the cylinder tube, the sensor is affixed to the cylinder tube by means of beveled holes in the sensor that receive bolts threadedly inserted through the cylinder tube to further properly align the sensor within the cylinder tube. When so affixed, the sensor is then detached from the piston so that the piston can thereafter move independently of the sensor. A fixture is also used that allows the assembler to accurately align the angular orientation of the sensor prior to being inserted into the cylinder tube.

Abstract: A method for transferring a substrate includes moving first and second substrate holding sections opposite each other, moving a first substrate stage holding the substrate so as to be disposed between the first and second substrate holding sections, delivering the substrate from the first substrate stage to the first and second substrate holding sections by releasing the holding of the substrate by the first substrate stage and holding the substrate by the first and second substrate holding sections, moving the first and second substrate holding sections from a first substrate taking-over position to a second substrate taking-over position, moving a second substrate stage so as to be disposed in the interval between the first and second substrate holding sections at the second substrate taking-over position, and delivering the substrate to the second substrate stage by releasing the substrate and holding the substrate by the second substrate stage.

Abstract: A wiring board with a built-in electronic component in which an electronic component is flip-chip mounted to be built in, including a conductive-pattern layer, a connection terminal formed in the conductive-pattern layer and electrically connected to the electronic component, and a solder resist layer formed on the conductive-pattern layer. The solder resist layer is formed around the connection terminal on the conductive-pattern layer, but it is not formed in at least part of the other region on the conductive-pattern layer.

Abstract: A method for the safe and easy installation of wall-mounted electrical switches utilizing a multi-functional tool. The tool is temporarily attached to a magnetically-attractive surface of a fixture using one or more magnets. The fixture may be safely held using the tool.

Abstract: A process for assembling a rigid-flex printed circuit board (PCB) is presented. During operation, the process receives rigid-flex PCBs that are to be coupled together, wherein a rigid-flex PCB includes flexible PCBs coupled to rigid PCBs. The process then places the PCBs onto a carrier which is configured to: align the PCBs so that bond regions located on the flexible PCBs overlap with bond regions located on corresponding flexible PCBs, and apply pressure to the overlapped bond regions. The process then sends the carrier through a reflow oven which reflows solder on the PCBs so that the components become mechanically and electrically coupled to the PCBs. The temperature profile generated by the reflow oven and the pressure applied by the carrier cures and sets an anisotropic conductive film located in the bond regions so that the overlapped flexible PCBs become mechanically and electrically coupled together.