Abstract: One or two, or more, additional conductive layers, separated from one another (if two or more) and separated from a patterned (signal) conductive layer are formed in a flexible substrate, for mounting a semiconductor die in a semiconductor device assembly. These additional layers are used as separate planes for carrying power and/or ground from outside the assembly to the die, on a separate plane from signals entering or exiting the die. Another aspect of the present invention provides a semiconductor device assembly including a first conductive layer with a plurality of traces formed on an insulating layer, a second conductive layer with an inner edge portion exposed within the central opening in the insulating layer, and a leadframe having a number of leads the inner end of one or more of the leads being electrically connected to an outer end of one or more of the traces.

Abstract: An integral solder preform is disclosed for application to a printed circuit card having first and second sides, a first edge and first and second pluralities of conductive pads disposed on the respective first and second sides of the printed circuit card in respective first and second predetermined conductive pad arrangements. The integral solder preform has first and second pluralites of solder pads having respective first and second solder pad arrangements which are maintained in position by a plurality of bridging solder bands. The first and second solder pad arrangements correspond to the first and second predetermined conductive pad arrangements and are spaced apart by a predetermined distance by spacing solder bands.

Abstract: A process for fabricating an electrical connector by the steps of: providing a housing of thermoplastic material having a front surface which will constitute an exterior surface of the connector, a rear surface and an opening extending to the rear surface; installing a conductive contact member so that at least a portion of the conductive contact member is positioned in the opening; and heating a portion of the housing adjacent the rear surface while displacing the portion of the housing to a location to extend across the opening and to contact the conductive contact member, and then allowing the portion of the housing to solidify at that location. The electrical connector may initially have a through opening which extends between the front and rear surfaces and the portion of the housing which is heated will be displaced in a manner to close the opening.

Abstract: An electrical assembly comprises an electrical component having an array of contact bumps. The component is mounted on a multilayer printed circuit board having a plurality of conducting pins located in holes in the board and having pointed ends projecting above the board and making electrical contact with the bumps on the component.

Abstract: A switch comprises a plunger, a retainer, a pair of terminals and an electrically-conducting wiper contact having a curved or bent middle portion defining two oppositely directed legs on either side of the middle portion. The retainer cooperates with the plunger to carry the wiper contact as the plunger moves between a normal and an actuated position. The terminals have facing contact surfaces for biased engagement with the portions of the legs exposed by the plunger and retainer to form an electrical path between the terminals when the plunger is in the actuated position. The plunger and the retainer are coupled together by arms which project from either the plunger or the retainer. The wiper contact is secured between the plunger and retainer without the need for forming a central loop in the wiper contact for engagement by the plunger.

Abstract: A multi-layer wiring assembly including a stack of insulating layers, e.g. of polyimide, alternating with wiring patterns, typically of copper. To establish the circuit pattern, successive wiring patterns are connected to one another through the intervening insulating layers at predetermined locations, by metal stud connections. The studs are formed during assembly of the stack by wire-bonding a stud onto an underlying wiring pattern through a through-hole of the insulating layer above, and then stamping the exposed end of the wire-bonded stud to spread it into contact with the uppermost wiring pattern. The wire-bonded studs e.g. of Au, form strong bonds with the underlying conductor and are quick to apply in an automated process using a wire-bonding machine.

Abstract: A device and method for locking an electrical component, having a body and a flange portion, with a panel through a panel opening, in which the flange abuts a first face of the panel, which includes moving an actuator on the body of the component to displace a cam follower on the body from a first to a second position in which the cam follower projects beyond the contour of the body enough to abut another panel face.

Abstract: A device for automatically fixing bus bars and after-fixing bus bars on an insulating board includes a workpiece setting table, on which a bus bar plate and an insulating board are set, is moved towards an upper die and a lower die, which are provided with an insulating board holding section and a bridge cutting and bus bar fixing section. The upper die is moved downwardly and upwardly, so that the bridges are removed from the bus bar plate, and the insulating board is picked up. Thereafter, an insulating board holding board holding the insulating board is moved to the bridge cutting and bus bar fixing section. The upper die is moved downwardly and upwardly again, so that bus bars are fixed onto the insulating board. As the upper die moves downwardly and then upwardly, the bridges are removed from the bus bar plate, and the insulating board and the intermediate product are lifted.

Abstract: A package for electrical components in which a circuit board holds the components. The package includes an enclosure having generally parallel, spaced apart upper and lower internal surfaces. The circuit board lies generally parallel to the lower internal surface with the electrical components held in an internal space between the circuit board and the upper internal surface. Conductive terminal pins extend from outside the enclosure into the internal space. The terminal pins are connected to the circuit board by conductive links, each link having an end attached to the periphery of the circuit board and another end projecting into the internal space.

Abstract: A terminal position assurance system is provided for an electrical connector which includes a dielectric housing having a terminal-receiving passage into which a terminal is inserted in an insertion direction to a fully inserted position. A latch surface is formed in the housing adjacent the passage and facing in the insertion direction. A bendable tab is provided on the terminal and is adapted to be bent against the latch surface. The bendable tab is structured to be bent about an axis generally parallel to the insertion direction to move an edge portion of the tab to a position over the latch surface when the terminal is in its fully inserted position.

Abstract: A substantially planar insulating sheet of high temperature printed circuit board material (11) is used to form a leadframe strip (18, 19, 21) for a semiconductor package (20). The leadframe strip (18, 19, 21) includes a die attach opening (12) through the insulating sheet (11). A plurality of metallized areas (13, 22, 23) on the insulating sheet (11) form bonding pads (13) and package leads (22). Conductive holes (14) electrically connect the bonding pads (13) and the package leads (22).

Abstract: A process for the assembly of a pin grid array electronic package by vacuum lamination is provided. A vacuum is applied to the package components at the same time the components are bonded with a dielectric sealant. The sealant flow into holes formed in the package base is improved thereby electrically isolating terminal pins which pass through the holes.

Abstract: A thick film hybrid circuit board device is formed by laminating a first layer and a second layer on an insulative base board. The second layer being overlapped between over the insulative base board and the first layer has a recessed portion located at cross portion where peripheral edge portion of the first layer and a peripheral edge portion of the second layer are crossed. The recessed portion is formed in the shape of being recessed inwardly of the second layer. Bleedings generated from the second layer consisting of paste are held in the recessed portion, so that short circuit accidents caused by the bleedings mutually combined are effectively prevented.

Abstract: A semiconductor device is fabricated by placing a semiconductor chip in a lead frame which has no die pad. Electrodes of the chip are connected by bonding wires to respective lead fingers. Additionally, the lead frame has movement restricting fingers which limit horizontal movement of the chip within the lead frame during injection of resin into a mold surrounding the chip. Furthermore, the mold has horizontal movement restricting projections to limit vertical movement of the chip within the mold cavity. The restriction on horizontal and vertical movement of the chip reduces the risk of the bonding wires being broken or short circuited during the resin injection process.

Abstract: An improved lamp socket, and method of fabricating same, including a housing having a cavity into which a plurality of contacts are inserted. The contacts function to mechanically retain the base of a lamp in place and to electrically connect the socket wiring to the contacts of such lamp.

Abstract: A method and apparatus for interconnecting electronic circuits using nearly pure soft annealed gold mechanically compressed within through-plated holes. The invention has its application in attaching integrated circuit dice directly to circuit boards by ball bonding gold wires to the bonding pads of the integrated circuit dice in a substantially perpendicular relationship to the surfaces of the dice and inserting the gold leads into through-plated holes of circuit boards which provide an electrical and a mechanical connection once the leads are compressed within the through-plated holes. The present invention also finds its application in the interconnection of sandwiched circuit board assemblies where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards and compressed so that the gold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards.

Abstract: A method of attaching a flat annular contact plate of a horn ring assembly to a flat annular flange of plastic substrate such as a turn signal canceling cam includes the steps of forming deformable tabs on the contact plate perpendicular to the plane thereof, forming slots in the substrate adjacent an inner edge if the annular flange, forming integral plastic shrouds with pockets therein adjacent the slots and perpendicular to the plane of the flange, seating the contact plate agaianst the flange with the deformable tabs projecting through the slots into the pockets on the shrouds, and bending the tabs against the flange to clamp the contact plate to the flange. The pockets hold the shrouds over the bent tabs and prevent spurious electrical contact with the tabs.

Abstract: An apparatus and method for providing electrical contact between an array of fingers of a tape automated bonding frame and a corresponding array of raised contact areas on a substrate. The tape automated bonding frame is preferably a multi-metal member having at least one utility plane. A load plate having downwardly projecting regions is pressed onto the tape automated bonding frame on a side opposite to the substrate. The substrate may be a printed circuit board and the raised contact areas may be conductive pads. The ends of the fingers of the tape automated bonding frame are precisely aligned with the raised contact areas of the substrate. The downwardly projecting regions of the load plate are generally rigid and provide a compression force between adjacent contact areas and between adjacent finger ends.

Abstract: An electrical connector is disclosed for mounting to a printed circuit board where the electrical connector includes electrical terminals having surface mount contacts adapted for electrical engagement against conductive pads on a printed circuit board. The electrical connector also includes front mating contact portions with lead sections intermediate the contact portions and the surface mount contact portions. An alignment tine plate is positioned over the intermediate lead portions above the surface mount contacts to correctly position the surface mount contacts in an array which corresponds to the conductive pads on the printed circuit board. The alignment plate includes elongate ribs extending from a lower surface of the plate an upper surface of the surface mount contacts, thereby spanning the entire row of contacts.

Abstract: A substrate provided with conductive terminals and another substrate provided with electrode pads and two-stepped electrical contact bumps formed respectively on the electrode pads and each consisting of a first raised portion and a second raised portion formed on the first raised portion, are joined securely by bonding the second raised portions coated respectively with droplets of conductive adhesive and the corresponding conductive terminals by the droplets of the conducting adhesive. The ratio of the area of a section of the first raised portion in a plane parallel to the surface of the electrode pad is greater than the area of a section of the second raised portion parallel to the section of the first raised portion at a predetermined ratio. In an exemplary method of forming the electrical contact bump, the second raised portion is formed by bending a conductive wire in a loop by a ball bonding apparatus.

Abstract: A connector system for use in coupling an implantable electrical lead to an implantable pulse generator, or other implantable electrical apparatus. The connector system includes a connector pin assembly, typically mounted to the implantable lead and a connector block, typically mounted to the electrical stimulator. The connector block is provided with a lumen, in which a plurality of resilient, elastomeric rings are linearly arranged. The rings are so sized as to frictionally engage a connector pin which is provided with a plurality of conductive pads, each coupled to a conductor within the implantable lead. Certain ones of the elastomeric rings are conductive, and engage with the conductive pads on the connector pin. Others of the rings are nonconductive and act as insulators and fluid seals. The connector pin assembly is also provided with a circumferential groove, which interlocks with the deflectable beam members of a retainer mounted to the connector block.

Abstract: An improved electrical test probe has a electrically conductive strain relief adapter mounted on a substrate for accepting a conductive cable having a central conductor and an outer shielding conductor separated by a dielectric layer. The conductive cable is inserted into the strain relief adapter with the outer shielding conductor in electrical contact with the adapter. The substrate is disposed within an electrically conductive elongate hollow body with the body being deformed proximate the location of the strain relief adapter to secure the substrate in the body and to provide electrical continuity between the outer shielding conductor and the substrate and the outer shielding conductor and the hollow body. The adapter further provides strain relief for the center conductor of the conductive cable and mechanical support for the substrate.

Abstract: The present invention relates to a terminal pin for electronic circuitry. The terminal pin includes an axial passageway. Various processes for electrically connecting the pin to the circuit are provided. The processes include riveting, welding and soldering. The axial passageway aids in the control of metal deformation to improve the bond between the pin and the circuitry.

Abstract: A mounting plate for securing a telecommunications wall outlet to a wall panel; a method of installing a telecommunications wall outlet; and an assembly of a telecommunications wall outlet, a mounting plate and a wall panel. The mounting plate has a planar element having ends and sides which surround an aperture through the planar element. Each end of the planar element provides at least one bendable tab for securing the mounting plate to a wall panel and also means for attaachment of a faceplate of a telecommunications outlet. The mounting plate is installed through an aperture cut in a wall panel which corresponds to the aperture through the mounting plate. The planar element is secured against the inner surface of the wall panel by the bendable tabs at each end of the planar element.

Abstract: A method and apparatus is provided for forming a power distribution system during a punching operation. A planar member of conductive material is located proximate to the substrate upon which the power distribution system is to be formed. A punch used to form the conductors from the planar member and deposit the conductors on the substrate. The action of the punch causes mechanical interference between the conductor and the substrate thereby securing the conductor to the substrate.

Abstract: An electrical circuit component is temporarily fixed to a temporary substrate. Electrical contacts on the component are interconnected with corresponding contacts on the test substrate by lead wires or ribbons using a bonding wedge that forms the lead wires into a gull-wing shape with central portions thereof formed adjacent to edge portions of the component. The component is subjected to a test procedure while fixed to the temporary substrate via signals applied to the contacts thereof. The lead wires are then severed near their connection to the temporary substrate, and the component with the remaining lead wire portions attached is removed from the test substrate. The lead wires are sufficiently stiff and/or are adhered to the edge portions of the component with an adhesive so as retain their shapes after removal of the component from the temporary substrate.

Abstract: An improved integrated chip carrier package contains closely spaced electrical leads which facilitates contact with leads from the chip.

Abstract: A process of automatic sequential production of potentiometers, and potentiometers obtained thereby. The potentiometers are generally low profile rotary-type potentiometers. The potentiometers are formed with a low profile cylindrical casing into which is inserted a laminate electrical resistance element of an incomplete annular shape, the ends of which remain connected to terminals. The casing engages a slider, which is in permanent mechanical and electrical contact with the resistance element and a collector terminal. The slider is assembled on a slider-holder rotatably attached through an aperture formed axially through the body and which is operable from the external surface of the casing. The process consists of automatically assembling the potentiometers in an in-line process. The metallic components are formed on a continuous metallic band by die-cutting the band to produce such components.

Abstract: A machine for inserting electrically conducting miniature spring sockets into holes of a printed circuit board without any damage to the circuit board, yet providing sufficient lateral movement to accommodate slight misalignments during the insertion process.

Abstract: A method and apparatus is provided for forming a power distribution system during a punching operation. A planar member of conductive material is located proximate to the substrate upon which the power distribution system is to be formed. A punch used to form the conductors from the planar member and deposit the conductors on the substrate. The action of the punch causes mechanical interference between the conductor and the substrate thereby securing the conductor to the substrate.

Abstract: A flexible circuit interconnector connects a circuit board having a ceramic substrate to pin connectors at the connector end of a circuit board connector housing. The interconnect has a thin flexible sheet of polymeric, electrical insulating material with a mating end and a connector end. The mating end includes a plurality of spaced holes therethrough for receiving tail ends of the pin connectors. A plurality of electrically conductive runners provided on one side of the flexible sheet electrically connect the pin connectors to printed conductors on the ceramic substrate. The thin flexible sheet has a viewing slot at the connector end thereof which is bridged by the runners and it has a bend which accommodates differential thermal expansion in the circuit board and connector.

Abstract: A plastic leaded chip carrier connector of a base having a plurality of apertures for receiving and orienting a plurality of wire pins therein, and a plurality of wire pins each of a predetermined configuration lockingly engaged within a corresponding aperture of the base for transmitting electrical information therethrough. A method for making such connectors by aligning the base with a wire feed device, advancing one end of a wire from the wire feed device on one side of the base through an aperture in the base to the opposite side of the base, forming a predetermined configuration of the wire end, retracting the formed wire into the aperture to lockingly engage said formed wire end therein, cutting the wire to form a pin locked in the aperture, and repeating the previous steps to form a pin in each aperture of the base. Also, an apparatus for carrying out this method to manufacture the desired connectors.

Abstract: A semiconductor device of the kind wherein one or more semiconductor chips are housed in a plug-in type package. The package is being molded with a printed wiring substrate, head portions of terminals, and a heat sink for semiconductor chip attachment as an integral part of the package. The one surface of the heat sink is being bared from one side of the package, and the semiconductor chips are being mounted on the other surface of the heat sink facing to the opening of the substrate.

Abstract: A method for bending and inserting a pin in one sequential operation includes the steps of feeding an end of a pre-notched pin wire, shearing a connector terminal from the end of the wire, clamping one part of the terminal between jaws, displacing the jaws toward a hole in a printed circuit board, displacing a bending sheet at a rate faster than the rate at which the jaws are displaced whereby the bending shoe bends the connector terminal pin while the jaws are moving, and inserting the bent terminal in the hole in the printed circuit board. The apparatus for carrying out the method includes a bending shoe ram and an insertion ram driven at different speeds and with different stroke lengths by an eccentric pin mounted on the end of a drive shaft.

Abstract: Automated insertion of pins (14) into apertures (12) in a backplane (10) is achieved by first shearing a predetermined number of pins from a continuous strip of pins (26). The sheared pins (12) are then engaged in a pin holder (134) which is indexed to locate the pins in registration with the apertures (12) in the backplane (10). The pin holder (134) is displaced towards the backplane (10) to insert the pins (14) into the apertures (12). As the pins are inserted, they are simultaneously engaged by a pair of guide fingers (244) which travel therewith to guide the engaged pins into the apertures without interfering with any previously inserted pins. The guide fingers disengage themselves from the pins once insertion thereof is substantially completed. An apparatus (10) is also described for carrying the above-described steps in sequence.

Abstract: A coaxial line as a rigid probe interposer is particularly useful for connecting an electrical tester to a high speed integrated circuit utilizes two coaxial dielectrics for spacing a center conductor from an outer conductor in the form of a holed metallic body. The line center conductor is initially coated with a first dielectric. The dielectric coated center conductor is thereafter positioned in an oversized hole within the conductive body. The annular free space existing between the inside wall of the hole and the outer circumference of the first dielectric is filled as by capillary action, with a second, liquid dielectric which flows into the fissures and cracks within the first dielectric prior to curing.

Abstract: An electrical contactor device has a molded insulating body base member with at least one boss having a bore extending from a contact element support surface. A stationary contact element having a generally planar plate portion and a projection extending from said plate portion adjacent, in a bent condition, to a terminal screw receiving boss is positioned on the boss of said base member and the terminal receiving screw is threaded into engagement with the contact element to assemble the contact element with the screw and to simultaneously bend the projection into a keyway formed in the bore to secure the contact element to the base member. A second projection adjacent the first projection is of substantially greater width than the first projection and is permanently bent into a position for engagement with a shelf extending from a portion of the base member adjacent to the bore to assist in securing the contact element to the base member.

Abstract: A device for inserting on a card for supporting a hybrid circuit or printed circuit, contacts connected together so as to form an assembly and each comprising, at one of their ends, a clip element oriented perpendicularly to the planes of the contacts and adapted to engage on the support card. The device comprises a fixed card support, a frame which is mobile in the longitudinal direction of the support and on which are mounted to be elastically mobile two rollers forming guide rollers for the contact assemblies, the clip elements of the contacts being at the level of the card placed on this support, a jack for displacing this frame, and means for connecting, as desired, the assemblies of contacts on the one hand with the fixed support and on the other hand with the mobile frame.

Abstract: The low profile integrated circuit electrical socket assembly includes a drawn metallic socket (A) into which a leaf spring insert (B) is press fit. The socket includes a hollow upper body portion (10), a hollow lower body portion (12), a transition portion (14) interconnecting the upper and lower body portions, and a radial flange (16) at the inlet end of the upper body portion. A lead receiving passage (18) is defined longitudinally through the upper body portion and into the lower body portion. The socket is inserted through an aperture (60) of a dielectric board (C) with the flange abutting one board surface (62) and the transition portion disposed outwardly adjacent the opposite surface (64). An axially compressive force is applied between the flange and the transition portion in such a manner that the transition portion is deformed radially outward into a retaining collar. In this manner, the flange and collar hold the socket securely in the dielectric board.

Abstract: Ceramic substrates are pinned using powdered metallurgy pins formed in situ on the substrate.

Abstract: A connector block includes terminals having contacts and channel shaped terminal tails with 90-degree bends and solder contacts on the ends of the tails.

Abstract: A thin, flat conductive terminal strap is rigidly fastened to an insulation support board. The support board has two spaced, parallel slots into which a U-shaped end of the strap is dropped. A portion of one leg of the U near its base has a length slightly longer than the distance between the slots. When the later leg is bent upwardly to wrap the strap around the material between the slots, its end, which has an extension region, engages a frangible region in the opposite leg just beneath the support board and distorts the frangible region beyond the edge of the slot which receives the leg with the frangible region. The extension is slightly narrower than the frangible region. Thus, the entire strap is securely staked to the terminal board. The opposite surface of the terminal strap may serve as a contact which makes sliding contact with a sliding wiper. An array of a plurality of such terminals may be formed on a common insulation board.

Abstract: An apparatus (10) and methods are disclosed for preparing the terminated end of a flat cable (25) for connectorization wherein the cable is of the type having two arrays of overlying/underlying conductors (27, 28) separated by an insulative center film (31), with each array being bonded directly to only the respectively adjacent one of two mutually disposed outer insulative films (33, 34), and wherein an aligned pair of isolating members (36, 37) are respectively positioned between, and transversely of, a different side of the center film the associated array of conductors at each predetermined terminating end of the cable, as fabricated. The apparatus includes a cross-slide assembly (12, 41), a flare-out die mechanism (14, 97), an optional trimming die mechanism (16, 134, 136) and a fold-back roller mechanism (18, 151, 167, 168).

Abstract: A method for the manufacture of a radiant electrical heater, intended more particularly for heating glass ceramic hotplates, comprises so inserting or pressing helical heating resistors in helical slots in a support, such that the support or the heater coils themselves are deformed and consequently fixed to the support. The coils penetrate the wall or bottom areas of the slot or are otherwise secured by parts of the support by positive engagement. An apparatus for performing the method has a tool with ribs which deforms the support or heater coils for positive engagement.A radiant heater is obtained, whose support has partly overlapping deformations in the slot area of the heater coils.

Abstract: A method for manufacturing a baseless incandescent lamp assembly comprises a step for molding a conductive plate material into a continuous holding member chain including a number of facing pairs of holding members on both sides of a belt-like coupling section, a holding step for causing a flattened seal section of a baseless incandescent lamp to be held between the paired holding members, a step for cutting off the paired holding members from the coupling section while keeping the flattened seal section of the baseless incandescent lamp between the holding members, and a step for inserting the holding members holding the flattened seal section of the baseless incandescent lamp therebetween into a lamp holding chamber of a main socket body, thereby fixing the holding members to said main socket body.

Abstract: A method for manufacturing a baseless incandescent lamp assembly comprises a step for holding a flattened seal section of a baseless incandescent lamp between a pair of holding members, a step for inserting the holding members into a lamp holding chamber of a main socket body while keeping the flattened seal action of the baseless incandescent lamp between the holding members, and a step for softening part of said main socket body by heating to deform the same, thereby forming caulked portions to prevent the inserted holding members from slipping out of the lamp holding chamber.

Abstract: A method for making an inductance which includes the steps of providing a coil form constructed of insulating material and having at least one opening extending there through for the receipt of a wire terminal, supporting a wire terminal in a cut-off mechanism positioning the so-supported wire terminal in the coil form opening, immobilizing the wire terminal by notching, removing the cut-off wire terminal from the cut-off mechanism winding a wire about the coil form and wrapping one end of the wire around one of the terminals, and dipping the wrapped terminal portion in molten solder.

Abstract: A shielded cable comprises a flat electrical insulator having a plurality of parallel spaced-apart conductors. A pluraity of openings extend through the insulator to expose at least one conductor. The shield, which is formed from an electrically conductive coating, not only covers the exterior of the insulator but also enters the openings and is electrically connected to the conductor. Gaps are created in the electrically conductive coating so as to provide areas for interconnection by an insulation displacement connector which "mass-terminates" all of the conductors. The exposed one conductor, which is in contact through the openings with the electrically conductive coating, maintains the electrical continuity of the shield notwithstanding the gap formed therein.

Abstract: An improved method for mass termination of pre-stripped flat transmission cable having conductors on closely spaced centers with the connector providing selective programming of grounds within the connector is disclosed. A connector includes three sub-assemblies, namely, a cover, a housing assembly with a plurality of receptacle type contacts and a ground bus mounted therein, and a strain relief member. The present method employs slotted beams to effect a connection between the conductors and grounds of the cable and the terminals and bus bars of the connector. The cable is prepared in a cable stripper to cut the insulation and displace it towards the free end of the cable sufficiently to allow the conductors to be seated in the connector cover. The application tooling then inserts the exposed conductors into the proper alignment slots of the cover while simultaneously trimming them to the correct length.