Abstract: There is provided a component joining structure that includes: a resin component; a metal tip that is provided in the resin component by insert molding, and that includes protruding portions that protrude from the resin component; and a metal component that is spot welded to the protruding portions, and that is joined to the resin component by an adhesive agent that is provided in gaps formed, by the protruding portions, between the resin component and the metal component.

Abstract: An assembly device for assembling a screw into a locking hole of a circuit board includes an assembled board and a guiding sleeve. The assembled board is configured to press against a circuit board. The guiding sleeve is movably arranged in the assembled board. A vertical channel is formed in an interior of the guiding sleeve. When the assembled board presses against the circuit board, one end of the guiding sleeve abuts against the circuit board, and the vertical channel is opposite to the screw hole on the circuit board. The screw is accurately assembled into the screw hole of the circuit board, thereby improving assembly efficiency.

Abstract: A heater assembly includes a heater having a pair of heating terminals, an integrated module, the heater is mounted on a first side of the integrated module and the heating terminals extend from a second side of the integrated module opposite to the first side, a ground terminal mounted on the second side of the integrated module and grounding the integrated module, and a connecting housing having a receiving portion. The ground terminal is arranged in a row with the heating terminals. The heating terminals and the ground terminal are inserted into the receiving portion through a bottom wall of the receiving portion.

Abstract: An electronics package includes an interconnect assembly comprising a first insulating substrate, a first wiring layer formed on a lower surface of the first insulating substrate, and at least one through hole extending through the first insulating substrate and the first wiring layer. The electronics package also includes an electrical component assembly comprising an electrical component having an active surface coupled to an upper surface of the first insulating substrate opposite the lower surface. The active surface of the electrical comprises at least one metallic contact pad. At least one conductive stud is coupled to the at least one metallic contact pad and is positioned within the at least one through hole. A conductive plug contacts the first wiring layer and extends into the at least one through hole to at least partially surround the at least one conductive stud.

Abstract: An electrical connector is provided and includes a housing and a contact. The housing includes a retention wall with a contact receiving passageway. The contact is secured in the contact receiving passageway and includes a front press fitting section and a rear press fitting section positioned rearward of the front press fitting section by a pitch.

Abstract: An electrical connector includes an insulating body having at least one terminal slot, and at least one terminal received in the terminal slot. The terminal slot is provided with a first inner wall and a second inner wall. The terminal has a fixing portion. The fixing portion is sequentially provided with a bonding section and a thinned section. A thickness of the thinned section is smaller than that of the bonding section. The bonding section forms interference fit with the second inner wall. The thinned section forms interference fit with the first inner wall, and extends to the second inner wall. In a direction perpendicular to the second inner wall, a gap exists between the thinned section and the second inner wall.

Abstract: A system, according to one embodiment, includes a first end having several first contacts configured for coupling with a circuit board, a second end oriented about orthogonal to the first end, and a plurality of leads connecting the first and second contacts. The second end has a plurality of second contacts configured for coupling directly with a card edge of an electronic device. The orientation of the second end relative to the first end is fixed. A system, according to another embodiment, includes a circuit board, a plurality of such connectors.

Abstract: An electrical connector (10) includes an insulative housing (20) and a number of terminals received in the insulative housing (20). Each terminal includes an engaging portion (54) for mating with a mating connector, a middle portion (56) interconnected with the engaging portion (54), and a soldering portion (55) interconnected with the middle portion (56). A dimension of the middle portion (56) in a thickness direction is greater than a dimension of the engaging portion (54) in the thickness direction.

Abstract: A heat-dissipation system and a matrix thermal sensing circuit are provided. The heat-dissipation is used in an electronic device. The electronic device comprises a circuit board and a plurality of load elements disposed on the circuit board. The matrix thermal sensing circuit includes a current sensing module and a calculation module. The current sensing module includes a plurality of sensing nodes. Each sensing node is electrically connected to a current feeding terminal of one corresponding load element, and senses the working current of the corresponding load element respectively. The calculation module is connected to the current sensing module and is used to determine thermal state of the location of the sensing node according to the working current respectively.

Abstract: Forming antenna structures having several conductor turns (wire, foil, conductive material) on a an antenna substrate (carrier layer or film or web), removing the antenna structures individually from the antenna substrate using pick & place gantry or by means of die punching, laser cutting or laminating, and transferring the antenna structure with it's end portions (termination ends) in a fixed position for mounting onto or into selected transponder sites on an inlay substrate, and connecting the aligned termination ends of the antenna structure to an RFID (radio frequency identification) chip or chip module disposed on or in the inlay substrate. A contact transfer process is capable of transferring several antenna structures simultaneously to several transponder sites.

Abstract: A method for at least partially inserting a plug into a hole, said method comprising the steps of a) providing a at least one substrate with at least one hole wherein said at least one hole has a largest dimension of from 1 ?m to 300 ?m, b) providing a piece of material, wherein said piece of material has a larger dimension than said at least one hole, c) pressing said piece of material against the hole with a tool so that a plug is formed, wherein at least a part of said piece of material is pressed into said hole, d) removing the tool from the piece of material. There is further disclosed a plugged hole manufactured with the method. One advantage of an embodiment is that an industrially available wire bonding technology can be used to seal various cavities. The existing wire bonding technology makes the plugging fast and cheap.

Abstract: A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes forming the Z-directed component in a cavity formed by a constraining material that defines the outer shape of the Z-directed component. The constraining material is dissipated to release the Z-directed component from the constraining material and the Z-directed component is fired.

Abstract: A method is provided for mounting a plurality of cable connectors onto a panel that defines a plurality of target mounting locations. At least two of the plurality of cable connectors defines at least a pair of cable retaining apertures. The pairs of cable retaining apertures of a first one of the two cable connectors are spaced apart in a first direction, and the pair of cable retaining apertures of a second one of the two cable connectors are spaced apart in a second direction that is different than the first direction.

Abstract: A method for forming a lead or lead extension having an arrangement of elongated conductors disposed in a body of a lead or lead extension includes ablating a plurality of spaced-apart channels in proximity to at least one of the proximal end or the distal end of the body to expose at least part of at least one of the conductors. A C-shaped contact is disposed into each of a different one of the transverse channels. Each C-shaped contact is electrically coupled to at least one of the conductors. Each C-shaped contact is closed so that opposing ends of the C-shaped contact are adjacent to one another and aligned over one of the elongated conductors. The two opposing ends of each C-shaped contact is coupled together such that each C-shaped contact forms a continuous path around the arrangement within the transverse channel in which the C-shaped contact is disposed.

Abstract: A control unit housing has connector pins arranged therein. Each pin has a first contact end directed to the housing interior for a press-fit connection to a circuit board insertable therein, and a second contact end directed out of the housing for connecting an electrical plug connector or the like. The housing is designed as a header that is open on one side and has an access opening for inserting the circuit board. The access opening can be closed by a cover after mounting the circuit board. The connector pins are substantially right-angled pins arranged in the region of a side wall of the housing. The pins are anchored in the housing by the second contact ends running approximately at right angles to the first contact ends, such that the mounting forces acting on the first contact ends during press-fit connecting are received by the housing.

Abstract: A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining.

Abstract: A portable electronic device includes: a housing, a processor provided in the housing, a rechargeable power pack provided in the housing in communication with the processor, apertures extending through the housing, insulating portions of the housing being provided between the apertures, a location of the apertures being selected to map out a graphical element, electrical contacts in communication with the battery for charging the battery, the electrical contacts being sized to be received in the apertures and wherein the insulating portions are provided for insulating the electrical contacts from one another.

Abstract: Propagating pin corrections through physically mating devices including bending one of a plurality of connectors of a first mating device; and mating the first mating device having the bent connector with an unmodified second mating device; wherein the mating of the first mating device and the unmodified second mating device bends a connector corresponding to the bent connector of the first mating device.

Abstract: A press assembly and a method for bending electrical terminals of battery cells are provided. The assembly includes a supporting member that holds a body portion of a cell thereon. The cell has first and second electrical terminals. The assembly further includes a lower plate having first and second dies that hold the first and second electrical terminals, thereon. The assembly further includes an upper plate having third and fourth dies, and guide rods disposed between the lower plate and the upper plate. The upper plate moves vertically on the guide rods relative to the lower plate. The assembly further includes an actuation assembly moving the upper plate toward the lower plate such that the first electrical terminal is bent into a first predetermined shape between the first and third dies, and the second electrical terminal is bent into a second predetermined shape between the second and fourth dies.

Abstract: A method of forming an electrically conductive connection between two or more electrically conductive elements (2, 6) is provided, as is the resulting connection. Wherein the two or more electrically conductive elements (2, 6) are coated with a non-conductive coating (7), wherein an at least partially electrically conductive pasty medium (8) is located in a region (12) between the electrically conductive elements (2, 6) at regions of the electrically conductive elements (2, 6) which are substantially free from any non-conductive coating (7).

Abstract: A novel method to manufacture a flexible cable for a disk drive is disclosed. The method includes providing a flexible laminar sheet. The flexible laminar sheet has a dielectric substrate layer and an electrically conductive layer contacting a first side of the dielectric substrate layer. A portion of the electrically conductive layer is etched away to define a first plurality of electrically conductive traces and to expose an etched surface of the first side of the dielectric substrate layer. A second plurality of electrically conductive traces is deposited on the etched surface of the first side of the dielectric substrate layer.

Abstract: A through-the-hole (TTH)/surface mount (SMT) insulation piercing connector includes one or two spaced electrical contacts. Each contact has a flat plate portion and integrally-formed legs. An L-shaped hook portion on the flat plate portion has a piercing tip pointed in a direction away from the legs. The piercing tip is spaced from the flat plate portion, the flat plate portion being configured and dimensioned to bend in the direction towards the piercing tip when pressed to urge an insulated wire onto said piercing tip to cause it to penetrate the wire insulation and make electrical contact with the internal conductive wires or strands within the wire. The legs are insertable into mounting holes in a substrate for direct TTH mounting in a PCB or to be secured to a header provided with mounting holes by TTH soldering and surface mounting by a pick-and-place machine acting on the header.

Abstract: A connection portion of a z-axis interconnector is assembled into contact with a plurality of aligned vias in a corresponding plurality of stacked printed circuit boards by gripping and pulling a leader portion of the interconnector connected to the connection portion, to move the interconnector into the final position with the connection portion contacting the aligned vias. The leader portion is severed from the connection portion after the interconnector is moved into the final position. A single pulling and cutting tool which accomplishes these functions preferably does so by a single pinch and cut device having opposing blades which partially penetrate into the leader portion to grip the leader portion, which fully penetrated through the leader portion to sever the leader portion, and which are moved toward and away from the plurality of stacked printed circuit boards to pull the interconnector and to reposition for severing the leader portion.

Abstract: Manufacturing circuits with reference plane voids over vias with a strip segment interconnect permits routing critical signal paths over vias, while increasing via insertion capacitance only slightly. The transmission line reference plane defines voids above (or below) signal-bearing plated-through holes (PTHs) that pass through a rigid substrate core, so that the signals are not degraded by an impedance mismatch that would otherwise be caused by shunt capacitance from the top (or bottom) of the signal-bearing PTHs to the transmission line reference plane. In order to provide increased routing density, signal paths are routed over the voids, but disruption of the signal paths by the voids is prevented by including a conductive strip through the voids that reduces the coupling to the signal-bearing PTHs and maintains the impedance of the signal path conductor.

Abstract: A manufacturing method is provided for a terminal (10) that has a board connecting portion (12) to be connected to a circular through hole (B1) formed to penetrate through a board (B). The manufacturing method includes a wire drawing step of manufacturing a wire material having a polygonal cross-section with obtuse interior angles by drawing the wire material through an opening of a wire drawing die, the opening having a polygonal shape with obtuse inner angles. The method then includes a surface processing step of applying a surface processing to the wire material, and a cutting step of cutting the wire material having the surface processing applied thereto to a specified length to form the terminal (10).

Abstract: A method for manufacturing supporting boards of light emitting diode modules comprises the following steps: providing a substrate which defines a plurality of through holes and receiving holes therein; providing an engaging plate which includes a plurality of electrode structures and brackets connecting the electrode structures with a connecting frame, each of the electrode structures forming a receiving cavity and an inserting part; providing a shaping roller assembly whereon the substrate and the engaging plate are wound, stacking the substrate and the engaging plate together, rotating the shaping roller assembly to make the shaping roller assembly press the stacked substrate and engaging plate, such that the through holes of the substrate are received in the receiving cavities of the engaging plate and the inserting parts of the electrode structures are inserted into the receiving holes of the substrate, whereby the supporting boards are formed.

Abstract: A portable electronic device includes: a housing, a processor provided in the housing, a rechargeable power pack provided in the housing in communication with the processor, apertures extending through the housing, insulating portions of the housing being provided between the apertures, a location of the apertures being selected to map out a graphical element, electrical contacts in communication with the battery for charging the battery, the electrical contacts being sized to be received in the apertures and wherein the insulating portions are provided for insulating the electrical contacts from one another.

Abstract: A method for manufacturing a silicon chip package for a circuit board assembly is provided with a package substrate having a silicon chip and an array of contact pads provided by conductive material. A plurality of conductive springs are affixed to the array of contact pads for providing conductive contact with the corresponding array of contacts on a circuit board assembly.

Abstract: A semiconductor device includes wiring boards each having an insulating board, conductor circuits and through-holes, the insulating board having top and bottom surfaces, the conductor circuits formed on the top and bottom surfaces, the through holes penetrating the insulating board and electrically connecting the conductor circuits of the top and bottom surfaces; conductor posts each having flange, head and leg portions, the flange portion having first and second surfaces and having an external diameter larger than that of the through-hole, the head portion protruding from the first surface, the leg portion protruding from the second surface; and electronic components each having an electrode formed on one or more surfaces and connected to the leg portion. The head portion is inserted until the first surface of the flange portion comes into contact with the bottom surface of the wiring board and electrically connected at an inner wall of the through-hole.

Abstract: A microelectronic device mounting substrate includes a bond pad with a side wall and an upper surface. A dielectric first layer is disposed on the mounting substrate and a solder mask second layer is disposed on the dielectric first layer. A uniform recess is disposed through the solder mask second layer and the dielectric first layer that exposes the portion of the bond pad upper surface.

Abstract: A board unit includes a board that has a through hole penetrating the board from a first side of the board to a second side of the board and having a conductive inner wall surface a first electronic component that has a first connection pin to be press-fitted in the through hole from the first side of the board, and a conductive member that is disposed in the through hole to connect the inner wall surface of the through hole to the first connection pin.

Abstract: This is directed to a power adapter plug arm manufactured from a single piece of material. The plug arm can include a plug operative to extend into a wall socket, an elongated plate coupled to an end of the plug such that the plug extends from a first surface of one end of the plate, and a pin coupled to the opposite end of the plate and extending from the opposite surface of the plate. The pin can be operative to engage a circuit board of the power adapter to provide power received from the wall socket to an electronic device coupled to the power adapter. To enhance the strength of the plug arm, the plate can be manufactured by creating a co-axial plug and a stem from a single piece of material, bending the stem, and cold heading the bent portion of the stem to form a plate. Because the cold heading process involves cold working the material, the arm and in particular the bridge member at the interface between the plate and the stem can become stronger as a result of the manufacturing process.

Abstract: A chip adapter used to install a chip on a first chip arranging area of a circuit board includes a board. The size of the board has the same size as the first chip arranging area of the circuit board. Edges of the chip adapter define a number of gaps corresponding to first pads of the circuit board. A second chip arranging area of the same size as the chip is arranged in a center of the chip adapter. A number of second pads are arranged around the second chip arranging area of the chip adapter corresponding to pins of the chip. Each second pad is electrically connected to a sidewall of the corresponding gap of the chip adapter.

Abstract: The insulation base side of single-sided FPC is turned to the die side, and the mounting surface side of ground circuit is turned to the upper side, and the FPC is placed on die (a). When the portion of ground circuit where the conduction is realized and metal reinforcing plate are punched by punch of which the clearance dimension is made to be 50 to 95% of the thickness of the material to be punched, hole sagging will be formed (b). The insulation base 1 side is turned up, electrically conductive adhesive and metal reinforcing plate are laminated in this order, heating pressing is performed with the press apparatus for metal reinforcing plate to be laminated (c). Thereby, laminated FPC is formed (d). At this time, since electrically conductive adhesive is injected into hole sagging by press pressing, the electrical connection of metal reinforcing plate and ground circuit can be attained by the interlaminar conduction by means of electrically conductive adhesive, and there is also no residual air.

Abstract: A contact element for producing an electric contact has a laser cut conducting plate, with the contour of the laser cut conducting plate including at least two tips, which are embodied as contact tips for a contact pad of a part, connected to each other by a separating area, such that a one-piece semi-finished part is embodied.

Abstract: A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one contact.

Abstract: A method of fabricating a circuit board includes the following steps. First, a patterned metal board is provided. The patterned metal board includes a patterned circuit having at least a pad. Next, a dielectric layer is formed on the patterned metal board to cover the patterned circuit. Thereafter, a processing treatment is preformed on a surface of the patterned metal board in which the surface is opposite to the patterned circuit, such that at least a conductive joint column disposed on the pad and a circuit layer having the patterned circuit are formed. Afterwards, a solder mask layer is formed on the dielectric layer to cover the circuit layer, such that the solder mask layer is in contact with the conductive joint column, the conductive joint column passes through the solder mask layer, and a height of the conductive joint column exceeds a thickness of the solder mask layer.

Abstract: A manufacturing method of a multilayer wiring board that includes a core board, a wiring layer, and an electrically insulating layer that are stacked on the core board. The manufacturing method forms a plurality of through holes in a core member, a thermal expansion coefficient of the core board being between 2 to 20 ppm, and the core member selected from silicon, ceramics, glass, a glass-epoxy composite, and metal. The through holes are made conductive by a conductive material, to electrically connect between the front and the back of the core board. A wiring layer and an electrically insulating layer are stacked on one surface of the core board to form a multilayer wiring layer. A capacitor is formed on the other surface of the core board.

Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

Abstract: A device for fitting printed circuit boards (5) with contact pins (7), comprising at least one insertion device (1) for inserting at least one contact pin (7) into a printed circuit board (5), at least one measuring device (3) for measuring the angle of insertion (?) between the at least one inserted contact pin (7) and the printed circuit board (5), wherein the measuring device (3) comprises a sensor assembly (9) having at least two sensors (11) arranged at different heights above the printed circuit board (5) in such a way that the contact pins (7) can be detected by the sensors (11). At least one of the sensor assemblies (9) and the printed circuit board (5) are capable of being displaced in a plane parallel to the printed circuit board (5).

Abstract: A method of manufacturing a component-embedded printed circuit board is disclosed. By using a method of manufacturing a component-embedded printed circuit board, which includes: mounting a component on a first copper foil, on which a pattern is formed, such that the component is electrically connected with the pattern; stacking an insulation layer, which has a cavity formed in a position corresponding to the component, on a second copper foil, on which at least one conductive protrusion is formed; stacking together the first copper foil and the second copper foil such that the component is embedded in the cavity and the first copper foil and the second copper foil are electrically connected by the conductive protrusion; and removing portions of the first copper foil and the second copper foil to form circuit patterns, the circuit pattern formed from the first copper foil may be given a buried form, so that it is possible to manufacture a thin printed circuit board, when embedding a flip chip type component.

Abstract: Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element; (2) a semiconductor device disposed adjacent to an upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a connection surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit, and the connection surface of the grounding element is electrically exposed adjacent to the lateral surface of the substrate unit. The grounding element corresponds to a remnant of an internal grounding via, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.

Abstract: A device connector producing method includes a primary molding step of forming a primary molded body (20) formed with pilot holes (24), a terminal press-fitting step of press-fitting intermediate terminals (11) into the pilot holes (24) to form an intermediate product (40), and an insert molding step of setting the intermediate product (40) in a secondary molding die (50) and forming a device connector. The primary molded body (20) includes a resin inflow opening (21) that enables resin from a gate (52) to flow through the primary molded body (20) during secondary molding, and a supporting projection (23) to contact an inner surface of the secondary molding die (50). Thus, resin flow during secondary molding is good and the intermediate product (40) will not displace.

Abstract: The disclosure involves the efficient termination of a winding PCB of a planar inductive component to a main PCB, using relatively little space and providing a low-resistance connection. The disclosed methods are especially suitable for planar structures where several winding PCBs, and/or winding PCBs and a main PCB, are all enclosed by the magnetic path components. The methods allow for a winding PCB to simply rest on the main PCB, or other winding PCBs, without any clearance. The disclosure employs mating sets of conductive annular rings with an optional interlocking terminal pin that allows two PCBs to be fixedly coupled together, while preserving a minimum distance between the solder-mask layers of the two PCBs in order to prevent the formation of unwanted electrical connections between the two PCBs. Solder is used to ensure effective coupling in each assembly of mating annular rings and optional terminal pin.

Abstract: A wired circuit board having improved adhesion between the conductive pattern and an insulating layer to prevent a plating solution from remaining between a metal plating layer and the insulating layer. The invention prevents ionic impurities in the plating solution from remaining as residual or ionic contamination, thereby preventing a short circuit from developing when electric current flows through the circuit under a high temperature and high humidity environment. Lower end portions of the terminal portions that are formed on an insulating base layer and lower end portions of side surfaces and metal plating layers that cover the terminal portions are embedded in the insulating base layer in a flexible wired circuit board.

Abstract: A method of connecting an electric actuator to a printed circuit by metal contacts having an open contact zone. The metal contacts are soldered to the printed circuit using an SMD-type automated method performed at a high speed and at a high temperature, and the electrical connection pins of the actuator can be mechanically connected to the metal contacts without soldering by butting the contact zone of the metal contacts against the connection pins of the actuator once the connection pins have been inserted through the contact zone.

Abstract: An interposer 2 comprising a base 10 formed of a plurality of resin layers 26, 34, 42, 52, 56; a thin-film capacitor 12 buried in the base 10, including a lower electrode 20, a capacitor dielectric film 22 and an upper electrode 24; a first through-electrode 14b formed through the base 10 and electrically connected to the upper electrode 24 of the thin-film capacitor 12; and a second through-electrode 14a formed through the base 10 and electrically connected to the lower electrode 20 of the thin-film capacitor 12, further comprising: an interconnection 48 buried in the base 10 and electrically connected to the respective upper electrodes 24 of a plurality of the thin-film capacitors 12, a plurality of the first through-electrodes 14b being electrically connected to the upper electrodes 24 of said plurality of the thin-film capacitors 12 via the interconnection 48, and said plurality of the first through-electrodes 14b being electrically interconnected by the interconnections 48.

Abstract: A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).

Abstract: A method of manufacturing a liquid container, the liquid container including a liquid containing chamber in which a liquid can be contained, an air communicating passage allowing the liquid containing chamber to communicate with air, a liquid supply port for supplying the liquid contained in the liquid container to an outside, a valve mechanism disposed in the liquid supply port, a liquid flow passage allowing the liquid container and the liquid supply port to communicate with each other, and a differential pressure valve which is disposed in the liquid flow passage, which is normally urged to be a closed state, and which is changed from the closed state to an opened state when a differential pressure between a side of the liquid supply port and a side of the liquid containing chamber is equal to or more than a predetermined value, the method includes: removing at least a part of the valve mechanism; inserting a jig from the liquid supply port; forcibly opening the differential pressure valve using the jig ag

Abstract: An electrical connector including an end member configured to connect the electrical connector to another member; and jaw segments. The jaw segments are configured to be arranged relative to one another to directly contact a core of a core and stranded (C-S) cable. Each of the jaw segments are configured to contact a different outer perimeter segment around the core to combine to substantially surround a portion of the core. The jaw segments are mounted directly with the end member at an interlocking connection of the jaw segments directly with the end member.