Abstract: A process for producing a circuit module including, carried out in this order, preparing a ceramic carrier substrate having ceramic substrate pads for mounting electronic parts, forming solder paste layers on the ceramic substrate pads, forming precoated solder layers by heating the ceramic carrier substrate having the solder paste layers on the ceramic substrate pads to melt the solder paste layers, and then cooling for solidifying the solder, preliminarily fixing stepped lid having protrusions adjacent to a cavity and dents adjacent to the cavity with the protrusions intervening therebetween to the precoated solder layers of the ceramic carrier substrate and joining the stepped lid to the ceramic carrier substrate with solder by placing the ceramic carrier substrate having the stepped lid preliminarily fixed to the precoated solder layers in a reflow furnace.

Abstract: In a sensing unit according to the present invention, a spring portion having a support portion and a movable portion is conductive. A signal of a sensor portion provided on the movable portion of the spring portion is transmitted via the spring portion. Hence, the sensing unit according to the present invention has a simple constitution with a small number of components, and a wire does not necessarily have to be provided for each sensor portion. As a result, a reduction in manufacturing cost, simplification of the manufacturing process, and so on are achieved.

Abstract: A method, including incorporating a conducting wire into a tubular braid consisting of a multiplicity of supporting wires, and covering the tubular braid with a sheath. The method further includes identifying a location of the conducting wire within the tubular braid and attaching an electrode through the sheath to the conducting wire at the location.

Abstract: Methods of making a sealed crimp connection attaching a terminal to a wire conductor are provided. A layer of fluid conformal coating is applied to overlie a terminal and underlie at least a lead of the wire conductor upon at least the lead being received into the terminal. The terminal, the fluid layer, and at least the lead of the wire conductor are crimped to form the crimp connection. Fluid conformal coating is displaced where an abutting surface of the terminal makes contact with at least the lead of the wire conductor. The fluid conformal coating is cured to a non-fluid state. The fluid conformal coating may be formed of an acrylated urethane material that may provide an increased pull force and a low crimp resistance in the crimp connection. The crimp connection may be constructed using a manufacturing process on an automated assembly line.

Abstract: A method of fabricating an electronic component is provided. The method includes placing a plurality of electrodes in a stack. Spacing between adjacent electrodes in the stack is determined by one or more removable spacers. The method further includes bonding adjacent electrodes together to fix the spacing and removing the spacers from between the adjacent electrodes.

Abstract: A process for packaging an electronic device employs an insulating protective resin layer produced from one or more of the resin compositions: (1) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.5 to 30 parts of an epoxy compound having an epoxy equivalent of more than 800, and an organic solvent, (2) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 10 parts of an epoxy compound having an epoxy equivalent of 100 to 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent; and (3) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 20 parts of an epoxy compound having an epoxy equivalent of more than 800, 2 to 30 parts of a polyvalent isocyanate compound, and an organic solvent.

Abstract: A method for producing a structure includes bonding two substrates facing one another by crushing a closed peripheral sealing strip located between the two substrates, the closed peripheral sealing strip delineating a closed cavity between the substrates. A microsystem is disposed on one of the substrates within the closed cavity. Before crushing, the sealing strip includes perforated patterns delineating a plurality of voids inside the strip.

Abstract: An implantable hermetic system includes a hermetic case and a hermetic feedthrough sealed into an aperture in the case. The hermetic feedthrough includes vias which form electrically conductive paths through the hermetic feedthrough. A header that includes integral interconnection contacts is attached to the case. The vias are electrically joined to the interconnection contacts.

Abstract: A connector apparatus, system, and method are provided. The connector can include a first end (105A) and a second end (105B) operably connected by a flexible member (150). The first end and the second end can each comprise a backing member (110), comprising a plurality of fasteners (125) and an aperture (115) operably connected to the flexible member. The backing member can be at least partially encapsulated using a material (130) forming a surface (135). A compressible sealing member (145) can be disposed at least partially about the surface.

Abstract: A method for manufacturing a substrate having built-in components prevents a short circuit caused by the spread of solder or conductive adhesive. Land regions to connect a circuit component and a wetting prevention region surrounding the land regions are formed on one primary surface of a metal foil. Terminal electrodes of the circuit component are electrically connected to the land regions using solder, and an uncured resin is disposed on and pressure bonded to the metal foil and the circuit component, so that a resin layer in which the circuit component is embedded is formed. Subsequently, a wiring pattern is formed by processing the metal foil. The wetting prevention region is a region obtained by roughening or oxidizing one primary surface of the metal foil so as to reduce solder wettability.

Abstract: A method of forming a ramp of material on a stepped portion of an item, comprises applying material in liquid form to the item in the vicinity of the stepped portion, the liquid having properties such that the liquid moves by capillary attraction to the stepped portion, and causing or allowing the material to solidify to form a ramp on the stepped portion. By using capillary flow, it is not necessary for the material to be placed in position very accurately. Variations in position of placement can be accommodated by the flow to the stepped region. The greater tolerance in accuracy of positioning means that processing can be performed more quickly.

Abstract: A probe including at its distal extremity a tubular flexible sheath core supporting at least a winding forming a shock electrode and connected to a electrical conductor of connection extending in a internal lumen of the sheath core. In a way characteristic of the invention, the sheath core extends axially without a solution of continuity in the area supporting the winding. In particular, the sheath core comprises cavities to receive and hold conducting inserts, of homologous size with cavities formed locally close to the ends of the winding, the insert being connected to the interior side to the electrical conductor, and on the external side to the corresponding extremity of winding. A longitudinal slit connects the two cavities and allows, by elastic deformation of the sheath core, the introduction into the cavities and in the internal lumen of the unit formed by the final extremity of the electrical conductor beforehand equipped with its two inserts.

Abstract: A surgical navigation system for navigating a region of a patient includes a non-invasive dynamic reference frame and/or fiducial marker, sensor tipped instruments, and isolator circuits. The dynamic reference frame may be repeatably placed on the patient in a precise location for guiding the instruments. The instruments may be precisely guided by positioning sensors near moveable portions of the instruments. Electrical sources may be electrically isolated from the patient.

Abstract: An IS-4 terminal connector assembly includes three terminal electrodes positioned over an inner tubular member such that they are radially offset from one another. Each of the terminal ring electrodes are configured such that they can withstand both tensile and cyclical bending loads with minimal compromise in their outer geometry. Additionally, each of the terminal electrodes is configured such that they have both an inner and outer geometry that facilitates adequate insulation between a select terminal electrode and an adjacent conductor. Additionally, each of the terminal ring electrodes is configured such that they facilitate an external approach to staking a cable conductor.

Abstract: A method of forming a seal about an electrically conductive core of a cable having an insulative outer cover and a terminal includes the steps of providing a lead of the core extending beyond an axial edge of the insulative outer cover; applying a conformal coating onto the lead; crimping the terminal onto the cable while the conformal coating is still wet to displace the conformal coating from between the lead and the abutting contact surfaces of the terminal and to cover and seal remaining portions of the lead not in direct contact with the terminal with the conformal coating and curing the conformal coating over the remaining portions of the lead.

Abstract: A method is disclosed for controlling warpage in an integrated electronic panel assembly including a plurality of die embedded within an encapsulant. The method comprises determining a number of build-up layers required for the integrated panel assembly. Each build-up layer contributes an amount of concavity to the integrated electronic panel assembly. A level of global convex warpage on the integrated panel assembly is then predicted, wherein the global convex warpage is provided by the presence of an embedded ground plane (EGP) alone within the integrated panel assembly and in the absence of any build-up layers. The embedded ground plane includes openings therein for accepting at least one die within a corresponding opening and it contributes a fixed amount of global convex warpage.

Abstract: A portable memory card including a molded plastic casing formed over a memory device and other circuits mounted on a substrate such that the molding material extends over side edges of the substrate to provide accurate width and thickness dimensions. Contact pads are formed on a lower surface of the PCBA substrate, which is exposed through a bottom of the casing. The PCBA is fabricated on a substrate carrier, then positioned inside of a mold assembly. During the molding process, a rod extends from an upper portion of the mold assembly and pushes the substrate against the lower surface. A vacuum is then applied to hold the substrate against the lower surface of the mold, and the rod is subsequently withdrawn from the mold cavity during injection of the molten molding material. A single cavity mold assembly provides molding material extends over front and back edges of the memory card.

Abstract: A method for sealing a cable in an enclosure includes assembling a first portion and a second portion of a cable seal around a cable. The first and second portions of the cable seal define a central axial opening having a sealing surface. The cable is disposed in the central axial opening. The method further includes inserting the cable seal and cable through an entrance of a generally u-shaped cable entry point of a side of an enclosure and positioning the cable seal within the cable entry point such that the cable seal protrudes from opposite surfaces of the side. An outer gasket seals between the surfaces of the side of the enclosure and the cable seal.

Abstract: A method of manufacturing gel containing wire connectors with a silicone gel that remains in an unseparated state wherein the temperature of the gel precursors are elevated before being mixed and dispensed into the cavity of a wire connector where the mixed gel precursors are allowed to cool and cure without the necessity of additional heating of either the mixed gel precursors or the wire connector.

Abstract: A tubular elastomer actuator with a shape in a cross-sectional view which shape exposes at most one single axis of symmetry of a specific length, e.g., an oval shape. The actuator could be made from a sheet made from a plurality of plate shaped elements which are laminated together and rolled. Each plate shaped element may have a corrugation that gives the element an anisotropic structure, and contains an electrode on only one surface. The actuator displacement is the result of shrinkage displacement of the plate shaped elements upon the application of electrical field across their thickness.

Abstract: A method of preparing a polymer actuator includes providing an ionic conductive polymer membrane; forming first and second metal electrodes respectively over first and second surfaces of the ionic conductive polymer membrane; substituting water used in the formation of the first and second metal electrodes with an ionic liquid stable to an electrolysis; and coating the first and second surfaces of the metal electrodes with a coating material.

Abstract: The present disclosure relates to a telecommunications cable having a jacket including a feature for allowing post-extrusion insertion of an optical fiber or other signal-transmitting member. The present disclosure also relates to a method for making a telecommunications cable having a jacket including a feature for allowing post-extrusion insertion of an optical fiber or other signal-transmitting member.

Abstract: An electronic device package 100 comprising a lead frame having at least one lead 110 with a notch 205. The notch includes at least one reentrant angle 210 of greater than 180 degrees and the notch is located distal to a cut end 1010 of the lead.

Abstract: A manufacturing method for integrating a passive component within a substrate is disclosed. The manufacturing method comprises the steps of: providing a circuit layer, wherein a positioning blind hole is formed in the circuit layer; forming a conductive material in the positioning blind hole; positioning the passive component in the positioning blind hole of the circuit layer and electrically connecting the passive component to the circuit layer via the conductive material in the positioning blind hole; and laminating a core layer, the passive component, and the circuit layer as the substrate.

Abstract: The method for manufacturing an electronic parts module includes an adhesive layer forming process forming an adhesive layer including solder particles on the circuit forming surface in range covering at least the first land part and the second land part; a passive element mounting process positioning a terminal of the passive element on the first land part and sticking the passive element to the base wiring layer through the adhesive layer; an active element mounting process, after the passive element mounting process, positioning a terminal of the active element on the second land part and sticking the active element to the base wiring layer through the adhesive layer; a pressing process solidifying the adhesive layer and melting the solder particles by laminating and thermally pressing a thermosetting sheet onto the circuit forming surface so as to form the resin sealing layer.

Abstract: The manufacturing method for an electronic parts module includes forming an adhesive layer including solder particles on the circuit forming surface in range covering at least the first and the second land parts, positioning a terminal of the active element on the second land part, sticking the active element to the base wiring layer through the adhesive layer by heating and pressing the active element onto the base wiring layer with a thermally pressing tool, and releasing the heating and pressing with the thermally pressing tool while the adhesive layer is semi-solidified, thereafter positioning a terminal of the passive element on the first land part and sticking the passive element to the base wiring layer through the adhesive layer, and solidifying the adhesive layer and melting the solder particles by laminating and thermally pressing a thermosetting sheet onto the circuit forming surface to form the resin sealing layer.

Abstract: The present invention relates to a connector of an electromagnetic clutch for a compressor and a manufacturing method thereof. The method includes the steps of arranging a leading end of a lead wire 62 or 72 of at least one discharge device 60 or remaining magnetic field removing device 70, which configures a surge absorbing circuit, to a terminal 50 installed in a connector 30 configuring a field coil assembly and having a coupling slot 56 formed in one side thereof; plastically deforming at least one slot bridge 57 to fix the lead wire 62 or 72 to the coupling slot 56; and making the connector 30 in a state where the terminal 50 is fixed to an assembly of at least the discharge device 60 or remaining magnetic field removing device 70 by injection molding.

Abstract: A method of manufacturing a hermetically sealed electrical connection is provided. The method includes providing an electrically conductive wire, surrounding the electrically conductive wire with a metal layer, providing an insulating layer between the metal layer and the electrically conductive wire, and applying a magnetically-induced compressive force to the metal layer such that the metal layer is compressed against the insulating layer and the insulating layer is compressed against the electrically conductive wire to form a hermetic seal between the metal layer and the conductive wire while maintaining the insulating layer therebetween.

Abstract: This invention relates to ejecting an underfill resin at multiple semiconductor die edges such that vacuum suction provided at a laminate through hole located beneath a stage enables spread of underfill resin from each edge simultaneously for quicker spread and reduction of voids. The excess underfill resin intentionally suctioned through the through hole air vent on the underside of the laminate is attracted to re-usable tape. The attracted underfill resin is cleaned from a rotating head mechanism by a cleaning pad positioned beneath a lower surface of the head.

Abstract: A sealed covering for exposed portions of electrical wires at an end of a protective tube, which houses a bus bar and has a cover shield, includes a plug. The plug includes two opposed hinged shells forming, when closed, a cavity for receiving a cable and a flange for engaging the cover shield. A method for enclosing at least one electrical splice between at least one electrical wire and at least one bus bar employs the sealed covering.

Abstract: Electronics mounted on a printed circuit board are housed within a high conductivity case with connecting pins extending therethrough. The case is filled with thermally conductive potting material to provide thermal conduction from the printed circuit board to the case. The case may be a conduit having open ends through which the printed circuit board is inserted or it may comprise a cover mounted to a base plate.

Abstract: A method of manufacturing an electronic component minimizes the occurrence of voids and degradation of characteristics in a resin-sealed portion, while reducing the costs thereof. A sealing step for sealing surface acoustic wave elements by a sealing resin member formed from a resin film is performed by mounting the surface acoustic wave elements on a collective mounting substrate and the resin film in a bag with a gas-barrier property, and causing the resin film to infiltrate between the surface acoustic wave elements mounted on the reduce-pressured-packed collective mounting substrate to be hermetically sealed by the pressure difference between the inside and the outside of the bag.

Abstract: A method being applied to manufacture a water-proof electronic device (200, 200a) is disclosed in the present invention. In the method, at least one inner component is assembled into at least one water-proof shell to form at least one sub-assembly, which has a first water-proof portion and a water-permeable portion; a injection molding die is fitted around the water-permeable portion; and an injection molding treatment is executed for the injection molding die with the water-permeable portion therein to form a second water-proof portion; and then the injection molding die is removed after a cooling process, so as to manufacture the water-proof electronic device with the first water-proof portion and the second water-proof portion.

Abstract: A filtered feedthrough assembly having at least one terminal pin therethrough is provided. The feedthrough assembly comprises a ferrule having a cavity therethrough for receiving the terminal pin, and insulating structure having an upper surface. The insulating structure is disposed within the cavity and around the terminal pin for electrically isolating the pin from the ferrule. A capacitor is disposed around the pin and electrically coupled thereto. The capacitor has a lower surface that is disposed proximate the upper surface, and at least one washer is disposed between the upper surface and the lower surface. To attach the capacitor to the insulating structure, a body of epoxy is substantially confined between the upper surface and the lower surface by the ferrule, the insulating structure, the capacitor, and the at least one washer.

Abstract: A wiring board with lead pins includes: connection pads formed on a wiring board, and lead pins bonded through a conductive material to the connection pads, wherein each of the lead pins has a head portion that is formed in one end of a shaft portion to be larger in diameter than the shaft portion, the head portions are bonded to the connection pads by the conductive material, a face of the wiring board on which the connection pads are formed is resin-sealed by a first resin to be thicker than the head portions, except portions to which the head portions are bonded, and sides of faces of the head portions to which the shaft portions are connected are sealed to be in close contact with the first resin by a second resin.

Abstract: A method of fabricating a hermetic terminal having an annular ring, a lead arranged to penetrate through the ring in which one end side thereof is an inner lead portion electrically connected to a piezoelectric vibrating piece and the other end side thereof is an outer lead portion electrically connected to outside as the ring is between them, and a filler fixing the lead to the ring, wherein the hermetic terminal seals the piezoelectric vibrating piece inside a case, the method includes the steps of: applying plating to a hermetic terminal intermediate having the lead fixed in the ring with the filler to plate the ring and the lead; setting the hermetic terminal intermediate after subjected to plating on a holding member; and flattening an end part of an inner lead portion in the lead to form a stair portion in the hermetic terminal intermediate set on the holding member.

Abstract: A method is provided for making an encapsulated stack of circuit boards. The method includes assembling the stack of circuit boards from a plurality of circuit boards, the circuit boards being spaced apart from each other; inserting the stack into an internal volume of a shell, the shell having a first end and a second end opposite the first end, an input orifice adjacent the first end, and an output orifice adjacent the second end and on a side opposite the input orifice; positioning the shell such that the input orifice is at a lowest point of any part of the internal volume of the shell, and such that the output orifice is at a highest point of any part of the internal volume of the shell; angling the shell relative to horizontal; and injecting an encapsulating compound into the input orifice to fill the internal volume of the shell with the encapsulating compound.

Abstract: Solder balls, such as, low melt C4 solder balls undergo volume expansion during reflow. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodates volume expansion. Air-cushioned diaphgrams, deformable materials and non-wettable surfaces may be used to permit return of the solder during cooling to its original site. A porous medium with voids sufficient to accommodate expansion may also be used.

Abstract: The invention relates to a method for producing an electrical leadframe (10), in particular for a light-emitting diode component, having at least one first electrical connection conductor (2) and at least one second electrical connection conductor (3).

Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.

Abstract: The invention relates to a multi-electrode array comprising a plurality of electrodes, the electrodes being spaced apart from each other by spacer means, the electrodes being secured to the spacer means, the spacer means being encapsulated within a housing. The invention also relates to an implantable device comprising a multi-electrode array of the invention, a method of manufacturing electrodes for use in an array of the invention and a method for manufacturing a multi-electrode array of the invention. The invention also relates to a method for monitoring the effect of a test substance on a biological tissue using a multi-electrode array of the invention.

Abstract: A method for manufacturing a printed circuit board having an embedded component is disclosed. The method includes: forming at least one contact bump and at least one electrode bump on one side of a base substrate; mounting the component such that the electrode bump is in correspondence with a contact terminal of the component; stacking an insulation layer, in which an opening is formed in correspondence to the component, on the one side of the base substrate, such that the contact bump penetrates the insulation layer; filling a filler in the opening; and stacking a metal layer on the insulation layer. Using the method, the reliability of circuit connections between the component and the circuit patterns can be improved, and the manufacturing process can be reduced in embedding the component in the printed circuit board.

Abstract: Disclosed herein is a printed circuit board including an electronic component embedded therein, as the electronic component is supported on the metal layer of core substrate, thus supporting and radiation performances are improved, production costs are reduced, and the manufacturing process is simplified.

Abstract: A method of manufacturing a sensor for in vivo applications includes the steps of providing two wafers of an electrically insulating material. A recess is formed in the first wafer, and a capacitor plate is formed in the recess of the first wafer. A second capacitor plate is formed in a corresponding region of the second wafer, and the two wafers are affixed to one another such that the first and second capacitor plates are arranged in parallel, spaced-apart relation.

Abstract: An electronic circuit formed by removing only a baseboard from an electronic module. The electronic circuit may be formed by providing a baseboard made of a water-soluble material, applying a water-soluble polymer as an insulating material to the baseboard, and forming an electronic module by mounting electronic parts to wires formed on the baseboard. The formation of the electronic circuit may also include removing the baseboard from the electronic module by dissolving the baseboard in water and deforming and resin-encapsulating the electronic module, which includes the electronic parts and wires in the state of lacking the baseboard.

Abstract: Cable connection unions are rapidly replaced in a universal seismic data acquisition-module without opening a main electronic circuitry protective chamber. Different connector types required for the many data transmission cable designs needed to service a wide range of survey conditions are more easily accommodated without exposing primary circuitry to the elements.

Abstract: Methods of coupling a surface mount device with a substrate such as a printed circuit, for example, are disclosed. A method, according to one aspect, may include coupling a holder with a substrate such that terminals of the substrate are included in an opening of the holder, mounting an electronic device over the terminals with a conductive bonding material disposed there between, heating the conductive bonding material to its melting point, and cooling the conductive bonding material.

Abstract: A tin-silver press-fit interconnect which includes a press-fit terminal having a coating or finish of a tin-silver compound for use with a terminal receiving device. The tin-silver compound serves to prevent the formation of tin whiskers which appear most frequently in pure tin coated electrical components under mechanical stress and which make the electronic device susceptible to short circuits. The tin-silver compound may include between 85 and 99.5% weight of tin and between 0.5 and 15% weight of silver and is applied at a thickness range between 0.4 and 5 microns using a technique such as electroplating, hot dip or immersion.

Abstract: A stencil and method for depositing a coupon of underfill material onto a substrate that is to receive an integrated circuit die.

Abstract: A method of manufacturing an optical component comprising a substrate and a mounting frame with plural contact portions disposed at predetermined distances from each other is provided. The method comprises providing a measuring frame separate from the mounting frame for mounting the substrate, which measuring frame comprises a number of contact portions equal to a number of the contact portions of the mounting frame, wherein respective distances between the contact portions of the measuring frame are substantially equal to the corresponding distances between those of the mounting frame, measuring a shape of the optical surface of the substrate, while the substrate is mounted on the measuring frame, and mounting the substrate on the mounting frame such that the contact portions of the mounting frame are attached to the substrate at regions which are substantially the same as contact regions at which the substrate was attached to the measuring frame.