Abstract: Connector assemblies for use with implantable medical devices having easy to assemble contacts are disclosed. The connector assemblies are generally formed by coupling a plurality of ring contacts, sealing rings, and spring contact elements together with at least one holding ring to form a connector having a common bore for receiving a medical lead cable. Contact grooves or spring chambers for positioning the spring contact elements are formed in part by assembling multiple components together. A further aspect is a provision for encasing each connector assembly or stack inside a thermoset layer or a thermoplastic layer before over-molding the same to a sealed housing.

Abstract: A manufacturing method of an electric contact and manufacturing equipment of the electric contact. A contact and a metal base are superimposed and support by a jig, and a rotational tool, which rotates at a predetermined speed and advances/retracts to/from the jig, is pressed into a surface, which is not contacted with the contact, of the metal base while being rotated, so that the contact and the metal base are joined by solid state diffusion welding by using frictional heat generated by friction between the rotational tool and the metal base, and then the rotational tool is retracted from the metal base.

Abstract: In one embodiment, a method of fabricating stimulation leads, the method comprises: providing a spool of polymer film; providing a plurality of payout carriers of wires; drawing the polymer film from the spool and the wires from the plurality of payout carriers over a rotating drum, wherein the drum comprises a plurality of grooves over an outer circumferential surface of the drum for directing the wires from the plurality of payout carriers, wherein a distance of each groove from an edge of the drum is varied about the circumference of the drum; bonding the wires to the polymer film while performing the drawing to form an intermediate assembly comprising the polymer film as a carrier with the bonded wires in a repeating pattern along a length of the intermediate assembly.

Abstract: A negative electrode terminal includes an outer terminal of a solid flat rivet shape and an inner terminal of a hollow flat rivet shape. A hollow axle portion of the inner terminal is inserted in a first insulating member, an opening bored in a sealing plate, and a second insulating member so as to be insulated from the sealing plate. A columnar axle portion of the outer terminal is inserted into the hollow axle portion of the inner terminal and crimped thereto, so that a radially bulge-deformed portion is formed in an intermediate portion of the columnar axle portion. The hollow axle portion deforms into a shape matching the radially bulge-deformed portion and is crimped to the columnar axle portion, and its tip is curling-formed to match a curved surface between a brim portion and the columnar axle portion of the outer terminal.

Abstract: A system in one embodiment includes a cable having a plurality of cable leads, and a multi-diode chip having a pad-side not facing the cable. The multi-diode chip includes a plurality of sets of contact pads on the pad-side of the multi-diode chip, and a plurality of crossed diode sets, wherein each set of crossed diodes is coupled between a first contact pad and a second contact pad of one set of contact pads, wherein at least two of the plurality of cable leads are coupled via wire-bonding to one of the plurality of sets of contact pads of the multi-diode chip for providing electrostatic discharge (ESD) protection for at least one element of the electronic device coupled to the at least two cable leads.

Abstract: A method for assembling an image capturing device is provided. The image capturing device includes a light-pervious module, an image sensor and a binding material. The image sensor has a light sensing region for converting an imaging light into an electronic signal. The binding material is used for binding articles together and curable by a curing process. Firstly, the light-pervious module and the image sensor together are releasably bound together via the binding material, thereby defining a close space for accommodating the image sensor. Then, a testing process is performed to detect a clean condition of the close space. If particles present in the close space are detected, the light-pervious module is detached from the image sensor, a cleaning process is done to remove the particle, and the light-pervious module and the image sensor are releasably bound together to define the close space again. Afterwards, the binding material is cured.

Abstract: There is provided a shielded cable connecting structure comprising a shielding layer removed portion where a plurality of covered wires are exposed for connection of connecting terminals to a shield connector and a conductive heat-shrinkable tube which is fittingly mounted on an end portion of an electromagnetic shielding layer which lies adjacent to the shielding layer removed portion and the shielding layer removed portion so as to bind together the plurality of covered wires through heat shrinkage.

Abstract: A method of providing a hermetic, electrical connection between two electrical components by mating at least one metal pin in a glass-ceramic to metal seal connector to two electrical components, wherein the glass-ceramic to metal seal connector incorporates at least one metal pin encased (sealed) in a glass-ceramic material inside of a metal housing, with the glass-ceramic material made from 65-80% SiO2, 8-16% Li2O, 2-8% Al2O3, 1-5% P2O5, 1-8% K2O, 0.5-7% B2O3, and 0-5% ZnO. The connector retains hermeticity at temperatures as high as 700° C. and pressures as high as 500 psi.

Abstract: A solar module connector comprising: a cable; a housing having a mounting surface at least a portion of which partially defines an opening for facilitating contact with at least one buss lead of a solar module, a cavity, a cable end, and a passageway between the cavity and the cable end; a seal disposed around the cable and at least partially seated in the passageway; and a contact electrically connected to the cable and disposed in the cavity proximate the opening.

Abstract: Systems and methods electrically connect a first electronic device or electrical component, having a external electrical connector, to a circuit board of a second electronic device. A low-cost, user-installable connection system isolates mechanical stresses imposed on the external electrical connector to within the user-installable connection system, thereby preventing the mechanical stresses from reaching the circuit board in the second electronic device. If the connection becomes faulty, only the low-cost, user-installable connection system must be replaced.

Abstract: A process of electrically connecting electrodes of a photovoltaic panel is provided, comprising: applying a conductive adhesive film on the electrodes of the photovoltaic panel, wherein the conductive adhesive film comprising an insulating adhesive layer and electrical conductive particles distributed in the insulating adhesive layer; providing a metal strip along the conductive adhesive film; and performing an electrical connection process between the metal strip and the electrodes via the conductive adhesive film.

Abstract: An implantable medical lead disclosed herein may include a longitudinally extending body, a helical anchor and a lead connector end. The longitudinally extending body may include a distal end, a proximal end, a braid-reinforced inner tubular layer extending between the proximal and distal ends, and an outer tubular layer extending between the proximal and distal ends. The braid-reinforced inner tubular layer may extend through the outer tubular layer in a coaxial arrangement. The helical anchor electrode may be operably coupled to a distal end of the braid-reinforced inner tubular layer. The lead connector end may be operably coupled to the proximal end of the body and include a pin contact operably coupled to a proximal end of the braid-reinforced tubular layer.

Abstract: An electrode assembly includes a positive electrode plate including a positive electrode active material layer and positive electrode uncoated areas on a positive collector, a negative electrode plate including a negative electrode active material layer and negative electrode uncoated areas on a negative collector, the negative electrode active material layer having a negative electrode active material on the negative electrode collector, and the negative electrode uncoated areas having no negative electrode active material, a separator interposed between the positive electrode plate and the negative electrode plate, and a positive electrode tab set and a negative electrode tab set. The positive electrode tab set includes a plurality of positive electrode tabs being folded portions of the positive electrode uncoated areas and coupled to each other, and the negative electrode tab set includes a plurality of negative electrode tabs being folded portions of the negative uncoated areas and coupled to each other.

Abstract: A secondary battery is disclosed. In one embodiment, the secondary battery includes i) a first electrode plate having two opposing surfaces, wherein the first electrode plate comprises a first electrode collector and a first electrode coating portion disposed on at least one of the two surfaces of the first electrode collector and ii) a second electrode plate having two opposing surfaces, wherein the second electrode plate comprises a second electrode collector and a second electrode coating portion disposed on at least one of the two surfaces of the second electrode collector. The secondary battery may further include a separator disposed between the first and second electrode plates and electrically insulating the first and second electrode plates from each other.

Abstract: A secondary battery and a method of manufacturing the secondary battery. A secondary battery includes an electrode assembly formed through winding a positive electrode plate including a positive electrode non-coating portion, a negative electrode plate including a negative electrode non-coating portion, and a separator between the positive and negative electrode plates. A part of the positive electrode non-coating portion and a part of the negative electrode non-coating portion are removed to form a positive electrode tab and a negative electrode tab at first and second ends, respectively, of the electrode assembly.

Abstract: A test socket, an electrical connector, and a method for manufacturing the test socket. In detail, the test socket for electrically connecting terminals of a semiconductor device to pads of a test apparatus includes: a housing having through-holes vertically extending to correspond in position to the terminals of the semiconductor device; contact pins disposed to correspond in position to the through-holes of the housing and contacting the terminals of the semiconductor device; and elastic members connected to the contact pins in the through-holes of the housing to contract and expand, wherein the elastic members are adhered to the contact pins by using an adhesive material.

Abstract: Portable electronic devices with sealed connectors are provided. A sealed connector may be formed using a multi-shot insert molding process. The sealed connector may include contacts. A first shot of thermoplastic may be injected to form a contact housing that is molded around the contacts. The contact housing may be encased in a metal shell. A second shot of thermoplastic material may be inserted to form a connector housing that is molded around the contact housing. An elastomeric sealing member may be integrated into the connector housing. A sealed connector formed in this way may be fitted into a device housing of an electronic device. The sealed connector may prevent ingress of liquid, dirt, or other undesirable debris that may enter into the device through the connector port. A flex circuit within the device may have solder pads that may be soldered to corresponding contacts in the connector.

Abstract: This document describes a protection circuit module including an integrated protection circuit chip and a secondary battery. According to execution examples in this document, the foregoing integrated protection circuit chip is attached at the bottom of a protection circuit module, and penetration hole equivalent to the projection of a battery cell is formed in the center of the protection circuit module. With this protection circuit module, it is possible to have a battery that the integrated protection circuit chip of the protection circuit module is included in the groove which is formed in the battery cell, and the projection of the battery cell is inserted into the penetration hole of the protection circuit module.

Abstract: A micro electromechanical system connecter includes a u-shaped plug connecter and a socket connector. The plug connecter includes two opposite substrates and a spacing element sandwiched therebetween and positioned at one ends of the two substrates. Two parallel grooves are defined in outer surfaces of the two substrates at the other ends the two substrates. A plurality of parallel first electrodes formed on the outer surfaces of the two substrates and configured to extend along a direction perpendicular to grooves. The socked connecter includes a base having a top surface. A recess is defined in the top surface. Two protrusions are respectively formed on two internal walls of the recess adjacent to the entrance of the recess. A plurality of parallel second electrodes formed on the base according to the first electrodes. Each second electrode extends from the top surface of the base to one of the two internal walls of the recess.

Abstract: A device and method for reinforcing a connector and a portion of cable adjacent to the connector is herein disclosed and claimed. The device of the present invention is comprised of a body that grips and secures a connector and a portion of cable adjacent to the connector. The body has a longitudinal passage therethrough, the passage having a first section and a second section. The first section is dimensioned to receive the connector and the second section is dimensioned to receive the portion of cable. The body may be comprised of two corresponding clam shell halves which can be fastened together using common fasteners, joined with an adhesive, or otherwise frictionally or chemically joined. The body may also be injection molded around the connector and cable.

Abstract: A conductor track carrier, particularly a leadframe that is preferably insert-molded with plastic or a rigid/flexible circuit carrier, includes one or more conductor tracks, which are received and held at least partially by a conductor track carrier component designed in one piece. The conductor track carrier component is designed such that it receives and holds furthermore at least one component of one or more sensors. A method of producing such a conductor track carrier is also provided.

Abstract: An anisotropic conductive joint package in which an anisotropic conductive film is joined to at least one conductive material selected from among the group consisting of gold (Au), silver (Ag), copper (Cu), aluminum (Al), magnesium (Mg), nickel (Ni), a tin oxide doped with indium (ITO), molybdenum (Mo), iron (Fe), palladium (Pd), beryllium (Be), and rhenium (Re).

Abstract: An electrical contact including a head, a tail including an opposing pair of major surfaces and a hole, a body connected at one end thereof to the head and at another end thereof to the tail, a peg arranged adjacent to the hole and to extend perpendicular or substantially perpendicular to one of the opposing pair of major surfaces and including at least one beveled side, and a solder member attached to the tail such that the peg creates and fits in a protrusion in a surface of the solder member when the solder member is attached to the tail, such that a portion of the solder member extends into the hole, and such that the solder member engages the at least one beveled side of the peg.

Abstract: According to one aspect of the present invention, there is provided a method for manufacturing an electrode carrier comprising one or more electrode contacts of an implantable medical device, comprising: coupling at least one electrode to a base plate, securing the base plate in a mold, injecting the mold with injection material at least partially around the at least one electrode coupled to the base plate, curing the injected material, and decoupling the at least one electrode from the base plate such that the cured injection material is separated from the base plate.

Abstract: A method of making an electrode assembly for a plasma processing apparatus includes securing a backing member to an electrode wherein first fastener members mounted in apertures in the backing member cooperate with second fastener members to hold the electrode assembly to a support member, such as a temperature-controlled top plate in a plasma processing chamber.

Abstract: There is provided a method of manufacturing a concave connector substrate that has high connection accuracy, a low manufacturing cost, and high flexibility in design, can ensure stable repeated use, and significantly improve use convenience.

Abstract: Disclosed is a pogo pin including: a hollow body having a spring structure by spirally cutting at least a portion of an outer surface thereof; and a conductive material filling at least an inside of the body. According to the present invention, when testing a semiconductor package, error rate in contact between the package, the pogo pin and a test board can be remarkably reduced, and simultaneously can enhance rigidity and electrical conductivity of the pogo pin. Further, simple componentry of the pogo pin can facilitate its fabrication, reduce fabrication costs, and even foresee fabrication of a micro-pogo pin.

Abstract: The electrically-conductive element, in particular for a rotary collector, for transferring electrical current between two parts (2, 24) that are movable relative to each other is covered in one or more layers of electrically-insulating enamel (42), with the exception of an electrical continuity zone (43). The layer(s) of enamel (42) is/are removed, e.g. by chemical, thermal, or mechanical attack. The enamel (42) is selected from the group comprising: polyvinyls, polyurethanes, polyesters, polyester imides, polyamide imides, and polyimides. The layers may be the same or different in chemical nature.

Abstract: A method for producing an electrical and mechanical connection, wherein a solid body comprises a support, on which is disposed an electrical contact zone and an electrically insulating support zone. A flexible, flat cable comprises a support layer made of an electrically insulating material and a strip conductor, with an electrical contacting point and a laterally adjacent insulating cable zone. An adhesive layer is applied on the cable and the contacting point is disposed on the support layer so that the adhesive layer surrounds the contacting point and adheres to the cable. The support and the cable are positioned in a pre-assembly position so that the contacting point of the cable is facing the contact zone of the support and the adhesive layer is facing the electrically insulating support zone. The solid body and the cable are positioned so that the contacting point electrically contacts the contact zone and the adhesive layer adheres to the surface of the solid body.

Abstract: In a medical implantable lead for monitoring and/or controlling of an organ inside a human or animal body, and a method for the manufacture thereof, two electrical conductors are each connected to a respective electrode for receiving or transmitting of electrical signals from or to the organ, and a tubular header is provided in a distal end of the lead. One electrode is positioned in the outermost distal end of the lead whereas the other is a ring electrode that is mounted by a coupling on the outside of the header. The coupling and the header are integrated into one unitary piece of an electrically insulating material having a coupling portion, and the coupling portion is adapted configured for quick fixing connection of the ring electrode to the header.

Abstract: The present invention provides a method for forming a surface graft, comprising the process of applying energy to the surface of a substrate containing polyimide having a polymerization initiating moiety in the skeleton thereof, to generate active points on the surface of the substrate and to generate a graft polymer that is directly bonded to the surface of the substrate starting from the active points and that has a polar group, and a surface graft material obtained thereby.

Abstract: A battery connector adapted for being electrically connected with a printed circuit board includes an insulating housing defining a plurality of terminal passageways, a plurality of fixing members fastened in the insulating housing and stretching beyond a top surface of the insulating housing for being soldered to the printed circuit board, and a plurality of electrical terminals disposed in the corresponding terminal passageways and each having a fixing board, a first contact portion stretching out of a bottom surface of the insulating housing and a substantially lying-V shaped second elastic portion extended from a top of the fixing board. A free end of the second elastic portion stretches out of the top surface of the insulating housing and is arched upward to form a second contact portion capable of elastically abutting against the printed circuit board.

Abstract: A tubular lead component includes a sleeve having a lumen and one or more ports located on the sleeve including a bore extending through the sleeve and into the sleeve lumen. During assembly of a medical electrical lead, the tubular lead component is slid over the outer surface of the lead body to a desired location on the lead. The ends of the tubular lead body are sealed and a space is defined between the inner surface of the tubular lead component and the outer surface of the lead body. Medical adhesive is injected through the port(s) to substantially fill the space between the tubular component and the lead body. The adhesive is then cured. Any ports extending away from the sleeve are removed after the curing step.

Abstract: An electrical connector assembly for an arcuate surface in a high temperature environment and associated method of use is disclosed for a variety of applications. This can include, but is not limited to, an injection molding heater assembly having at least one heater and an injection molding heater and nozzle assembly having at least one heater and a nozzle that is in thermal communication with the at least one heater. This at least one electrical connector, having a first electrical conductor that is electrically connectable to at least one first conductive portion on at least one arcuate surface and a second electrical conductor that is electrically connectable to at least one second conductive portion on the at least one arcuate surface, and at least one disconnect mechanism positioned adjacent to the at least one electrical connector and in electrical connection with the first electrical conductor and the second electrical conductor.

Abstract: Printed circuit board capacitors include a first electrode comprising a via extending at least partially through a multi-layer printed circuit board and a plurality of conductive pads in electrical contact with the via and extending radially outward from the via, and a second electrode electrically isolated from the first electrode and comprising a plurality of ground-plane layers of the printed circuit board. The plurality of ground-plane layers include electrically conductive material overlapping the plurality of conductive pads.

Abstract: A method of repairing a used electrode device 1 is disclosed wherein the method has the steps of providing a used electrode assembly 1 having an inner conductor 9 with an integral electrode tip 3 encapsulated in an insulator body 8 having an outer conductor 10 and an outer electrode tip 4C; and pressing the inner conductor 9 with integral electrode tip 3 while holding or restraining the insulator body 8 to apply an force sufficient to overcome at least partially the adhesion forces at the mating surfaces of the inner conductor 9 and the insulator body 8. Thereafter by grasping an end 9A of the inner conductor 9 opposite the tip 3 while holding the insulator body 8 and withdrawing the inner conductor 9 from the insulator body 8 the parts can be separated.

Abstract: A one-piece electrical contact ring for use in a lead receptacle of an implantable medical device includes (i) a tubular body defining a cavity extending through the body and (ii) a plurality of resiliently deflectable elements extending from the tubular body into the cavity. The deflectable elements have a lead contacting portion configured to contact the lead when received by the cavity. The lead contacting portions of the deflectable elements in a relaxed state are located in a plane that intersects the tubular body and are configured to deflect along the plane towards the tubular body as the lead is inserted in the contact ring. The contact ring may further include a plurality of stops, each configured to (i) engage a stop portion of the elements when the elements are sufficiently outwardly deflected and (ii) inhibit further outward deflection of the elements when the stops engage the stop portions.

Abstract: Metal pastes and methods make it possible to produce extremely compact layers between contact surfaces of structural components, which layers are sufficiently elastic to permanently withstand mechanical and thermal stress variations. This is achieved by the porosity of a corresponding contact area being controlled. For this purpose, a metal paste is provided which contains 70-90% by weight of a metal powder, 1-20% by weight of an endothermically decomposable metal compound and 5-20% by weight of a solvent having a boiling point or range above 220° C., the metal paste being compactable exothermically to form a metal contact.

Abstract: A sensor utilizing a non-leachable or diffusible redox mediator is described. The sensor includes a sample chamber to hold a sample in electrolytic contact with a working electrode, and in at least some instances, the sensor also contains a non-leachable or a diffusible second electron transfer agent. The sensor and/or the methods used produce a sensor signal in response to the analyte that can be distinguished from a background signal caused by the mediator. The invention can be used to determine the concentration of a biomolecule, such as glucose or lactate, in a biological fluid, such as blood or serum, using techniques such as coulometry, amperometry, and potentiometry. An enzyme capable of catalyzing the electrooxidation or electroreduction of the biomolecule is typically provided as a second electron transfer agent.

Abstract: A diaphragm assembly used for a condenser microphone has a diaphragm made of a resin film including a metallized film on one surface of a supporter ring. The diaphragm is made by a first step of bonding a ring jig of a larger diameter than the supporter ring to the resin film having the metallized film composed of a ductile metallic material on the one surface via an adhesive without exerting tension on the resin film; a second step of heating and contracting the resin film bonded to the ring jig without applying the tension at a temperature over a glass transition point of a film material; and a third step of bonding the supporter ring to the resin film via an adhesive in a state of exerting predetermined tension on the resin film. The diaphragm assembly is cut out of the resin film after the adhesive becomes hardened.

Abstract: Connector assemblies for use with implantable medical devices having easy to assemble contacts are disclosed. The connector assemblies are generally formed by coupling a plurality of ring contacts, sealing rings, and spring contact elements together with at least one holding ring to form a connector having a common bore for receiving a medical lead cable. Contact grooves or spring chambers for positioning the spring contact elements are formed in part by assembling multiple components together. A further aspect is a provision for encasing each connector assembly or stack inside a thermoset layer or a thermoplastic layer before over-molding the same to a sealed housing.

Abstract: In semiconductor devices having a copper-based metallization system, bond pads for wire bonding may be formed directly on copper surfaces, which may be covered by an appropriately designed protection layer to avoid unpredictable copper corrosion during the wire bond process. A thickness of the protection layer may be selected such that bonding through the layer may be accomplished, while also ensuring a desired high degree of integrity of the copper surface.

Abstract: Method for preventing solder from rising to a portion of an electric contact when the electric contact is being soldered to a copper foil so as to extend therefrom. The portion is plated with a noble metal and adapted to contact a mating object. Cooling means is brought into contact with at least the portion of the electric contact adapted to contact the mating object, and connection portion between the electric contact and the copper foil is heated by heating means. The rising of solder can be prevented and the electric contacts thus obtained are superior in mechanical property (sufficient bonding strength), electrical property (conductive property and low contact resistance), resistance to environmental conditions (impediment to oxidization), and physical property (limitation of rise of solder due to capillary action).

Abstract: A method of producing a flexible circuit according to an embodiment herein include supplying a substrate layer film and supplying a cover layer film. A conductive ink is printed on at least a portion of the substrate layer film using an ink jet printing technique. The cover layer film is then laminated over the substrate layer film to provide the flexible circuit. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A method and apparatus for creating a sealed cavity includes a housing assembly (100) incorporating a molded connector (110) with an interior portion formed into a cavity (170) and a vent hole (160) that communicates with the cavity (170). The vent hole (160) permits escape of gas generated by solidification of sealant (410) used to attach lid (410) to housing lid seat (120). The vent hole (160) further prevents contaminants from reaching the cavity interior until the final connector seal is applied. The vent hole (160) can be interfaced with a final applied mating sealed connector which utilizes the mating connector seal to provide the final cavity seal. The molded connector (110) can then be adapted with a sensor module which circumvents the need for sealing the small vent hole (160) using additional processes.

Abstract: Disclosed herein is an electrical component comprising a segment having a diameter in the range of about 1 micrometers to about 10 cm, the segment comprising a plurality of non-metallic, resistive fibers in a non-metallic binder. The segment is precisely trimmed to impart to the segment an electrical resistance within 1% of the desired resistance value. A manufacturing system and methods of manufacturing components having precise specifications also are disclosed.

Abstract: A method is provided for removing a component from a medium. The method includes applying an adhesive to a portion of a component. An attachment member is inserted into the portion of the component. The attachment member is pulled with a pulling element in a direction opposite a medium in which the component is inserted.

Abstract: A feedthrough assembly for an implantable medical device includes an insulator element hermitically sealed to a ferrule and a feedthrough member, and a capacitive element spaced apart from the insulator element within the ferrule and coupled to the feedthrough member by a conductive material; the conductive material extends in an area between the capacitive element and the feedthrough member. The assembly further includes a heat and pressure deformed thermoplastic adhesive member that extends around the feedthrough member within the ferrule, is located between the capacitive element and the insulator element, and is sealed to an external surface of the capacitive element in order to isolate the conductive material.

Abstract: The present invention relates to electrolytic cathode assemblies typically used in the refining or winning of metals and to methods of manufacturing and using same. The cathode assembly comprises an electrically conductive hanger bar and a deposition plate attached along an upper end to the hanger bar to define a joint. The cathode assembly further comprises a protective covering having lateral edges and surrounding the hanger bar and a portion of the upper end of the deposition plate so as to substantially enclose the joint and to leave end portions of the hanger bar exposed outside of the lateral edges of the protective covering. Each end of the protective covering includes a corrosion resistant material positioned to form a substantially continuous seal between the protective covering and the hanger bar, thereby to at least hinder fluid flow into the protective covering. Methods of manufacturing and using the electrolytic cathode assemblies are also described.

Abstract: A substrate for fixing an integrated circuit element includes: a plurality of metal columns that are aligned in a longitudinal direction and a lateral direction in a planar view, each of the plurality of metal columns having a first face and a second face facing opposite direction to the first face; and a connecting part that connects the plurality of metal columns one another at a part of each of the plurality of metal columns between the first face and the second face. In the substrate, a recognition mark is formed on the first face of one of the plurality of metal columns.