Abstract: An actuator element includes an electrode film; and an insulation film layered on the electrode film including a through hole for connecting a wiring which is formed on the insulation film to the electrode film. A shape of a rim of the through hole is either a closed curve free of corners or a polygon with vertex angles which are larger than 90 degrees.

Abstract: In an electronic component, when L0 is a dimension of an electronic component body in a first direction, L1 is a distance between a first outer electrode and a second outer electrode on a first surface in the first direction, and L2 is a dimension of each of the first and second outer electrodes on the first surface in the first direction, 0%<L1/L0<10% and 30%<L2/L0<50% are satisfied.

Abstract: A dual cantilever beam relaxor-based piezoelectric single crystal accelerometer is provided. A flexural sensing structure is provided that employs at least two piezoelectric cantilever beams having their longitudinal axes disposed in a substantially parallel arrangement with each beam containing at least one relaxor-based single crystal transduction element having its polarization axis substantially perpendicular to the longitudinal axis of the beam. One end is mounted to a rigid base and the other end can be mounted to a seismic proof-mass or can be free, wherein the base is subjected to dynamic excitation from either mechanical or acoustical origin. The flexible sensing structure can optionally be encapsulated in a viscoelastic material having a mechanical compliance and loss that is substantially greater than that of the flexible sensing structure.

Abstract: A surface acoustic wave device includes a piezoelectric substrate, at least one interdigital transducer (IDT) electrode provided on the piezoelectric substrate, and an insulator layer to improve a temperature characteristic arranged so as to cover the IDT electrode. When a surface of the insulator layer is classified into a first surface region under which the IDT electrode is positioned and a second surface region under which no IDT electrode is positioned, the surface of the insulator layer in at least one portion of the second surface region is higher than the surface of the insulator layer from the piezoelectric substrate in at least one portion of the first surface region by at least about 0.001?, where the wavelength of an acoustic wave is ?.

Abstract: A method of fabricating a plurality of ultrasound transducer assemblies is provided. The method includes applying one or more layers of patternable material to at least a portion of a surface of a wafer comprising a number of die. The method further includes patterning the patternable material to define a plurality of openings, where each of the openings is aligned with a respective one of the die, disposing ultrasound acoustic arrays in respective ones of the openings, coupling the ultrasound acoustic arrays to the respective die to form the respective ultrasound transducer assemblies, and separating the ultrasound transducer assemblies to form individual ultrasound transducer assemblies.

Abstract: A flow channel substrate has pressure chambers, and the pressure chambers communicate with nozzle openings for ejecting liquid. Each of piezoelectric elements on the flow channel substrate has a piezoelectric layer, a pair of electrodes, and a wiring layer coupled to the electrodes. The wiring layer has an adhesion layer and a conductive layer on the adhesion layer. The adhesion layer contains at least one selected from nickel, chromium, titanium, and tungsten. The piezoelectric element has an insulating film at least between the wiring layer and the electrodes. The wiring layer and the electrodes of the piezoelectric element are coupled via contact holes created through the insulating film.

Abstract: A method of manufacturing a ladder filter including first and second resonators includes: forming a piezoelectric film on an entire surface of a substrate that has respective lower electrodes of the first and second resonator formed thereon, an conductive film on the piezoelectric film, and a second film on the conductive film; forming a pattern of the second film in a prescribed region in the second area; forming a first film on an entire surface of the substrate; etching the first film, forming a pattern of the first film, the second film and the conductive film in the second area, and forming a pattern of the first film and the conductive film in the first area, to form respective upper electrodes from the conductor film; and thereafter, etching the piezoelectric film to form respective patterns of the piezoelectric film in the first and second areas, respectively.

Abstract: A piezoelectric device includes an integrated circuit (IC) chip and a piezoelectric resonator element, a part of the piezoelectric resonator element being disposed so as to overlap with a part of the IC chip when viewed in plan. The IC chip includes: an inner pad disposed on an active face and in an area where is overlapped with the piezoelectric resonator when viewed in plan; an insulating layer formed on the active face; a relocation pad disposed on the insulating layer and in an area other than a part where is overlapped with the piezoelectric resonator element, the relocation pad being coupled to an end part of a first wire; and a second wire electrically coupling the inner pad and the relocation pad, the second wire having a relocation wire and a connector that penetrates the insulating layer, the relocation wire being disposed between the insulating layer and the active face.

Abstract: An electronic component includes: an element that is located on a substrate; a signal wiring that is located on the substrate and electrically connected to the element; a metal plate that is located so as to form a cavity on a functional part of the element and covers an upper surface of the cavity; a support post that is located on the substrate so as not to be located on the signal wiring, and supports the metal plate; and an insulating portion that covers the metal plate and the support post, and contacts a side surface of the cavity.

Abstract: A piezoelectric device includes: a piezoelectric vibrating reed; and a package, wherein the piezoelectric vibrating reed has a vibrating part and first and second supporting arms extending from a base end part, the package has a base, a lid, a cavity defined by the base and the lid, a convex part projecting from the base or the lid into the cavity, a length of the first supporting arm is shorter than a length of the second supporting arm, and the convex part is provided in a range ahead of a leading end of the first vibrating arm in an extension direction of the first supporting arm and at least partially overlapping with the second supporting arm in a length direction of the piezoelectric vibrating reed so as not to overlap with the piezoelectric vibrating reed in a plan view.

Abstract: A method of manufacturing a microphone comprising a substrate, a transducer element that is mounted on a top side of the substrate, a covering layer that covers the transducer element and forms a seal with the top side of the substrate, a shaped covering material that covers the substrate, the transducer element and the covering layer, and a sound opening that extends through the covering material and the covering layer. Methods for manufacturing a microphone and for manufacturing a plurality of microphones are also disclosed.

Abstract: A piezoelectric element includes a plurality of individual electrodes, a piezoelectric layer formed on each of individual electrodes, and a common electrode which is formed on the piezoelectric layer and is an electrode common to the individual electrodes. Further, a protection film covering a region, which is not covered by the common electrode on the individual electrode, is provided.

Abstract: Embodiments of the invention provide a dielectric elastomer composite material comprising a plurality of elastomer-coated electrodes arranged in an assembly. Embodiments of the invention provide improved force output over prior DEs by producing thinner spacing between electrode surfaces. This is accomplished by coating electrodes directly with uncured elastomer in liquid form and then assembling a finished component (which may be termed an actuator) from coated electrode components.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: A method of making a handheld, electromechanical device useful in mammalian body-care includes the steps of: a) forming a one-piece housing having a single opening defined by a rim; b) assembling a unitary insert; c) inserting the unitary insert through the single opening of the housing; d) removably applying a cover having an exterior surface to close the opening of the one-piece housing; and e) attaching the unitary insert to at least one of the one-piece housing and the removable cover. The rim of the one-piece housing circumscribes a rim area, and the one-piece housing has a projected area that is substantially larger than the rim area. The unitary insert is dimensioned to be insertable through the opening defined by the rim, and it has a frame having disposed thereon electromechanical elements interconnected in an electrical circuit. The cover closes off the opening of the one-piece housing.

Abstract: Passivated micromechanical resonators and related methods are described. Applicants have appreciated that polycrystalline conductive layers used as electrodes for some MEMS resonators are a source of mechanical and electrical instability. To inhibit or prevent contamination of such conductive layers, which may exacerbate the instabilities, passivation structures are used. The passivation structures can be grown, deposited, or otherwise formed.

Abstract: System and methods for controlling power delivery to system components are disclosed. A controller is communicatively coupled to a point-of-load converter through a first communication path and a shared memory is communicatively coupled to the point-of-load converter through a second communication path. A third communication path communicatively couples the controller and the shared memory. Control data is communicated from the controller to the point-of-load converter through the first communication path and measurement data is written from the point-of-load converter to the shared memory through the second communication path. The controller is operable to read the measurement data from the shared memory through the third communication path.

Abstract: The present disclosure provides a manufacturing method of a quartz-crystal device, in which its lid and base is manufactured with smaller thermal expansion coefficient between AT-cut quartz-crystal wafer.

Abstract: A piezoelectric device includes: a piezoelectric vibrating reed; and a package, wherein the piezoelectric vibrating reed has a vibrating part and first and second supporting arms extending from a base end part, the package has a base, a lid, a cavity defined by the base and the lid, a convex part projecting from the base or the lid into the cavity, a length of the first supporting arm is shorter than a length of the second supporting arm, and the convex part is provided in a range ahead of a leading end of the first vibrating arm in an extension direction of the first supporting arm and at least partially overlapping with the second supporting arm in a length direction of the piezoelectric vibrating reed so as not to overlap with the piezoelectric vibrating reed in a plan view.

Abstract: In a method for manufacturing a laminated ceramic electronic component, when a plating film to define an external terminal electrode is formed by plating exposed ends of a plurality of internal electrodes at a WT surface of a component main body, ingress of a plating solution may be caused from a gap between an end edge of the plating film and the component main body to decrease the reliability of a laminated electronic component obtained. An internal dummy electrode is provided around a region where the exposed ends of the plurality of internal electrodes are distributed in the WT surface of the component main body. The internal dummy electrode includes two LW-direction sections extending parallel or substantially parallel to each other in a direction along the LW surface, and two LT-direction sections extending parallel or substantially parallel to each other in a direction along the LT surface. The plating film is formed at least over the exposed end of the internal dummy electrode.

Abstract: A piezo actuator with protection against environmental influences comprises a layer stack (1) of piezoelectric material layers (10) and interposed electrode layers (20). The piezo actuator furthermore comprises a first and a second material layer (31, 32) composed in each case of a material which exhibits smaller amount of expansion. than the piezoelectric material layers (10) when a voltage is applied. to the electrode layers (20), and comprises a cover layer (50) composed of a metal material. The layer stack (1) is arranged between the first and second material layers (31, 32). The cover layer (50) surrounds the layer stack (1) and is sputtered onto the first and second material lavers (31, 32).

Abstract: An integrated resonator apparatus includes a piezoelectric resonator and an acoustic Bragg reflector formed adjacent the piezoelectric resonator. The integrated resonator apparatus also includes a mass bias formed over the Bragg reflector on a side of the piezoelectric resonator opposite the piezoelectric resonator.

Abstract: A bulk acoustic wave resonator structure that isolates the core resonator from both environmental effects and aging effects. The structure has a piezoelectric layer at least partially disposed between two electrodes. The structure is protected against contamination, package leaks, and changes to the piezoelectric material due to external effects while still providing inertial resistance. The structure has one or more protective elements that limit aging effects to at or below a specified threshold. The resonator behavior is stabilized across the entire bandwidth of the resonance, not just at the series resonance. Examples of protective elements include a collar of material around the core resonator so that perimeter and edge-related environmental and aging phenomena are kept away from the core resonator, a Bragg reflector formed above or below the piezoelectric layer and a cap formed over the piezoelectric layer.

Abstract: The invention relates to an actuator unit, which comprises a piezoactuator (1) having a first end face (14?) and a second end face (13?). The actuator unit further comprises a sleeve (9) for accommodating the piezoactuator (1), wherein the sleeve (9) has a first end face (14) and a second end face (13). The actuator unit further comprises a potting compound (11) which surrounds the piezoactuator (1). The piezoactuator (1) and the potting compound (11) are introduced into the sleeve (9). The potting compound (11) extends no further than the first end face (14?) of the piezoactuator (1). The invention further relates to a method for manufacturing an actuator unit and a sleeve for accommodating a piezoactuator.

Abstract: A multilayered electroactive polymer (EAP) device and a method of manufacturing the same is provided. The multilayered EAP device includes a plurality of unit layers. Each unit layer includes an EAP layer formed of an electroactive polymer (EAP), a protecting layer configured to prevent a material from penetrating into the EAP layer, and an active electrode formed using a conductive material. The protecting layer may be formed below the active layer or above the active layer. The active electrode may be interposed between two protecting layers.

Abstract: To provide a vibration actuator, a lens barrel, a camera, a manufacturing method for a vibration body and a manufacturing method for a vibration actuator, which have a high driving efficiency and can lead to easy manufacture. A vibration actuator of the present invention is provided with an elastic body and an electromechanical transducer element sintered onto the elastic body in the state that the element is divided into a plurality of areas by a groove-shaped border portion.

Abstract: A piezoelectric device includes: a substrate; a first electrode which is layered over the substrate; a first piezoelectric film which is layered over the first electrode; a metal oxide film which is layered over the first piezoelectric film; a metal film which is layered over the metal oxide film; a second piezoelectric film which is layered over the metal film; and a second electrode which is layered over the second piezoelectric film, wherein a polarizing direction of the first piezoelectric film and a polarizing direction of the second piezoelectric film are different from each other.

Abstract: A package and method for manufacturing the package using a rivet having a head portion and a core portion protruding from a rear surface of the head portion. The package includes a plurality of substrates bonded to each other and a cavity that houses an object in a sealed state. The core portion is disposed in a through hole in a base substrate and electrically connects the object with the outside. The core portion is inserted into the through hole and a glass frit is formed between the through hole and the core portion and seals the rivet in the through hole. A gas relief passage is formed leading from a base end of the core portion to a surface of the head portion.

Abstract: A manufacturing method of common mode filters and a structure of the same are revealed. A common mode choke layer is disposed over a composite substrate and a second magnetic material layer is coated on an upper surface of the common mode choke layer. The common mode choke layer is produced by a wafer-level electrode leading out method and having leading-out terminals on sides thereof. External electrodes are formed on sides of the common mode choke layer by partial cutting, sputtering, lithography and electroplating at wafer level and corresponding to the leading-out terminals. Thereby common mode filters produced are supported more stably. Moreover, the volume is minimized due to inductive coils and external electrodes connected by wafer level packaging. Thus the common mode filters are mass-produced, the cost is down and the defect rate is reduced.

Abstract: A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.

Abstract: A magnetic head driving piezoelectric ceramic actuator having an actuator body and a coating layer. The actuator body has a piezoelectric ceramic substrate and first and second electrodes. The piezoelectric ceramic substrate has first and second principal surfaces, first and second side surfaces, and first and second edge surfaces. The first electrode has a first external electrode portion formed on a part of the first principal surface, and a second external electrode portion formed on the first edge surface. The second electrode has a third external electrode portion formed on the second edge surface, and a fourth external electrode portion formed on the first principal surface. Each of: at least a part of each of the first and second external electrode portions; and at least a part of each of the third and fourth external electrode portions, constitutes a joined portion mounted on the substrate by an electrically-conductive agent.

Abstract: Manufacturing a semiconductor structure including modifying a frequency of a Film Bulk Acoustic Resonator (FBAR) device though a vent hole of a sealing layer surrounding the FBAR device.

Abstract: Provided is a bulk acoustic wave resonator (BAWR). The BAWR may include a first electrode, a piezoelectric layer disposed on the first electrode, a second electrode disposed on the piezoelectric layer. In various aspects, at least one of the first electrode, the piezoelectric layer, and the second electrode are formed of a carbon-based material.

Abstract: A piezoelectric element includes a plurality of individual electrodes, a piezoelectric layer formed on each of individual electrodes, and a common electrode which is formed on the piezoelectric layer and is an electrode common to the individual electrodes. Further, a protection film covering a region, which is not covered by the common electrode on the individual electrode, is provided.

Abstract: An ultrasound transducer element includes a piezoelectric layer, a front end body, and a backing layer assembly. The piezoelectric layer extends between opposite front and back sides and is configured to transmit acoustic waves from the front side. The front end is body disposed proximate to the front side of the piezoelectric layer and is configured to emit the acoustic waves out of a housing. The backing layer assembly is disposed proximate to the back side of the piezoelectric layer. The backing layer assembly includes a first thermally conductive mesh disposed in a matrix enclosure. The first thermally conductive mesh is positioned to conduct thermal energy away from the piezoelectric layer. In one aspect, the first thermally conductive mesh is a grid of elongated strands of a metal or metal alloy material oriented in at least one of transverse or oblique directions.

Abstract: Provided is a method for amplifying a frequency variation of a detected signal in a biosensor that is used for detecting a biomolecule by measuring a change in frequency of an oscillating signal, the change being caused by pressure a biomolecule applies to a piezoelectric substance. The method for amplifying a frequency variation of a detected signal comprises the steps of: (a) applying a sample to a probe being fixed to an upper portion of a substrate of the biosensor to allow a biomolecule in the sample to be bound to the probe; (b) applying protein tagged with a metal particle to the biosensor to allow the protein and the biomolecule to be bound with each other; and (c) applying a metal enhancer to the biosensor to allow the metal enhancer to be bound to the metal particle having been bound to the protein.

Abstract: Acoustic wave devices and methods of coating a protective film of alumina (Al2O3) on the acoustic wave devices are disclosed herein. The protective film is applied through an atomic layer deposition (ALD) process. The ALD process can deposit very thin layers of alumina on the surface of the acoustic wave devices in a precisely controlled manner. Thus, the uniform film does not significantly distort the operation of the acoustic wave device.

Abstract: The invention relates to fiber-reinforced composites acting as an actuator, as a sensor and/or as a generator and to a manufacturing process. It is the object of the invention to provide such fiber-reinforced composites which can be manufactured simply and reliably and which are securely fastened and exactly positioned as elements acting as actuators, generators and/or sensors. In a fiber-reinforced composite in accordance with the invention, at least one piezoelectric element is fixed and positioned by fibers or yarn within a fiber structure or by means of fibers or yarn to a fiber structure. Flexible, electrically conductive connections which can be contacted from outside the fiber-reinforced composite are led at and/or within the fiber structure to electric connector contacts of the at least one piezoelectric element. One or more piezoelectric elements, electrically conductive connections and the fiber structure are embedded in a matrix material.

Abstract: In an exemplary method a piezoelectric wafer is prepared on which multiple piezoelectric frames are formed. Each frame has a piezoelectric vibrating piece including excitation electrodes, and a frame portion surrounds the vibrating piece. A lid wafer is prepared on which multiple respective lids are formed, each sized substantially similarly to the respective frames. A base wafer is prepared on which multiple of bases are formed, each sized substantially similarly to the respective frames. Each base has through-holes. Stripes of a first bonding film are formed on both major surfaces of the piezoelectric wafer around the periphery of each frame. Stripes of a second bonding film are formed on the inner major surface of the lid wafer, corresponding to respective stripes of the first bonding film. Stripes of a third bonding film are formed on the inner major surface of the base wafer, corresponding to respective stripes of the first bonding film.

Abstract: A method for fabricating electrostatic transducers and arrays electrically separates the substrate segments of the transducer elements from each other using a technique involving two cutting steps, in which the first step forms a patterned opening in the substrate to make a partial separation of substrate segments, and the second step completes the separation after the substrate segments have been secured to prevent instability of the substrate segments upon completion of the second step. The securing of the substrate segments may be accomplished by filling a nonconductive material in the partial separation or securing the transducer array on a support substrate. When the substrate is conductive, the separated substrate segments serve as separate bottom electrodes that can be individually addressed. The method is especially useful for fabricating ID transducer arrays.

Abstract: A coupling structure for coupling piezoelectric material generated stresses to an actuated device of an integrated circuit includes a rigid stiffener structure formed around a piezoelectric (PE) material and the actuated device, the actuated device comprising a piezoresistive (PR) material that has an electrical resistance dependent upon an applied pressure thereto; and a soft buffer structure formed around the PE material and PR material, the buffer structure disposed between the PE and PR materials and the stiffener structure, wherein the stiffener structure clamps both the PE and PR materials to a substrate over which the PE and PR materials are formed, and wherein the soft buffer structure permits the PE material freedom to move relative to the PR material, thereby coupling stress generated by an applied voltage to the PE material to the PR material so as change the electrical resistance of the PR material.

Abstract: An electronic component includes an electronic component body having a plurality of electrodes and a sealing film sandwiching the electronic component body from both surfaces. The sealing film is sealed along its entire periphery. Extraction electrode portions are formed on an inner surface of the sealing film which is in contact with the electronic component body, and at positions corresponding to the electrodes, and are in contact with the electrodes.

Abstract: A piezoelectric device includes a rectangular base plate having a first face where a pair of mounting terminals are formed, a second face opposite to the first face, where a bonding face is formed in a circumference, and a pair of connecting electrodes formed in the bonding face; a rectangular piezoelectric vibrating piece having a pair of excitation electrodes and lead electrodes extracted from a pair of the excitation electrodes, so that the lead electrode is fixed to the connecting electrode using a conductive adhesive; a lid plate that covers the piezoelectric vibrating piece; and a ring-shaped encapsulating material arranged in a ring shape between the bonding face and the lid plate to encapsulate the base plate and the lid plate. The connecting electrode is formed in a comb-tooth shape as seen from a normal direction of the second face to increase a lateral length of the connecting electrode.

Abstract: There are provided a piezoelectric vibrating reed which can be reliably bonded ultrasonically and which can be efficiently manufactured, a piezoelectric vibrator, a method of manufacturing a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio-controlled timepiece. A piezoelectric vibrating reed includes: a piezoelectric plate having vibrating portions and a base portion adjacent to the vibrating portions; excitation electrodes formed in the vibrating portions; mount electrodes formed in the base portion; lead-out electrodes for making the excitation electrodes and the mount electrodes electrically connected to each other; and a passivation film which is formed of an electrically insulating material and covers the excitation electrodes and the lead-out electrodes. These electrodes disposed on one surface of the base portion are formed only in a region covered by the passivation film.

Abstract: The present invention relates to an actuator arrangement for use in a fuel injector, comprising: a piezoelectric actuator having a body section, said body section having a first end piece and a second end piece; a rigid encapsulation member which encloses the body section and the end pieces, wherein potting material is fitted between the rigid encapsulation member and the body section, wherein the first end piece is slideably fitted into the rigid encapsulation and the second end piece is fixed to or integrated into the encapsulation member.

Abstract: The bending transducer has a layer construction containing a piezoelectrically active element, which is formed of a piezoactive material, in particular a piezoceramic, and electrode layers fitted thereon. In order to enable a high bending loading of the bending transducer and to reduce the risk of fracture, it is provided that a protective layer is applied to the layer construction on the outer side, preferably on both sides, which protective layer is applied to the layer construction in particular under prestress.

Abstract: An electronics filter circuit includes an electromechanical resonator that is mounted directly to the surface of a silicon integrated circuit, rather than being a surface mounted or leaded filter can on a circuit board. This filter circuit allows the integrated circuit electronic package to be significantly smaller than a conventional electromechanical resonator package. The electromechanical resonator may be protected during processing and during use with a protective cover that is made of a material such as titanium. The protective cover is attached to the integrated circuit chip.

Abstract: A piezoelectric component manufacturing method is provided. The method includes preparing an integrated piezoelectric substrate, and forming comb-shaped electrodes and wiring electrodes having element wiring connecting to the comb-shape electrodes on a primary surface of the piezoelectric substrate, forming an SiO2 layer, performing a characteristics inspection on the piezoelectric substrate and marking defective piezoelectric elements, coating said SiO2 layer surface with photosensitive resin, and then exposing and developing to form an insulating layer.

Abstract: A package for an electronic component includes a first substrate and a second substrate. In the package, an interior space capable of housing the electronic component is formed between the first substrate and the second substrate, a sealing hole communicating with the interior space and an exterior is formed in at least one of the first substrate and the second substrate, the interior space can be airtightly sealed by melting a solid sealant provided in the sealing hole, and an interior wall of the sealing hole has a curved surface extending in directions of penetration and inner periphery of the sealing hole.

Abstract: Provided are an acoustic wave device and a method for manufacturing the same, the acoustic wave device being effectively prevented from expanding and contracting due to temperature change and having a small frequency shift. The acoustic wave device of the present invention has a piezoelectric substrate (1) having an IDT (2) formed on one principal surface of the piezoelectric substrate (1), and a thermal spray film (3) formed on an opposite principal surface (1b) of the piezoelectric substrate (1), the thermal spray film being of a material having a smaller linear thermal expansion coefficient than the piezoelectric substrate (1) and having grain boundaries and pores (4), at least a part of which is filled with a filling material (5).