Abstract: An electronic module, comprises: a circuit board; a piezoelectric device having a lid, the piezoelectric device being mounted on the circuit board; and an electronic component mounted on the circuit board. The electronic component includes an adjustment terminal for at least one of adjusting and inspecting an electrical characteristic thereof. The lid is electrically conducted to the adjustment terminal.

Abstract: A surface acoustic wave device having a three-layered structure of sealing resin for sealing a mounting substrate and a surface acoustic wave element in which the elastic modulus of resin of the intermediate layer is higher than that of resin of the outermost layer and the elastic modulus of resin of the innermost layer is lower than that of resin of the outermost layer. The three-layered structure of the sealing resin suppresses crush of a bump when a pressure is applied from the outside and reduces stress applied to the bump due to the change in temperature.

Abstract: An acoustic boundary wave device includes a first medium having piezoelectricity, electrodes that are provided on the first medium and excite acoustic waves, a second medium made of a material different from the first medium and provided on the first medium so as to cover the electrodes, and a third medium that has a heat conductivity higher than that of the second medium and is provided so as to contact an upper surface of the second medium and at least a part of side surfaces of the second medium.

Abstract: A crystal device for surface mounting is provided with at least: a container body having a substantially rectangular outer shape and mounting electrodes formed in the four corners of the outside bottom surface of the container body; and a crystal blank hermetically sealed within the container body. The spacing of mounting electrodes on at least one side of the outside bottom surface is less than the length of the mounting electrodes in the direction along that side. A jetty having a height greater than the thickness of the mounting electrodes is provided in the cross-shaped area interposed between the mounting electrodes on the outside bottom surface.

Abstract: A piezoelectric device includes a piezoelectric element, a circuit board on which the piezoelectric element is mounted, an IC component having at least a function of oscillating the piezoelectric element and connected to a bottom face of the circuit board, an insulating section covering at least a part of the IC component, a circuit connection terminal formed on a main surface of the IC component, an internal connection bump formed on the circuit connection terminal and connected to the circuit connection terminal and the bottom face of the circuit board, a functional terminal formed on a main surface of the IC component, a back surface electrode formed on a back surface of the IC component, a penetrating electrode penetrating the IC component from the main surface to the back surface and connecting the functional electrode and the back surface electrode to each other, an external connection bump connected to the back surface electrode, and a mounting terminal formed on a surface of the insulating section, an

Abstract: A composite electronic component provided is one with sufficient impact resistance. In this resonator 1, a capacitive element 3 has a projection 37 projecting outside a piezoelectric element 2, from a portion of the capacitive element 3 coinciding with a vibration region 2a. The projection 37 is provided on each of two sides of the capacitive element 3 in a direction substantially perpendicular to a longitudinal direction of the capacitive element 3. This causes the projections 37 of the capacitive element 3 to be buried in a mold resin 5, whereby the capacitive element 3 is sufficiently fixed to the mold resin 5 even if the mold resin 5 is provided with a vibration space 5a containing the vibration region 2a of the piezoelectric element 2. Therefore, an improvement is made in impact resistance of the resonator 1.

Abstract: A piezoelectric element includes: a base substrate; a lower electrode provided on the base substrate; a piezoelectric layer provided on the lower electrode; an upper electrode provided on the piezoelectric layer; and a protection layer that covers a side surface of the piezoelectric layer, wherein the protection layer is formed from polymeric material.

Abstract: A piezoelectric element includes: a base substrate; a lower electrode provided above the base substrate; a lower dummy electrode provided on the base substrate and electrically insulated from the lower electrode; a piezoelectric layer provided on the base substrate, the lower electrode and the lower dummy electrode; and an upper electrode provided on the piezoelectric layer.

Abstract: Manufacturing a piezoelectric vibration device, includes: forming a bonding electrode on a part of a piezoelectric substrate to which a cover makes contact; forming a part defining a through hole to the cover so that a profile of an edge of an opening of the through hole at a first surface of the cover is positioned inside an outer shape of the taking out electrode in a plan view when the cover and the piezoelectric substrate are overlapped; forming a first glass film on the first surface of the cover; forming a second glass film on the first surface of the cover; bonding the first glass film to the taking out electrode as well as the second glass film to the bonding electrode by generating an electric field; and cutting an electrical coupling between the taking out electrode and the bonding electrode after step (e).

Abstract: A piezoelectric package comprises a piezoelectric plate having a first planar surface and a second planar surface that are electrically isolated from each other. The piezoelectric package further comprises a first electrically conductive layer electrically coupled to the first planar surface, and a second electrically conductive layer electrically coupled to the second planar surface. The piezoelectric package further comprises a first electrically insulative material (e.g., a rigid fiber composite material) encapsulating the piezoelectric plate and at least portions of the first and second electrically conductive layers.

Abstract: Acoustic wave devices coated with a biolayer are described for the detection target bio-molecules. The acoustic wave device is connected in an oscillator circuit, and the frequency shift ?f resulting from a biomolecular event is recorded. Further described are the use of Rayleigh wave surface acoustic wave devices for vapor phase detection as well as quartz crystal microbalance devices for liquid phase measurements. A biofilm on the surface of the acoustic wave device comprises of a layer of antibodies raised against a specific target molecule or antigen. Signatures for detection events are presented in the form of frequency shifts ?f(t).

Abstract: To provide a piezoelectric oscillator which can be reduced in size by reducing the planar size. With regard to a layered lead frame comprising two lead frames and, connection leads for connection with a piezoelectric resonator are formed on the upper lead frame and the connection leads are erected upwards so as to form connection terminals, and mounting leads for mounting to a mounting board are formed on the lower lead frame and the mounting leads are erected downwards so as to form mounting terminals, and an IC forming an oscillating circuit is mounted on the layered lead frame, the piezoelectric resonator formed by sealing a piezoelectric resonator element within a package is mounted on the layered lead frame, and the layered lead frame and the piezoelectric resonator are sealed within a resin package such that the principal surface of the mounting terminals are exposed outwards, thereby forming a completed article.

Abstract: Aspects of the invention can provide a method capable of easily realizing immobilization with the optimum density derived from a concentration control and without phase separation in coadsorption of a number of molecules. The immobilization method can include the step of dissolving a plurality of molecules to be immobilized to a solid phase substrate with a solvent to obtain a solution of the plurality of molecules, and the step of incubating the solution and the solid phase substrate in touch therewith. Each of the molecules can include a solid phase substrate joint portion having a jointing property to the solid phase substrate, a functional portion having a specific function, and a linker portion positioned between the solid phase substrate joint portion and the functional portion.

Abstract: To propose a structure of a small-sized airtight terminal capable of restraining a reduction in yield of steps of fabricating an airtight terminal and steps of integrating a piezoelectric vibrator and a mold structure of a surface mount type piezoelectric vibrator in correspondence with the airtight terminal, there is provided a surface mount type piezoelectric vibrator including a piezoelectric vibrating piece having a pair of exciting electrodes, a first electrode of the pair of exciting electrodes being electrically connected to the lead, and a second electrode thereof being electrically connected to a stem of an airtight terminal, a case of a bottomed cylinder type fixed to the stem to cover the piezoelectric vibrating piece to form an airtight space, a first external electrode terminal electrically conductive to the first electrode by way of the lead, a second external electrode terminal electrically conductive to the second electrode, and a mold resin molded to be formed on surfaces of the case and the

Abstract: A surface acoustic wave filter includes a device chip, one principal surface of a piezoelectric substrate having a wiring pattern including IDTs and pads electrically connected to the IDTs, that is disposed so as to oppose a mount board, with the pads being electrically connected to lands of the mount board through bumps. A resin film covers the other principal surface of the piezoelectric substrate and the principal surface of the mount board to seal the device chip. In the piezoelectric substrate, the area of the one principal surface is greater than the area of the other principal surface.

Abstract: A sealing arrangement of a piezoelectric actuator comprises terminal posts (14) projecting from the piezoelectric actuator and a metallic top arrangement (18, 22), provided with openings (28) allowing the passage of the terminal posts (14) which is emplaced on the piezoelectric actuator. In order to facilitate reliable sealing in particular also for comparatively thin top plates (18), the invention provides for emplacing on terminal post sections (30) projecting from the openings (28) a sealing element (32) which is formed from an electrically insulating and sealing material and which is positioned tight against, on the one hand, circumferential areas (34) of the terminal post sections (30) and, on the other hand, the top arrangement (18, 22), with an insulating disk (40) provided with openings allowing the passage of the terminal posts (14) and made of electrically insulating material being located between the sealing element (32) and the top arrangement (18, 22).

Abstract: A piezoelectric ceramic composition includes: a composite oxide, as a main component thereof, represented by the composition formula, Pba[(Zn1/3Nb2/3)xTiyZrz]O3, wherein a, x, y and z satisfy the following relations, 0.96?a?1.03, 0.005?x?0.047, 0.42?y?0.53, 0.45?z?0.56, and x+y+z=1, and the following additives in the indicated percentages by mass in relation to the main component, Cu as a first additive, in a content ?, in terms of Cu2O, falling within a range 0<??0.5%; at least one of Li, Co, Ni, Ga and Mg, as a second additive, in a content ?, in terms of carbonate for Li, falling within a range 0<??0.1%, in a content ?1, in terms of oxide for Co, Ni and Ga, falling within a range 0<?1?0.2%, and in a content ?2, in terms of carbonate for Mg, falling within a range 0<?2?0.2%; and at least one of Ta, Nb, W and Sb, as a third additive, in a content ?, in terms of oxide, falling within a range 0<??0.6%.

Abstract: In an electronic component package in which an electronic component mounted through an external electrode disposed on a mounting board is covered with a molding resin, the electronic component has a structure in which IDT electrodes disposed on the lower surface of a component substrate made of a piezoelectric material are covered with a component cover, and an intermediate elastic layer having an elastic modulus smaller than that of the component substrate and greater than that of the molding resin is provided between the component substrate and the molding resin.

Abstract: Provided is a piezoelectric element including a monolithic piezoelectric substrate that can prevent not only migration between internal electrodes, but also deterioration resulting from a decrease in the degree of polarization even when temperature changes are repeatedly applied to the piezoelectric element. A piezoelectric element 1, in which a first external electrode 4 and a second external electrode 5 are formed on a first side face 2c and a second side face 2d, respectively, of a monolithic piezoelectric substrate 2 including first internal electrodes 3b and 3d placed at a first electric potential and second internal electrodes 3a, 3c and 3e placed at a second electric potential, which is different from the first electric potential, stacked with piezoelectric layers interposed therebetween, and exterior portions 6 and 7 for preventing migration are provided to cover a third side face 2e and a fourth side face 2f.

Abstract: The present invention provides a piezoelectric actuator with excellent durability. In the present invention, a piezoelectric element 2 in which a plurality of piezoelectric layers that expand in accordance with an applied voltage, and internal electrode layers for supplying an applied voltage, are alternately laminated, and at least a part of the side surfaces 201 and 202 thereof is covered by an external packaging resin 25, the piezoelectric element 2 being housed in a sealed container 11 that substantially isolates it from the external atmosphere, and in which the internal atmosphere 19 is replaced by an inert gas. Alternatively, the piezoelectric element 2 is housed in a sealed container 11 that substantially isolates it from the external atmosphere, and the external packaging resin 25 includes an antioxidant.

Abstract: A surface mount type piezoelectric vibrator comprises a piezoelectric vibrator piece having an electrode, an airtight container made of glass or a ceramic material for encapsulating the piezoelectric vibrator piece, and an external terminal formed on an exterior surface of the airtight container and connected to the electrode of the piezoelectric vibrator piece. The external terminal comprises a metal alloy of Ni and Cr. A film of Au is formed on a surface of the metal alloy of Ni and Cr.

Abstract: The piezoelectric actuator includes a piezoelectric element (2) including a sheet of piezoelectric ceramic and electrodes formed at least part of the surface of the sheet of piezoelectric ceramic, and a holding member (4) holding the piezoelectric element (2); The piezoelectric at least one of the requirements (a) to (e) described below; (a) The bulk density shall be equal to or smaller than 5 g/cm3, and the Young's modulus Y11E calculated according to a resonance-antiresonance method shall be equal to or larger than 90 GPa; (b) The coefficient of thermal conductivity shall be equal to or larger than 2 Wm?1K?1; (c) The coefficient of thermal expansion shall be equal to or larger than 3.0 ppm/° C. over a temperature range from ?30° C. to 160° C.; (d) The pyroelectric coefficient shall be equal to or smaller than 400 ?Cm?2K?1 over the temperature range from ?30° C. to 160° C.

Abstract: A surface mount type piezoelectric vibrator comprises a piezoelectric vibrator having a piezoelectric vibrating piece bonded to an airtight terminal with a lead terminal and sealed by a cylindrical bottomed metal sealing tube. An electrode terminal is connected to the lead terminal so that a tip of the electrode terminal is disposed approximately at the same position as a tip of the lead terminal in a longitudinal direction of the surface mount type piezoelectric vibrator. The piezoelectric vibrator is coated with a mold resin.

Abstract: In a surface acoustic wave device, electrode films constituting at least one IDT are disposed on a piezoelectric substrate, and an SiO2 film is arranged on the piezoelectric substrate so as to cover the electrode films. The film-thickness of the electrode films is in the range of about 1% to about 3% of the wavelength of an excited surface acoustic wave.

Abstract: A piezoelectric electronic component for use in a cellular phone or the like and capable of achieving reductions in size and profile is provided. A piezoelectric element oscillating in response to application of an input signal and outputting an output signal corresponding to the oscillations is provided on a substrate. The piezoelectric element includes a pad, the pad inputting and outputting the input and output signals. A shell member serving as a sealing member and having an insulation film covering the piezoelectric element is provided on the substrate, the shell member being remote from the piezoelectric element. The shell member includes a through hole above the pad, and the through hole is occluded with an electrode.

Abstract: A seal (10) for a piezo-actuator of a fuel injector with terminal posts (12) projecting out of the piezo-actuator and a head arrangement (14) mounted on the piezo-actuator with openings (16) for passage of the terminal posts (12) is particularly suitable even for comparatively thin head plates. A sealing unit (18) mounted on the head arrangement (14) and provided with openings for passage of the terminal posts (12) is provided, having a support (22), on which a sealing material (26) is arranged, which is in contact in a sealing manner with the peripheral surfaces of the terminal posts (12) and a peripheral region of the head arrangement (14) and in which an element (20) made of microporous material is integrated to create gas permeability.

Abstract: An apparatus comprising one or more piezoelectric mass sensors for use in diagnostic and analytic processes, in particular for immunochemical detection of diagnostically relevant analytes in real time, is described. Each piezoelectric mass sensor comprises a piezoelectric crystal with a receptor surface which has immobilized thereon a lawn of recombinant antibodies comprising single VH chain or single-chain Fv (scFv) polypeptides specific for a particular antigen. Binding of antigen to the recombinant antibodies results in a change in mass on the receptor surface which is detected as a change in resonant frequency. In a preferred embodiment, the receptor layer is a precious metal such as gold which facilitates self-assembly of the recombinant antibodies into a lawn on the receptor surface via a cysteine residue at the carboxy terminus of the attachment polypeptide.

Abstract: A thin film piezoelectric resonator, includes: a sealing member; an insulating layer with fine holes which is provided on the sealing member; a semiconductor layer which has a cavity over the fine holes provided on the insulating layer; a protective film provided on the semiconductor layer and over the cavity; a lower electrode provided on the protective film; a piezoelectric film provided on the lower electrode; an upper electrode provided on the piezoelectric film; a first lead electrode connected to the lower electrode and provided on the protective film; a second lead electrode connected to the upper electrode and provided on the protective film; and an etched part of the protective film or a deposited layer part which is formed opposite the fine holes.

Abstract: Provided is an actuator device including piezoelectric elements which are displaceably provided on a substrate. Each piezoelectric element is formed of a lower electrode, a piezoelectric layer and an upper electrode. In the actuator device, longitudinal end portions of the upper electrode define longitudinal end portions of a piezoelectric active portion to be a substantial driver of the piezoelectric element. The lower electrode and the piezoelectric layer are provided continuously to the longitudinal outside of the piezoelectric active portion. Regions of the piezoelectric layer outside of the piezoelectric active portion are formed so that thin film portions may have a thin thickness.

Abstract: A piezoelectric resonator includes a resonator substrate, a base substrate supporting the resonator substrate, a lid substrate covering a surface of the resonator substrate, the surface being on an opposite side of a surface facing the base substrate, a first excitation electrode formed on the surface of the resonator substrate facing the lid substrate, a second excitation electrode formed on the surface of the resonator substrate facing the base substrate, and a third electrode provided on the surface of the resonator substrate facing the base substrate, the third electrode being electrically connected to the first excitation electrode through a concave portion which is formed on a side surface of the resonator substrate.

Abstract: A combination transducer and water-blocking film for acoustic signaling through ambient water. The water-blocking film has an etched fluoropolymer film and adjacent bonding film interposed between the transducer and the water. Potting material extends adjacent to and is bonded to both sides of the water-blocking film. The film and potting material create an acoustic window. The etched fluoropolymer film is approximately one to two thousandths inch thick and the bonding film is approximately one thousandths inch thick, and the potting material is a polyurethane matrix.

Abstract: A piezoelectric/electrostrictive structure is provided, including a plurality of stacked sheet-shaped piezoelectric/electrostrictive bodies and at least one sheet of a thin film. The interfaces between the piezoelectric/electrostrictive bodies are exposed at side faces of the piezoelectric/electrostrictive structure, the side faces have notches, and the thin film is placed on the notched portions of side faces. A method for manufacturing the piezoelectric/electrostrictive structure includes the steps of stacking a plurality of ceramic green sheets made of a piezoelectric/electrostrictive material, firing the stacked ceramic green sheets to prepare fired piezoelectric/electrostrictive bodies and forming at least one sheet of a thin film on side faces of the fired piezoelectric/electrostrictive bodies by a chemical vapor deposition process.

Abstract: An electromechanical functional module and associated process for production thereof, which includes at least one transducer, at least one upper fiber cover layer, which is nonconducting and is positioned over the at least one transducer having a first electrode and a second electrode, at least one lower fiber cover layer, which is nonconducting and is positioned below the at least one transducer, at least one fiber interlayer, which is nonconducting with at least one cut-out for accommodating the at least one transducer, at least one upper electric contract strip that is integrally connected to the at least one upper fiber cover layer and in contact with the first electrode of the at least one transducer, and at least one lower electric contract strip that is integrally connected to the at least one lower fiber cover layer and in contact with the second electrode of the at least one transducer, wherein the at least one upper fiber cover layer, the at least one lower fiber cover layer and the at least one tra

Abstract: A piezoelectric actuator is proposed, for example for actuating a mechanical component, and has a multilayered structure of piezoelectric layers with inner electrodes interspersed between them. The inner electrodes contact the outer electrodes on alternating sides and the regions between the outer electrodes are provided with a suitable insulation. The insulation is a layer comprised of a band, for example an adhesive tape, which covers over a predetermined region between the outer electrodes. The adhesive tape is comprised of a precisely measured, prefabricated material and can be stuck, rolled, melted, vulcanized, or sintered in place in a bubble-free manner.

Abstract: A composite electronic component provided is one with sufficient impact resistance. In this resonator 1, a capacitive element 3 has a projection 37 projecting outside a piezoelectric element 2, from a portion of the capacitive element 3 coinciding with a vibration region 2a. The projection 37 is provided on each of two sides of the capacitive element 3 in a direction substantially perpendicular to a longitudinal direction of the capacitive element 3. This causes the projections 37 of the capacitive element 3 to be buried in a mold resin 5, whereby the capacitive element 3 is sufficiently fixed to the mold resin 5 even if the mold resin 5 is provided with a vibration space 5a containing the vibration region 2a of the piezoelectric element 2. Therefore, an improvement is made in impact resistance of the resonator 1.

Abstract: A composite electronic component provided is one with sufficient impact resistance. In this resonator 1, a piezoelectric element 2 is supported by receivers 73, 83 in platelike holding portions 72, 82, and edge parts 74a, 84a in the holding portions 72, 82 are in contact with a capacitive element 3. This results in keeping the distance constant between the piezoelectric element 2 and the capacitive element 3. Furthermore, even if an impact is exerted on the resonator 1, the platelike holding portions 72, 82 will absorb the impact. Therefore, an improvement is made in impact resistance of the resonator 1.

Abstract: A piezoelectric device includes an element substrate having a piezoelectric element and an electrically conductive pattern connected to the piezoelectric element, a supporting layer arranged within the periphery of the piezoelectric element, a cover extending so as to provide a groove inside the external periphery of the element substrate, the groove ranging over the entire external periphery of the element substrate by removing a portion of the cover and/or supporting layer inside the external periphery of the element substrate after the cover is arranged on the supporting layer, an insulating reinforcing material that entirely covers portions of the element substrate ranging from the cover to the periphery of a principal surface of the element substrate, and an electrically conductive member electrically connected to the electrically conductive pattern so as to pass through the cover and the reinforcing material.

Abstract: A multilayered piezoelectric element in which braking to displacement of piezoelectric material layers is suppressed and insulating films suitable for thinning of the piezoelectric material layers are formed. A method of manufacturing the element includes the steps of: (a) forming a multilayered structure including piezoelectric material layers, at least one first electrode layer, and at least one second electrode layer; (b) discharging a liquid synthetic resin from a nozzle provided in a dispenser to apply it to an end portion of the first electrode layer in a first region within side surfaces of the multilayered structure and curing the liquid synthetic resin to form a first insulating film; and (c) discharging the liquid synthetic resin from the nozzle to apply it to an end portion of the second electrode layer in a second region and curing the liquid synthetic resin to form a second insulating film.

Abstract: A piezoelectric actuator for media flowing around it having a piezo stack which is arranged within a deformable isolating material so as to be in direct contact therewith at least over certain regions. The isolating material is for its part enclosed by a fluidically closed actuator housing, which is formed by a housing shell which is delimited at its one end by a dimensionally stable actuator top and at its other end by a dimensionally stable actuator bottom. The actuator top and bottom are arranged on the active main surfaces of the piezo stack. To increase the service life, the housing shell is produced from a limp and/or elastic material and is disposed at a distance from the piezo stack. The length of the housing shell, measured along the surface line, corresponds at least to the maximum extent of the piezo stack and/or the housing shell can be stretched accordingly.

Abstract: Provided is a thin-film piezoelectric element which reduces the influence of an oxide film left on the electrode film on the degradation of element characteristics, and a method of making the thin-film piezoelectric element. The thin-film piezoelectric element has ZrO2 as the main component of the outermost layer of the oxide film which covers the laminate. Young's modulus of the ZrO2 is 190 GPa, giving a significantly low value compared with Young's modulus of MgO, 245 GPa. Consequently, the influence of the oxide film on the reduction in the displacement magnitude of the piezoelectric film is smaller than the influence of the MgO thin film left in the conventional thin-film piezoelectric element. As a result, the thin-film piezoelectric element decreases the influence of the oxide film on the degradation of element characteristics compared with the conventional thin-film piezoelectric element.

Abstract: The invention relates to piezoelectric resonators. An interposer element is used between a resonating plate and the resonator package to provide improved (i.e. reduced) acceleration sensitivity. The interposer element is preferably of similar thermal expansion characteristics to the resonating plate. Electrical connection to the resonating plate from the exterior of the package is preferably provided via the interposer element.

Abstract: A method of manufacturing a piezoelectric thin film resonator forms, after forming a piezoelectric film on a substrate so as to cover a lower electrode formed on the substrate, an electrode material layer for forming an upper electrode above the piezoelectric film, forms a mask of a predetermined form on the electrode material layer, and then etches the electrode material layer to form the upper electrode. Before a step of forming the electrode material layer, a protective layer for protecting the piezoelectric film during etching of the electrode material layer is formed so as to cover at least a part of the piezoelectric film where the upper electrode is not formed, and the electrode material layer is then formed so as to cover the protective layer.

Abstract: A piezoelectric power generator (20, 120) comprises plural piezoelectric devices (22, 122); an actuator (24) positioned to impart an excitation to the plural piezoelectric devices (22, 122) in a predefined sequence; and, an electrical conduction system (30) connected to the plural piezoelectric devices for conducting an electrical charge created by the excitation. Preferably the plural piezoelectric devices (22, 122) are arranged in a predetermined relationship relative to the actuator (24) whereby only one of the plural piezoelectric devices (22, 122) is actuated at a time. For example, the plural piezoelectric devices (22, 122) can be arranged in an angular pattern (such as a circular pattern) relative to the actuator (24). Preferably, a rotational speed of the actuator (24) permits an excitation response for a given plural piezoelectric device (22, 122) to essentially fully decay before the given plural piezoelectric device (22, 122) is again excited.

Abstract: A surface acoustic wave device that enables to reduce heating process, prevent from heat break, and make thin profile is to be provided. The surface acoustic wave device includes a substrate, a surface acoustic wave element having a comb electrode formed on a piezoelectric substrate, and being flip-mounted on the substrate using a bump in such a manner as the comb electrode is disposed opposite to the substrate, a first resin layer covering the surface acoustic wave element, and a second resin layer formed on the first resin layer, wherein the first resin layer and the second resin layer are thermosetting resins in which state transitions of being softened and thereafter cured are produced through heating process, and the first resin layer is formed of a resin material having greater fluidity caused by softening than the resin material of the second resin layer.

Abstract: A deployable acoustic wave RFID/biosensor assembly has at least one protective layer, and an acoustic wave RFID/biosensor within the protective layer or layers. The acoustic wave RFID/biosensor includes an acoustic wave device, a biolayer mounted on the acoustic wave device, an electric circuit operable to actuate the acoustic wave device, and a fluidic chamber associated with the biolayer. In use, the fluidic chamber contains fluid which, if a predetermined substance to be sensed is present, operates to modify the biolayer which in turn affects the operation of the acoustic wave device. Protective fluid is provided within the protective layer or layers substantially surrounds the acoustic wave RFID/biosensor to protect the acoustic wave RFID/biosensor from damage when the RFID/biosensor assembly impacts a target and to protect the biolayer from deterioration during storage and use.

Abstract: In a manufacturing method for a SAW apparatus a first insulating layer is formed on the entire surface of a piezoelectric LiTaO3 substrate. By using a resist pattern used for forming an IDT electrode, the first insulating layer in which the IDT electrode is to be formed is removed. An electrode film made of a metal having a density higher than Al or an alloy primarily including such a metal is disposed in the area in which the first insulating layer is removed so as to form the IDT electrode. The resist pattern remaining on the first insulating layer is removed. A second insulating layer is formed to cover the first insulating layer and the IDT electrode.

Abstract: A method of manufacturing an actuator includes applying at least one layer of electrically-conductive material and at least one layer of electrically-insulative material to an actuator block, and separating the actuator block into a plurality of actuators, each actuator having at least one actuator finger. The electrically-conductive material and the electrically-insulative material are applied one layer upon another in an alternating manner to the actuator block in at least one actuator finger location. The layer of insulative material is larger in area than the layer of conductive material such that an insulative layer, applied to the actuator block and sandwiching a conductive layer between the insulative layer and the actuator block, at least partially encloses and electrically isolates the electrically-conductive layer by covering the conductive material on at least three sides.

Abstract: The invention provides a piezoelectric oscillator that allows for fine adjustment of the frequency after resin molding, a manufacturing method therefor, and a mobile phone and an electronic apparatus using the piezoelectric oscillator. The piezoelectric oscillator can include a resonator package, in which a piezoelectric resonator element is housed, and a semiconductor device, in which an oscillation circuit that is electrically connected to the resonator package is incorporated. The resonator package and the semiconductor device can be fixed to corresponding different surfaces of an island portion of a lead frame, and resin molding is performed so that a transparent lid of the resonator package is exposed to the outside.

Abstract: An electronic component includes at least one piezoelectric vibrating portion, a connecting portion provided on a substrate, a structural piece including a concavity so as not to disturb the vibration of the piezoelectric vibrating portion, and a connecting wiring for electrically connecting a pad on the substrate to a mounting wiring disposed on the upper surface of the structural piece. The structural piece further includes a through hole having an electroconductive material filled therein. The structural piece seals the piezoelectric vibrating portion.

Abstract: An object of the present invention is to provide a stacked piezoelectric element with excellent reliability and durability, a production method thereof and an electrically conducting adhesive. A stacked piezoelectric element comprising a ceramic stack obtained by alternately stacking a piezoelectric layer comprising a piezoelectric material and an internal electrode layer having electrical conductivity, and an electrically conducting adhesive layer provided to allow for electrical conduction to said internal electrode layer of the same polarity on the side surface of said ceramic stack, wherein said electrically conducting adhesive layer comprises a base resin having dispersed therein an electrically conducting filler and microparticles, and the boundary between said microparticle and said base resin is in a state that a void is formed at least in a part between those two members or in a state that when said base resin is elongated, a void can be formed between those two members.