Abstract: A contour resonator is provided with a vibrating body formed from a flat plate in a square shape, excitation electrodes formed on both front and back surfaces of the vibrating body and regulating a resonance frequency, and temperature characteristic adjustment films formed on surfaces of the excitation electrodes and adjusting a temperature characteristic.

Abstract: A surface acoustic wave device includes a piezoelectric substrate, at least one interdigital transducer (IDT) electrode provided on the piezoelectric substrate, and an insulator layer to improve a temperature characteristic arranged so as to cover the IDT electrode. When a surface of the insulator layer is classified into a first surface region under which the IDT electrode is positioned and a second surface region under which no IDT electrode is positioned, the surface of the insulator layer in at least one portion of the second surface region is higher than the surface of the insulator layer from the piezoelectric substrate in at least one portion of the first surface region by at least about 0.001?, where the wavelength of an acoustic wave is ?.

Abstract: A piezoelectric element includes in a laminated state a piezoelectric layer, a first electrode formed on a first surface of the piezoelectric layer, and a second electrode formed on a second surface of the piezoelectric layer which is opposite to the first surface. The piezoelectric layer has a film thickness of 5 ?m or less, and has a flat portion formed as a second surface in parallel with the first surface, and a lateral portion inclined downwardly from the flat portion towards the first surface. The second electrode has a central portion formed in parallel with the flat portion, and a slope portion inclined downwardly from the central portion towards the flat portion. The inclination angle of the slope portion to the flat portion is gentle as compared with the inclination angle of the lateral portion to the first surface.

Abstract: An electronic device includes: a package including a lid and a package base, the package being formed by bonding the lid to a joint surface of the package base using a bonding material; and a resin portion covering the package. The resin portion covers at least the package base and the bonding material, and at least a part of the resin portion has a section outline. The section outline has an outermost portion thereof in a direction parallel with a mount surface of the electronic device. The outermost portion is located below a lower surface of the lid in a direction perpendicular to the mount surface of the electronic device.

Abstract: An actuator arrangement comprising a piezoelectric actuator having a body section, a shroud which enshrouds at least part of the body section of the actuator, and at least one constrictive member disposed externally with respect to the shroud. The constrictive member applies a constrictive force to the shroud to maintain a seal between the shroud and the underlying body section of the actuator.

Abstract: An acoustic wave device includes a substrate, a device chip that has a piezoelectric substrate and is flip-chip mounted on a surface of the substrate, a first insulation layer that has a dielectric constant lower than that of the piezoelectric substrate and is provided on a surface of the device chip opposite to another surface that faces the substrate, and a metal seal part that seals the device chip.

Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes location of a piezoelectric material as part of a semiconductor sensing structure. The semiconductor sensing structure, in conjunction with the piezoelectric material, can be used as a sensing device to provide an output signal associated with a sensed event.

Abstract: This invention relates to a system for exciting oscillations of micromechanical cantilever sensors and for measuring and evaluating the corresponding oscillations. Such sensors can e.g. be used to detect chemical substances, biomolecules, microorganisms or viruses, or to analyze surface-related phenomena and processes such as conformational changes or phase transitions in thin layers, or to measure physical properties of their surrounding, such as viscoelastic properties of liquids. In the so-called dynamic operation mode, cantilever oscillations are excited and the frequency shift of the ground frequency and/or of one or some higher harmonics, occurring because of a process taking place at the cantilever surface, are measured. In the so-called static mode, the deflection of the cantilever is determined. The setup described in this invention allows measurements in gases as well as liquids.

Abstract: An object of the present invention is to; miniaturize, increase the capacity, and reduce the price of piezoelectric components. The present invention relates to a piezoelectric component and a manufacturing method thereof, characterized in that: there are bonded and laminated at least two or more piezoelectric elements in which comb-teeth electrodes, wiring electrodes having element wirings that are arranged adjacent to the comb-teeth electrodes, and electrode terminals connected to the wiring electrodes, are formed on a principal surface of a plurality of piezoelectric substrates, while forming hollow sections between the respective piezoelectric elements; through electrodes are formed in the respective piezoelectric substrates so as to pass therethrough; the through electrodes are connected to the electrode terminals; and the piezoelectric substrates are sealed by a resin sealing layer.

Abstract: A coating providing high abrasion and chemical resistance composed of a barrier layer from vanadium, molybdenum, niobium, tantalum and the like, and an outer layer of diamond-like carbon. The coating is especially applicable for acoustic wave device (AWD) based sensors, and for passivating an electrode such as an electrode deposited on the AWD sensing area. The coating provides excellent mechanical and acoustical characteristics for coating acoustic wave devices allowing the sensor to operate in harsh environments.

Abstract: A piezoelectric actuator for flowing-around media, with a piezo element arranged between two end caps. The piezo element is surrounded by a ring-shaped sheathing connected to the end caps. The sheathing consists, at least in portions, of a composite material with at least two layers, at least one layer consisting of a metallic material and at least one layer consisting of a polymer.

Abstract: An intracavity ultrasonic probe which prevents or reduces degradation or failures with time due to use of an intermediate balloon made of rubber. The intracavity ultrasonic probe includes: a piezoelectric vibrator having a piezoelectric material, and a first electrode layer and a second electrode layer formed on a first surface and a second surface of the piezoelectric material, respectively; at least one acoustic matching layer provided above the second electrode layer; an acoustic lens disposed above the at least one acoustic matching layer so as to cover the at least one acoustic matching layer and the piezoelectric vibrator; and a sulfur adsorbing material layer disposed between the acoustic lens and the second electrode layer.

Abstract: A piezoelectric package comprises an upper and lower piezoelectric plates, each having opposing electrodes. The piezoelectric package further comprises an electrically insulative structure encapsulating the piezoelectric plates. The piezoelectric package further comprises first and second external connectors mounted to the insulative structure. The connectors respectively have connector terminals that are electrically coupled to the electrodes in different orders, and have geometric arrangements that are identical, such that a single interface device can be selectively mated to either of the connectors. The piezoelectric package may be incorporated into a system that comprises electronic circuitry configured for operating the piezoelectric package, and a single interface device electrically coupled between the electronic circuitry and either of the external connectors of the piezoelectric package to selectively configure the package between a unimorph and a bimorph.

Abstract: A composite acoustic wave device (AWD) which is adapted for operation at high ambient pressures is provided. The AWD comprises two piezoelectric plates in back to back relationship, with electrodes disposed between the plates. The plates are bonded so as to neutralize the effects of external pressure. Further disclosed is a sensor utilizing the AWD and methods for utilizing such AWD for physical measurements in high pressure environments. An optional cavity formed between the piezoelectric plates offers the capability to measure the pressure and to further neutralize the residual effects of the pressure on measurement accuracy.

Abstract: In a method for producing a multilayer encapsulation (1) of a piezo actuator (5) such that the piezo actuator (5) is protected towards the outside without having to use an additional enveloping housing-type structure, in order to produce the multilayer encapsulation (1), an electrically insulating elastic layer (10) is first applied to the surface of the piezo actuator (5), whereupon a metallic layer is applied to the electrically insulating elastic layer (10) so as to planarly cover the same.

Abstract: An electrical device such as a piezoelectric actuator is protected against permeation by injurious fluids such as fuel (diesel/gasoline) and water by encapsulating the device with a shape memory metallic material. The shape memory metallic material may be in the form of a tube manufactured to the required dimensions for encapsulation of the device. The tube may then be plastically deformed, such as by stretching, before being placed over the device and heated above its transformation temperature to recover its original shape. The invention is particularly suitable for protecting passivated piezoelectric actuators.

Abstract: A surface acoustic wave device includes a piezoelectric substrate, a surface acoustic wave element composed of electrodes provided on the piezoelectric substrate and the piezoelectric substrate, a first seal resin portion provided on the piezoelectric substrate and having a cavity on the surface acoustic wave element, and an inorganic insulation film provided in contact with a surface of the piezoelectric substrate to surround the surface acoustic wave element.

Abstract: A scalable piezoelectric package comprising a plurality of piezoelectric cells, each including a piezoelectric element and an external connector electrically coupled to the piezoelectric element of the respective piezoelectric cell. The piezoelectric package further comprises at least one intercellular conductor electrically coupling the piezoelectric cells together, such that the external connector of each of the piezoelectric cells is electrically coupled to the piezoelectric plate of each of the remaining piezoelectric plates of the piezoelectric cells.

Abstract: The invention provides an encapsulating arrangement for an electrical component comprising first and second insulating layers and an electrically charged conductive layer, preferably in the form of a metal foil, intermediate the first and second insulating layers, and arranged to prevent the passage of ionic species across the encapsulating arrangement. The encapsulating arrangement of the invention has particular application to piezoelectric actuator arrangements for fuel injectors of internal combustion engines.

Abstract: The present invention provides a layer acoustic wave device that is formed without requiring a bonding process to attach a secondary substrate. In particular, the layer acoustic wave device is formed from a substrate, an interdigital transducer created on the substrate, a dielectric layer formed over the interdigital transducer and substrate, and at least one isolation layer formed over the dielectric layer. The at least one isolation layer has sufficient properties to minimize particle displacement on a top surface of the at least one isolation layer. The at least one isolation layer has a greater acoustic impedance than that of the dielectric layer.

Abstract: In a method for the production of a gradient encapsulation layer 20 on a piezoelectric actuator 1, based on this gradient encapsulation layer 20, the piezoelectric actuator 1 does not 5 require an additional housing-like enveloping structure in order to be protected externally. The gradient encapsulation layer 20 is produced by cold gas spraying of particles having different material properties.

Abstract: A composite electronic component provided is one with sufficient impact resistance. In this resonator 1, a piezoelectric element 2 is supported by receivers 73, 83 in platelike holding portions 72, 82, and edge parts 74a, 84a in the holding portions 72, 82 are in contact with a capacitive element 3. This results in keeping the distance constant between the piezoelectric element 2 and the capacitive element 3. Furthermore, even if an impact is exerted on the resonator 1, the platelike holding portions 72, 82 will absorb the impact. Therefore, an improvement is made in impact resistance of the resonator 1.

Abstract: The magnetic device according to the invention is integrated on a substrate and comprises at least one element made of piezoelectric material associated with actuating electrodes, and at least one magnetic element able to deform under the stress of the piezoelectric material element. The device has the form of a beam movable with respect to the substrate, and comprises two transverse parts of predetermined width, along a reference longitudinal axis. The piezoelectric material element is formed by at least a part of a transverse part and each transverse part comprises a zone for mechanical anchoring on the substrate. The transverse parts are connected by at least one central branch, of predetermined width, on which the magnetic element is arranged.

Abstract: A surface-mount SAW device configured to prevent sealing resin layer coated all over the top surface of a piezoelectric substrate from becoming charged even if the piezoelectric substrate forming the SAW device is made of a pyroelectric material. The SAW device is composed of a mounting substrate; a SAW chip provided with a piezoelectric substrate, an IDT electrode formed on one surface of said piezoelectric substrate, and connection pads connected via conductor bumps to conductor traces; a flip chip mounted to the mounting substrate; and a sealing resin layer coated all over the outer surface of the SAW chip flip-chip mounted on the mounting substrate and extended down to the top surface of the mounting substrate to define an airtight space between the IDT electrode and the mounting substrate; and wherein the electrical conductivity of the piezoelectric substrate is increased to suppress charging of the sealing resin layer.

Abstract: An arrangement with a piezoelectric actuator is disclosed, made up of a piezoelectric element with a multilayer construction of piezoelectric layers. The piezoelectric actuator is surrounded by an inner chamber at least surrounding the layers, which filled with a fluid insulation medium. The inner chamber is sealed from a fluid medium in an outer chamber an elastic sleeve which can change shape. The sleeve is sealed with sealing elements being provided at the axial ends thereof in the region of an actuator base and an actuator head. By a shape and/or positional change of the sealing elements, corresponding to the elasticity of the sleeve, a volume equalization in the inner chamber with the insulation medium is achieved.

Abstract: A surface mount crystal oscillator comprises a crystal blank, an IC chip having an oscillation circuit integrated thereon, and a hermetic package for accommodating the crystal blank and IC chip therein. The hermetic package comprises a substantially rectangular ceramic substrate formed with a metal film which makes a round on one main surface thereof, and a concave metal cover having an open end face bonded to the metal film. The IC chip is secured to the one main surface of the ceramic substrate through ultrasonic thermo-compression bonding using bumps, the crystal blank is disposed above the IC chip, and the ceramic substrate has the one main surface formed as a flat surface.

Abstract: A wafer level package filter includes a device wafer having an acoustic wave device disposed on its surface, the acoustic wave device including at least an acoustic wave resonator associated with a piezoelectric substrate and a connecting pad. A capped substrate includes circuitry having inductors and capacitors. The capped substrate has a coefficient of thermal expansion significantly unequal to a coefficient of thermal expansion for the piezoelectric substrate. An adhesive bond connects the capped substrate to the device wafer for encapsulating the acoustic wave device within a cavity. A dielectric overcoat is deposited over a portion of the capped substrate, and a metallization layer extends over a portion of the dielectric layer connecting the capped substrate circuitry to a connecting pad of the acoustic wave device. Optionally, a bond connecting the capped substrate to the device wafer may provide an interlocking connection.

Abstract: A piezoelectric actuator module having a piezoelectric actuator, fastened between an actuator head and an actuator foot, and having a sheath, surrounding the piezoelectric actuator, for electrical passivation, is proposed in which the sheath is an insulation guard layer that is joined by nonpositive and/or positive engagement, by means of a mechanical attachment, to attachment components in the region of the end faces of the piezoelectric actuator or of the actuator head and/or of the actuator foot.

Abstract: Disclosed is a piezoelectric component (1) comprising a piezoelectric transducer (10) wherein a pair of electrodes (20a, 20b) are formed on both major surfaces of a piezoelectric substrate (11), a pair of frame members (30a, 30b) fitted to both major surfaces of the piezoelectric transducer (10), a pair of sealing substrates (40a, 40b) composed of a light-transmitting resin material and so fitted as to cover the frame members (30a, 30b), opaque coating layers (50a, 50b) respectively formed on the sealing substrates (40a, 40b), and a pair of input/output terminal electrodes (61a, 61b) respectively connected to the electrodes (20a, 20b). By having such a constitution, the state of sealed space and sealing widths of the frame members (30a, 30b) can be checked by visual examination such as direct visual observation or image recognition, and thus a highly reliable piezoelectric component (1) can be obtained. In addition, a mark can be made on the coating layers (50a, 50b).

Abstract: Elements and methods for forming elements that operate with acoustic waves are disclosed. The element includes a piezoelectric electric substrate that has a first thermal coefficient of expansion, electrically conducting element structures on an upper side of the substrate, a compensation layer on an underside of the substrate, and an SiO2 layer over the element structures.

Abstract: A surface acoustic wave component includes a piezoelectric substrate and an electrode structure that includes multiple layers and that is on the piezoelectric substrate. A dielectric layer is above the electrode structure. The dielectric layer has an acoustic impedance Za,d. The multiple layers include a first layer system that includes at least one first layer made of a first material, which has an acoustic impedance that is less than 2Za,d. The second layer system includes at least one second layer made of a second material, which has an acoustic impedance that exceeds 2Za,d. The second layer system has a height that is between 15% and 85% of a total height of the multiple layers.

Abstract: A piezoelectric/electrostrictive element with improved moisture resistance while having less degradation in its piezoelectric/electrostrictive properties and a method of manufacturing such a piezoelectric/electrostrictive element are provided. A laminated vibrator of a piezoelectric/electrostrictive element has a structure in which an electrode film, a piezoelectric/electrostrictive film, another electrode film, another piezoelectric/electrostrictive film, and another electrode film are laminated one above the other. In the manufacture of the piezoelectric/electrostrictive element, the laminated vibrator and a counter electrode are immersed in an electrodeposition coating fluid containing a coating component so that the electrodeposition coating fluid is brought into contact with the surfaces of the laminated vibrator and the counter electrode.

Abstract: A piezoelectric actuator module having a multilayer structure of piezoelectric elements is proposed as a piezoelectric actuator, wherein a different polarity of an electric voltage is alternately applied to inner electrodes which are arranged between piezoelectric layers of the piezoelectric elements in the direction of the layer structure of the piezoelectric elements, said module having an actuator foot and an actuator head composed of steel and having an elastic insulation medium which surrounds at least the piezoelectric elements in predefined limits. At least one annular groove or recess, into which a material which can be crosslinked with the insulation medium is vulcanized, is provided on the actuator foot and/or on the actuator head, and a flexible, weldable hose or sheath lies encompasses the piezoelectric element, and at least above the grooves or recesses containing the material as an insulation medium the weldable hose is welded to the material in the grooves or recesses.

Abstract: Selective whole cell QCM biosensors are disclosed. Also disclosed are methods of making and using such whole cell QCM biosensors, e.g., to screen drugs and diagnose diseases.

Abstract: A stacked crystal unit includes: a first crystal plate in which a vibration member links to an outer circumferential frame portion, and a pair of extending electrode extends to the frame portion from excitation electrodes; and a second and third crystal plates which have a concave portion in an area opposite to the vibration member and whose open end surfaces are joined by direct bonding to both principal surfaces of the frame portion in the first crystal plate. The extending electrodes are electrically extended to an outer surface of at least one of the second and third crystal plates via electrode through-holes provided in the frame portion. The electrode through-hole includes: a first electrode through-hole penetrating through the frame portion from the principal surface of the frame portion where the extending electrode extends; and a second electrode through-hole provided in the second or third crystal plate.

Abstract: A package structure of a micro-electromechanical system (MEMS) type microphone is disclosed. The MEMS microphone comprises a substrate, a MEMS chip, an acoustic wave cover, and an encapsulant. The substrate has connection pads. The MEMS chip is electrically coupled to the connection pads. The MEMS chip includes an acoustic wave sensing portion. The acoustic wave cover is fixed on the MEMS chip for covering without contacting the acoustic wave sensing portion and defining an acoustic wave cavity space. The acoustic wave cover has an opening for allowing an acoustic wave to enter or exit out of the acoustic cavity space. The encapsulant encapsulates the substrate, the MEMS chip, and the acoustic wave cover, wherein a surface of the acoustic wave cover is exposed. The exposed surface of the acoustic wave cover is along the same level as the surface of the encapsulant.

Abstract: A vibrator module includes a frame having an outer frame and an inner frame. A vibrator unit is formed inside the inner frame. The frame and the vibrator unit are formed of a piezoelectric ceramic or the like as one piece. On one side of the vibrator unit, an IC is mounted so that a hollow portion is provided between the vibrator unit and the IC. The periphery of the IC is filled with a resin material. On the other side of the vibrator unit, a top cover serving as a sealing material is mounted so that a hollow portion is provided between the vibrator unit and the top cover.

Abstract: Devices for monitoring structural health conditions of structures. A device includes a bottom substrate layer and an electrical connection layer disposed on the bottom substrate layer. The electrical connection layer includes a middle layer and a pair of generally comb-shaped electrodes disposed beneath the bottom surface of the middle layer. The device also includes one or more piezo-ceramic transducers sandwiched between the bottom substrate layer and the electrical connection layer, wherein the transducers are electrically coupled to the comb-shaped electrodes. The device also includes a top cover layer disposed on the electrical connection layer and means for communicating electrical signals to the piezo-ceramic transducers.

Abstract: Disclosed is a sonic fine-hole forming apparatus for forming a fine-hole in a surface of a membrane or solid body in a liquid by means of sonic energy. The sonic fine-hole forming apparatus is adapted to generate a sonic oscillation driving signal comprises a voltage waveform which has positive and negative voltage portions being asymmetrical, and a sharp peak portion. The sonic fine-hole forming apparatus includes a sonic oscillation section having a surface provided with a covering layer or a protective material having an electrically insulating property and a sonic transparency. The coated layer or a protective material is formed to have a thickness of 10 ?m or more. The sonic fine-hole forming apparatus of the present invention can form a fine-hole in a surface of a solid body without using a large-scale apparatus, while suppressing a destructive action around the fine-hole.

Abstract: An enclosure for enclosing piezoelectric elements of a piezoelectric actuator comprises a side wall that is shaped to define at least one strain compensation formation selected from a longitudinally-extensible part at which the side wall can be extended or contracted parallel to a longitudinal axis of the enclosure; and an inwardly-deflectable part at which the side wall can be deflected transversely to the longitudinal axis.

Abstract: An arrangement having a component mounted on a carrier in a flip chip construction which is encapsulated by a film, in particular a plastic film, laminated over the entire surface of the component. For additional sealing and mechanical stabilization, a plastic compound in liquid form is subsequently applied and hardened so as to surround the chip.

Abstract: A piezooscillator having a piezoelectric vibrator and an oscillation circuit in a space surrounded by a substrate and a cover, which has a smaller size and height, and further, which can be assembled easily and suppress power consumption, is provided.

Abstract: A glass cover wafer is bonded to a quartz SAW using glass frit technology, such that the glass wafer and glass frit formulation provides a thermal coefficient of expansion (TCE) of glass that fits the average TCE of the quartz in two perpendicular directions in a unique package. A dicing technology is used for chip separation. The sensor back side and the shaft are attached with a glass glue that transitions the TCE from the shaft to the quartz without interposing a large amount of the glue.

Abstract: Devices are disclosed that include a piezoelectric vibrating piece; a glass base and lid form a package enclosing the piezoelectric vibrating piece. The piece has first and second electrodes. The base has first and second opposing surfaces. The base mounts the piezoelectric vibrating piece, and the lid seals the piezoelectric vibrating piece in the package. The base includes first and second metal wires, extending therethrough, whose ends are denuded to the first and second surfaces and connected to the first and second electrodes, respectively. In disclosed methods for making the packaged devices, such as piezoelectric oscillators, multiple packaged devices are made simultaneously by stacking and simultaneously bonding respective wafers on which glass bases, piezoelectric vibrating pieces, and lids have been formed.

Abstract: In a method for analysis biomolecules (3) attached to a solid surface of a substrate (1) are used for detecting the presence of analytes (4) in a sample by binding of the analytes to the biomolecules. The biomolecules (3) are attached directly to the surface of the substrate together with biomolecule-repellent molecules (5), which cover the surface between the biomolecules (3) to prevent nonspecific binding of analytes (4) and other biomolecules. The invention relates also to a biosensor where biomolecules (3) are attached directly to the substrate (1) together with biomolecule-repellent molecules (5), which cover the surface between the biomolecules (3) to prevent non-specific binding of analytes (4) and other biomolecules. The biomolecules (5) can be self-assembled hydrophilic polymers. One example of using the invention is immunological analysis using surface plasmon resonance (SPR).

Abstract: A piezoelectric oscillator includes: a package including a first recessed portion formed on a first surface, a second recessed portion formed on a second surface with at least a part of a side surface being open, and a conductor wired from at least one of an inside surface of the first recessed portion and an inside surface of the second recessed portion to an outside surface; a piezoelectric element accommodated in the first recessed portion; a lid being in contact with the first surface and air-tightly sealing the first recessed portion; a circuit element accommodated in the second recessed portion and connected with the conductor; a resin portion formed in the second recessed portion to cover the circuit element; and an electrical check terminal connected with the conductor of the package.

Abstract: The present invention relates to a piezoelectric resonator system comprising a plurality of piezoelectric resonator sensors C?, C?. Each sensor C?, C? comprises an oscillator circuit 29?, 29? which is surrounded by its own individual conducting shield 44?, 44?. Each shield 44?, 44? is connectable to one pole of the power supply for its respective sensor C?, C?. These shields 44?, 44? prevent electromagnetic radiation from the sensors C?, C? from being transmitted through air.

Abstract: A piezoelectric device includes a piezoelectric element package having a piezoelectric element accommodated therein and a connection terminal formed on a side surface and a bottom surface thereof, a circuit element coupled to the connection terminal on the bottom surface of the piezoelectric element package, an insulating resin portion being in an essentially rectangular parallelepiped shape and covering the circuit element, an external electrode formed on a bottom surface of the resin portion, and a connection electrode formed on the side surface of the piezoelectric element package and a side surface of the resin portion and coupling the connection terminal formed on the side surface of the piezoelectric element package and the external electrode on the resin portion.

Abstract: A surface mount crystal oscillator comprises: a crystal blank; an IC chip in which at least an oscillator circuit using the crystal blank is integrated; a mounting substrate having one main surface on which the crystal blank is disposed, and the other main surface used to mounting the crystal oscillator on a wiring board; and a cover bonded to the mounting substrate for hermetically sealing the crystal blank within a space between the mounting substrate and the cover. The mounting substrate has the one main surface extending outward from a region in which the cover is disposed such that a portion of the one main surface exposes. Test terminals which are electrically connected to the crystal blank are disposed on the exposed region of the one main surface.

Abstract: The present invention relates generally to methods and compositions for analyzing test samples containing target analytes including proteins and nucleic acids. The invention uses a surface acoustic wave sensor in combination with a hydrogel to obtain an ultra sensitive non-fluorescent detection system.