Abstract: A multilayer filter includes a laminate including a plurality of dielectric layers stacked on each other. Inner layer electrodes and outer terminals are provided in the laminate. First and second balanced-side capacitors connected in series between first and second balanced terminals are defined by the inner layer electrodes. An inner-layer plate electrode not connected to any outer terminals is provided on the first dielectric layer. A first plate electrode connected to the first balanced terminal and a second plate electrode connected to the second balanced terminal are provided on the second dielectric layer in opposing relation to the inner-layer plate electrode. The inner-layer plate electrode and the first plate electrode and the first dielectric layer constitute the first balanced-side capacitor, and the inner-layer plate electrode and the second plate electrode and the first dielectric layer constitute the second balanced-side capacitor.

Abstract: An electronic component includes a multilayer body including a plurality of insulating layers stacked on top of one another. An LC parallel resonator is provided in the multilayer body, includes a coil and a capacitor, and has a ring shape when viewed in plan in the x-axis direction. The capacitor includes a capacitor conductor layer connected to one end of the coil and a resonant ground conductor layer that is connected to the other end of the coil and that is provided on the positive z-axis direction side of the capacitor conductor layer. The resonant ground conductor layer faces the capacitor conductor layer with one of the plurality of insulating layers therebetween. An outer electrode is provided on the negative z-axis direction side of the LC parallel resonator and faces the capacitor conductor layer with one of the plurality of insulating layers therebetween.

Abstract: A common mode filter is manufactured to include a coil part including an insulation layer and a conductor pattern formed in the insulation layer; and a magnetic substrate coupled to one surface or both surfaces of the coil part. The magnetic substrate includes: an electrostatic absorbing layer made of an electrostatic absorbing material; a magnetic layer provided on one surface or both surfaces of the electrostatic absorbing layer and made of a magnetic material; and an electrode provided between the magnetic layer and the electrostatic absorbing layer and made of a conductive material. Therefore, common mode filter may maintain high efficiency characteristics while preventing an electrostatic discharge phenomenon.

Abstract: A multilayer filter includes a plurality of mutually coupled resonant circuits provided within a multilayer body. Capacitor internal electrodes, inductor internal electrodes, and inductor via electrodes, ground via electrodes, and input-output via electrodes are arranged within the multilayer body. The ground via electrodes and the input-output via electrodes are provided on a dielectric layer on a mounting surface, or a second dielectric layer on a first dielectric layer provided on the mounting surface. The capacitor internal electrodes arranged towards the side of the mounting surface do not overlap the input-output electrodes when viewed in plan view. With this configuration, degradation in frequency characteristics of a resonant circuit is effectively prevented by controlling one of an inductive component and a capacitive component of the resonant circuit.

Abstract: A multilayer filter includes a laminate including a plurality of dielectric layers stacked on each other. Inner layer electrodes and outer terminals are provided in the laminate. A second coil electrode constituting a balanced-side inductor is defined by one of the inner layer electrodes. The second coil electrode has a coiled shape, and includes a first end connected to a first coil electrode through a via electrode and a second end connected to a third coil electrode through a via electrode. The second coil electrode is connected at a predetermined position along the winding direction thereof to a ground terminal, as one of the outer terminals, through an electrode for connection to a ground. The position where the ground connection electrode is connected to the second coil electrode is determined based on a balance characteristic in the balanced terminal side.

Abstract: A polar-type low pass filter includes a low pass filter portion and first, second and third ground conductors, in a laminated body. The low pass filter portion includes parallel resonant circuits including first, second, third and fourth capacitors and inductors, in a series arm, and at least capacitors in a parallel arm thereof. Pattern conductors configuring the first, second, third and fourth capacitors face the first ground conductor and so forth, in a z-axis direction.

Abstract: A signal transmission device includes substrates and resonance sections resonating at the predetermined resonance frequency. At least one of the substrates is formed with two or more resonators in the second direction, and the remaining one or two or more of the substrates are each formed with one or more resonators in the second direction, and at least one of the resonance sections is configured by a plurality of resonators opposing one another in the first direction between the substrates, the opposing resonators form a coupled resonator resonating as a whole at the predetermined resonance frequency through electromagnetic coupling in a hybrid resonance mode, and in a state that the substrates are separated away from one another to fail to establish electromagnetic coupling thereamong, the resonators forming the coupled resonator resonate at any other resonance frequency different from the predetermined resonance frequency on the substrate basis.

Abstract: A microwave device having a narrow gap between two parallel surfaces of conducting material by using a texture or multilayer structure on one of the surfaces. The fields are mainly present inside the gap, and not in the texture or layer structure itself, so the losses are small. The microwave device further comprises one or more conducting elements, such as a metal ridge or a groove in one of the two surfaces, or a metal strip located in a multilayer structure between the two surfaces. The waves propagate along the conducting elements. At least one of the surfaces is provided with means to prohibit the waves from propagating in other directions between them than along the ridge, groove or strip. At very high frequency the gap waveguides and gap lines may be realized inside an IC package or inside the chip itself.

Abstract: An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board.

Abstract: Various exemplary embodiments relate to a support assembly for a planar filter. The assembly includes a u-shaped housing with angled surfaces at the inner corners of the u-shape, a first dielectric plate having a first angled surface in contact with one of the angled surfaces of the housing, a second dielectric plate having a second angled surface in contact with the other angled surface of the housing, at least one compressible ring, and a cover. The planar filter is supported between the first dielectric plate and the second dielectric plate. The cover compresses the compressible ring to apply downward force on the first and second dielectric plates. The downward force is translated to an inward force by the angled surfaces of the housing. The angled surfaces of the housing apply an inward force on the first dielectric plate and the second dielectric plate.

Abstract: A semiconductor device has a substrate and band-pass filter formed over the substrate. The band-pass filter includes a first conductive trace wound to exhibit inductive properties with a first end coupled to a first terminal of the semiconductor device and second end coupled to a second terminal of the semiconductor device, and first capacitor coupled between the first and second ends of the first conductive trace. A second conductive trace is wound to exhibit inductive properties with a first end coupled to a third terminal of the semiconductor device and second end coupled to a fourth terminal of the semiconductor device. The second conductive trace has a different size and shape as the first conductive trace. A second capacitor is coupled between the first and second ends of the second conductive trace. A third conductive trace is wound around the first and second conductive traces to exhibit inductive properties.

Abstract: A filter circuit includes an antenna-side circuit, a transmission-side circuit, a reception-side circuit, and an external connection capacitor. The antenna-side circuit is connected to an antenna-side terminal. The transmission-side circuit is connected to a transmission-side terminal and the antenna-side circuit. The reception-side circuit is connected to a reception-side terminal, the antenna-side circuit, and ground. The external connection capacitor is connected between an external control terminal and a connection point between the antenna-side circuit and the reception-side circuit. The antenna-side circuit and the transmission-side circuit constitute a low pass filter. The antenna-side circuit and the reception-side circuit constitute a band pass filter. The reception-side circuit includes an LC parallel resonant circuit.

Abstract: An RF signal blocking device includes a capacitor unit and an inductor unit defining an LC resonance circuit. The capacitor unit and inductor unit are set such that a cutoff frequency in the LC resonance circuit after disconnection by fusing of a second inductor including a fuse wire, among first and second inductors of the inductor unit, fluctuates within a prescribed frequency band. The RF signal blocking device reliably blocks an RF signal in a prescribed frequency band after an abnormality of fusing in the second inductor including a fuse wire occurs due to an input of an RF signal having an RF power value greater than or equal to a predetermined level.

Abstract: A ceramic multilayer component includes a ceramic body including a plurality of ceramic layers stacked on top of one another, internal electrodes located inside the ceramic multilayer body, terminal electrodes located on a mounting surface of the ceramic multilayer body, and via hole conductors that are arranged inside the ceramic multilayer body so as to connect the internal electrodes and the terminal electrodes to each other. An insulating portion is arranged to extend as a single body across a surface of the ceramic multilayer body and across the terminal electrodes. The insulating portion covers at least a portion of each of the via conductors and covers a portion of each of the terminal electrodes when viewed from the mounting surface side.

Abstract: A common mode noise filter includes: a common mode filter inserted into a pair of signal lines; and a pair of capacitively coupled coils having one ends connected respectively to the corresponding signal lines and the other ends opened. According to the present invention, common mode noise can be removed by a common mode filter, as well as, differential mode noise in a desired frequency band can be removed by a pair of coils whose other ends are opened.

Abstract: A first coil is configured in such a structure that first and second coil conductors are connected by a first through-hole conductor. A second coil is configured in such a structure that third and fourth coil conductors are connected by a second through-hole conductor. The first and second coils are arranged in a nonmagnetic section consisting of nonmagnetic layers. A portion located inside the first coil and the second coil in the nonmagnetic section includes a first regional portion and a second regional portion adjacent to each other when viewed from a laminated direction of the nonmagnetic layers. The first and second through-hole conductors are located in the first regional portion so as to be adjacent to each other, when viewed from the laminated direction. A magnetic core section comprised of a magnetic material is located in the second regional portion when viewed from the laminated direction.

Abstract: A noise filter includes a first substrate on which a filter input terminal, an input-side capacitor, a common-mode choke coil, and a filter output terminal are mounted and a second substrate on which an output-side capacitor and a ground capacitor are mounted. The first substrate is selected from a plurality of first substrates including a substrate in which a characteristic of at least one of an input-side capacitor and a common-mode choke coil is different, the second substrate is selected from a plurality of second substrates including a substrate in which a characteristic of at least one of an output-side capacitor and a ground capacitor is different, and the second substrate is attached to an end of the first substrate so that the filter output terminal is electrically connected to the output-side capacitor and to be substantially vertical to the first substrate.

Abstract: There is provided a band pass filter including: a first substrate including a plurality of capacitors and a plurality of conductive patterns provided thereon; and a second substrate laminated with the first substrate and connected to the plurality of first conductive patterns through a plurality of via holes, wherein an attenuation frequency is determined according to the amount and shape of the plurality of via holes.

Abstract: A filter and a method of filtering a high frequency electrical signal using photonic components is disclosed. The filter has a serially fiber-coupled laser source, a modulator, a filter, and a photodetector. The electrical signal is applied to the modulator. The modulated light propagates through the filter which is constructed to pass not only a modulated sideband, but also at least a fraction of light at the carrier frequency of the laser. The photodetector detects a signal at the beat frequency between the carrier and sideband signals, after both signals have propagated through the filter. As a result, a separate optical branch for light at the carrier frequency is not required, which considerably simplifies the filter construction and makes it more stable and reliable.

Abstract: A multilayer bandpass filter includes a first capacitor electrode of a first stage LC parallel resonator, a second capacitor electrode of a second stage LC parallel resonator, and a third capacitor electrode of a third stage LC parallel resonator. Via electrodes and a line electrode define an inductor electrode of the first stage LC parallel resonator. Via electrodes and a line electrode define an inductor electrode of the second stage LC parallel resonator. Via electrodes and a line electrode define an inductor electrode of the third stage LC parallel resonator. The inductor electrodes of the three LC parallel resonators are arranged so loop planes thereof are disposed about a center axis extending in a stacking direction of dielectric layers. This permits setting of electromagnetic coupling between the LC parallel resonators of an input and an output stage, and allows a filter's attenuation characteristics to be freely set.

Abstract: There are provided a series inductor array implemented as a single winding capable of decreasing a layout area for providing a plurality of inductors, and a filter including the same, the series inductor array including a winding structure having both ends, and one or more terminal parts electrically connected to a region between the both ends of the winding structure to form an external electrical connection, wherein the winding structure has a structure in which a plurality of inductors having inductance formed in regions of the winding structure disposed between the both ends thereof and the terminal parts or between the terminal parts are connected in series.

Abstract: In a multilayer band-pass filter, each of first-stage to third-stage LC parallel resonators includes capacitor electrodes, via electrodes, and a line electrode. Jump-coupling capacitor electrodes face the capacitor electrodes of the first-stage and third-stage LC parallel resonators. The direction in which the inductor electrode extends from the capacitor electrodes of each of the first-stage and third-stage LC parallel resonators is opposite to the direction in which the inductor electrode extends from the capacitor electrodes of the second-stage LC parallel resonator.

Abstract: A multilayer electronic component and a multilayer electronic component manufacturing method are capable of easily controlling the degree of magnetic field coupling between inductors. Via-hole conductors are arranged so that they extend in a lamination direction in a laminate, and function as a first inductor. Via-hole conductors are arranged so that they extend in the lamination direction in the laminate, and function as a second inductor. A first capacitor and the first inductor define a first resonance circuit. A second capacitor and the second inductor define a second resonance circuit. The via-hole conductors are arranged in a first insulating layer so that they are spaced apart from each other by a first distance. The via-hole conductors are arranged in a second insulating layer so that they are spaced apart from each other by a second distance that is different from the first distance.

Abstract: A choke is disclosed. The choke is configured to attenuate propagation of an electromagnetic (EM) wave between a cavity and a door adjacent to an opening of the cavity. The choke includes one or more choke components having a mechanical wave attenuating structure.

Abstract: An exemplary embodiment of the present disclosure illustrates a multilayer circuit board structure, for suppressing the undesired electromagnetic wave propagation within a specific frequency band. The multilayer circuit board structure includes a plurality of crystals and a plurality of conducting channels, wherein a crystal includes a first through fourth conducting planes, at least a first conducting connector, and at least a second conducting connector, wherein the first through the fourth conducting planes are substantially parallel to each other. The first conducting plane is electrically connected to the third conducting plane through the first conducting connector. The fourth conducting plane is electrically connected to the second conducting plane through the second conducting connector. The first and the third conducting planes are configured to be electrically separated from the second and the fourth conducting planes.

Abstract: Disclosed herein are a common mode noise chip filter and a method for preparing thereof, the common mode noise chip filter including: a ferrite substrate; coil patterns formed on the ferrite substrate; and a ferrite-polymer composite layer on the substrate provided with the coil patterns, wherein the ferrite-polymer composite layer includes spherical ferrite particles and flake shaped ferrite particles.

Abstract: A bandpass filter comprises a first capacitor, a second capacitor, a third capacitor and at least two resonators. The first and second capacitors are coupled in parallel with each other, and each of the first and second capacitors includes an input. The third capacitor is coupled between the first capacitor and the second capacitor at their respective inputs. The at least two resonators are coupled in parallel with the first capacitor and the second capacitor and are positioned adjacent to each other at a distance such that the at least one component of the resonators are electromagnetically coupled together to provide three (3) transmission zeros.

Abstract: Disclosed herein are a common mode noise chip filter and a method for manufacturing the same, the common mode noise chip filter including: a ferrite substrate; coil patterns formed on the ferrite substrate; and a ferrite-polymer complex layer formed on the result substrate having the coil patterns formed therein, wherein the ferrite-polymer complex layer has a multilayer structure, so that the ferrite-polymer complex layer filling an inner space of the substrate having inner coil patterns is formed to have the multilayer structure but not a single-layer structure, thereby lowering internal stress, and thus improving reliability of the common mode noise chip filter as a product.

Abstract: An electronic component includes a multilayer body including insulating layers that are stacked on each other. First and second LC parallel resonators each include via hole conductors extending in a z-axis direction and loop shaped conductive layers provided on the insulating layers. The first and second LC parallel resonators define a band pass filter. A first loop plane of the first LC parallel resonator and a second loop plane of the second LC parallel resonator are parallel or substantially parallel to the z-axis direction, are parallel or substantially parallel to each other, and are overlapped with each other at at least a portion of the first loop plane and the second loop plane in a plan view from the direction perpendicular or substantially perpendicular to the first loop plane. The first loop plane protrudes from the second loop plane at the positive direction in the z-axis direction.

Abstract: To suppress changes in capacitance due to displacement between electrodes opposing each other across a dielectric layer, thereby allowing stable manufacturing of a capacitance device having a desired capacitance. The capacitance device according to the present invention is of a configuration including a dielectric layer (10), a first electrode (11) formed on a predetermined surface (10a) of the dielectric layer (10), and a second electrode (12) formed on a surface (10b) on the opposite side of the dielectric layer (10) from the predetermined surface (10a). The forms of the first and second electrodes (11, 12) are set so that even in the event that the first electrode (11) is relatively displaced regarding position in a predetermined direction as to the second electrode (12), the area of the opposing-electrode region between the first electrode (11) and to the second electrode (12) is unchanged.

Abstract: A CRLH resonator-based band-pass filter includes at least two CRLH resonators. The resonators are connected by capacitive coupling. The resonators includes a microstrip line having input and output ports. The microstrip line includes a first interdigital line serial-connected to the input port, a second interdigital line serial-connected to the output port, a connection line connecting the first and second interdigital lines, and an inductor line parallel-connected to the connection line and provided with a grounded end.

Abstract: Disclosed herein is a filter chip element including a ferrite substrate, internal coil patterns formed on the ferrite substrate; and a ferrite composite layer filled between the internal coil patterns formed on the ferrite substrate, wherein the ferrite composite layer includes foaming resin, thereby increasing magnetic permeability and a Q value which are important characteristics of a filter chip element for noise prevention among electromagnetic shielding components.

Abstract: Parameters of a radio frequency filter can be changed by changing structure of each component of the filter. Material of each component, diameters of each of magnetic cylinders, density of each of conductive coils, and thickness of each of dielectric layers can be changed. When any component needs to be replaced, the filter can be detached as needed.

Abstract: A noise filter includes a first magnetic core that includes a plurality of leg portions, and a first connection portion and a second connection portion, which connect both ends of the leg portions, a plurality of coils that are wound on the leg portions, respectively, and a second magnetic core that is configured to be attachable to and detachable from the first magnetic core such that a closed magnetic path, which intersects with each of the first connection portion and the second connection portion and which passes through the leg portions, is formed, in which the first magnetic core includes a normal mode inductance, and the closed magnetic path includes a common mode inductance.

Abstract: A multi-layered component is disclosed, including at least one inductive region, wherein the inductive region includes a ferrite ceramic. The inductive region has electrode structures that form at least one inductance. The multi-layered component has at least one capacitive region, wherein at least one capacitive region includes a varistor ceramic. The capacitive region forms at least one capacitance. At least one inductive region and at least one capacitive region form at least one LC filter.

Abstract: There is herein disclosed an interdigital capacitor, an inductor, and an LH transmission line and a coupler using the interdigital capacitor and the inductor. The interdigital capacitor comprises two finger sets which are substantially disposed in parallel with each other. Fingers of each finger set are overlapped at outer edges thereof with each other to thereby generate capacitance. The inductor is formed substantially spirally inside the transmission line, so that it can have a large inductance in a compact shape and can be used in a broad frequency band. The LH transmission line has a broad frequency band in a compact shape, which includes interdigital capacitors connected in series with each other and inductors connected in parallel with each other. In addition, the coupler employing the LH transmission line has an excellent couplability.

Abstract: A hybrid filter may include sum, low-pass, high-pass, and intermediate nodes. A terminating impedance may couple the intermediate node to a circuit ground. A first low-pass network may couple the sum node to the low-pass node, and a first high-pass network may couple the sum node to the high-pass node. A second low-pass network may couple the high-pass node to the intermediate node. A second high-pass network may couple the low-pass node to the intermediate node. The second high-pass network may include the series connection of a first capacitor, a coupling network, and a second capacitor. The coupling network may include two coupling sections each with planar broadside-coupled first, second, and third conductor elements separated by dielectric layers. The first and third conductor elements in each section may be connected electrically in parallel.

Abstract: Disclosed is a resonator made up of three sections (i.e., first, second and third sections) of a semiconductor layer. The second section has an end abutting the first section, a middle portion (i.e., an inductor portion) coiled around the first section and another end abutting the third section. The first and third sections exhibit a higher capacitance to the wafer substrate than the second section. Also disclosed are a process control system and method that incorporate one or more of these resonators. Specifically, during processing by a processing tool, wireless interrogation unit(s) detect the frequency response of resonator(s) in response to an applied stimulus. The detected frequency response is measured and used as the basis for making real-time adjustments to input settings on the processing tool (e.g., as the basis for making real-time adjustments to the temperature setting(s) of an anneal chamber).

Abstract: In a vehicle network for controlling electronic devices of the type having a network driver with at least one output line connected to the network through a common mode choke. A circuit for improving the immunity of the network includes a resistor and a capacitor connected in series between the signal output line and ground. The series resistor and capacitor protect the network from communication errors.

Abstract: In a multilayer bandpass filter, a first capacitor is defined between a first capacitor electrode and a ground electrode. A second capacitor is defined between a second capacitor electrode and the ground electrode. A first inductor is defined by first and second via electrodes and a first inductor electrode. A second inductor is defined by third and fourth via electrodes and a second inductor electrode. Two LC parallel resonators, one of which includes the first inductor and the first capacitor and the other one of which includes the second inductor and the second capacitor, are provided. The second via electrode included in one of the LC parallel resonators and the fourth via electrode included in the other one of the LC parallel resonators are electrically connected to each other by a via coupling electrode.

Abstract: In a high-frequency filter, four LC parallel resonators include four capacitors and four resonance coils, and are aligned in a predetermined direction. The four capacitors are defined by a ground conductor and a resonance capacitor conductor. The four coils are defined by a first via conductor, a second via conductor, and a line conductor. A floating conductor is provided astride within the four coils, and a sum of electrostatic capacitance between line conductors and the floating conductor is larger than electrostatic capacitance between the resonance capacitor conductor and the floating conductor, the line conductors overlapping with the floating conductor in planar view from a lamination direction.

Abstract: The present invention relates to a via structure having an open stub and a printed circuit board having the same. In accordance with an embodiment of the present invention, a via structure having an open stub including: a signal transmission via passing through an insulating layer; upper and lower via pads for connecting first and second transmission lines, which are respectively formed on and under the insulating layer, and the signal transmission via; and at least one open stub connected to an outer periphery of each via pad to have a shunt capacitance with each ground pattern formed on and under the insulating layer is provided. Further, a printed circuit board with a via having an open stub is provided.

Abstract: A feedthrough capacitor includes an inner electrode that extends coaxially within a grounded outer electrode. A non-conductive, epoxy-based potting material insulates and adhesively joins opposing roughened portions of the inner and outer electrodes. A capacitor assembly extends between the inner and outer electrode and serves to bypass relatively high frequency signals carried by the inner electrode to the grounded outer electrode. The capacitor assembly includes a plurality of monolithic multilayer ceramic capacitors, each capacitor having first and second terminals that are respectively surface mounted onto inner and outer concentric conductive rings. A plurality of deflectable tines project radially inward from the inner ring and resiliently circumferentially contact the exterior of the inner electrode. Similarly, a plurality of deflectable tines project radially outward from the outer ring and resiliently circumferentially contact the interior of the outer electrode.

Abstract: A signal transmission device includes: a first substrate and a second substrate; a first resonance section including a first resonator and a second resonator electromagnetically coupled to each other; a second resonance section disposed side-by-side relative to the first resonance section, and electromagnetically coupled to the first resonance section to perform a signal transmission between the first and second resonance sections; and a first shielding electrode disposed between the first resonator and the second substrate and partially covering the first resonator to allow at least an open end of the first resonator to be covered therewith, and a second shielding electrode disposed between the second resonator and the first substrate and partially covering the second resonator to allow at least an open end of the second resonator to be covered therewith.

Abstract: In a filter, a plurality of coils include a plurality of line conductor layers that are each provided on an insulator layer, a plurality of via hole conductors that extend from one end of the line conductor layers in the y-axis direction to the negative direction side of the z-axis direction, and are electrically connected to a plurality of capacitor conductor layers, and a plurality of via hole conductors that extend from the other end of the line conductor layers in the y-axis direction to the negative direction side of the z-axis direction, and are electrically connected to a ground conductor layer. The distance between the via hole conductor layers connected to the ground conductor layer differs from the distance between the via hole conductor layers connected to the capacitor conductor layers.

Abstract: An electromagnetic interference filter for various electronic devices such as implantable medical devices is provided. A plurality of signal electrodes can be configured in an array, where each signal electrode extends vertically from a top surface to a bottom surface of the filter such that the signal electrodes are flush with the top and bottom surface. Ground or common electrodes can have a parallel arrangement and be interposed between the signal electrodes. The ground electrodes can be grounded internally, externally, or both internally and externally. Dielectric material can be disposed between signal electrodes and ground electrodes to act as an insulator between adjacent electrodes.

Abstract: Disclosed herein is a thin film type common mode filter including: a base substrate made of an insulating material; a first insulating layer formed on the base substrate; a coil-shaped internal electrode formed on the first insulating layer; a second insulating layer formed on the internal electrode; an external electrode terminal having a vertical section connected to a side surface of the internal electrode and a horizontal section extended from an upper end of the vertical section toward a horizontal direction to thereby form a parallel surface spaced apart from the internal electrode by a predetermined distance; and a ferrite resin layer formed between the horizontal section of the external electrode terminal and the internal electrode.

Abstract: A filter assembly is provided. The filter assembly includes a printed circuit board (PCB) including a plurality of electronic components, a base disposed under the PCB, and an inductor coupled to the base, the inductor including a core and a coil to which current is applied, wherein the PCB has a through-hole through which at least one portion of the coil pass.

Abstract: A resonator is connected to a first plane which is one of a power plane and a ground plane, wherein the power plane and the ground plane are apart from each other in an up-down direction. The resonator comprises a connecting portion and a body portion. The connecting portion is connected to the first plane. The connecting portion extends in the up-down direction beyond a second plane, which is a remaining one of the power plane and the ground plane, while not being in electrical contact with the second plane. The body portion is connected to the connecting portion while not being in contact with the second plane. The body portion is arranged so that the second plane is located between the body portion and the first plane in the up-down direction.

Abstract: A capacitive filter assembly and method including a housing having a power terminal connection for receiving electrical power. A plurality of capacitors in an electrically parallel configuration coupled to one or more side walls of the housing. The plurality of capacitors electrically communicating with a plurality of respective printed wiring boards (PWB) coupled to the capacitors inside the housing, and the plurality of capacitors being positioned between the power terminal connection in the housing and respective housing ground connections in the housing. A plurality of support structures coupled to the plurality of capacitors, respectively, the plurality of support structures being configured to mate with the respective printed wiring boards, the support structures being mounted in the housing such that the capacitors are coupled to the housing using their respective support structures.