Waveguide Type Patents (Class 333/239)
  • Patent number: 11962087
    Abstract: This document describes a single-layer air waveguide antenna integrated on a circuit board. The waveguide guides electromagnetic energy through channels filled with air. It is formed from a single layer of material, such as a sheet of metal, metal-coated plastic, or other material with conductive surfaces that is attached to a circuit board. A portion of a surface of the circuit board is configured as a floor of the channels filled with air. This floor is an electrical interface between the circuit board and the channels filled with air. The single layer of material is positioned atop this electrical interface to define walls and a ceiling of the channels filled with air. The single layer of material can be secured to the circuit board in various ways. The cost of integrating an air waveguide antenna on to a circuit board this way may be less expensive than other waveguide-manufacturing techniques.
    Type: Grant
    Filed: February 1, 2023
    Date of Patent: April 16, 2024
    Assignee: Aptiv Technologies AG
    Inventors: Scott D. Brandenburg, David Wayne Zimmerman, Mark William Hudson, Sophie Macfarland
  • Patent number: 11955711
    Abstract: A redirecting structure for electromagnetic waves, the redirecting structure comprising a first reflection passage formed between a first conductive element and a second conductive element, and an antenna structure comprising an antenna element and a radiation passage extending from the antenna element in a first direction. The antenna structure is connected to the first reflection passage at a first interface, the first reflection passage extending in a second direction different from the first direction. A first reflective structure is associated with an interior of the first reflection passage and is arranged at a predetermined distance from the first interface such that electromagnetic waves propagating from the antenna structure into the first reflection passage are reflected to the radiation passage by the first reflective structure.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: April 9, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Janne Ilvonen, Alexander Khripkov, Jari Kristian Van Wonterghem, Ruiyuan Tian
  • Patent number: 11936111
    Abstract: An antenna array with a layered structure having a base layer with a metamaterial structure, a printed circuit board (PCB) layers, a feed layer arranged on the opposite side of the PCB from the RF IC(s), and a radiating layer arranged on the feed layer. The radiating layer having a plurality of radiating elements. The metamaterial structure is arranged to attenuate electromagnetic radiation propagating between the at least two adjacent waveguides in the frequency band.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: March 19, 2024
    Assignee: GAPWAVES AB
    Inventors: Thomas Emanuelsson, Yang Jian, Ashraf Uz Zaman, Wai Yan Yong
  • Patent number: 11824248
    Abstract: A shielded bridge for a coplanar waveguide (CPW) includes a signal bridge extending from a first terminal of the CPW to a second terminal of the CPW. The signal bridge has a raised central portion that extends over a separate signal conductor. The shielded bridge for the CPW also includes a ground bridge extending from a first ground plane on a first side of the separate signal conductor to a second ground plane on a second side of the separate signal conductor. The ground bridge is positioned between the signal bridge and the separate signal conductor.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: November 21, 2023
    Assignee: California Institute of Technology
    Inventors: Oskar Painter, Seyed Mohammad Mirhosseini Niri, Eun Jong Kim, Alp Sipahigil, Vinicius Thaddeu dos Santos Ferreira, Andrew J. Keller, Mahmoud Kalaee, Michael T. Fang
  • Patent number: 11700689
    Abstract: A circuit board includes a first layer, a second layer, a third layer, a plurality of plating through holes, at least one first intermediate layer and at least one second intermediate layer. The first layer and the second layer are used as reference voltage planes. A plurality of transmission wires are disposed on the third layer. The transmission wires are coupled to a wireless signal transceiver and a plurality of antenna arrays; wherein the third layer is disposed between the first layer and the second layer. The plating through holes are disposed at sides of the third layer, wherein the plurality of plating through holes are configured to connect the first reference voltage plane with the second reference voltage plane. The first intermediate layer is disposed between the first layer and the third layer, and the second intermediate layer is disposed between the second layer and the third layer.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: July 11, 2023
    Assignee: HTC Corporation
    Inventors: Che-Jung Chang, Chia-Chu Ho, Wei-Hong Gao
  • Patent number: 11677130
    Abstract: A waveguide for receiving an incident electromagnetic wave (EMW) having an operating frequency ? includes an array of spaced apart unit cells arranged along the waveguide. The unit cells are configured to resonantly couple to the incident EMW and radiate an EMW at the operating frequency propagating inside and along the waveguide. Each unit cell is configured to couple to the incident EMW with a first coupling efficiency and includes a dielectric body configured to couple to the incident EMW with a second coupling efficiency and one or more metal layers disposed on and partially covering the dielectric body. The second coupling efficiency is substantially smaller than the first coupling efficiency. A communication system includes the waveguide and a transceiver configured to emit an EMW having the operating frequency ?.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: June 13, 2023
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Jaewon Kim, Dipankar Ghosh, Craig W. Lindsay, Matthew S. Stay
  • Patent number: 11664568
    Abstract: Embodiments disclosed herein include waveguides. In an embodiment, a waveguide comprises a conductive shell and a first ridge within the conductive shell. In an embodiment, the first ridge extends away from the conductive shell. In an embodiment, the waveguide further comprises a first core over the first ridge, where the first core comprises a first dielectric material with a first permittivity. In an embodiment, the waveguide may further comprise a second core embedded in the first core, where the second core comprises a second dielectric material with a second permittivity that is greater than the first permittivity.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: May 30, 2023
    Assignee: Intel Corporation
    Inventors: Cooper S. Levy, Chintan S. Thakkar, James E. Jaussi, Bryan K. Casper
  • Patent number: 11664562
    Abstract: A redirecting device for mm-waves includes an input section, an output section disposed at 90 degrees to the input section, and a waveguide member extending from the input section to the output section. The waveguide member is a rigid dielectric material.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: May 30, 2023
    Assignee: TE Connectivity Germany GmbH
    Inventors: Christian Rusch, Bert Bergner
  • Patent number: 11592596
    Abstract: The invention relates to a method for creating a space of invisibility, which comprises: (a) providing a metamaterial plate having a subwavelength thickness, said metamaterial plate having bottom and top surfaces; (b) radiating the bottom surface of the metamaterial plate by a primary radiation thereby to form a space of invisibility above the top surface of the metamaterial plate, said space of invisibility being located within a space of a secondary radiation above the metamaterial plate which is in turn formed as a result of said primary radiation passing through metamaterial plate.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: February 28, 2023
    Assignee: B.G. Negev Technologies & Applications Ltd. at Ben-Gurion University
    Inventor: Alina Karabchevsky
  • Patent number: 11476566
    Abstract: A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency. The structure is capable of transmitting or receiving electrical energy and/or data at various near and far field magnetic coupling frequencies.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: October 18, 2022
    Assignee: NuCurrent, Inc.
    Inventors: Vinit Singh, Christine A. Frysz
  • Patent number: 11456516
    Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device can include an assembly having asymmetrically situated conductors. In selected examples, the assembly includes a ground plane, a central shield portion, a first side shield portion on a first side, a second side shield portion on a second side, a first conductor asymmetrically situated between the central shield portion and the first side shield portion, a second conductor asymmetrically situated between the central shield portion and the second side shield portion, and dielectric within the assembly.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: September 27, 2022
    Assignee: Intel Corporation
    Inventors: Ling Li Ong, Kin Wai Lee, Bok Eng Cheah, Yang Liang Poh, Yean Ling Soon
  • Patent number: 11394098
    Abstract: According to one aspect of the invention, there is provided a waveguide for transmission of electromagnetic wave signals, comprising: a first dielectric part comprising a dielectric; a conductor part covering a part of the first dielectric part; and a second dielectric part surrounding the first dielectric part and the conductor part.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: July 19, 2022
    Assignee: Korea Advanced Institute Of Science And Technology
    Inventors: Hyeon Min Bae, Ha Il Song
  • Patent number: 11342649
    Abstract: The THz waveguides disclosed herein are used to transmit signals having a THz frequency in the range from 0.1 THz to 10 THz and include an alumina core surrounded by an optional cladding. The core may have a diameter (D1) in the range from 10 ?m to 500 ?m and may be comprised of a ceramic ribbon having a dielectric constant (Dk). The optional cladding may have a dielectric constant (Dk) less than the core. The THz waveguides can be formed using a continuous firing process and nano-perforation technology that enables access to a wide form factor range. In one example, rectangular waveguides, or ribbons, may be fabricated in the 10 ?m to 200 ?m thick range at widths in the range from sub-millimeters to several meters and lengths in the range from millimeters to several hundred meters.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: May 24, 2022
    Assignee: Corning Incorporated
    Inventors: Michael Edward Badding, Ming-Jun Li, Karan Mehrotra, Cheng-Gang Zhuang
  • Patent number: 11335999
    Abstract: A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency. The structure is capable of transmitting or receiving electrical energy and/or data at various near and far field magnetic coupling frequencies.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: May 17, 2022
    Assignee: NuCurrent, Inc.
    Inventors: Vinit Singh, Christine A. Frysz
  • Patent number: 11264687
    Abstract: Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: March 1, 2022
    Assignee: Intel Corporation
    Inventors: Georgios Dogiamis, Adel A. Elsherbini
  • Patent number: 11255934
    Abstract: A magnetic resonance RF receive coil with non-conductive waveguides for data transfer between the RF coil antennas and the channel aggregator is described. The non-conductive waveguide for each channel includes a plastic waveguide transferring data between a millimeter wave transmitter and a millimeter wave receiver.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: February 22, 2022
    Assignee: CANON MEDICAL SYSTEMS CORPORATION
    Inventors: Mark Spring, Yoshinori Hamamura, Ernie Zepeda
  • Patent number: 11189898
    Abstract: A waveguide and a communication system including the waveguide are described. The waveguide is configured to propagate an electromagnetic wave having an operating frequency along the waveguide. The waveguide includes a substrate having a first dielectric constant, and an array of spaced apart unit cells at least partially embedded in the substrate and arranged along the waveguide. Each of a plurality of the unit cells in the array of spaced apart unit cells has a first transmission parameter S121 having a lowest resonant frequency ?1 and includes a dielectric body and one or more electrically conductive layers disposed on and partially covering the dielectric body. The dielectric body has a second dielectric constant greater than the first dielectric constant at the operating frequency and has a second transmission parameter S221 having a lowest resonant frequency ?2 greater than ?1.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: November 30, 2021
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Jaewon Kim, Dipankar Ghosh, Craig W. Lindsay, Matthew S. Stay
  • Patent number: 11075436
    Abstract: An RF joint rotating about an axis of rotation (Z) includes a number N, greater than or equal to 1, of RF transmission channels, a first, internal surface of symmetry of revolution about the axis (Z) and of RF transmission having a first, internal radius r1, and a second, external surface of symmetry of revolution about the axis (Z) and of RF transmission having a second, external radius r2, strictly less than the first, internal radius r1.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: July 27, 2021
    Assignees: THALES, CENTRE NATIONAL D'ETUDES SPATIALES
    Inventors: Dimitri Vynohradov, Jérôme Brossier, Benjamin Monteillet, Jérôme Lorenzo, Nicolas Ferrando
  • Patent number: 11056757
    Abstract: In a manufacturing method of a radio-frequency member in which an inner peripheral surface of a cavity in a die includes a functional-region section that provides the radio-frequency member, a gate opens in a first wall surface of the inner peripheral surface of the cavity, an overflow expands in a direction in which a second wall surface of the inner peripheral surface extends is opened in the second wall surface, the functional-region section is located in a main flow region, the functional-region section includes a plurality of rod forming holes, a distance between edges of openings of at least two rod forming holes is smaller than depths of both of the two rod forming holes, a metal material in a fluid state is injected into the cavity through the gate, and a portion of the metal material flows outside of the cavity from the overflow.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: July 6, 2021
    Assignee: NIDEC CORPORATION
    Inventor: Takumi Yamaguchi
  • Patent number: 11031668
    Abstract: Aspects of the subject disclosure may include, for example, a transmission medium for propagating electromagnetic waves. The transmission medium can have a first dielectric material for propagating electromagnetic waves guided by the first dielectric material, and a second dielectric material disposed on at least a portion of an outer surface of the first dielectric material for reducing an exposure of the electromagnetic waves to an environment that adversely affects propagation of the electromagnetic waves on the first dielectric material. Other embodiments are disclosed.
    Type: Grant
    Filed: July 2, 2019
    Date of Patent: June 8, 2021
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Paul Shala Henry, Robert Bennett, Farhad Barzegar, Irwin Gerszberg, Donald J. Barnickel, Thomas M. Willis, III
  • Patent number: 11011814
    Abstract: A transmission line includes a post-wall waveguide which includes a dielectric substrate on which a pair of post-walls is formed and a first conductor layer and a second conductor layer opposed to each other with the dielectric substrate interposed therebetween and in which a region surrounded by the pair of post-walls, the first conductor layer, and the second conductor layer is a waveguide region, a waveguide tube having a hollow rectangular shape, being connected with the first conductor layer so as to cover an opening portion formed in a side wall, and in which an inside communicates with the waveguide region through an opening formed in the first conductor layer, and a wire member which is arranged such that through the opening, a first end is located inside the dielectric substrate and a second end is located in the waveguide tube.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: May 18, 2021
    Assignee: FUJIKURA LTD.
    Inventors: Yusuke Uemichi, Ning Guan
  • Patent number: 10992015
    Abstract: A transmission line includes a post-wall waveguide which includes a dielectric substrate on which a pair of post-walls is formed and a first conductor layer and a second conductor layer opposed to each other with the dielectric substrate interposed therebetween, and in which a region surrounded by the pair of post-walls, the first conductor layer, and the second conductor layer is a waveguide region, a waveguide tube having a hollow rectangular shape, being connected with the first conductor layer to cover an opening portion formed in a side wall, and in which an inside communicates with the waveguide region through an opening formed in the first conductor layer, a blind via formed in the dielectric substrate such that one end is disposed inside the opening, and a pole member including a post member connected to the one end of the blind via and a support member supporting the post member.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: April 27, 2021
    Assignee: FUJIKURA LTD.
    Inventor: Yusuke Uemichi
  • Patent number: 10978773
    Abstract: In accordance with one or more embodiments, a guided wave launcher includes a dielectric cable having an unexposed dielectric core portion that is surrounded by a dielectric cladding portion. The unexposed dielectric core portion is configured to receive a first electromagnetic wave at the end of the dielectric cable and to guide the first electromagnetic wave along the first unexposed dielectric core portion. An exposed dielectric core portion of the dielectric cable, that is not surrounded by the dielectric cladding portion, is configured to couple a portion of the first electromagnetic wave to a transmission medium in proximity to the exposed dielectric core portion, wherein the portion of the electromagnetic wave coupled to the transmission medium propagates as a second electromagnetic wave along the transmission medium without requiring an electrical return path.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: April 13, 2021
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Robert Bennett, Farhad Barzegar, Irwin Gerszberg, Thomas M. Willis, III, Paul Shala Henry
  • Patent number: 10944146
    Abstract: The invention provides a dielectric waveguide for transmitting millimeter waves or sub-millimeter waves. The dielectric waveguide is easily processed and connected even when having a small diameter, and can provide a connection structure exhibiting low transmission and return losses of high frequency signals. The dielectric waveguide includes a dielectric waveguide body and a dielectric waveguide end having a lower permittivity than the dielectric waveguide body. The dielectric waveguide body and the dielectric waveguide end are seamlessly and monolithically formed from the same material.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: March 9, 2021
    Assignees: DAIKIN INDUSTRIES, LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Hiroyuki Yoshimoto, Dai Fukami, Taku Yamanaka, Masahiro Horibe, Yuto Kato, Ryo Sakamaki
  • Patent number: 10938087
    Abstract: There is provided an antenna structure for a radio frequency identification (RFID) reader. The antenna structure includes a substrate, and an antenna structure disposed on the substrate. The antenna includes a peripheral frame portion, a first strip section disposed at a first side of the peripheral frame portion, and a second strip section disposed at a second side of the peripheral frame portion. In particular, the first strip section and the second strip section each includes multiple spaced-apart strip portions extending from a first part of the peripheral frame portion to a second part of the peripheral frame portion. There is also provided a method of manufacturing the antenna structure, an RFID reader system including the antenna structure, and an RFID system including the RFID reader system and an RFID tag.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: March 2, 2021
    Assignee: Agency for Science, Technology and Research
    Inventors: Xianming Qing, Zhining Chen, Chean Khan Goh
  • Patent number: 10879577
    Abstract: The present disclosure relates to a multilayer electromagnetic waveguide that includes a plurality of layers forming guide channels for an electromagnetic wave, and at least one transition device including at least one dielectric layer between two guide channels, referred to as coupled guide channels, extending as an extension. Each transition device includes at least one adaptation channel extending in a longitudinal direction, and each adaptation channel is defined by two electrically conductive walls. At least one wall extends along the dielectric spacer layer from one end of the coupled guide channel, over a length suitable for optimizing the transmission of an electromagnetic wave between the two coupled guide channels.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: December 29, 2020
    Assignees: CENTRE NATIONAL D'ETUDES SPATIALES CNES, LE CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, L'UNIVERSITE DE RENNES 1
    Inventors: Nicolas Capet, Francesco Foglia Manzillo, Karim Tekkouk, Ronan Sauleau, Mauro Ettorre
  • Patent number: 10833730
    Abstract: Aspects of the subject disclosure may include, providing, by a power supply of a communication device, energy to a transmitter of the communication device, wherein the power supply directly obtains the energy from a transmission medium via a capacitive divider and a DC converter, and wherein the communication device includes an insulator that electrically insulates the transmission medium from a utility structure supporting the communication device; generating, by the transmitter of the communication device, a signal; and inducing according to the signal, by a coupler of the communication device, an electromagnetic wave that propagates along the transmission medium without requiring an electrical return path. Other embodiments are disclosed.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: November 10, 2020
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Farhad Barzegar, Irwin Gerszberg
  • Patent number: 10782388
    Abstract: A radar sensing system for a vehicle includes a radar sensor disposed at the vehicle so as to sense exterior of the vehicle. The radar sensor includes a plurality of transmitters that transmit radio signals and a plurality of receivers that receive radio signals. The received radio signals are transmitted radio signals that are reflected from an object. A processor is operable to process an output of the receivers. The radar sensor includes a printed circuit board having circuitry disposed thereat. The printed circuit board includes two HF-laminate layers and a copper layer disposed between the HF-laminate layers. At least one waveguide is established through the copper layer.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: September 22, 2020
    Assignee: MAGNA ELECTRONICS INC.
    Inventor: Wilhelm Johann Wolfgang Woehlte
  • Patent number: 10749237
    Abstract: A method for manufacturing a substrate integrated waveguide for a millimeter wave signal is disclosed. In the method, a gold layer is disposed on a top surface of the silicon substrate using a lift-off process. Next, two parallel rows of substantially equal spaced vias are formed in the silicon substrate using a through-silicon-via etching process. Then, a copper layer is disposed on the bottom side of the silicon substrate and on interior surfaces of each via. The separation between the copper layer and the gold layer define a height of the substrate integrated waveguide, while the separation between the two parallel rows of substantially equal spaced vias define a width of the substrate integrated waveguide. In some implementations the length of the substrate defines a length of the substrate integrated waveguide, and the length, width, and height define a resonator that is resonant at a millimeter wave frequency.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: August 18, 2020
    Assignee: Semiconductor Components Industries, LLC
    Inventor: Kiryung Shin
  • Patent number: 10627014
    Abstract: A casing spacer which allows for the positioning of a carrier pipe or set of carrier pipes in a desirable location inside a casing pipe.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: April 21, 2020
    Inventors: Damian Daigle, Joseph E. Wilson, Miguel Regato, Tom Forlander
  • Patent number: 10573951
    Abstract: A split resonator and a printed circuit board (PCB) including the same are disclosed. The split resonator is mounted to one side of the PCB to improve the electromagnetic shielding effect, and absorbs a radiation field emitted to the outer wall of the PCB. The PCB includes: a substrate on which one or more electronic components are populated; a dielectric substrate mounted to one side of the substrate; one pair of conductors provided in the dielectric substrate, spaced apart from the substrate in a thickness direction of the substrate by a predetermined distance, and arranged to face each other; and a connection portion configured to interconnect the one pair of conductors, and arranged in parallel to the thickness direction of the substrate.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: February 25, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Soon Yong Lee, Yeon Sik Yu, Il Kim, Keon Young Seo, Min-Goo Seo, Jae-Deok Lim, Si Ho Jang, Hyun-Tae Jang
  • Patent number: 10560152
    Abstract: Aspects of the subject disclosure may include, for example, a system for exchanging electrical signals and guided electromagnetic waves between customer premises equipment and service provider equipment to provide uplink and/or downlink communication services. Other embodiments are disclosed.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: February 11, 2020
    Assignee: AT&T INTELLECTUAL PROPERTY I, L.P.
    Inventors: Martin Birk, Paul Shala Henry
  • Patent number: 10560144
    Abstract: Aspects of the subject disclosure may include, for example, a system for receiving first electromagnetic waves via a transmission medium without utilizing an electrical return path, and inducing second electromagnetic waves at an interface of the transmission medium without the electrical return path. In an embodiment, the first and second electromagnetic waves have a non-optical frequency range. Other embodiments are disclosed.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: February 11, 2020
    Assignee: AT&T INTELLECTUAL PROPERTY I, L.P.
    Inventors: Robert Bennett, Paul Shala Henry, Farhad Barzegar, Irwin Gerszberg, Donald J. Barnickel, Thomas M. Willis, III
  • Patent number: 10544893
    Abstract: Pipeline segments can contain cables, such as communication cables (e.g., fiber optic cables) within insulation material surrounding the pipeline segments. Cables can be embedded within the insulation material, run through conduits embedded within the insulation material, placed in channels formed in the insulation material, or otherwise. Channels containing one or more cables can be filled with supplemental insulation material, thus securing the cables within the channels. Pipelines created as disclosed herein can enable data transfer between distant points without the need to lay fiber optic cable in addition to the pipeline. Further, fiber optic cable embedded thusly can be used to sense conditions in the pipeline, such as leaks, seismic activity, strain, and temperature information.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: January 28, 2020
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Todd J. Green, Alexis Wachtel, II, William Markus
  • Patent number: 10505252
    Abstract: In accordance with one or more embodiments, a communication system, includes a first coupler configured to guide a first communication signal conveying first data to an interior of a cable, wherein the first coupler is further configured to generate first guided electromagnetic waves in response to the first communication signal, wherein the first guided electromagnetic waves are guided by a structure within the cable and propagate within the cable without requiring an electrical return path; wherein the cable comprises a plurality of uninsulated conductors that are stranded together, wherein the plurality of uninsulated conductors form a plurality of interstitial areas that are bounded by conductive surfaces of at least three of the plurality of uninsulated conductors, and wherein the structure comprises one of the plurality of interstitial areas.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: December 10, 2019
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Bruce E. Stuckman, Paul Shala Henry, Giovanni Vannucci, Thomas M. Willis, III, Robert Bennett, Irwin Gerszberg, Farhad Barzegar, Donald J. Barnickel, Martin Birk, Shikik Johnson
  • Patent number: 10498044
    Abstract: Aspects of the subject disclosure may include, for example, an antenna structure having a feedline, and a dielectric antenna coupled to the feedline. A first structural feature of an aperture of the dielectric antenna and a second structural feature of a junction between the feedline and the dielectric antenna can be configured to increase a front-to-back ratio of wireless signals received by the aperture of the dielectric antenna and received outside a reception area of the aperture of the dielectric antenna. Other embodiments are disclosed.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: December 3, 2019
    Assignee: AT&T INTELLECTUAL PROPERTY I, L.P.
    Inventors: Paul Shala Henry, Thomas M. Willis, III, Farhad Barzegar, Robert Bennett, Irwin Gerszberg, Donald J. Barnickel
  • Patent number: 10483609
    Abstract: A digital system has a dielectric core waveguide that is formed within a multilayer substrate. The dielectric waveguide has a longitudinal dielectric core member formed in the core layer having two adjacent longitudinal sides each separated from the core layer by a corresponding slot portion formed in the core layer The dielectric core member has the first dielectric constant value. A cladding surrounds the dielectric core member formed by a top layer and the bottom layer infilling the slot portions of the core layer. The cladding has a dielectric constant value that is lower than the first dielectric constant value.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: November 19, 2019
    Assignee: Texas Instruments Incorporated
    Inventors: Robert Floyd Payne, Gerd Schuppener, Juan Alejandro Herbsommer
  • Patent number: 10454150
    Abstract: A radio frequency waveguide is disclosed. The radio frequency waveguide includes: a dielectric including an exterior input surface, an exterior output surface and other exterior surfaces; and a metal disposed on the other exterior surfaces of the dielectric, wherein the dielectric is voidless and adapted to propagate radio frequency radiation from the exterior input surface to the exterior output surface.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: October 22, 2019
    Assignee: Hughes Network Systems, LLC
    Inventors: Peter Hou, Hamad Alsawaha, Thomas Jackson, Bingqian Lu, Yilin Mao
  • Patent number: 10374657
    Abstract: Aspects of the subject disclosure may include, for example a communication device that includes first and second waveguide devices that provide communications via electromagnetic waves that propagate along a transmission medium without utilizing an electrical return path, where the electromagnetic waves are guided by the transmission medium. The communication device can include a housing supporting a first plurality of antennas and a second plurality of antennas. The communication device can include a support structure physically connecting the first and second waveguide devices with the housing. Other embodiments are disclosed.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: August 6, 2019
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: David M. Britz, John W. MacNeill, David DeVincentis, Robert Bennett, Paul Shala Henry, Irwin Gerszberg, Farhad Barzegar, Thomas M. Willis, III, Donald J. Barnickel
  • Patent number: 10312596
    Abstract: A dual-polarization, circularly-polarized artificial-impedance-surface antenna has two adjacent tensor surface-wave waveguides (SWGs), a waveguide feed coupled to each of the two SWGs and a hybrid coupler having output ports, each output port of the hybrid coupler being connected to the waveguide feeds coupled to the two SWGs, the hybrid coupler, in use, combining the signals from input ports of the 90° hybrid coupler with phase shifts at its output ports.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: June 4, 2019
    Assignee: HRL Laboratories, LLC
    Inventor: Daniel J. Gregoire
  • Patent number: 10307792
    Abstract: The present disclosure discloses an ultrasonic transducer. The ultrasonic transducer includes an active layer. The active layer includes an array of piezoelectric pillars configured for emitting and receiving ultrasound and an attenuation portion surrounding sidewalls of the piezoelectric pillars and configured for attenuating a part of the ultrasound emitted from the sidewalls of the piezoelectric pillars. The present disclosure also relates to an ultrasonic fingerprint recognition sensor and an electronic device having the ultrasonic transducer.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: June 4, 2019
    Assignee: NANCHANG O-FILM BIO-IDENTIFICATION TECHNOLOGY CO., LTD
    Inventors: Anpeng Bai, Wensi Sun
  • Patent number: 10299368
    Abstract: Apparatus, and corresponding method, relates generally to a microelectronic device. In such an apparatus, a first conductive layer is for providing a lower interior surface of a circuit structure. A plurality of wire bond wires are interconnected to the lower interior surface and spaced apart from one another for providing at least one side of the circuit structure. A second conductive layer is for providing an upper interior surface of the circuit structure spaced apart from the lower interior surface by and interconnected to the plurality of wire bond wires. The plurality of wire bond wires, the first conductive layer and the second conductive layer in combination define at least one opening in the at least one side for a signal port of the circuit structure. Such circuit structure may be a signal guide circuit structure, such as for a signal waveguide or signal cavity for example.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: May 21, 2019
    Assignee: Invensas Corporation
    Inventors: Shaowu Huang, Javier A. Delacruz
  • Patent number: 10276907
    Abstract: Aspects of the subject disclosure may include, for example, a cable can include a core, a plurality of strips of cladding disposed on the core, and a coupler that facilitates inducing electromagnetic waves that propagate along the core, where a first dielectric constant of the core exceeds a second dielectric constant of each strip of cladding of the plurality of strips of cladding, and where the electromagnetic waves propagate along the core without requiring an electrical return path. Other embodiments are disclosed.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: April 30, 2019
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Robert Bennett, Aldo Adriazola, Mitchell Harvey Fuchs, Brandon Pimm, Farhad Barzegar, Irwin Gerszberg, Paul Shala Henry, William Scott Taylor, Donald J. Barnickel, Thomas M. Willis, III
  • Patent number: 10276908
    Abstract: An electromagnetic wave transmission board comprises a substrate. The substrate comprises a first dielectric layer and a second dielectric layer, and the first dielectric layer is stacked on the second dielectric layer. The first dielectric layer and the second dielectric layer together form a wave guiding space. The wave guiding space is configured for transmitting electromagnetic wave.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: April 30, 2019
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Wei Huang, Shih-Hsien Wu, Wei-Chung Lo
  • Patent number: 10249925
    Abstract: An apparatus comprises a plurality of waveguides, wherein the waveguides include a dielectric material; an outer shell; and a supporting feature within the outer shell, wherein the waveguides are arranged separate from each other within the outer shell by the supporting feature.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: April 2, 2019
    Assignee: Intel Corporation
    Inventors: Georgios C. Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Aleksandar Aleksov, Brandon M. Rawlings, Richard J. Dischler
  • Patent number: 10230173
    Abstract: A slot array antenna includes: an electrically conductive member having an electrically conductive surface and slots therein, the slots being arrayed in a first direction which extends along the conductive surface; a waveguide member having an electrically conductive waveguide face which opposes the slots and extends along the first direction; and an artificial magnetic conductor extending on both sides of the waveguide member. At least one of the conductive member and the waveguide member includes dents on the conductive surface and/or the waveguide face, the dents each serving to broaden a spacing between the conductive surface and the waveguide face relative to any adjacent site. The dents include a first, second, and third dents which are adjacent to one another and consecutively follow along the first direction. A distance between centers of the first and second dents is different from a distance between centers of the second and third dents.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: March 12, 2019
    Assignees: NIDEC CORPORATION, WGR CO., LTD.
    Inventors: Hideki Kirino, Hiroyuki Kamo
  • Patent number: 10199706
    Abstract: Embodiments herein describe a high-speed communication channel in a PCB that includes a dielectric waveguide sandwiched between two ground layers. The dielectric waveguide includes a core and a cladding where the material of the core has a higher dielectric constant than the material of the cladding. Thus, electromagnetic signals propagating in the core are internally reflected at the interface between the core and cladding such that the electromagnetic signals are primary contained in the core.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: February 5, 2019
    Assignee: International Business Machines Corporation
    Inventors: Samuel R. Connor, Daniel M. Dreps, Jose A. Hejase, Joseph Kuczynski, Joshua C. Myers, Junyan Tang
  • Patent number: 10199707
    Abstract: A ball-grid-array printed-circuit-board assembly includes a die, a plurality of solder-balls, a substrate, a top-metal layer, and a bottom-metal layer. The die includes a signal-out-pad and a plurality of ground-pads arranged about the signal-out-pad. The top-metal layer, a plurality of vias in the substrate, and the bottom-metal layer cooperate to form a substrate-integrated-waveguide. The top-metal layer is configured to define a U-shaped-slot between a signal-portion of the top-metal layer aligned with the signal-out-pad and the substrate-integrated-waveguide, and a ground-portion of the top-metal layer aligned with the plurality of ground-pads. The U-shaped-slot is characterized by a slot-length that is selected based on the frequency of a signal, and a slot-width that is selected based on the via-height such that the signal generates an electric field directed across the U-shaped-slot whereby the signal is propagated from the signal-portion of the top-metal layer into the substrate-integrated-waveguide.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: February 5, 2019
    Assignee: APTIV TECHNOLOGIES LIMITED
    Inventors: George J. Purden, Shawn Shi, David W. Zimmerman
  • Patent number: 10135123
    Abstract: An antenna system includes a tunable medium, rectifier circuitry, combining circuitry, and control circuitry. The tunable medium includes antenna elements corresponding to lumped impedance elements and variable impedance control inputs configured to enable selection of an impedance value for each of the lumped impedance elements. The control circuitry is configured to determine a scattering matrix (S-matrix) relating field amplitudes at lumped ports including internal lumped ports and lumped external ports. The internal lumped ports correspond to the lumped impedance elements, and the lumped external ports correspond to at least one of the rectifier circuitry inputs, the combined output of the combining circuitry, and the at least one transmitting element. A method includes determining at least a portion of component values of a desired S-matrix, and adjusting the variable impedance control inputs to at least approximate at least a portion of the desired S-matrix.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: November 20, 2018
    Assignee: Searete LLC
    Inventors: Daniel Arnitz, Joseph Hagerty, Russell J. Hannigan, Guy S. Lipworth, Matthew S. Reynolds, Yaroslav A. Urzhumov
  • Patent number: 10129057
    Abstract: Aspects of the subject disclosure may include, receiving a communication signal, and generating an electromagnetic wave that propagates along an outer surface of a dielectric layer environmentally formed on a cable. The dielectric layer can be a liquid disposed on an outer surface of the cable that enables the electromagnetic wave to propagate along the dielectric layer of the cable without an electrical return path, and conveys the communication signal. Other embodiments are disclosed.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: November 13, 2018
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Thomas M. Willis, III, Giovanni Vannucci, Paul Shala Henry, Robert Bennett, Farhad Barzegar, Irwin Gerszberg, Donald J. Barnickel