Including Spaced, Electrically Compensated, Internal Support Means Patents (Class 333/244)
  • Patent number: 11342683
    Abstract: Circuit board connector that provides electrical connection between conductive traces in a printed circuit board and microwave/millimeter-wave components.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: May 24, 2022
    Assignee: Cubic Corporation
    Inventors: Timothy Smith, Jean-Marc Rollin, Jared Jordan, Brian Kerrigan, William Stacy
  • Patent number: 10535910
    Abstract: The present disclosure relates to a dielectric coupling sleeve configured to capacitively couple a first electrical conductor to a second electrical conductor. The dielectric coupling sleeve includes a first sleeve section and a second sleeve section. The first sleeve section has a first diameter. A receiving space is closed on one side and formed in the first sleeve section. The receiving section is configured to receive an insertion of the first electrical conductor. The second sleeve section has a second diameter. The second diameter is smaller than the first diameter. The second sleeve section is configured for insertion into the conductor cavity of the second electrical conductor.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: January 14, 2020
    Assignee: Phoenix Contact GmbH & Co. KG
    Inventor: Martin Lilge
  • Patent number: 10382001
    Abstract: A conductive path with noise filter that enables an efficient reduction in a surge noise in a specific frequency band is provided. A conductive path with noise filter includes a conductive path main body, V-phase wire, W-phase wire, a coil-shaped inductor, V-phase inductor, W-phase inductor surrounding the conductive path main body, V-phase wire, W-phase wire, and a capacitor, V-phase capacitor, W-phase capacitor arranged between the conductive path main body, V-phase wire, W-phase wire and the inductor, V-phase inductor, W-phase inductor.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: August 13, 2019
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventor: Yoshio Mizutani
  • Patent number: 10249453
    Abstract: Embodiments of switches (10) include first and second electrical conductors (34, 36) suspended within an electrically-conductive housing (28), and a contact element (16) having an electrically-conductive portion (53b) that establishes electrical contact between the first and second electrical conductors (34, 36) when the contact element (16) is in a closed position. The electrically-conductive portion (53b) is electrically isolated from a ground plane (27) of the switch (10) by adjacent electrically-insulative portions (53a, 53c) of the contact element (16).
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: April 2, 2019
    Assignee: Harris Corporation
    Inventors: John E. Rogers, Michael R. Weatherspoon
  • Patent number: 9865910
    Abstract: An optimized coaxial transmission line having joined segments of coaxial transmission lines is provided. First insulating supports positioned at flange joints within the joined segments are provided. Second insulating supports are positioned a distance x, where x = 1 4 ? ? + n · 1 2 ? ? , from the first insulating supports to cancel reflections created by the insulating supports. Preferably, x=¼?, and the second insulating supports are positioned for one quarter of a wavelength at either FM frequencies, VHF frequencies, UHF frequencies, or IBOC frequencies. A method for optimizing a transmission line by frequency is also provided. First, segments of coaxial transmission lines are joined together, each segment having a first insulating support positioned at a flange joints within the joined segment.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: January 9, 2018
    Assignee: Electronics Research, Inc.
    Inventors: Nicholas A. Paulin, Mark Steapleton
  • Patent number: 9312589
    Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.
    Type: Grant
    Filed: June 2, 2014
    Date of Patent: April 12, 2016
    Assignee: NUVOTRONICS, INC.
    Inventors: David W. Sherrer, John J. Fisher
  • Patent number: 8969733
    Abstract: The present invention is directed to an RF device that includes a ceramic layer characterized by a ceramic layer dielectric constant and includes an RF circuit arrangement having a predetermined geometry and predetermined electrical characteristics. The ceramic layer dissipates thermal energy generated by the RF circuit via substantially the entire ceramic surface area. A first dielectric layer comprises a thermoplastic material and has a predetermined first thickness and a first dielectric constant. The predetermined electrical characteristics of the RF circuit arrangement are a function of the ceramic layer dielectric constant. A relative softness of the thermoplastic material is a function of the RF device operating temperature.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: March 3, 2015
    Assignee: Anaren, Inc.
    Inventors: Chong Mei, Michael J. Len, Hans P. Ostergaard
  • Patent number: 8933769
    Abstract: Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: January 13, 2015
    Assignee: Nuvotronics, LLC
    Inventors: William D. Houck, David W. Sherrer
  • Patent number: 8847711
    Abstract: A rigid radio frequency (RF) coaxial transmission line to be positioned within a wellbore in a subterranean formation may include a series of rigid coaxial sections coupled together in end-to-end relation. Each rigid coaxial section may include an inner conductor, a rigid outer conductor surrounding the inner conductor, and a dielectric therebetween. Each of the rigid outer conductors may include a rigid outer layer having opposing threaded ends defining overlapping mechanical threaded joints with adjacent rigid outer layers. Each of the rigid outer conductors may also include an electrically conductive inner layer coupled to the rigid outer layer and having opposing ends defining electrical joints with adjacent electrically conductive inner layers.
    Type: Grant
    Filed: August 7, 2012
    Date of Patent: September 30, 2014
    Assignee: Harris Corporation
    Inventors: Brian Wright, Murray Hann, Raymond Hewit
  • Patent number: 8742874
    Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.
    Type: Grant
    Filed: April 12, 2011
    Date of Patent: June 3, 2014
    Assignee: Nuvotronics, LLC
    Inventors: David W. Sherrer, John J. Fisher
  • Patent number: 8717124
    Abstract: A transmission line structure, a transmission line thermal manager and/or process thereof. A transmission line thermal manager may include a thermal member. A thermal member may be configured to form a thermal path, for example away from one or more inner conductors of a transmission line. A part of a thermal member may be formed of an electrically insulative and thermally conductive material. One or more inner conductors may be spaced apart from one or more outer conductors in a transmission line. A transmission line and/or a transmission line thermal manager may be configured to maximize a signal through a system, for example by modifying the geometry of one or more transmission line conductors and/or of a thermal manager.
    Type: Grant
    Filed: January 22, 2011
    Date of Patent: May 6, 2014
    Assignee: Nuvotronics, LLC
    Inventors: Kenneth Vanhille, David Sherrer
  • Patent number: 8704610
    Abstract: A multi-layer cradle comprises a first layer comprising first and second contact pads configured to be electrically coupled to a signal input and a signal output of the electronic component, respectively. The first layer also comprises a first ground plane configured to be electrically coupled to a ground of the electronic component and a first fence positioned about the first ground plane. The first ground plane is positioned at least between the first and second contact pads. A second layer comprising a second ground plane is also included. The cradle further comprises a first dielectric material positioned between the first and second layers, a ground plane via extending through the first dielectric material and electrically coupled to the first and second ground planes, and a plurality of fence vias extending through the first dielectric material and electrically coupled to the first fence and to second ground plane.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: April 22, 2014
    Assignee: General Electric Company
    Inventors: Victor Taracila, Fraser John Laing Robb, Vijayanand Alagappan, Miguel Angel Navarro, II, Peter Asuzu
  • Patent number: 8659371
    Abstract: A system is provided for three dimensional coaxial transmission of signals in a micro-machined component, the system having, a micro-machined component matrix with a first metallic sheet having a plurality of first access holes disposed therein; a second metallic sheet having a plurality of second access holes disposed therein; a plurality of metal posts disposed between the first and second metallic sheets such that the metallic sheets are maintained at a desired distance; walls defining a coaxial transmission channel; and a coaxial transmission core disposed within the channel.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: February 25, 2014
    Assignees: BAE Systems Information and Electronic Systems Integration Inc., Nuvotronics, LLC
    Inventors: Daniel L. Fonataine, David Sherrer
  • Publication number: 20140015623
    Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
    Type: Application
    Filed: September 17, 2013
    Publication date: January 16, 2014
    Applicant: NUVOTRONICS, LLC
    Inventor: David Sherrer
  • Patent number: 8269576
    Abstract: A coaxial connector that includes: a first inner conductor and a second inner conductor; a capacitor that is electrically coupled to the first inner conductor and the second inner conductor; an outer conductor that surrounds the first and second inner conductors, and the capacitor; a first support member that fixes the first inner conductor to the outer conductor; a second support member that fixes the second inner conductor to the outer conductor; a first dielectric material that is provided between the outer conductor and the first inner conductor and between the outer conductor and the second inner conductor, and a second dielectric material that is provided between the outer conductor and the capacitor.
    Type: Grant
    Filed: August 22, 2011
    Date of Patent: September 18, 2012
    Assignee: Fujitsu Limited
    Inventors: Takatoshi Yagisawa, Keiichi Ishikawa, Yushi Kirii
  • Publication number: 20110273241
    Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
    Type: Application
    Filed: January 28, 2011
    Publication date: November 10, 2011
    Inventors: David W. Sherrer, Jean-Marc Rollin
  • Patent number: 8031037
    Abstract: Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
    Type: Grant
    Filed: October 29, 2009
    Date of Patent: October 4, 2011
    Assignee: Nuvotronics, LLC
    Inventors: David W. Sherrer, William D. Houck
  • Patent number: 8026774
    Abstract: A radio frequency signal transmission method for transmitting a radio frequency signal through an inner conductor serving as a signal line, the radio frequency signal transmission method including: causing the radio frequency signal to be input to and propagate through the inner conductor, an impedance between the inner conductor and an outer conductor serving as a grounding line being adjusted to a predetermined impedance; and causing a component of the radio frequency signal to propagate through a capacitor provided in a middle of the inner conductor, an impedance at a portion of the capacitor installed being adjusted to match the predetermined impedance by a dielectric material provided around the capacitor.
    Type: Grant
    Filed: February 17, 2011
    Date of Patent: September 27, 2011
    Assignee: Fujitsu Limited
    Inventors: Takatoshi Yagisawa, Keiichi Ishikawa, Yushi Kirii
  • Patent number: 7952449
    Abstract: A coaxial connector includes a first inner conductor and a second inner conductor. A capacitor connects between the first inner conductor and the second inner conductor. An outer conductor extends along and surrounds the first and second inner conductors and the capacitor. A first dielectric material is filled in a gap between the outer conductor and the first and second inner conductors. A support member supports the first and second inner conductors with respect to the outer conductor. A second dielectric material for impedance matching is provided between the capacitor and the outer conductor.
    Type: Grant
    Filed: October 14, 2008
    Date of Patent: May 31, 2011
    Assignee: Fujitsu Limited
    Inventors: Takatoshi Yagisawa, Keiichi Ishikawa, Yushi Kirii
  • Patent number: 7948335
    Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.
    Type: Grant
    Filed: June 20, 2008
    Date of Patent: May 24, 2011
    Assignee: Nuvotronics, LLC
    Inventors: David W. Sherrer, John J. Fisher
  • Patent number: 7656256
    Abstract: Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: February 2, 2010
    Assignee: Nuvotronics, PLLC
    Inventors: William D. Houck, David W. Sherrer
  • Patent number: 7649432
    Abstract: Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are mechanically locked to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: January 19, 2010
    Assignee: Nuvotornics, LLC
    Inventors: David W. Sherrer, Christopher A. Nichols, Shifang Zhou
  • Publication number: 20080191817
    Abstract: Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are mechanically locked to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
    Type: Application
    Filed: December 28, 2007
    Publication date: August 14, 2008
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: David W. Sherrer, Christopher A. Nichols, Shifang Zhou
  • Patent number: 7164333
    Abstract: A standing wave barrier for at least one radio frequency cable having a cable axis has at least one metallic base web that proceeds parallel to the cable axis from a first web end to a second web end. The web ends are coupled to one another in terms of radio frequency terms via a capacitance, so that the base web and the capacitance together form a radio frequency resonant oscillator circuit. The base web and the capacitance are situated in one of two half-shells that can be connected to one another such that the radio frequency cable is clamped between them. The capacitance has an adjustable capacitor element that has a first capacitor surface and a second capacitor surface. The first capacitor surface is connected in electrically conductive fashion to the first web end, and the second capacitor surface is connected in electrically conductive fashion to the second web end.
    Type: Grant
    Filed: March 18, 2005
    Date of Patent: January 16, 2007
    Assignee: Siemens Aktiengesellschaft
    Inventors: Helmut Greim, Jürgen Hagen
  • Patent number: 7148772
    Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: December 12, 2006
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: David W. Sherrer, John J. Fisher
  • Patent number: 7012489
    Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.
    Type: Grant
    Filed: March 4, 2004
    Date of Patent: March 14, 2006
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: David W. Sherrer, John J. Fisher
  • Patent number: 6972648
    Abstract: A coaxial transmission line having intermediary segments of equal lengths and equidistant insulator supports is provided. The transmission line segment and insulator support spacing is designed to cause any reflection artifacts to occur outside or between desired channel bands.
    Type: Grant
    Filed: July 24, 2003
    Date of Patent: December 6, 2005
    Assignee: SPX Corporation
    Inventors: Jeffrey Brown, John Schadler
  • Patent number: 6870448
    Abstract: A movable support for a coaxial structure, such as a coaxial feed-through, connector, or cable, allows adjusting the height of a center pin of the coaxial structure relative to the surface of a high-frequency planar microcircuit mounted on a base. The height of the center pin is optimized to provide a high-frequency transition between the coaxial transmission structure and a planar transmission structure, such as a stripline structure, on the planar microcircuit. An interference fit between the movable support and base at the operating height provides a high-quality ground contact underneath the center pin.
    Type: Grant
    Filed: March 14, 2003
    Date of Patent: March 22, 2005
    Assignee: Agilent Technologies, Inc.
    Inventors: Michael B. Whitener, Michael T. Powers, Matthew R. Richter, Donald J. Taylor
  • Patent number: 6847274
    Abstract: The idea of the invention is to fabricate a multilayer coaxial transmission line into a printed circuit. The outermost conductor is fabricated by conductive conduit strips in different layers, using conductive via posts in isolation layers connecting the strips. The innermost conductor can be a single conductive strip or multiple strips in different layers connected together through conductive via posts.
    Type: Grant
    Filed: May 17, 2001
    Date of Patent: January 25, 2005
    Assignee: Nokia Corporation
    Inventors: Olli Salmela, Ilpo Kokkonen
  • Patent number: 6822532
    Abstract: A suspended stripline device and method for manufacturing thereof. The device includes first and second conductive traces disposed on a dielectric substrate, each of the first and second conductive traces having a first edge and a second edge, and a housing at least partially surrounding the dielectric substrate, wherein the second edge of each of the first and second conductive traces includes at least one outwardly extending protrusion, the size and orientation of which may be selected so as to compensate for unequal even and odd mode propagation velocities through the suspended-stripline device. The device may be packaged by folding solder-coated tabs, provided on the housing, around the dielectric substrate and heating the device such that the solder melts causing the housing to be secured to the substrate.
    Type: Grant
    Filed: July 29, 2002
    Date of Patent: November 23, 2004
    Assignee: Sage Laboratories, Inc.
    Inventors: John R. Kane, Richard J. Garabedian
  • Patent number: 6816040
    Abstract: A broadband coaxial transmission line is formed by joining smaller coaxial transmission lines having particularly formulated lengths. Insulating supports in the transmission line are situated in a prescribed manner to reduce reflections along the transmission line. The insulating supports are also formed with particularly positioned symmetric voids to minimize weight, provide adequate structural support, and minimize reflections.
    Type: Grant
    Filed: April 28, 2003
    Date of Patent: November 9, 2004
    Assignee: SPX Corporation
    Inventors: Jeffrey Brown, Gordon Eaton, John Schadler
  • Patent number: 6816039
    Abstract: Support structure for high frequency coaxial transmission line. A conductive bead ring is split in two halves longitudinally, containing a relief for excess glass flow and provision for locking the halves together. A glass dielectric surrounds the center conductor, which is tapered from a first larger diameter to a second smaller diameter in the region of the glass dielectric. A fixture for forming the glass to metal seal uses dams to control the positioning of the glass with respect to the taper in the center conductor.
    Type: Grant
    Filed: July 10, 2003
    Date of Patent: November 9, 2004
    Assignee: Agilent Technologies, Inc.
    Inventors: Donald J. Taylor, Matthew R. Richter, Zahn Zhang, Glenn S. Takahashi
  • Publication number: 20040212465
    Abstract: A broadband coaxial transmission line is formed by joining smaller coaxial transmission lines having particularly formulated lengths. Insulating supports in the transmission line are situated in a prescribed manner to reduce reflections along the transmission line. The insulating supports are also formed with particularly positioned symmetric voids to minimize weight, provide adequate structural support, and minimize reflections.
    Type: Application
    Filed: April 28, 2003
    Publication date: October 28, 2004
    Applicant: SPX CORPORATION
    Inventors: Jeffrey Brown, Gordon Eaton, John Schadler
  • Publication number: 20040178868
    Abstract: A movable support for a coaxial structure, such as a coaxial feed-through, connector, or cable, allows adjusting the height of a center pin of the coaxial structure relative to the surface of a high-frequency planar microcircuit mounted on a base. The height of the center pin is optimized to provide a high-frequency transition between the coaxial transmission structure and a planar transmission structure, such as a stripline structure, on the planar microcircuit. An interference fit between the movable support and base at the operating height provides a high-quality ground contact underneath the center pin.
    Type: Application
    Filed: March 14, 2003
    Publication date: September 16, 2004
    Inventors: Michael B. Whitener, Michael T. Powers, Matthew R. Richter, Donald J. Taylor
  • Patent number: 6765461
    Abstract: Asymmetric support for high frequency transmission lines. An asymmetrical support structure coaxially supports a center conductor over a ground plane using a dielectric material. Absorbing material between the dielectric and the outer conductor reduces the effects of high order modes.
    Type: Grant
    Filed: April 30, 2003
    Date of Patent: July 20, 2004
    Assignee: Agilent Technologies, Inc.
    Inventors: Julius K Botka, Floyd A Bishop, Jon L. James, Michael T. Powers
  • Patent number: 6621384
    Abstract: A technique for providing a multi-layer substrate which is capable of signal transmission at multiple propagation speeds is disclosed. In one embodiment, the technique is realized by constructing a multi-layer substrate by creating air channels in dielectric layers adjacent to a conductor. The air channels may also be filled with an alternative dielectric material. At least three types of multi-layer substrates may be produced through this technique. Furthermore, signal tracks of varying lengths can be provided to accommodate differing delays.
    Type: Grant
    Filed: December 28, 2000
    Date of Patent: September 16, 2003
    Assignee: Nortel Networks Limited
    Inventors: Martin R. Handforth, Herman Kwong, Richard R. Goulette
  • Patent number: 6603376
    Abstract: A technique for improving signal reach and signal integrity when using high bit rates or high signal frequencies is provided. A multi-layer substrate comprises a conductor having a continuous main path and discrete spaced edges protruding from opposing edges of the continuous main path. A first spacer layer is disposed on a first side of the conductor, the first a spacer layer having an air channel substantially coextensive with the continuous main path and a solid portion overlapping with the discrete spaced edges. A second spacer layer is disposed on a second side of the conductor, the second spacer layer having an air channel substantially coextensive with the continuous main path of the conductor and a solid portion overlapping with the discrete spaced edges.
    Type: Grant
    Filed: December 28, 2000
    Date of Patent: August 5, 2003
    Assignee: Nortel Networks Limited
    Inventors: Martin R. Handforth, Scott B. Kuntze, Herman Kwong
  • Patent number: 6465741
    Abstract: A spacer apparatus (10) for spacing a high voltage lead (25) from other components in an electrical device includes a hub (11), a plurality of spokes (15-18) extending radially outwardly from the hub (11), and first and second spacer rim segments (19, 20) connected to the spokes (15-18). The hub (11) has a center (12) and first and second holes (13, 14) located on opposite sides of the center (12). The holes (13, 14) each have an open side for receiving a lead (25). The spacer rim segments (19, 20) are movable using a scissors-like action with the hub center (12) as a fulcrum to selectively enlarge one of the open sides to facilitate attachment to a high voltage lead (25). The spacer apparatus (10) is symmetrical so that an operator can attach the spacer to a lead (25) regardless of the direction in which the apparatus is initially grasped.
    Type: Grant
    Filed: November 15, 2001
    Date of Patent: October 15, 2002
    Assignees: Sony Corporation, Sony Electronics, Inc.
    Inventors: Jason Christopher Pionek, Trentiss Tyrone Agnew, Randy Hiroshi Nakamura
  • Patent number: 6400235
    Abstract: A coupler includes one or more conductors and a support structure for the conductors within the coupler. The conductors are inserted through oblong holes in the support structure while the support structure is in an assembling position. When the support structure is tilted from the assembling position to a securing position, which is in a direction away from normal to a longitudinal axis of the conductors, the external surfaces of the conductors are engaged by the support structure at the oblong holes. Typically, a removable cover of the coupler exerts a downward force, which deflects opposite outer edges of the support structure to maintain the support structure in the securing position. The spacing between the conductors is maintained substantially constant over time, temperature, and handling while the support structure is in the securing position.
    Type: Grant
    Filed: August 20, 1999
    Date of Patent: June 4, 2002
    Assignee: L3 Communications Corporation
    Inventor: Henry Perez
  • Patent number: 6316719
    Abstract: Interconnections are made through a planar circuit by a monolithic short-circuited transmission path which extends from a circuit portion of the planar circuit to the opposite side. The opposite side is ground sufficiently to remove the short-circuiting plate, thereby separating the previously monolithic conductors, and exposing ends of the separated conductors of the transmission path. Connection is made between the exposed conductors of the transmission path and the registered contacts of a second planar circuit by means of electrically conductive, compliant fuzz buttons. The transmission path may be a coaxial path useful for RF.
    Type: Grant
    Filed: February 15, 2000
    Date of Patent: November 13, 2001
    Assignee: Lockheed Martin Corp.
    Inventors: Brian Alan Pluymers, Doreen Marie Nixon
  • Patent number: 6031188
    Abstract: Interconnections are made through a planar circuit by a monolithic short-circuited transmission path which extends from a circuit portion of the planar circuit to the opposite side. The opposite side is ground sufficiently to remove the short-circuiting plate, thereby separating the previously monolithic conductors, and exposing ends of the separated conductors of the transmission path. Connection is made between the exposed conductors of the transmission path and the registered contacts of a second planar circuit by way of electrically conductive, compliant fuzz buttons. The transmission path may be a coaxial path useful for RF.
    Type: Grant
    Filed: April 30, 1998
    Date of Patent: February 29, 2000
    Assignee: Lockheed Martin Corp.
    Inventors: Brian Alan Pluymers, Doreen Marie Nixon, Richard Joseph Teti, Robert Edward Hayes
  • Patent number: 5945897
    Abstract: Interconnections are made through a planar circuit by a monolithic short-circuited transmission path which extends from a circuit portion of the planar circuit to the opposite side. The opposite side is ground sufficiently to remove the short-circuiting plate, thereby separating the previously monolithic conductors, and exposing ends of the separated conductors of the transmission path. Connection is made between the exposed conductors of the transmission path and the registered contacts of a second planar circuit by means of electrically conductive, compliant fuzz buttons. The transmission path may be a coaxial path useful for RF.
    Type: Grant
    Filed: April 30, 1998
    Date of Patent: August 31, 1999
    Assignee: Lockheed Martin Corporation
    Inventors: Brian Alan Pluymers, Richard Joseph Teti
  • Patent number: 5831440
    Abstract: A microwave test kit including a SWR bridge with one or more accompanying precision airlines for connecting between the test port of the SWR bridge and a test device. The SWR bridge includes a branch opposite its test port which includes an adapter having a connector with a center conductor support bead matching the center conductor support bead used in the precision airlines to compensate for impedance mismatch. The test kit may further include a standard 50 ohm termination and an offset termination, having an impedance other than 50 ohms, with the adapter of the SWR bridge configured to enable a user to selectively connect the standard termination to enable measurements to be made in an error averaging mode, or the offset termination to enable measurements to be made in a magnified mode.
    Type: Grant
    Filed: December 18, 1995
    Date of Patent: November 3, 1998
    Assignee: Wiltron Company
    Inventor: William W. Oldfield
  • Patent number: 5828272
    Abstract: A conducting housing for use in a coaxial cable distribution system is of larger length than width and defines an RF signal path therein. A part of the RF signal path is the inner conductor of inner and outer approximately co-extensive conductors. The inner conductor except near its ends has only air separating it from the outer conductor. The outer conductor will usually be of a U-shape lying, in section, on three sides of the central conductor. The outer conductor may be structually combined with an insulating plate supporting the remainder of the RF circuit.
    Type: Grant
    Filed: February 3, 1997
    Date of Patent: October 27, 1998
    Assignee: J. E. Thomas Specialties Limited
    Inventors: Robert L. Romerein, David B. Crowhurst
  • Patent number: 5796317
    Abstract: A variable impedance coaxial transmission line having a center conductor of constant cross-section, an outer conductor surrounding and coaxial with the center conductor and spaced radially therefrom, and a variable dielectric constant material between the center conductor and the outer conductor. The variable dielectric constant material has a plurality of alternating elements of high dielectric material and low dielectric material arranged along the center conductor from a first end to a second end of the center conductor. The invention also includes a reduced size, high-power broadband power/divider incorporating the variable impedance coaxial transmission line.
    Type: Grant
    Filed: February 3, 1997
    Date of Patent: August 18, 1998
    Assignee: Tracor Aerospace Electronic Systems, Inc.
    Inventors: Walter Bohlman, John Greeley
  • Patent number: 5793215
    Abstract: A 6 port TEM cell for measuring garbage EMI/EMS of an electrical and electronic equipment which can form an electromagnetic field of horizontal/vertical polarization using characteristic that internal electric field polarization is changed according to feeder line selection inside a multi-transmission line, and coupling amount among internal conductors is reduced by positioning the spherical internal conductors at corners of external conductors, thereby widening a test area.
    Type: Grant
    Filed: December 22, 1995
    Date of Patent: August 11, 1998
    Assignee: Electronics and Telecommunications Research Institute
    Inventor: Jae-Hoon Yun
  • Patent number: 5790003
    Abstract: A spacer is indicated for a high-frequency coaxial cable with an inner conductor, a tube-shaped outer conductor and a dielectric cavity located between the two conductors which, through the use of different materials, has a higher thermal load capacity in the inner conductor area than in the outer conductor area. When installed, the parts, which are composed of different materials and are superimposed in the radial direction, are mechanically interconnected.
    Type: Grant
    Filed: January 22, 1997
    Date of Patent: August 4, 1998
    Assignee: Alcatel Alsthom Compagnie Generale d'Electricite
    Inventors: Horst Fischer, Hartmut Gohdes
  • Patent number: 5790002
    Abstract: A spacer is indicated for a high-frequency coaxial cable with an inner conductor, a tube-shaped outer conductor and a dielectric cavity located between the two conductors, which has a higher thermal load-carrying capacity in the inner conductor area than in the outer conductor area, due to the use of different materials. The parts of the spacer which are made of different materials are radially superimposed and are solidly interlocked with each other by means of injection molding.
    Type: Grant
    Filed: January 24, 1997
    Date of Patent: August 4, 1998
    Assignee: Alcatel Alsthom Compagnie Generale d'Electricite
    Inventors: Horst Fischer, Hartmut Gohdes
  • Patent number: 5724012
    Abstract: Transmission-line network of the foam stripline type. To reduce dielectric losses in the foam, part of the foam in the region of the stripline is removed so that the wave properties of the transmission-line network are not impaired. The removed foam forms ducts that may be used for the forced cooling of the stripline using air or other cooling agents.
    Type: Grant
    Filed: August 1, 1996
    Date of Patent: March 3, 1998
    Assignee: Hollandse Signaalapparaten B.V.
    Inventor: Petrus Johannus Stephanus Teunisse
  • Patent number: 5638035
    Abstract: A conducting housing (to be closed by a lid) for a coaxial cable distribution network has a common port and one of an aerial or pedestal port. A motherboard carries an RF circuit and a transfer switch. In one setting of the transfer switch the RF circuit connects a coaxial pin at the common port with a coaxial pin at the pedestal port. In the other setting the common port pin is connected to the aerial port pin. When the aerial port is used on a rectangular housing, a transmission line forms part of the RF circuit between the motherboard and the aerial port. The transmission is preferably a central conductor spaced over most of its length by air from an outer conductor in the form of an inverted U enclosing the central conductor on three sides. Preferably a ground plane on the back of the motherboard connects to the transmission line outer conductor to provide a path entry in the housing at both ends for ground currents generated by signals in the RF path.
    Type: Grant
    Filed: April 21, 1995
    Date of Patent: June 10, 1997
    Assignee: J. E. Thomas Specialties Limited
    Inventors: Robert L. Romerein, David B. Crowhurst, Zdenek J. Nepovim, Kenneth W. Lynes