Tapered Patents (Class 333/34)
  • Patent number: 11758662
    Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a first rigid substrate, a second rigid substrate, a flexible substrate comprising a first portion attached to the first rigid substrate, a second portion attached to the second rigid substrate, a middle portion connecting the first portion to the second portion, wherein the middle portion is bent, and metallic traces therethrough, and a component forming a direct interface with the middle portion of the flexible substrate, the component electrically coupled to the metallic traces. In selected examples, the device further includes a casing.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: September 12, 2023
    Assignee: Intel Corporation
    Inventors: Tin Poay Chuah, Bok Eng Cheah, Jackson Chung Peng Kong
  • Patent number: 11695192
    Abstract: An adapter for coupling a coaxial transmission line to a waveguide, wherein the center conductor of the coaxial line passes via a back short of the waveguide through an iris and that terminates to the inside wall of the waveguide.
    Type: Grant
    Filed: July 27, 2021
    Date of Patent: July 4, 2023
    Assignee: Millimeter Wave Systems, LLC
    Inventors: Martin Skowyra, William R. Shedd, Christopher Tze-Chao Koh
  • Patent number: 11670829
    Abstract: A radar assembly includes a rectangular-waveguide (RWG) and a printed-circuit-board. The rectangular-waveguide (RWG) propagates electromagnetic energy in a transverse electric mode (TE10) and in a first direction. The printed-circuit-board includes a plurality of conductor-layers oriented parallel to each other. The printed-circuit-board defines a substrate-integrated-waveguide (SIW) that propagates the electromagnetic energy in a transverse electric mode (TE10) and in a second direction perpendicular to the first direction, and defines a transition that propagates the electromagnetic energy between the rectangular-wave-guide and the substrate-integrated-waveguide. The transition includes apertures defined by at least three of the plurality of conductor-layers.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: June 6, 2023
    Assignee: Aptiv Technologies Limited.
    Inventor: Sankara Narayana Mangaiahgari
  • Patent number: 11664569
    Abstract: The present invention relates to a metalized waveguide interface (1) for providing a galvanically isolated waveguide connection for a propagating signal, between a standardized waveguide (2) and a, to the standardized waveguide non-compatible, metalized chip-level waveguide (3). The metalized waveguide interface (1) is configured such that a first open-ended quarter wavelength waveguide (31) and a second open-ended quarter wavelength waveguide (32) is obtained along the directions d1 and d2, respectively, when the metalized chip-level waveguide (3) is mounted on the support surface (5). The interface is further configured such that third open-ended quarter wavelength waveguide (33) is obtained between the third surface portion (9) and the metalized chip-level waveguide (3) when the metalized chip-level waveguide (3) is mounted on the support surface (5).
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: May 30, 2023
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Mikael Hörberg, Yinggang Li, Ola Tageman
  • Patent number: 11404758
    Abstract: A transition device for a hollow waveguide comprises a rectangular structure comprising an inlet wall and interior extending from the inlet wall along a longitudinal axis. The inlet wall is configured to receive a transmission line comprising an antenna. The antenna forms a proximal end proximate to the inlet wall and a distal end configured to extend into the rectangular structure of the hollow waveguide. A channel is formed in the rectangular structure. The channel comprises a base forming a tuning surface. The tuning surface is configured to extend along a length of the antenna in a spaced configuration parallel to the longitudinal axis.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: August 2, 2022
    Assignee: Whirlpool Corporation
    Inventor: Francesco Giordano
  • Patent number: 11335986
    Abstract: A high frequency connection structure includes: a waveguide; a ridge coupler constituted by a conductor formed inside one end of the waveguide; a transmission line adjacent to the one end of the waveguide; an inductance adjustment structure which is provided between the ridge coupler and the transmission line and which adjusts ground inductance that is created due to a connection between the ridge coupler and the waveguide; and a wire which connects one end of the ridge coupler on a side of the transmission line and one end of the transmission line with each other.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: May 17, 2022
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Hiroshi Hamada, Teruo Jo, Hideyuki Nosaka
  • Patent number: 11183877
    Abstract: Aspects of the subject disclosure may include, for example, a utilities management system operable to receive via a guided wave transceiver a plurality of utility status signals from a plurality of utility sensors located at a plurality of supervised sites. Utility control data is generated based on the plurality of utility status signals. At least one control signal is generated for transmission via the guided wave transceiver to at least one of the plurality of supervised sites, and the at least one control signal includes at least one utility deployment instruction based on the utility control data. Other embodiments are disclosed.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: November 23, 2021
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Pamela A. M. Bogdan, George Blandino, Ken Liu, Leon Lubranski, Eric Myburgh, Tracy Van Brakle
  • Patent number: 11152710
    Abstract: Disclosed is a wide-band conformal coaxial antenna conformal to a surface that comprises an inner conductor, an outer conductor, and a dielectric layer. The inner conductor extends towards the surface from a coaxial input below the surface and the outer conductor surrounds the inner conductor extending from the coaxial input to the surface. The dielectric layer is between the inner conductor and the outer conductor. The inner conductor has a first inner conductor diameter at the coaxial input and a second inner conductor diameter at a distal end of the inner conductor at or proximately below the surface. The inner conductor forms an inner conductor surface at the distal end of the inner conductor and the second inner conductor diameter is larger than the first inner conductor diameter. The outer conductor has a first outer conductor diameter at the coaxial input and a second outer conductor diameter at the surface. The second outer conductor diameter is larger than the first outer conductor diameter.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: October 19, 2021
    Assignee: The Boeing Company
    Inventors: Das D. Butherus, Nicholas B. Mentesana
  • Patent number: 11114735
    Abstract: A coaxial waveguide transducer includes: a waveguide having a substantially L shape formed of a first waveguide part and a second waveguide part arranged substantially orthogonal to each other; a stepwise step bend part formed in an outer corner part of an L-shaped bent part of the waveguide; a first conductor and a second conductor arranged in respective inner side walls of the waveguide in such a way that they are extended in a direction in which a central conductor of the coaxial line is extended and are positioned on a plane the same as that where the central conductor is provided; and a third conductor having one end connected to the central conductor and another end connected to one of the first conductor and the second conductor, the third conductor being arranged obliquely with respect to the direction in which the central conductor is extended.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: September 7, 2021
    Assignee: NEC CORPORATION
    Inventors: Takahiro Miyamoto, Norihisa Shiroyama
  • Patent number: 11024935
    Abstract: A stripline radial power combiner is provided. The stripline radial combiner comprises a first stripline level comprising N radial combiner arms coupled to a first common node; a second stripline level comprising a common port coupled to a second common node; wherein the first stripline level is mounted over the second stripline level; and wherein the first common node and the second common node are coupled by a conductive via through the first stripline level and the second stripline level.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: June 1, 2021
    Assignee: CommScope Technologies LLC
    Inventors: Dean Zavadsky, Gilberto Guerra, Michael Nelson, Brogan McWilliams
  • Patent number: 11005185
    Abstract: The system and method for a conformal millimeter wave (mmW) cavity backed slot antenna with near positive gain and hemispherical gain coverage. The antenna has a microstrip launch and feed and a surface mount connector. The mmW antenna may have a stripline launch or waveguide launch instead of a microstrip launch. In some cases, the microwave electronics can be mounted on the launch substrate instead of a connector.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: May 11, 2021
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Dean W. Howarth, Jonothan S. Jensen
  • Patent number: 10952313
    Abstract: An electronic circuit includes a first conductor configured horizontally on a first layer and a second conductor configured horizontally on a second layer. The second conductor is separated from the first conductor by a plurality of layers. A third conductor is configured between the first layer and the second layer. The third conductor electrically couples the first conductor and the second conductor. One or more intermediate conductors are electrically coupled to the third conductor, with the one or more intermediate conductors configured on one or more intermediate layers between the first layer and the second layer.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: March 16, 2021
    Assignee: ARISTA NETWORKS, INC.
    Inventors: Theophilus Ko, Pranav Devalla, Jim Weaver
  • Patent number: 10950920
    Abstract: It is provided a waveguide comprising a tubular, electrically conductive waveguide body, the waveguide having a rectangular cross-section. The waveguide further comprises an electrically conductive foil comprising at least one matching portion arranged within the waveguide body, extending along a propagation direction of the waveguide body, and at least one connection portion arranged outside of the waveguide body, for connecting the waveguide to a component, wherein the matching portion of the foil is tapered in a propagation direction of the waveguide and arranged to form a ridge protruding from a sidewall of the waveguide along part of the length of the waveguide, and wherein the connection portion extends outside of the waveguide, in a propagation direction of the waveguide and in the same plane as the matching portion. It is also provided a waveguide arrangement and a method for manufacturing such a waveguide arrangement.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: March 16, 2021
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Per Ligander, Thomas Emanuelsson, Ola Tageman
  • Patent number: 10833386
    Abstract: Waveguide transition devices for power-combining devices are disclosed. A waveguide transition device includes a coaxial waveguide section that is configured to concurrently receive electromagnetic output signals from a plurality of amplifiers and transition the electromagnetic output signals to a waveguide coupling section to form a combined and amplified electromagnetic signal. In turn, the waveguide coupling section transitions the combined and amplified electromagnetic signal to a waveguide output port. As disclosed herein, representative waveguide transition devices are configured to allow higher operating powers without typical device failure mechanisms. Spatial power-combining devices that include representative waveguide transition devices have improved power handling capabilities.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: November 10, 2020
    Assignee: Qorvo US, Inc.
    Inventor: John Kitt
  • Patent number: 10686241
    Abstract: Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: June 16, 2020
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyeon Min Bae, Ha Il Song, Huxian Jin
  • Patent number: 10674598
    Abstract: In one embodiment, an apparatus includes a printed circuit board, a via-stub resonator formed in the printed circuit board, a plurality of vias surrounding the via-stub resonator, and a microstrip connected to the via-stub resonator for use in measuring an insertion loss to provide a resonance frequency. The via-stub resonator is designed to reproduce a dielectric constant value of a known material in a simulation. A via dielectric constant in an x and y plane is calculated based on the resonance frequency. A method for measuring the via dielectric constant using the via-stub resonator is also disclosed herein.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: June 2, 2020
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: David Nozadze, Amendra Koul, Joel Richard Goergen, Mike Sapozhnikov
  • Patent number: 10667385
    Abstract: Embodiments of the invention may relate to a circuit board (CB). The circuit board may include a first CB layer that includes a first anti-pad having a first area, a second CB layer that includes a second anti-pad having the first area and being located substantially beneath the first anti-pad, a first via within the first anti-pad and the second anti-pad, and a first CB trace in the second CB layer. The first CB trace may be coupled to the first via to form a first transition point within a first signal propagation path. The first area may be determined, at least in part, by a depth within the CB of the second CB layer.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: May 26, 2020
    Assignee: Arista Networks, Inc.
    Inventor: James A. Weaver
  • Patent number: 10667103
    Abstract: Systems and methods for configuring a sensor on a controller include receiving a sensor description defined in a format of a domain specific language corresponding to the sensor. The sensor description is parsed to identify one or more instructions. The one or more instructions are mapped to corresponding commands of the controller to enable the controller to perform the one or more instructions.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: May 26, 2020
    Assignee: Alcatel Lucent
    Inventors: Aidan Boran, Alan P. Leddy
  • Patent number: 10374316
    Abstract: Aspects of the subject disclosure may include, for example, a solid dielectric antenna having a non-uniform spatial distribution of relative permittivity.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: August 6, 2019
    Assignee: AT&T INTELLECTUAL PROPERTY I, L.P.
    Inventors: Robert Bennett, Irwin Gerszberg, Farhad Barzegar, Thomas M. Willis, III, Donald J. Barnickel, Paul Shala Henry
  • Patent number: 10312581
    Abstract: An antenna system including: a metal base plate; an antenna element arranged on and extending away from the front side of the base plate; a circuit board including a ground plane, adjacent to, and in thermal contact with the base plate; a plurality of electrical components on the circuit board including a power amplifier and an I/O connector; a metal support plate separated from, parallel to, and facing the base plate, with the circuit board located between the base and support plates; a plurality of thermally conductive standoffs thermally connecting the base plate to the support plate; and a master board including an I/O connector mating with the I/O connector on the circuit board and electrically connecting the circuit board to the master board, the master board located between the circuit board and the support plate and including signal paths for routing signals to the circuit board.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: June 4, 2019
    Assignee: BLUE DANUBE SYSTEMS, INC.
    Inventors: James Emerick, Robert M. Honeycutt, Josef Ocenasek
  • Patent number: 10270145
    Abstract: A technique is presented to extract electromagnetic radiation from a dielectric loaded waveguide consisting of a layer or layers of dielectric material enclosed in a metallic conducting jacket. The electromagnetic radiation generated in the dielectric waveguide by a charged particle beam or otherwise generated as input to the waveguide. Dielectric loaded waveguides used for generation (or transport) of electromagnetic radiation at frequencies above 100 GHz have dimensions in the sub-mm range. Due to difficulty in the fabrication of a conventional broadband horn-like antenna to extract electromagnetic radiation from the structure because of the large impedance mismatch between the dielectric loaded waveguide and free space, the designing and fabricating aperture of antennas are formed as part of the dielectric waveguide and utilizes an angle cut or a set of apertures machined into the dielectric loaded waveguide to ensure broadband power extraction with minimal return loss and high directivity.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: April 23, 2019
    Assignee: EUCLID TECH LABS, LLC
    Inventors: Sergey Antipov, Chunuang Jing, Roman Kostin, Jiaqu Qiu, Dan Wang, Alexei Kanareykin, Stanislauv Baturin, Sergey Baryshev
  • Patent number: 9692137
    Abstract: An annular slot antenna includes an inner conductor divided by a dielectric gap into a rear section and a front section. An inner conductor of a coaxial feed line is contacted with the front section of the inner conductor and the outer conductor of the coaxial feed line is contacted with the rear section.
    Type: Grant
    Filed: April 18, 2013
    Date of Patent: June 27, 2017
    Assignee: EADS Deutschland GmbH
    Inventor: Michael Sabielny
  • Patent number: 9634371
    Abstract: A transmission line circuit assembly has a substrate layer having a transmission line trace, further having a functional portion and a transitional portion. An enclosure of the assembly houses the transitional portion of the transmission line trace. A first surface of a dielectric plug is conductively coupled to an inner top surface of the enclosure. A second surface of the plug is aligned and spaced apart from the transitional portion of the transmission line trace to define a gap therebetween. An interfacing portion of a connecting pin is housed within the enclosure and bonded to the transitional portion. A connecting portion of the pin is connectable to an external conductor. The gap may be filled with a dielectric material. The transitional portion, dielectric plug, dielectric filler and connecting pin form an electromagnetic transition providing tuning and matching of the function portion with the external conductor.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: April 25, 2017
    Assignee: COM DEV International Ltd.
    Inventors: Arvind Swarup, David Davitt
  • Patent number: 9484614
    Abstract: A dielectric waveguide (DWG) has a longitudinal core member with a first dielectric constant value surrounded by a cladding with a cladding dielectric constant value that is lower than the first dielectric constant value. A first port of a signal divider is connected to receive a signal from the DWG. A second port and a third port are each configured to output a portion of the signal received on the first port, wherein the first and second port are approximately in line and the third port is at an angle to a line formed by the first port and the second port. The first port and second port have a core member with the first dielectric constant value, and the third port has a core member with a second dielectric constant value that is higher than the first dielectric constant value.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: November 1, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Juan Alejandro Herbsommer
  • Patent number: 9419324
    Abstract: A basic cell of a microwave group delay line is disclosed for tuning the electromagnetic signal propagation delay time from signal source (1) to output (5), wherein two pairs of unequal-length stubs ((L1b, L1b), (L2b, L2b)) are placed on both sides of the main transmission path (2) in the signal layer and two pairs of complementary slot-lines ((L1t, L1t), (L2t, L2t)) are placed on both sides of the main transmission path (2) in ground plane for microstrip structure. Unequal-length stubs are placed in central layer and complementary slot-lines are placed in either outer conductor ground planes for strip-line structure. The characteristic impedances (Z0, 2Z1b, 2Z2b, 2Z1t, 2Z2t) of transmission paths are selected to control group delay time and minimize reflection of signals from signal source to output. A cascade connection of the basic cell forms a delay line system.
    Type: Grant
    Filed: January 15, 2014
    Date of Patent: August 16, 2016
    Inventors: Ching-Wen Hsue, Thomas Hsue
  • Patent number: 9401532
    Abstract: A high-frequency signal line includes a dielectric element body including regions and a plurality of flexible dielectric sheets. A signal conductive layer is provided in or on the dielectric element body. Ground conductive layers are provided in or on the dielectric element body and face the signal conductive layer. A distance between the ground conductive layer and the signal conductive layer in the region is smaller than a distance between the ground conductive layer and the signal conductive layer in the regions. The dielectric element body is bent in the region.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: July 26, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shigeru Tago, Satoshi Sasaki, Noboru Kato
  • Patent number: 9318786
    Abstract: A high-frequency signal line includes an element assembly including a plurality of insulator layers, a linear signal line provided in or on the element assembly, a first ground conductor provided in or on the element assembly and extending along the signal line, and a plurality of floating conductors provided in or on the element assembly on a first side in a direction of lamination relative to the signal line and the first ground conductor, so as to be arranged along the signal line in an orientation crossing the signal line when viewed in a plan view in the direction of lamination. The floating conductors are opposite to the signal line and the first ground conductor with at least one of the insulator layers positioned therebetween, the floating conductors being connected to neither the signal line nor the first ground conductor.
    Type: Grant
    Filed: March 4, 2014
    Date of Patent: April 19, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Noboru Kato
  • Patent number: 9281551
    Abstract: A multi-band whip antenna having a 30 MHz to 2 GHz bandwidth and an L-band dipole has its coverage extended up to 6 GHz by eliminating nulls and reducing VSWR problems that are cured through the utilization of a sleeve over the feedpoint of the L-band antenna. Chokes in the form of sleeves are provided at either end of the L-band dipole to shorten the L-band antenna for preventing reverse polarity currents at the L-band antenna feedpoint, with the antenna further including the use of double shielded meanderline to provide improved performance between 410-512 MHz and in which a capacitance sleeve is added at the bottom of the L-band antenna to effectively elongate the antenna below the L-band to permit operation below 700 MHz.
    Type: Grant
    Filed: July 16, 2014
    Date of Patent: March 8, 2016
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: John T. Apostolos, William Mouyos, Judy Feng
  • Patent number: 9252472
    Abstract: A load for traveling microwave energy has an absorptive volume defined by cylindrical body enclosed by a first end cap and a second end cap. The first end cap has an aperture for the passage of an input waveguide with a rotating part that is coupled to a reflective mirror. The inner surfaces of the absorptive volume consist of a resistive material or are coated with a coating which absorbs a fraction of incident RF energy, and the remainder of the RF energy reflects. The angle of the reflector and end caps is selected such that reflected RF energy dissipates an increasing percentage of the remaining RF energy at each reflection, and the reflected RF energy which returns to the rotating mirror is directed to the back surface of the rotating reflector, and is not coupled to the input waveguide. Additionally, the reflector may have a surface which generates a more uniform power distribution function axially and laterally, to increase the power handling capability of the RF load.
    Type: Grant
    Filed: February 5, 2014
    Date of Patent: February 2, 2016
    Assignee: Calabazas Creek Research, Inc.
    Inventors: R. Lawrence Ives, Yosuke M. Mizuhara
  • Patent number: 9007152
    Abstract: A transmission line includes two tapered lines having a tapered planar shape and arranged in parallel, opposite lines provided in opposition to the narrower width sides of the two tapered lines, and a bonding wire for connecting the narrower width sides of the two tapered lines and the opposite lines, wherein the width between two outer edges on the narrower width sides of the two tapered lines arranged in parallel is greater than the width between outer edges on the opposite side of the opposite lines in opposition to the narrower width sides of the two tapered lines.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: April 14, 2015
    Assignee: Fujitsu Limited
    Inventor: Satoshi Masuda
  • Publication number: 20150097634
    Abstract: Embodiments are directed to a structure comprising: a first substrate section having a first thickness, a second substrate section having a second thickness different from the first thickness, a plurality of vias configured to couple a first ground plane associated with the first substrate section and a second ground plane associated with the second substrate section, and a microstrip comprising: a first section associated with the first substrate section and having a first width, a second section associated with the second substrate section and having a second width different from the first width, and a taper between the first width and the second width.
    Type: Application
    Filed: October 8, 2013
    Publication date: April 9, 2015
    Applicant: BLACKBERRY LIMITED
    Inventors: Nasser Ghassemi, Houssam Kanj, Christopher Andrew DeVries, Huanhuan Gu
  • Patent number: 9000863
    Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: April 7, 2015
    Assignee: Nuvotronics, LLC.
    Inventor: David Sherrer
  • Patent number: 8952678
    Abstract: In a gap-mode waveguide embodiment, an interior gap in a tubular waveguide principally condenses a dominant gap mode near the interior gap, and an absorber dissipates electromagnetic energy away from the gap mode. In this manner, the gap mode may dissipate relatively little power in the absorber compared to other modes and propagate with lesser attenuation than all other modes. A gap mode launched into a gap-mode waveguide may provide for low-loss, low-dispersion propagation of signals over a bandwidth including a multimode range of the waveguide. Gap-mode waveguide embodiments of various forms may be used to build guided-wave circuits covering broad bandwidths extending to terahertz frequencies.
    Type: Grant
    Filed: November 21, 2011
    Date of Patent: February 10, 2015
    Inventor: Kirk S. Giboney
  • Publication number: 20150029073
    Abstract: A transmission device for a near field communication (NFC) device includes a matching circuit, a connecting interface with a first width for connecting an operating circuit of the NFC device, a first transmission line electrically connected between an antenna of the NFC device and the matching circuit, and a second transmission line electrically connected between connecting interface and the matching circuit, including an increasing width portion and a constant width portion, wherein a width of the second transmission increases from the first width to a second width within the increasing width portion and keeps the second width within the constant width portion, wherein the second width is greater than and related to the first width.
    Type: Application
    Filed: September 23, 2013
    Publication date: January 29, 2015
    Applicant: Wistron NeWeb Corporation
    Inventors: Mei Tien, Chih-Chun Peng, Liang-Kai Chen, Chin-Shih Lu
  • Patent number: 8933763
    Abstract: Presently disclosed is a matching network provided from a slow wave, wrapped, tapered-transformer transmission line.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: January 13, 2015
    Assignee: Raytheon Company
    Inventor: Bryan Fast
  • Patent number: 8866563
    Abstract: Aspects of the disclosure provide a connector. The connector includes a first signal conductor. The first signal conductor is configured to receive a first electronic signal that includes multiple frequency components. The first signal conductor includes a plurality of conductor portions having portion-dependent impedances. The first signal conductor is configured to transfer the first electronic signal between a via on a circuit board that has a via stub and an electronic device to reduce via stub effects. In addition, in an example, the connector includes a second signal conductor to transfer a second electronic signal. The second electronic signal and the first electronic signal are a pair of differential signals. In an example, the first signal conductor and the second signal conductor have different via stub effects.
    Type: Grant
    Filed: March 16, 2010
    Date of Patent: October 21, 2014
    Assignee: Marvell Israel (M.I.S.L.) Ltd.
    Inventor: Liav Ben Artsi
  • Publication number: 20140292195
    Abstract: In a magnetron and a plasma waveguide through which a microwave oscillated from the magnetron moves, there is provided a plasma waveguide including a plurality of step parts formed at any one side on an inner side surface of the waveguide, and a block part of a predetermined height formed at any other side on the inner side surface of the waveguide, wherein the block part is formed at a side opposite to a boundary part between the plurality of step parts.
    Type: Application
    Filed: March 26, 2014
    Publication date: October 2, 2014
    Applicant: TRIPLE CORES KOREA CO., LTD.
    Inventors: Ik Nyun Kim, Sung Ok Kang, Min Heum Eum
  • Patent number: 8847696
    Abstract: A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: September 30, 2014
    Assignee: QUALCOMM Incorporated
    Inventors: James Leroy Blair, Jeffrey Thomas Smith
  • Publication number: 20140266493
    Abstract: A transition (100, 300) from microstrip to waveguide, the waveguide comprising first (120) and second (105, 105?, 105?) interior surfaces connected by side walls (115, 116) whose height (h1, h2, h3) is the shortest distance between said interior surfaces, and a microstrip structure (130, 135, 110) extending into the closed waveguide (105). The microstrip structure comprises a microstrip conductor (130, 135) on a dielectric layer arranged on said first interior surface. The microstrip conductor (130,135) comprises and is terminated inside the closed waveguide by a patch (135). The height (h1) of the side walls (115, 116) along the distance that the microstrip conductor (130, 135) extends into the closed waveguide (105) being less than half of the greatest height (h3) beyond the microstrip structure's protrusion into the closed waveguide (105).
    Type: Application
    Filed: October 18, 2011
    Publication date: September 18, 2014
    Applicant: TELEFONAKTIEBOLAGET L M ERICSSON (PUBL)
    Inventor: Ola Tageman
  • Patent number: 8792752
    Abstract: Provided is an optical waveguide element module which suppresses reflection of a modulation signal and attenuation of a modulation signal, even when an impedance of a modulation electrode of an optical waveguide element and an impedance of a transmission line for inputting the modulation signal from the external of the optical waveguide element are different from each other. The optical waveguide element module is provided with an optical waveguide element, which has a substrate (1) composed of a material having electro-optical effects, an optical waveguide (2) formed on the substrate, and a modulation electrode (3) which modules optical waves propagating in the optical waveguide; a connector (8), wherein an external signal line which inputs the modulation signal to the modulation electrode is connected to the modulation electrode; and a relay line which connects the connector and the modulation electrode and is formed on a relay substrate (7).
    Type: Grant
    Filed: July 3, 2009
    Date of Patent: July 29, 2014
    Assignee: Sumitomo Osaka Cement Co., Ltd.
    Inventors: Ryo Shimizu, Toru Sugamata
  • Publication number: 20140184362
    Abstract: A high-frequency signal line includes an element assembly including a plurality of flexible insulator layers. a linear signal line provided in or on the element assembly, a first ground conductor provided in or on the element assembly and extending along the signal line, a plurality of second ground conductors provided in or on the element assembly and arranged at predetermined intervals in a direction in which the signal line extends, on a first side in a direction of lamination relative to the signal line, the second ground conductors being opposite to the signal line with at least one of the insulator layers positioned therebetween, and a plurality of first via-hole conductors extending through at least one of the insulator layers so as to connect the first and second ground conductors.
    Type: Application
    Filed: March 4, 2014
    Publication date: July 3, 2014
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Shigeru TAGO, Noboru KATO
  • Publication number: 20140184351
    Abstract: An exemplary embodiment of the present invention provides an improved dielectric waveguide named electrical fiber. The electrical fiber with a metal cladding may isolate the interference of the signals in other wireless channels and adjacent electrical fibers, which typically causes band-limitation problem, for a smaller radiation loss and better signal guiding to lower the total transceiver power consumption as the transmit distance increases. Also, the electrical fiber may have frequency independent attenuation characteristics to enable high data rate transfer with little or even without any additional receiver-side compensation due to vertical coupling of the electrical fiber and an interconnection device.
    Type: Application
    Filed: December 11, 2013
    Publication date: July 3, 2014
    Applicant: Korea Advanced Institute of Science and Technology
    Inventors: Hyeon Min BAE, Ha Il SONG, Huxian JIN
  • Patent number: 8766747
    Abstract: On-chip high performance slow-wave coplanar waveguide structures, method of manufacture and design structures for integrated circuits are provided herein. The structure includes at least one ground and a signal layer provided in a same plane as the at least one ground. The signal layer has at least one alternating wide portion and narrow portion. The wide portion extends toward the at least one ground.
    Type: Grant
    Filed: April 1, 2010
    Date of Patent: July 1, 2014
    Assignee: International Business Machines Corporation
    Inventors: Essam Mina, Guoan Wang
  • Patent number: 8766748
    Abstract: On-chip high performance slow-wave microstrip line structures, methods of manufacture and design structures for integrated circuits are provided herein. The structure includes at least one ground and a signal layer provided in a different plane than the at least one ground. The signal layer has at least one alternating wide portion and narrow portion with an alternating thickness such that a height of the wide portion is different than a height of the narrow portion with respect to the at least one ground.
    Type: Grant
    Filed: December 3, 2010
    Date of Patent: July 1, 2014
    Assignee: International Business Machines Corporation
    Inventors: Essam Mina, Guoan Wang, Wayne H. Woods, Jr.
  • Patent number: 8760245
    Abstract: On-chip high performance slow-wave coplanar waveguide structures, method of manufacture and design structures for integrated circuits are provided herein. The structure includes at least one ground and signal layer provided in a same plane as the at least one ground. The signal layer has at least one alternating wide portion and narrow portion with an alternating thickness. The wide portion extends toward the at least one ground.
    Type: Grant
    Filed: December 3, 2010
    Date of Patent: June 24, 2014
    Assignee: International Business Machines Corporation
    Inventors: Essam Mina, Guoan Wang, Wayne H. Woods, Jr.
  • Publication number: 20140167876
    Abstract: Presently disclosed is a matching network provided from a slow wave, wrapped, tapered-transformer transmission line.
    Type: Application
    Filed: December 14, 2012
    Publication date: June 19, 2014
    Applicant: RAYTHEON COMPANY
    Inventor: Bryan Fast
  • Patent number: 8723616
    Abstract: Provided is a waveguide-microstrip line converter, including: a waveguide; a dielectric substrate that is connected to cover one end of the waveguide; a strip conductor that is disposed on a front surface of the dielectric substrate; a conductor plate that is disposed the front surface of the dielectric substrate, and connected to the strip conductor; a ground conductor that is disposed on a rear surface of the dielectric substrate; and a plurality of connection conductors that connect a periphery of the conductor plate and the ground conductor, in which: the ground conductor has an opening formed therein in a connection region; the strip conductor and the ground conductor form a microstrip line; and the plurality of connection conductors are arranged so that a distance between two lines of the plurality of connection conductors that are aligned in a longitudinal direction of the microstrip line, and disposed on both opposing sides of the conductor plate in a vicinity of a connection portion is narrower than
    Type: Grant
    Filed: February 5, 2010
    Date of Patent: May 13, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Akimichi Hirota, Yukihiro Tahara, Naofumi Yoneda
  • Patent number: 8706050
    Abstract: There are provided a matching circuit which is less prone to impedance mismatch even with variations in pattern dimension, and a wiring board, and also a transmitter, a receiver, a transceiver, and a radar apparatus that succeed in offering stable characteristics with the installation of the matching circuit. Characteristic impedance of a first transmission line including a connection portion is varied between a reflection source including a stub portion and a bonding wire serving as a load. Impedance variation is achieved by varying a distance from the connection portion to a back conductor layer coupled thereto with respect to a distance from the stub portion and a transmission line portion to an inner conductor layer coupled to them.
    Type: Grant
    Filed: July 31, 2009
    Date of Patent: April 22, 2014
    Assignee: Kyocera Corporation
    Inventor: Nobuki Hiramatsu
  • Patent number: 8704718
    Abstract: A radiating element having a transition from a waveguide to a dipole radiator. The radiating element utilizes the electric field of electromagnetic waves propagating in the waveguide to excite a section of a microstrip transmission line that is collinear with the waveguide's propagation direction. A waveguide septum guides the electric field of the electromagnetic waves into the transmission line and provides impedance matching. The transmission line can be formed on a first side of a dielectric substrate having a ground plane on a second side of the substrate. A first dipole leg is formed by making a ninety degree turn in the transmission line. A second dipole leg is extended from the ground plane and turned opposite from the first dipole leg. The transmission line includes a transformer having stepped or gradual changes in width of the transmission line leading to the dipole to provide additional impedance matching.
    Type: Grant
    Filed: September 15, 2010
    Date of Patent: April 22, 2014
    Assignee: Honeywell International Inc.
    Inventor: Michael G. Guler
  • Publication number: 20140091884
    Abstract: A substrate integrated waveguide to air filled waveguide transition includes an electrically conductive top layer, an electrically conductive base layer spaced apart from the top layer, wherein the top and base layers each extend along a length axis from a first end to a second end of the transition, the top layer defining a width axis normal to the length axis in the plane of the top layer, and wherein a separation between the top layer and base layer increases towards the second end in a transition region, wherein the transition further includes a dielectric layer sandwiched between the top and base layers, the dielectric layer including a taper portion having a width which tapers to a point at an end point between first and second ends, the width of the taper decreasing towards the second end.
    Type: Application
    Filed: April 12, 2012
    Publication date: April 3, 2014
    Applicant: FILTRONIC PLC
    Inventor: Gary Flatters