Printed Circuit-type Coil Patents (Class 336/200)
-
Patent number: 11887772Abstract: A surface mount inductor includes a molded body made of a composite material containing magnetic powder, and a metal plate including a first metal plate portion embedded in the molded body and a second metal plate portion extending from the first metal plate portion to an outside of the molded body. The second metal plate portion is extended from a side surface or mounting surface side of the molded body, is arranged along the molded body with a bent portion, and forms an external terminal arranged at least on the mounting surface side of the molded body. The external terminal includes a plating layer on a surface on an opposite side from a surface facing the molded body, and does not include a plating layer on the surface facing the molded body.Type: GrantFiled: February 28, 2019Date of Patent: January 30, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Takumi Arai, Ryuta Uematsu, Koichi Saito, Kazuhide Kudo
-
Patent number: 11889629Abstract: A component carrier includes a base material stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a magnet stack with a plurality of magnetic layers and at least one bonding layer, each of the at least one bonding layer bonding two respectively neighboured magnetic layers, wherein the magnet stack is embedded in the base material stack.Type: GrantFiled: April 28, 2020Date of Patent: January 30, 2024Assignee: AT&SAustria Technologie & Systemtechnik AGInventors: Gerald Weidinger, Gerald Weis, Ivan Salkovic, Karl Kirchheimer
-
Patent number: 11887764Abstract: A laminated electronic component having a coil formed in the laminated body of pluralities of laminated magnetic material layers and conductor patterns by electrically connecting the conductor patterns adjacent to each other via the magnetic material layers. The magnetic material layers contain a metal magnetic material. The coil has a first end portion close to a bottom surface of the laminated body and a second end portion distant from the bottom surface of the laminated body. The first end portion is electrically connected to a first external terminal disposed on the bottom surface of the laminated body. The second end portion is electrically connected to a second external terminal disposed on the bottom surface of the laminated body via an electrode disposed on a side surface of the laminated body. The electrode is covered with an insulator film.Type: GrantFiled: February 17, 2021Date of Patent: January 30, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Yutaka Noguchi, Takeshi Kobayashi, Makoto Yamamoto
-
Patent number: 11881343Abstract: A method for constructing a solenoid inductor includes positioning an inner winding substantially around a magnetic core, positioning an outer winding substantially around the inner winding, and using a layered process to perform said positioning the inner and outer windings. The layered process includes processing a first conducting layer as a bottom layer of the outer winding, above processing a first dielectric layer, above processing a second conducting layer as a bottom layer of the inner winding, above processing a second dielectric layer, above processing a magnetic core layer, above processing a third dielectric layer, above processing a third conducting layer as a top layer of the inner winding, above processing a fourth dielectric layer, above processing a fourth conducting layer as a top layer of the outer winding, above processing a fifth dielectric layer, and the inner and outer windings are electrically connected.Type: GrantFiled: February 11, 2021Date of Patent: January 23, 2024Assignee: Cirrus Logic, Inc.Inventors: Aleksey S. Khenkin, David Patten, Jun Yan
-
Patent number: 11881342Abstract: A coil electronic component includes a support substrate having a first surface and a second surface opposing each other, a coil pattern disposed on the first surface of the support substrate, first and second conductive vias penetrating the support substrate and connected to one end and the other end of the coil pattern, respectively, an encapsulant encapsulating the support substrate and the coil pattern, and first and second external electrodes disposed on a lower surface of the encapsulant and electrically connected to the first and second conductive vias, respectively. The support substrate is disposed between the lower surface of the encapsulant and the coil pattern.Type: GrantFiled: August 28, 2019Date of Patent: January 23, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTDInventors: Kwang Il Park, Jong Min Lee
-
Patent number: 11875931Abstract: A coil component includes a winding-type coil including a coil portion and first and second lead-out portions respectively connected to the coil portion; a body in which the winding-type coil is disposed, the first and second lead-out portions of the winding-type coil exposed from the body; a noise removal portion including a pattern portion spaced apart from a metal wire of the winding-type coil in the body and having both end portions spaced apart from each other to have an open-loop, and a third lead-out portion connected to the pattern portion and exposed from the body; an insulating layer disposed between the winding-type coil and the noise removal portion; and first to third external electrodes arranged on the body to be spaced apart from each other and respectively connected to the first to third lead-out portions.Type: GrantFiled: August 11, 2020Date of Patent: January 16, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Mi Yoo, Dong Hwan Lee, Hwi Dae Kim, Sang Soo Park, Chan Yoon, Dong Jin Lee
-
Patent number: 11875927Abstract: A coil component includes a core including a winding core portion and a first flange portion that is disposed on a first end portion of the winding core portion in a direction in which the winding core portion extends. A first curved portion is formed at a connection between a bottom surface of the winding core portion and the first flange portion. A ratio of a length of the first curved portion in a height direction to a distance in the height direction between the bottom surface and a first terminal electrode is no less than 20% and no more than 60% (i.e., from 20% to 60%).Type: GrantFiled: April 16, 2020Date of Patent: January 16, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Takashi Sukegawa, Yasuhiro Itani, Takanori Suzuki, Yuuki Kitadai, Yoshifumi Maki, Reiichi Matsuba
-
Patent number: 11876449Abstract: An inductor component includes a composite body that includes a plurality of composite layers each including a composite material of an inorganic filler and a resin; and a plurality of spiral wires that each are stacked on the composite layer, the spiral wires each being covered with the other composite layer. The average particle diameter of the inorganic filler is equal to or smaller than 5 ?m, the wire pitch of the spiral wires is equal to or smaller than 10 ?m, and the interlayer pitch between adjacent spiral wires is equal to or smaller than 10 ?m.Type: GrantFiled: June 5, 2020Date of Patent: January 16, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Akinori Hamada, Yoshimasa Yoshioka, Hayami Kudo, Shinji Yasuda
-
Patent number: 11875932Abstract: A wireless charging coil includes a first wire and a second wire, and the first wire and the second wire are both spirally wound into coils. The first wire includes a first wire part and a second wire part that are connected to each other, and the second wire includes a third wire part and a fourth wire part that are connected to each other. The first wire part is located in a first layer, the second wire part is located in a second layer, the third wire part is located in the first layer, and the fourth wire part is located in the second layer. The first layer and the second layer are two adjacent layers.Type: GrantFiled: March 25, 2021Date of Patent: January 16, 2024Assignee: VIVO MOBILE COMMUNICATION CO., LTD.Inventor: Jun Zhang
-
Patent number: 11871113Abstract: A coil member according to an embodiment comprises: a substrate having a top surface and a bottom surface opposite the top surface; a first coil electrode disposed on the top surface of the substrate and including a first pattern electrode; and a second coil electrode disposed on the bottom surface of the substrate and including a second pattern electrode. The first coil electrode includes: a first outermost pattern electrode; a first innermost pattern electrode; and a central pattern electrode between the first outermost pattern electrode and the first innermost pattern electrode, wherein the line width of at least one of the first outermost pattern electrode or the first innermost pattern electrode is greater than the line width of the central pattern electrode.Type: GrantFiled: October 8, 2020Date of Patent: January 9, 2024Assignee: LG INNOTEK CO., LTD.Inventors: Seung Jin Lee, Hyung Kyu Yoon, Hye Yeong Jung
-
Patent number: 11869700Abstract: An inductor device includes first trace, second trace, third trace, fourth trace, first capacitor, and second capacitor. One terminal of each of the at least two sub-traces of first trace are coupled to each other at first node. One terminal of each of the at least two sub-traces of second trace are coupled to each other at second node. One terminal of third trace is coupled to second trace, and another terminal of third trace is coupled to first input/output terminal. One terminal of fourth trace is coupled to first trace, and another terminal of fourth trace is coupled to second input/output terminal. First capacitor is coupled to first node and second node. Second capacitor is coupled between first node and first input/output terminal, or coupled between first node and second input/output terminal, or coupled between first input/output terminal and second input/output terminal.Type: GrantFiled: September 9, 2020Date of Patent: January 9, 2024Assignee: REALTEK SEMICONDUCTOR CORPORATIONInventors: Hsiao-Tsung Yen, Jian-You Chen, Ka-Un Chan
-
Patent number: 11870340Abstract: An improved distributed-output multi-cell-element power converter utilizes a multiplicity of magnetic core elements, switching elements, capacitor elements and terminal connections in a step and repeat pattern. Stepped secondary-winding elements reduce converter output resistance and improve converter efficiency and scalability to support the high current requirements of very large scale integrated (“VLSI”) circuits. Some embodiments of the multi-cell converter comprise integrated secondary-side switching devices comprising control circuitry that monitors circuit conditions to determine when the switching device is to be ON and OFF, thereby eliminating the need for secondary-side switch control signals and signal buses, primary-to-secondary interface circuitry and centralized drive circuitry.Type: GrantFiled: September 14, 2021Date of Patent: January 9, 2024Assignee: Vicor CorporationInventors: Patrizio Vinciarelli, Andreas Gerasimos Ladas
-
Patent number: 11869698Abstract: A coil component includes a body having one surface and the other surface, opposing each other, and one side surface and the other side surface, each connecting the one surface and the other surface to each other, opposing each other, a recess formed in each of the one side surface and the other side surface of the body to extend to the one surface of the body, a support substrate disposed inside the body, a coil portion, disposed on the support substrate, having one end portion and the other end portion exposed to the recess, an oxide insulating layer disposed on a surface of the body, and a first insulating layer disposed along a surface of the oxide insulating layer to cover the surface of the body.Type: GrantFiled: January 27, 2020Date of Patent: January 9, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan Yang, Seung Min Lee, Byung Soo Kang, Byeong Cheol Moon, Yong Hui Li
-
Patent number: 11869687Abstract: A coil component includes a core including a winding core portion and a pair of flange portions provided at both ends of the winding core portion, electrode portions provided in the flange portions, a wire wound around the winding core portion, and a magnetic plate fixed to the flange portions. The magnetic plate includes an annular first planar portion, a second planar portion that is located inside the inner circumference of the first planar portion and has a step between the first and the second planar portions, and a connection surface portion connecting the inner circumference of the first planar portion to the outer circumference of the second planar portion. The connection surface portion is configured by annularly disposing at least three slopes inclined with respect to the direction orthogonal to the first planar portion and has chamfered portions each being disposed between adjacent slopes.Type: GrantFiled: September 1, 2021Date of Patent: January 9, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Haruki Nakashima, Ryuta Uematsu, Yuki Kanbe
-
Patent number: 11869855Abstract: In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.Type: GrantFiled: September 26, 2022Date of Patent: January 9, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Zhemin Zhang, Kenji Otake, Yi Yan, Jeffrey Morroni, Yuki Sato, Takafumi Ando
-
Patent number: 11862389Abstract: A magnetic device includes a magnetic core, a plurality of first windings forming respective first winding turns, and a second winding forming a second winding turn. Each first winding turn is within the second winding turn, as seen when the magnetic device is viewed cross-sectionally in a first direction. Yet another magnetic device includes a magnetic core, one or more first windings, and one or more second windings magnetically isolated from the one or more first windings.Type: GrantFiled: July 12, 2021Date of Patent: January 2, 2024Assignee: VOLTERRA SEMICONDUCTOR LLCInventors: Alexandr Ikriannikov, Anthony J. Stratakos
-
Patent number: 11862380Abstract: Anchor conductors extending from internal terminal conductors and being in contact with a component body are provided inside the component body. The anchor conductors are provided so as not to be connected to a coil conductor including a circulating portion, and so as not to be exposed on an outer surface of the component body. The anchor conductors are in contact with the component body to thereby enhance fixing force of the internal terminal conductors to the component body.Type: GrantFiled: September 7, 2022Date of Patent: January 2, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Takashi Mizukami, Yasuo Matsumoto
-
Patent number: 11862385Abstract: An electromagnetic device includes a substrate, magnetic cores, transmission line layers, and conductive members. The substrate is provided with annular receiving grooves for accommodating the magnetic cores; the substrate is divided into a central portion and a peripheral portion; inner and outer via holes are respectively formed on the central portion and the peripheral portion, respectively; the transmission line layers each including wire patterns are respectively provided on opposite sides of the substrate; and the conductive members are sequentially connected to the wire patterns on both sides of the substrate to form a transformer and/or a filter; the electromagnetic device has a first side provided with a slot and a second side parallel to the transmission line layers; and first conductive pins electrically connected to the at least one transmission line layers are provided on at least one of the side wall surrounding the slot and a second side.Type: GrantFiled: November 6, 2020Date of Patent: January 2, 2024Assignee: SHENNAN CIRCUITS CO., LTD.Inventors: Weijing Guo, Yuhua Zeng, Hua Miao, James Quilici
-
Patent number: 11854730Abstract: There is provided a coil component including a coil portion that has at least one layer of planar coil including a coil-wound portion and an insulative layer which covers the periphery of the coil-wound portion, a covering portion that covers the coil portion and is constituted of a mixture including magnetic fillers and resin, and a conductor post that is penetratingly provided inside the covering portion and extends from the coil-wound portion to an upper surface of the covering portion along an axial direction of the planar coil. The conductor post has a post portion which extends from the coil-wound portion in the axial direction of the planar coil, and a lid portion which is exposed from the covering portion and extends from an end portion of the post portion on the upper surface side along a surface direction of the upper surface.Type: GrantFiled: November 19, 2021Date of Patent: December 26, 2023Assignee: TDK CORPORATIONInventors: Makoto Endo, Mitsunori Hiraoka, Kazuhiko Ito
-
Patent number: 11854733Abstract: In a coil component, a double coil is configured of a first coil portion and a second coil portion, and a first through conductor of the first coil portion and a second through conductor of the second coil portion are adjacent to each other. Thus, the first coil portion and the second coil portion have enhanced magnetic coupling at locations (that is, the first through conductor and the second through conductor) at which planar coil patterns of upper and lower surfaces of an insulating substrate are connected, in addition to magnetic coupling in the planar coil patterns wound around a through hole. Therefore, according to the coil component, a high coupling coefficient between the first coil portion and the second coil portion is realized.Type: GrantFiled: December 1, 2020Date of Patent: December 26, 2023Assignee: TDK CORPORATIONInventors: Masataro Saito, Masazumi Arata, Hokuto Eda, Kohei Takahashi, Takamasa Iwasaki
-
Patent number: 11851762Abstract: A device, for depositing a layer on a substrate by supplying one or more process gases to a process chamber, includes a susceptor and one or more transmitter coils. The susceptor bearing the substrate can be heated to a process temperature by means of an electromagnetic alternating field generated by the one or more transmitter coils. The one or more transmitter coils have a coating that consists of tin and nickel in order to provide a corrosion-resistant coating, which simultaneously has low emissivity and is therefore effective in the presence of chlorine compounds and moisture.Type: GrantFiled: July 3, 2018Date of Patent: December 26, 2023Assignee: AIXTRON SEInventor: Hans-Gerd Fuss
-
Patent number: 11855231Abstract: A distributed power harvesting system including multiple direct current (DC) power sources with respective DC outputs adapted for interconnection into a interconnected DC power source output. A converter includes input terminals adapted for coupling to the interconnected DC power source output. A circuit loop sets the voltage and current at the input terminals of the converter according to predetermined criteria. A power conversion portion converts the power received at the input terminals to an output power at the output terminals. A power supplier is coupled to the output terminals. The power supplier includes a control part for maintaining the input to the power supplier at a predetermined value. The control part maintains the input voltage and/or input current to the power supplier at a predetermined value.Type: GrantFiled: September 14, 2022Date of Patent: December 26, 2023Assignee: Solaredge Technologies Ltd.Inventors: Guy Sella, Lior Handelsman, Yoav Galin, Amir Fishelov, Meir Adest
-
Patent number: 11854732Abstract: Disclosed herein is an apparatus that includes a substrate having first and second surfaces opposite to each other, a first coil pattern formed on the first surface of the substrate, and a second coil pattern formed on the second surface of the substrate. The first coil pattern includes first and second lines, and the second coil pattern includes third and fourth lines. The first line is greater in a number of turn than the second line, and the third line is greater in a number of turn than the fourth line. The first line is connected to the fourth line, and the third line is connected to the second line.Type: GrantFiled: October 30, 2019Date of Patent: December 26, 2023Assignee: TDK CorporationInventors: Junpei Hayama, Noritaka Chiyo, Shigeru Kaneko, Tomohiro Moriki, Takahiro Ohishi, Toshio Tomonari
-
Patent number: 11848136Abstract: A coil component includes a body having one end and the other end opposing each other, a support substrate disposed inside the body, a coil portion, disposed on at least one surface of the support substrate, in which an end portion of an outermost turn is disposed closer to the one surface of the body than to the other surface of the body, a lead-out portion connected to the outermost turn of the coil portion and exposed to the one surface of the body, and an anchor portion connected to the lead-out portions and including a via pad disposed between the lead-out portion and the coil portion inside the body.Type: GrantFiled: November 19, 2020Date of Patent: December 19, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun Kim, Byeong Cheol Moon
-
Patent number: 11848140Abstract: Various examples of an integrated parallel matrix transformer and inductor are disclosed herein. In one aspect, the transformer includes a first magnetic core having a first set of pillars of a first transformer and a second set of pillars of a second transformer and a second magnetic core having a first and second inductor pillar. The first and second magnetic cores can be separate or integrated into one core. The transformer also includes a planar winding structure. The planar winding structure may include a primary winding and a plurality of secondary windings. The primary winding can be configured to equally divide a primary current. The primary winding can extend a number of turns to conduct half of the primary current around the first inductor pillar and the first set of pillars and to conduct half of the primary current around the second inductor pillar and the second set of pillars.Type: GrantFiled: June 11, 2020Date of Patent: December 19, 2023Assignee: VIRGINIA TECH INTELLECTUAL PROPERTIES, INC.Inventors: Mohamed Hassan Abouelella Ahmed, Fred C. Lee, Qiang Li
-
Patent number: 11848135Abstract: A coil component includes a core including a winding core portion, a first flange portion, and a second flange portion, and a first wire and a second wire that are wound around the winding core portion in the same direction and that form a winding portion. The winding portion includes a second intersecting portion along a third side surface of the winding core portion at a position on the winding portion nearest to the second flange portion.Type: GrantFiled: September 26, 2022Date of Patent: December 19, 2023Assignee: Murata Manufacturing Co., Ltd.Inventors: Yasuhiro Itani, Takashi Sukegawa, Takanori Suzuki, Yuuki Kitadai, Yoshifumi Maki, Reiichi Matsuba
-
Patent number: 11848138Abstract: A coil component includes a drum core including a winding core portion and flange portions on opposite sides of the winding core portion in its axial direction, a wire wound around the winding core portion, and a sheet core arranged on a top surface of each of the flange portions and on the wire with an adhesive interposed therebetween. The adhesive contains no filler. A shortest distance between the top surface of the flange portion and the sheet core is not smaller than about 3 ?m.Type: GrantFiled: January 9, 2019Date of Patent: December 19, 2023Assignee: Murata Manufacturing Co., Ltd.Inventor: Hiroyuki Tei
-
Patent number: 11848290Abstract: A semiconductor structure includes a first inductor, a second inductor, and a first input/output (I/O) pad. The first I/O pad is coupled to the first inductor and the second inductor. The first I/O pad, a first central axis of a first magnetic field of the first inductor, and a second central axis of a second magnetic field of the second inductor are disposed sequentially along a first direction.Type: GrantFiled: March 31, 2021Date of Patent: December 19, 2023Assignee: REALTEK SEMICONDUCTOR CORPORATIONInventors: Cheng-Wei Luo, Chieh-Pin Chang, Kai-Yi Huang, Ta-Hsun Yeh
-
Patent number: 11848144Abstract: One object of the present invention is to provide an electronic component less prone to migration of impurity atoms between a conductor and an external electrode. A coil component as an electronic component includes: a base body; a conductor; a first external electrode electrically connected to the conductor; a second external electrode electrically connected to the conductor; and a metal film positioned between the conductor and the first external electrode, wherein the metal film contains metal particles configured such that an average of ?/? is 0.8 to 1.2, where for each of the metal particles, ? is a dimension of the metal particle in a direction horizontal to a boundary interface, and ? is a dimension of the metal particle in a direction perpendicular to the boundary interface.Type: GrantFiled: December 18, 2020Date of Patent: December 19, 2023Assignee: TAIYO YUDEN CO., LTD.Inventor: Hirotaka Wakabayashi
-
Patent number: 11848147Abstract: A coil component includes a core including a winding core portion and a first flange portion, a first wire and a second wire that are wound around the winding core portion in the same direction, and a first terminal electrode that is disposed on the first flange portion and that is connected to a first end portion of the first wire. The shape of an outer edge of the first terminal electrode includes a convex curve.Type: GrantFiled: April 16, 2020Date of Patent: December 19, 2023Assignee: Murata Manufacturing Co., Ltd.Inventors: Yoshifumi Maki, Reiichi Matsuba, Takashi Sukegawa, Yasuhiro Itani, Takanori Suzuki, Yuuki Kitadai
-
Patent number: 11848482Abstract: A mobile terminal, including an NFC antenna. The NFC antenna includes a feed, an inductor and a capacitor that are connected in parallel to the feed. The NFC antenna includes one or more of a first distributed inductor, a second distributed inductor, a third distributed inductor, and a fourth distributed inductor. The first distributed inductor is located between the feed and the inductor, the second distributed inductor is located between the inductor and a first ground point, the third distributed inductor is located between the feed and the capacitor, and the fourth distributed inductor is located between the capacitor and a second ground point. The inductor includes a lumped inductor and a metal segment connected to the lumped inductor in series.Type: GrantFiled: July 30, 2019Date of Patent: December 19, 2023Assignee: Honor Device Co., Ltd.Inventor: Haikun Wang
-
Patent number: 11848145Abstract: A coil includes a winding section that are formed by winding a conductive wire having an insulating cover and a pair of opposite principal surfaces into an upper stage and a lower stage that are connected to each other by an innermost turn of the conductive wire that serves as a transition section while both ends of the conductive wire are located at an outermost turn of the conductive wire. The coil also includes a pair of lead-out portions that are taken from respective outermost turns of the upper stage and the lower stage and that continue to respective ends of the conductive wire. In the coil, at least part of the transition section includes a widened portion, and a width of the widened portion of the conductive wire is greater than a width of the conductive wire at a position other than the widened portion.Type: GrantFiled: October 9, 2020Date of Patent: December 19, 2023Assignee: Murata Manufacturing Co., Ltd.Inventor: Takeo Ohaga
-
Patent number: 11844177Abstract: A DC/DC converter component has a reduced mounting area and includes an inductor component; a semiconductor integrated circuit including a switch circuit connected to the inductor component, and a control circuit that controls the switch circuit; and a package substrate, to which the semiconductor integrated circuit is mounted, having a mounting face that opposes an other substrate when the package substrate is mounted to the other substrate. The inductor component includes an element body, and a plurality of inductor wiring lines, each extending in the element body and in parallel with a main face of the element body. A value of inductance of a second inductor wiring line is 10% or more greater than a value of inductance of a first inductor wiring line. The inductor component has a dimension equal to or less than 0.25 millimeters in a thickness direction, and is mounted to the package substrate.Type: GrantFiled: August 24, 2021Date of Patent: December 12, 2023Assignee: Murata Manufacturing Co., Ltd.Inventors: Yoshimasa Yoshioka, Kouji Yamauchi
-
Patent number: 11842846Abstract: A laminated electronic component includes a body including a magnetic layer containing magnetic particles; a coil provided within the body; and outer electrodes provided on a bottom surface of the body and each electrically connected to any one of end portions of the coil. The coil is formed by connecting a plurality of coil conductors stacked within the body, and the body includes a non-magnetic layer present between one of the outer electrodes and one of the coil conductors opposing the one of the outer electrodes.Type: GrantFiled: October 3, 2019Date of Patent: December 12, 2023Assignee: Murata Manufacturing Co., Ltd.Inventors: Mitsuhiro Sato, Daisuke Takahashi, Ryohei Kawabata
-
Patent number: 11842833Abstract: A coil component includes a magnetic portion that includes metal particles and a resin material, a coil conductor embedded in the magnetic portion, and outer electrodes electrically connected to the coil conductor. The average particle diameter of the metal particles in the magnetic portion is 1 ?m or more and 5 ?m or less, and the CV value of the metal particles is 50% or more and 90% or less.Type: GrantFiled: September 30, 2020Date of Patent: December 12, 2023Assignee: Murata Manufacturing Co., Ltd.Inventors: Takuya Ishida, Gota Shinohara
-
Patent number: 11842842Abstract: An inductor component including a magnetic layer in which a magnetic metal powder is dispersedly present in a base material made of an insulation material and an inductor wiring line laminated on a surface of the magnetic layer. The inductor wiring line includes an anchor portion extending from a main face of the inductor wiring line on a side of the magnetic layer and covering a surface of the magnetic metal powder in the magnetic layer.Type: GrantFiled: February 11, 2021Date of Patent: December 12, 2023Assignee: Murata Manufacturing Co., Ltd.Inventors: Yoshimasa Yoshioka, Hiroki Imaeda, Shinji Otani
-
Patent number: 11837877Abstract: This application discloses a coil module, which includes: an insulation layer, a first planar coil winding, and a second planar coil winding, one turn of coil of the first planar coil winding includes a first portion, a second portion, and a first connection part, and one turn of coil of the second planar coil winding includes a third portion, a fourth portion, and a second connection part. The first connection portion connects an outer side part of the first portion and an inner side part of the second portion, the second connection portion connects an inner side part of the third portion and an outer side part of the fourth portion, and there is an overlap between a projection of the first connection portion on a plane of the insulation layer and a projection of the second connection portion on the plane of the insulation layer.Type: GrantFiled: September 25, 2020Date of Patent: December 5, 2023Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Changsheng Pei, Yongfa Zhu, Zhiqiang Zeng, Xiaowei Chen
-
Patent number: 11830674Abstract: A ceramic electronic device includes a multilayer chip in which a plurality of dielectric layers and a plurality of internal electrode layers are stacked. The plurality of internal electrode layers include Au. Each of the plurality of internal electrode layers includes an Au-containing layer of which an Au concentration with respect to all detected elements is 5 at % or more, on an interface between the each of the plurality of internal electrode layers and a dielectric layer next to the each of the plurality of internal electrode layers. A relationship of C?500×t/T is satisfied when a thickness of the each of the plurality of internal electrode layers is T nm, a thickness of the Au-containing layer is t nm, and an Au concentration with respect to a total of Ni and Au in a whole of the each of the plurality of internal electrode layers is C at %.Type: GrantFiled: April 25, 2022Date of Patent: November 28, 2023Assignee: TAIYO YUDEN CO., LTD.Inventors: Hidetoshi Masuda, Minoru Ryu, Teruo Atsumi
-
Patent number: 11831153Abstract: A tuned single-coil inductor is implemented between a signal driver output and external contact of an ESD-protected integrated circuit (IC) die and more specifically between the parasitic capacitances of the signal driver and the contact-coupled ESD (electrostatic discharge) element to form a Pi (?) filter that enhances signaling bandwidth at the target signaling rate of the IC die. The signal driver may be implemented with output-stage data serialization circuitry disposed in series between source terminals of a thick-oxide drive transistor and a power rail to avoid explicit level-shifting circuitry between the relatively low core voltage domain and relatively high I/O voltage domain.Type: GrantFiled: July 28, 2020Date of Patent: November 28, 2023Assignee: Cadence Design Systems, Inc.Inventors: Phalguni Bala, Manjunath Karikatti, Navin Kumar Mishra
-
Patent number: 11830664Abstract: A multilayer coil component 1 includes an element body 2, a coil 8, and a terminal electrode 4 and a terminal electrode 5. Each of the terminal electrode 4 and the terminal electrode 5 is disposed over at least the end surfaces 2a and 2b and a main surface 2d. Each of the terminal electrode 4 and the terminal electrode 5 and at least a part of the coil 8 overlap when viewed from the facing direction of the pair of side surfaces 2e and 2f. Each of the terminal electrode 4 and the terminal electrode 5 and the coil 8 do not overlap when viewed from the facing direction of the pair of end surfaces 2a and 2b.Type: GrantFiled: January 17, 2020Date of Patent: November 28, 2023Assignee: TDK CORPORATIONInventors: Hajime Kato, Hidekazu Sato, Makoto Yoshino, Kazuya Tobita, Yuto Shiga, Youichi Kazuta, Noriaki Hamachi
-
Patent number: 11830652Abstract: A coil component and a method for manufacturing the same are provided, and the coil component includes a body portion including a magnetic material, a support member disposed in the body portion, first and second conductor patterns disposed in both sides of the support member, opposing each other, a recess portion formed in a side surface of the support member, a via conductor disposed in the recess portion and connecting the first and second conductor patterns to each other, and a via pad disposed in an end portion of each of the first and second conductor patterns to connect the first and second conductor patterns to the via conductor, and having a line width greater than line widths of the first and second conductor patterns.Type: GrantFiled: July 31, 2019Date of Patent: November 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun Kim, Byeong Cheol Moon
-
Patent number: 11830829Abstract: Techniques and mechanisms for providing an inductor with an integrated circuit (IC) die. In an embodiment, the IC die comprises integrated circuitry and one or more first metallization layers. The IC die is configured to couple to a circuit device including one or more second metallization layers, where such coupling results in the formation of an inductor which is coupled to the integrated circuitry. One or more loop structures of the inductor each span both some or all of the one or more first metallization layers and some or all of the one or more second metallization layers. In another embodiment, the IC die or the circuit device includes a ferromagnetic material to concentrate a magnetic flux which is provided with the inductor.Type: GrantFiled: June 9, 2022Date of Patent: November 28, 2023Assignee: Intel CorporationInventors: Wilfred Gomes, Mark Bohr, Doug Ingerly, Rajesh Kumar, Harish Krishnamurthy, Nachiket Venkappayya Desai
-
Patent number: 11830648Abstract: Inductor device includes first and a second coils. First coil is wound into plural first circles. Second coil is wound into plural second circles. First connection member is coupled to first circle between outermost and innermost sides among first circles located at first area and first circle on outermost side among first circles located at second area. Second connection member is coupled to second circle on outermost side among second circles located at first area and second circle between outermost and innermost sides among second circles located at second area. At least two first circles of first circles are located at first area, and half of first circle of first circles is located at second area. Half of second circle of second circles is located at first area, and at least two second circles of second circles are located at second area.Type: GrantFiled: September 17, 2020Date of Patent: November 28, 2023Assignee: REALTEK SEMICONDUCTOR CORPORATIONInventors: Chieh-Pin Chang, Cheng-Wei Luo, Kai-Yi Huang, Ta-Hsun Yeh
-
Patent number: 11830656Abstract: A transformer device includes a first coil and a second coil. The first coil includes a number of first circles. The second coil includes a number of second circles. A first side of a first one of the first coil is adjacent to one of the first coil, and a second side of the first one of the first coil is adjacent to one of the second coil. A first side and a second side of a second one of the first coil are adjacent to one of the second coil, respectively.Type: GrantFiled: September 29, 2020Date of Patent: November 28, 2023Assignee: REALTEK SEMICONDUCTOR CORPORATIONInventors: Hsiao-Tsung Yen, Ka-Un Chan
-
Patent number: 11830643Abstract: A coil electronic component includes a body including magnetic particles and an insulating resin, and a coil portion disposed within the body. The body has a multilayer structure including a core portion covering the coil portion and a cover portion covering the core portion. The magnetic particles included in the core portion have a distribution of a particle size having a D50 of 3.5 ?m or less.Type: GrantFiled: September 6, 2019Date of Patent: November 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Il Jin Park, Joong Won Park, Se Hyung Lee, Soon Kwang Kwon
-
Patent number: 11830660Abstract: A coil electronic component is provided, the coil electronic component including a body having a laminate structure formed of a plurality of conductor patterns disposed therein, and including an insulating layer disposed between the plurality of conductor patterns, and an external electrode disposed externally of the body. Portions of the plurality of conductor patterns include a coil pattern and a lead-out pattern connecting the coil pattern and the external electrode, the lead-out pattern includes a first metal layer and a second metal layer disposed on the first metal layer, and a pore density of the first metal layer is higher than a pore density of the second metal layer.Type: GrantFiled: October 15, 2019Date of Patent: November 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Hyung Sang Jeon
-
Patent number: 11830655Abstract: A coil component includes a body, a support substrate disposed in the body, and a coil portion including a first coil pattern on one surface of the support substrate, a first lead-out pattern extending from the first coil pattern to an end surface of the body, and a second lead-out pattern disposed on the one surface of the support substrate to be spaced apart from the first coil pattern and extending to another end surface of the body. A reinforcing pattern portion is disposed between each lead-out pattern and the one surface of the support substrate, first and second slit portions are disposed in edge portions of the body and respectively expose the first and second lead-out patterns, and first and second external electrodes are respectively disposed on the inner surfaces of the first and second slit portions and respectively connected to the first and second lead-out patterns.Type: GrantFiled: August 11, 2020Date of Patent: November 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan Yang, Joung Gul Ryu, Ji Man Ryu, Byung Soo Kang, Byeong Cheol Moon
-
Patent number: 11817252Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: GrantFiled: January 11, 2022Date of Patent: November 14, 2023Assignee: TDK CORPORATIONInventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito
-
Patent number: 11817251Abstract: An electronic component includes an internal electrode and an external electrode electrically connected thereto. The external electrode includes a conductive base having a porous structure and a resin filled in voids in the porous structure of the conductive base. The electronic component further includes a connection layer disposed between the internal electrode and the external electrode.Type: GrantFiled: October 29, 2021Date of Patent: November 14, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kun Hoi Koo, Byung Woo Kang, Ji Hye Han, Bon Seok Koo
-
Patent number: 11817249Abstract: An inductor component includes an element body including insulating layers laminated on one another, and a coil conductor layer winding on a main surface of one of the insulating layers. The coil conductor layer contains sulfur.Type: GrantFiled: November 30, 2018Date of Patent: November 14, 2023Assignee: Murata Manufacturing Co., Ltd.Inventors: Hiromi Miyoshi, Kenta Kondo, Yasunari Nakashima