Printed Circuit-type Coil Patents (Class 336/200)
  • Patent number: 11810704
    Abstract: A multilayer coil component includes an element body having a multilayer structure including a first element body portion formed of a ferrite element body material, and a second element body portion laminated on the first element body portion and formed of a ferrite element body material having a composition different from the ferrite element body material forming the first element body portion, a multilayer coil having an axis parallel to a lamination direction of the element body, and a stress alleviation portion provided in an inner region of the multilayer coil when viewed from the lamination direction. In the multilayer coil component, the stress alleviation portion is provided in the inner region of the multilayer coil in which a stress tends to be concentrated to alleviate the stress in the inner region of the multilayer coil, and thereby occurrence of cracking in the element body can be suppressed.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: November 7, 2023
    Assignee: TDK CORPORATION
    Inventors: Hidekazu Sato, Takahiro Sato, Hitoshi Kudo, Takashi Endo, Yusuke Nagai, Tatsuro Suzuki, Hiroko Korikawa, Kenji Komorita
  • Patent number: 11810707
    Abstract: A coil component according to one embodiment of the present invention includes a magnetic base body, a first external electrode, a second external electrode, a coil conductor extending around a coil axis, and an insulator. The insulator is provided between the flange portion of the second external electrode and the second coil pattern.
    Type: Grant
    Filed: February 14, 2022
    Date of Patent: November 7, 2023
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Ichiro Yokoyama
  • Patent number: 11811381
    Abstract: First and second coils have winding axes in a laminated direction of base material layers and are magnetically coupled to each other. First and second capacitors are positioned in the laminated direction on layers different from layers on which the first and second coils are provided. The first and second coils are connected so that the winding directions of the first and second coils are opposite. The second capacitor is connected in parallel to a series circuit of the first coil and the second coil. The first capacitor is connected between a position where the first coil is connected to the second coil and a reference potential electrode. Mutual inductance caused by coupling between the first and second coils and the first capacitor provides a first attenuation pole and a parallel connection circuit of the series circuit and the second capacitor provides a second attenuation pole.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: November 7, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Satoshi Shigematsu, Kenichi Ishizuka
  • Patent number: 11804323
    Abstract: An electronic component includes a marker excellent in visibility and prevented from peeling off. That is, an electronic component is provided with an element body having a conductor inside; an insulating film and at least one marker disposed on a surface of the element body; and an external electrode disposed on the element body or the insulating film. The marker is exposed on a surface of the electronic component, and when the maximum height of the marker on the surface of the element body on which the marker is disposed is Mmax and the maximum height of the insulating film is Imax, Mmax and Imax satisfy the following expression: Mmax?Imax.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: October 31, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Minoru Gibu
  • Patent number: 11804456
    Abstract: A microelectronics package, comprising a substrate comprising a first bondpad and a second bondpad over a dielectric. An inductor comprising at least one wire extends over the dielectric. The at least one wire has a first end coupled to the first bondpad and a second end coupled to the second bondpad, and an inductor core layer over the dielectric. The inductor core layer comprises a magnetic material. At least a portion of the inductor extends within the inductor core layer.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: October 31, 2023
    Assignee: Intel Corporation
    Inventors: William J. Lambert, Omkar Karhade, Martin Rodriguez, Gregorio R. Murtagian
  • Patent number: 11804324
    Abstract: A coil component includes a body including a coil having a top coil and a bottom coil connected to each other through a via and an external electrode disposed on an external surface of the body to be connected to the coil. A first insulating layer is disposed on a surface of the top coil, and a second insulating layer is disposed on a surface of the bottom coil. The first and second insulating layers are disposed to extend between the top coil and the bottom coil.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: October 31, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hun Kim, Byeong Cheol Moon
  • Patent number: 11799516
    Abstract: A radio frequency circuit includes a first acoustic wave filter that is connected to a common terminal and includes a first acoustic wave resonator, a first LC filter that is connected to the common terminal via the first acoustic wave filter and includes at least one of an inductor or a capacitor, a second acoustic wave filter that is connected to the common terminal and includes a second acoustic wave resonator, and a second LC filter that is connected to the common terminal via the second acoustic wave filter and includes at least one of an inductor or a capacitor.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: October 24, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Morio Takeuchi, Syunsuke Kido
  • Patent number: 11799504
    Abstract: A band-switching network includes a dual-band balun and a switch network. The dual-band balun includes a first output and a second output. The switch network includes a first switch and a second switch in which an input to the first switch is coupled to the first output and an input to the second switch is coupled to the second balanced output. The dual-band balun further includes a primary coil, a first secondary coil and a second secondary coil in which the first secondary coil is coupled to the first balanced output and the second secondary coil is coupled to the second balanced output. In one embodiment, the primary coil and the first secondary coil are coupled by a first coupling factor k1, and the primary coil and the second secondary coil are coupled by a second coupling factor k2 that is different from the first coupling factor k1.
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: October 24, 2023
    Inventors: Amitoj Singh, Ajaypat Jain, Xiaohua Yu, Tienyu Chang, Siu-Chuang Ivan Lu, Sang Won Son
  • Patent number: 11798728
    Abstract: A coil device includes a first conductor on a first layer and arranged in a first spiral shape, a second conductor on a second layer and arranged in a second spiral shape, a transition that connects the first conductor and the second conductor in series, a first terminal connected to an end of the first conductor, and a second terminal connected to an end of the second conductor. The first terminal and the second terminal are outside of the first conductor and the second conductor when viewed in plan. The first conductor and the second conductor each include a plurality of in-plane traces connected in parallel with each other.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: October 24, 2023
    Assignee: DSBJ PTE. LTD.
    Inventor: Soheil Saadat
  • Patent number: 11791088
    Abstract: In a multilayer coil component 1, a coil 7 includes a first connection part 22a and a second connection part 26a, the first connection part 22a is connected to one end part of the coil 7, which part is placed on a side of one principal surface 2c, and is arranged in an identical dielectric layer 6 with a conductor 22 included in the one end part, the second connection part 26a is connected to the other end part of the coil 7, which part is placed on a side of the other principal surface 2d, and is arranged in an identical dielectric layer 6 with a conductor 26 included in the other end part, and recessed parts 8a and 8b and recessed parts 9a and 9b are respectively provided in the first terminal electrode 4 and the second terminal electrode 5 in the element body 2.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: October 17, 2023
    Assignee: TDK CORPORATION
    Inventors: Kazuya Tobita, Hajime Kato, Makoto Yoshino, Youichi Kazuta, Yuto Shiga, Noriaki Hamachi
  • Patent number: 11791087
    Abstract: The present invention relates to a planar converter, comprising: a magnetic unit comprising a first planar winding and two second planar windings magnetically coupled to each other and a magnetic core assembly; two closed circuits each comprises the first planar winding, a switch, and has a first connection point and a second connection point; two PCBs each provided with at least one of the closed circuits thereon; and two first connectors each comprising two welding ends opposite to each other, wherein the two welding ends of one of the two first connectors are connected to the first connection points of the two closed circuits, respectively, and the two welding ends of another one of the two first connectors are connected to the second connection points of the two closed circuits, respectively, and the two closed circuits are connected in parallel.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: October 17, 2023
    Assignee: Delta Electronics, Inc.
    Inventors: Da Jin, Yahong Xiong, Qinghua Su
  • Patent number: 11791085
    Abstract: An inductor component comprising a first magnetic layer and a second magnetic layer containing a resin, a substrate of a sintered body having a first principal surface in close contact with the first magnetic layer and a second principal surface above which the second magnetic layer is disposed, and a spiral wiring disposed between the second magnetic layer and the substrate.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: October 17, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshimasa Yoshioka, Mizuho Katsuta, Kouji Yamauchi, Ryo Kudou, Naoya Noo
  • Patent number: 11791086
    Abstract: In an exemplary embodiment, an electronic component includes: an element body part 10 constituted by an insulative body of rectangular solid shape; an internal conductor 30 provided inside the element body part 10; and external electrodes 50 provided at least on the bottom face 14 (mounting surface) of the element body part 10 and electrically connected to the internal conductor 30; wherein the element body part 10 has: a conductor-containing layer 20 in which a coil conductor 36 (functional part) that will become a part of the internal conductor 30 to demonstrate electrical performance, is provided; and a high-hardness layer 22 which is provided side by side with the conductor-containing layer 20 in a direction parallel with the bottom face 14 (mounting surface) of the element body part 10, and which has a higher hardness compared to the conductor-containing layer 20. The electronic component has improve mechanical strength.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: October 17, 2023
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Masuo Yatabe, Chitose Kimura, Kozue Imaizumi, Ichiro Yokoyama
  • Patent number: 11783990
    Abstract: In an embodiment, an integrated circuit die includes a semiconductor substrate, patterned metal layers compiled over the semiconductor substrate, and a tapered multipath inductor formed in the patterned metal layers. The tapered multipath inductor includes, in turn, an inductor input terminal, an inductor output terminal, and N number of parallel inductor tracks electrically coupled between the inductor input terminal and the inductor output terminal. The parallel inductor tracks wind or wrap around an inductor centerline to define a plurality of multipath inductor windings including an innermost winding and an outermost winding. The parallel inductor tracks further vary in track width when progressing from the outermost winding to the innermost winding of the plurality of multipath inductor windings.
    Type: Grant
    Filed: March 30, 2022
    Date of Patent: October 10, 2023
    Assignee: NXP B.V.
    Inventors: Thomas Jan Hoen, Yanyu Jin, Anne Johan Annema, Jos Verlinden
  • Patent number: 11783986
    Abstract: A resonant coil with integrated capacitance includes at least one separation dielectric layer and a plurality of conductor layers stacked in an alternating manner. Each of the plurality of conductor layers includes a first conductor sublayer and second conductor sublayer having common orientation and a sublayer dielectric layer separating the first and second conductor sublayers, each conductor layer having multiple discontinuities.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: October 10, 2023
    Assignee: THE TRUSTEES OF DARTMOUTH COLLEGE
    Inventors: Phyo Aung Kyaw, Aaron Stein, Charles R. Sullivan
  • Patent number: 11785724
    Abstract: A planar coil element of the present invention includes an insulating base film having a first surface and a second surface opposite to the first surface, a first conductive pattern deposited on the first surface side of the insulating base film, and a first insulating layer covering the first conductive pattern on the first surface side, in which the first conductive pattern includes a core body and a widening layer deposited by plating on the outer surface of the core body, the core body includes a thin conductive layer on the insulating base film, and the ratio of the average thickness of the first conductive pattern to the average circuit pitch of the first conductive pattern is 1/2 or more and 5 or less.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: October 10, 2023
    Assignee: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Hiroshi Ueda, Kousuke Miura, Yoshihito Yamaguchi, Yuka Urabe
  • Patent number: 11783991
    Abstract: An inductor device includes a first inductor and a second inductor. The first inductor has a first winding and a second winding. The second inductor has a third winding and a fourth winding, and the second inductor is disposed adjacent to the first inductor, and the second inductor is coupled to the first inductor in an interlaced manner.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: October 10, 2023
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Hsiao-Tsung Yen, Ka-Un Chan
  • Patent number: 11783993
    Abstract: An inductor according to one embodiment of the present invention includes: a base body having a mounting surface, a top surface, and a first end surface; first and second external electrodes attached to the mounting surface and spaced from each other; and an internal conductor disposed in the base body and extending linearly from the first external electrode to the second external electrode. One end of the internal conductor is exposed from the mounting surface and connected to the first external electrode, and the other end of the internal conductor is exposed from the mounting surface and connected to the second external electrode. The base body is partitioned into a first region and a second region, the first region being enclosed by the internal conductor and the mounting surface, and a ratio of an area of the second region to an area of the first region is 0.95 to 1.0.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: October 10, 2023
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takayuki Arai, Naoya Terauchi
  • Patent number: 11771897
    Abstract: The present invention relates to a system, its catheter and its method for providing electrical pulses and/or therapeutic or diagnostic liquids directly to a pituitary gland of a mammal. The catheter, containing an electrode or a microcannula or both, is moved through an endovascular route of a patient to his/her sinus cavernosus and then the distal end of the electrode or microcannula is moved through an opening in the distal end of the catheter and then through a perforation in the medial wall of the sinus cavernosus, to the pituitary gland.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: October 3, 2023
    Assignee: ACADEMISCH ZIEKENHUIS LEIDEN (H.O.D.N. LUMC)
    Inventors: Wouter R. Van Furth, Nienke R. Biermasz, Amir H. Zamanipoor Najafabadi
  • Patent number: 11776734
    Abstract: A coil element according to one embodiment includes: an insulator body including first insulating layers and second insulating layers laminated in a stacking direction; first conductive patterns formed on the first insulating layers; and second conductive patterns formed on the second insulating layers. The insulator body includes a first end region situated at a top in the stacking direction, a second end region situated at a bottom in the stacking direction, and an intermediate region situated between the first end region and the second end region. The insulator body includes a first portion and a second portion that is an area other than the first portion. The first portion covers upper and lower surfaces of one or more intermediate first conductive patterns in the intermediate region among the plurality of first conductive patterns. The electrical resistivity of the first portion is higher than that of the second portion.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: October 3, 2023
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Natsuko Sato, Tomoo Kashiwa
  • Patent number: 11769616
    Abstract: Cables are magnetically attracted to magnets in straps and other items such as electronic devices. The cables may contain signal lines to convey power and/or data. Magnetic material that is attracted to magnetic fields may be incorporated into the signal lines and/or other structures in the cables. The straps may have flexible magnets and/or other magnets extending along their lengths. The magnets of the straps create magnetic fields that attract the cables. Electronic devices may also have housings that contain magnets to attract the cables. Using magnetic attraction, cables can be removably attached to straps and other items during operation of an electronic device, thereby helping to prevent tangling of the cables.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: September 26, 2023
    Assignee: Apple Inc.
    Inventors: Toria F. Yan, Liam R. Martinez, Yi H. Hsieh, Yunhe Huang, Zebinah P. Masse
  • Patent number: 11769620
    Abstract: The electronic component includes an element body having a mounting surface, an upper surface opposing the mounting surface, a first side surface, and a second side surface adjacent to the first side surface, and an outer conductor including a first portion extending along the first side surface and embedded in the element body so as to be exposed from the first side surface. The element body has a first chamfered portion at a corner portion connecting the upper surface and the first side surface, and a length of the first chamfered portion is longer than a thickness of the first portion of the outer conductor in a direction substantially orthogonal to the first side surface.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: September 26, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yasunari Nakashima
  • Patent number: 11769617
    Abstract: A laminated coil component in which the reliability can be improved by suppressing a decrease in the bonding strength between an extended conductor layer and an external electrode. The laminated coil component includes an element body; a coil placed inside the element body and including a plurality of coil conductor layers that are electrically connected; and an external electrode formed on an outer surface of the element body and electrically connected to the coil via an extended conductor layer electrically connected to the coil. The extended conductor layer has an average crystal grain size less than an average crystal grain size of each of the coil conductor layers.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: September 26, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Takashi Sakai
  • Patent number: 11769619
    Abstract: A coil component includes a support substrate, a coil portion disposed on one surface of the support substrate and having one end and the other end connected by a plurality of turns, a body in which the support substrate and the coil portion are embedded, a lead portion extending from one end of the coil portion, and an auxiliary lead portion disposed between one end of the coil portion and the other end of the coil portion, and extending from the coil portion to be spaced apart from the lead portion, on one surface of the support substrate. The lead portion and the auxiliary lead portion are exposed to an external surface of the body to be spaced apart from each other.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: September 26, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Kwang Il Park
  • Patent number: 11766824
    Abstract: An apparatus for producing a three-dimensional multilayer object produces a three-dimensional multilayer object by partially applying energy to a conductive powder and thereby melting or sintering and curing the conductive powder. The apparatus for producing a three-dimensional multilayer object includes: a holding unit holding the conductive powder, and holding the cured three-dimensional multilayer object; an energy application unit applying energy to the conductive powder held by the holding unit; a probe disposed spaced apart from a surface layer portion of the cured three-dimensional multilayer object and detecting a flaw in the surface layer portion; and a probe moving mechanism relatively moving the probe with respect to the surface layer portion. The probe contains an excitation coil generating an eddy current in the surface layer portion, and a detection coil detecting a change in a magnetic field of the surface layer portion.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: September 26, 2023
    Assignee: IHI Corporation
    Inventor: Takeru Oohashi
  • Patent number: 11761987
    Abstract: A circuit interrupter includes separable contacts; an operating mechanism; an electronic trip unit; and a current sensor assembly including: a harvester circuit having a primary conductor through which input current passes, a secondary winding and a harvester core structured to saturate at a first input current level, a Rogowski coil structured to measure voltage at an output of the Rogowski coil, the measured voltage indicative of output current of the Rogowski coil, where linearity of the output of Rogowski coil deviates more than a deviation tolerance based at least in part on saturation of the harvester core at the first input current level, and a compensation coil arranged at 180 degree opposite to the secondary winding of the harvester core, the compensation coil structured to delay saturation of the harvester core until the input current reaches a second input current level higher than the first input current level.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: September 19, 2023
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Rishabh Dixit, Theodore James Miller, Asish Das
  • Patent number: 11764524
    Abstract: A terminal connector for attachment to a circuit board. The terminal connector comprises first and second terminals, each comprising a connection end for connection to respective contacts in the circuit board and a wire attachment formation for connecting a wire to the respective terminal. The terminal connector further comprises a ferrite core surrounding a section of both the first and second terminals between their terminal contacts and wire attachment formations. The ferrite core is directly connected to the terminals and is secured to the circuit board by the terminals when their connection ends are connected to the respective contacts in the circuit board.
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: September 19, 2023
    Assignee: TDK-LAMBDA UK LIMITED
    Inventor: Radoslav Solc
  • Patent number: 11761795
    Abstract: A measurement device for measuring an angular position of a movable body that is rotatable about an axis of rotation relative to a stationary body, the device comprising, facing each other, a movable portion with a first printed circuit having first tracks formed thereon defining a plurality of target patterns and a stationary portion with a second printed circuit having second tracks formed thereon defining a plurality of measurement patterns that are angularly distributed in regular manner. The target patterns are angularly distributed in irregular manner, the number of target patterns is not less than two, and the product of the number of target patterns multiplied by the number of measurement patterns is not less than twelve.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: September 19, 2023
    Assignees: SAFRAN LANDING SYSTEMS, SAFRAN ELECTRONICS & DEFENSE
    Inventors: Didier Levavasseur, Thierry Bickard
  • Patent number: 11763980
    Abstract: A coil component in which a crack is rarely generated around a coil conductor layer. The coil component includes an element body; and a coil provided in the element body and spirally wound along a first direction. The coil has a plurality of coil conductor layers stacked along the first direction. The element body has a vicinity area located in a vicinity of each of the coil conductor layers, and has a non-vicinity area other than the vicinity area. The vicinity area has a pore area rate less than a pore area rate in at least a part of the non-vicinity area.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: September 19, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Takashi Sakai
  • Patent number: 11761034
    Abstract: A method for real-time quantitative detection of single-type, target nucleic acid sequences amplified using a PCR in a microwell, comprising introducing in the microwell a sample comprising target nucleic acid sequences, magnetic primers, and labelling probes; performing an amplification cycle to form labelled amplicons; attracting the magnetic primers to a surface through a magnetic field to form a layer including labelled amplification products and free magnetic primers; and detecting the labelled amplification products in the layer with a surface-specific reading method.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: September 19, 2023
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Lucio Renna, Clelia Carmen Galati, Natalia Maria Rita Spinella
  • Patent number: 11763978
    Abstract: A coil component may include a body having one surface and the other surface facing each other; a wound coil embedded in the body; a first lead frame and a second lead frame, embedded in the body and each having one surface exposed to the one surface of the body to be spaced apart from each other; and a connection portion connecting at least one of the first and second lead frames and at least one end portion of the wound coil.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: September 19, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD
    Inventors: Ju Hwan Yang, Tae Jun Choi, Byung Soo Kang, Woo Chui Shin, Byeong Cheol Moon
  • Patent number: 11763979
    Abstract: A coil component 1 includes a base body 10 having a mounting surface 10b, a coil conductor 25 wound around a coil axis X through a plurality of layers in the base body 10, where the coil conductor 25 has a first end 25a and a second end 25b, external electrodes 21 and 22 provided on the mounting surface 10b, a lead-out conductor 26 connecting the first end 25a of the coil conductor 25 and the external electrode 21, and a lead-out conductor 27 connecting the second end 25b of the coil conductor 25 and the external electrode 22. At least a portion of the lead-out conductor 26 is positioned within a first region R1 inside the coil conductor 25 in a radial direction when seen in a direction of the coil axis X.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: September 19, 2023
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takayuki Arai, Naoya Terauchi, Tomoo Kashiwa
  • Patent number: 11756723
    Abstract: A multilayer coil component includes a component element assembly in which an inner conductor is disposed and an outer electrode disposed on the surface of the component element assembly. The component element assembly includes a first dielectric glass layer in which the inner conductor is embedded and second dielectric glass layers that are thin layers disposed on respective principal surfaces of the first dielectric glass layer. The primary component of each of the first dielectric glass layer and the second dielectric glass layers is formed of a glass material and has a filler component containing at least quartz, and the second dielectric glass layers have a lower quartz content than the first dielectric glass layer.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: September 12, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Naoyuki Murakami
  • Patent number: 11756718
    Abstract: A transformer respectively includes a first isolation barrier, a first inductive element, a second isolation barrier, and a second inductive element. The first isolation barrier and second isolation barrier each comprise multiple isolation layers. The transformer also includes magnetic material including a top magnetic portion disposed above the first isolation barrier. The transformer also includes a bottom magnetic portion disposed below the second inductive element; The transformer further includes an intermediary magnetic portion extending from the top magnetic portion to the bottom magnetic portion via a through-hole within the first isolation barrier, first inductive element, second isolation barrier, and second inductive element. The transformer yet further includes at least one lateral magnetic portion extending from the top magnetic portion to the bottom magnetic portion.
    Type: Grant
    Filed: December 30, 2018
    Date of Patent: September 12, 2023
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Zhemin Zhang, Roberto Giampiero Massolini, Joyce Marie Mullenix
  • Patent number: 11756985
    Abstract: An exemplary embodiment of the present invention provides a planar inductor including a substrate, a first magnetic layer, a conductive coil, and a second magnetic layer. The first magnetic layer can be disposed on at least a portion of the substrate. The conductive coil can be disposed on a first portion of the first magnetic layer. The second magnetic layer can be disposed on a second portion of the first magnetic layer and on at least a portion of the conductive coil.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: September 12, 2023
    Assignees: Georgia Tech Research Corporation, NITTO DENKO CORPORATION
    Inventors: Markondeya Raj Pulugurtha, Yoshihiro Furukawa, Himani Sharma, Keiji Takemura, Rao R. Tummala, Teng Sun
  • Patent number: 11756720
    Abstract: A coil component includes a coil portion embedded in a body, first and second lead-out portions connection to both end of the coil portion, respectively, and exposed from one surface of the body to be spaced apart from each other, and a support substrate supporting the coil portion and the first and second lead-out portions, and exposed from the one surface of the body. Each of the first and second lead-out portions includes a lead-out pattern and an auxiliary lead-out pattern disposed on one surface and the other surface of the support substrate, opposing each other, and exposed from the one surface of the body, respectively, and a connection via penetrating through the support substrate to connect the lead-out pattern and the auxiliary lead-out pattern to each other, and exposed from the one surface of the body.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: September 12, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Min Lee, Ju Hwan Yang, Yoon Mi Cha
  • Patent number: 11747222
    Abstract: A method for manufacturing a deformation detection sensor that includes: preparing a plurality of thermoplastic resin layers, at least one of which has a main surface on which a conductive member is formed; laminating the plurality of thermoplastic resin layers; after lamination, integrally forming the plurality of thermoplastic resin layers by hot pressing to obtain a laminated body configured so that a transmission line is formed from a first portion of the conductive member and the laminated body; and attaching a piezoelectric film to the laminated body so that a piezoelectric element is formed from a second portion of the conductive member, the laminated body, and the piezoelectric film.
    Type: Grant
    Filed: December 21, 2022
    Date of Patent: September 5, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takashi Kihara, Jun Endo, Masamichi Ando
  • Patent number: 11747951
    Abstract: The present disclosure relates to an electromagnetic induction film and a manufacturing method thereof, an electromagnetic induction panel and a manufacturing method thereof, and a touch display device. The method for manufacturing the electromagnetic induction film may include: arranging a plurality of first conductors in parallel along and spaced apart along a first direction on a substrate; arranging an insulating layer on the plurality of first conductors; arranging a plurality of second conductors in parallel and spaced apart along the first direction on the insulating layer; and electrically connecting head end areas of the first conductors to head end areas of the second conductors and electrically connecting tail end areas of the first conductors to tail end areas of the second conductors to form an electromagnetic induction coil spirally surrounding the insulating layer.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: September 5, 2023
    Assignee: SHENZHEN HITEVISION TECHNOLOGY CO., LTD.
    Inventor: Yunshen Chen
  • Patent number: 11750247
    Abstract: An inductor circuit includes a receiver inductive circuit, a transmitter inductive circuit, and an antenna inductive circuit which are implemented on a single chip die; the receiver inductive circuit is disposed on a specific ring of a specific plane to form a ring shape; the transmitter inductive circuit and the antenna inductive circuit are disposed inside the specific ring and surrounded by the specific ring of the specific plane; and, a circuit area, occupied by the transmitter inductive circuit, inside the specific ring and on the specific plane, is larger than a circuit area occupied by the receiver inductive circuit and by the antenna inductive circuit.
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: September 5, 2023
    Assignee: PixArt Imaging Inc.
    Inventors: Mu-Tsung Lai, Tung-Ying Chiang, Chien-An Hou, Chia-Pei Chen
  • Patent number: 11749458
    Abstract: A ceramic electronic device includes a multilayer chip including a multilayer structure, a first cover layer and a second cover layer and having a parallelepiped shape, the multilayer structure having a structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked and are alternately exposed to a first end face and a second end face of the multilayer chip, the first end face being opposite to the second end face, the first cover layer being provided on an upper face of the multilayer structure in a stacking direction, the second cover layer being provided on a lower face of the multilayer structure, a first external electrode formed on the first end face, and a second external electrode formed on the second end face. In this structure, a relationship of 0.20?R1/?{square root over (?)}(P12?C12)?0.80 is satisfied.
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: September 5, 2023
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Mikio Tahara
  • Patent number: 11749444
    Abstract: An inductor built-in substrate includes a core substrate having openings, a magnetic resin filled in the openings of the core substrate, and through-hole conductors formed through the core substrate such that each of the through-hole conductors includes a metal film. The magnetic resin has through holes formed through the magnetic resin such that the through-hole conductors include a group of through-hole conductors formed in the through holes formed through the magnetic resin, and the magnetic resin includes an iron oxide filler in an amount of 60% by weight or more.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: September 5, 2023
    Assignee: IBIDEN CO., LTD.
    Inventors: Hiroaki Kodama, Kazuro Nishiwaki, Kazuhiko Kuranobu, Hiroaki Uno
  • Patent number: 11751330
    Abstract: A dielectric substrate may support conductive traces that form windings for a least one pole of a planar armature of an axial flux machine. At least a portion of the dielectric substrate, which is adapted to be positioned within an annular active area of the axial flux machine, may include a soft magnetic material. Such a planar armature may be produced, for example, by forming the conductive traces on the dielectric substrate, and filling interstitial gaps between the conductive traces with at least one epoxy material in which the soft magnetic material is embedded.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: September 5, 2023
    Assignee: E-Circuit Motors, Inc.
    Inventors: George Harder Milheim, Steven Robert Shaw, Ryan Terrence Duffy, Edward Charles Carignan
  • Patent number: 11742126
    Abstract: An inductor includes a magnetic base body including soft magnetic metal particles containing iron, first and second external electrodes provided on the magnetic base body, and an internal conductor provided in the magnetic base body, with one end thereof electrically connected to the first external electrode and the other end thereof electrically connected to the second external electrode, the internal conductor extending linearly from the first external electrode to the second external electrode in plan view. The magnetic base body is configured so that a peak intensity ratio is 2 or more between a peak intensity of a first peak and a peak intensity of a second peak in a Raman spectrum obtained by using an excitation laser with a wavelength of 488 nm. The first peak is around a wave number of 712 cm?1, and the second peak is around a wave number of 1320 cm?1.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: August 29, 2023
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Shunta Ishiwata, Shinsuke Takeoka
  • Patent number: 11742133
    Abstract: Provided is an electronic component including a secondary side coil including a plurality of coil parts, in which each of the coil parts includes: a plate-like base part; a leg part formed on the base part; and a pin part formed at a tip of the leg part.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: August 29, 2023
    Assignee: SONY CORPORATION
    Inventor: Hirofumi Nakazawa
  • Patent number: 11742138
    Abstract: A method of manufacturing a wireless power reception apparatus includes: forming a lower tray that includes a thermally conductive material and accommodates and fix a coil winding; arranging a coil winding on the lower tray; forming a magnetic field shielding plate so as to accommodate and fix a plurality of magnetic tiles at predetermined intervals; forming a coupled member of a magnetic tiles-magnetic field shielding plate by arranging the plurality of magnetic tiles at the predetermined intervals on the magnetic field shielding plate; forming a thermally conductive polymer molding layer by applying a thermally conductive polymer molding solution to fill spaces between the coil winding and the coupled member of a magnetic tiles-magnetic field shielding plate and bonding the plurality of magnetic tiles and the coil winding such that the plurality of magnetic tiles are positioned over the coil winding; and curing the thermally conductive polymer molding layer.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: August 29, 2023
    Assignee: THE GAUSS INC.
    Inventor: Bong Gi You
  • Patent number: 11742132
    Abstract: An electronic component includes an insulating layer that has a principal surface, a passive device that includes a low voltage pattern that is formed in the insulating layer and a high voltage pattern that is formed in the insulating layer such as to oppose the low voltage pattern in a normal direction to the principal surface and to which a voltage exceeding a voltage to be applied to the low voltage pattern is to be applied, and a shield conductor layer that is formed in the insulating layer such as to be positioned in a periphery of the high voltage pattern in plan view, shields an electric field formed between the low voltage pattern and the high voltage pattern, and suppresses electric field concentration with respect to the high voltage pattern.
    Type: Grant
    Filed: December 14, 2022
    Date of Patent: August 29, 2023
    Assignee: ROHM CO., LTD.
    Inventor: Kosei Osada
  • Patent number: 11742131
    Abstract: A coil component includes a body, a coil portion disposed inside the body, a first external electrode and a second external electrode spaced apart from each other on one surface of the body and connected to the coil portion, a first insulating layer and a second insulating layer respectively connected to the one surface of the body, respectively disposed to side surfaces of the body to extend upwardly of the one surface of the body, and a third insulating layer and a fourth insulating layer respectively connected to the one surface of the body, respectively disposed on end surfaces of the body and each extending upwardly of the one surface of the body. A portion of each of the first and second external electrodes, exposed from the first to fourth insulating layers, is spaced apart from each of a plurality of edges of the one surface of the body.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: August 29, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Soo Kang, Yong Hui Li, Seung Mo Lim, Byeong Cheol Moon
  • Patent number: 11735346
    Abstract: A multilayer substrate includes at least three coil conductors respectively patterned on different surfaces of a first main surface of a laminated body, a second main surface of the laminated body, and laminated interfaces of insulating base materials and that are arranged in a lamination direction. The at least three coil conductors include first and second coil conductors, and are connected in series between first and second external electrodes. A surface at which another coil conductor is provided is not interposed between two surfaces at which the first and second coil conductors are provided, respectively. Further, the first and second coil conductors are directly connected to the first and second external electrodes, respectively, without another coil conductor interposed therebetween.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: August 22, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shingo Ito, Kuniaki Yosui
  • Patent number: 11735350
    Abstract: An inductor includes a body including a coil and a magnetic portion, and having two facing principal surfaces and side surfaces adjacent to the two principal surfaces. The coil includes a winding portion formed from a conductor and a pair of extended portions extended from the winding portion. The magnetic portion includes magnetic powder and contains the coil. The winding portion includes a first meandering portion and a second meandering portion each including straight portions continuously formed so as to extend substantially circularly from an outer side to an inner side of the body when the winding portion is seen through the principal surfaces of the body from the principal surfaces. The first and second meandering portions are continuously formed on the inner side of the body. The straight portions constituting the first meandering portion and the straight portions constituting the second meandering portion are disposed apart from each other.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: August 22, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Jianxin Sheng
  • Patent number: 11735355
    Abstract: An inductor includes a wire having a width W, and a first electrode and a second electrode continuous to each of both ends of the wire. The wire, the first electrode, and the second electrode are present on the same plane. The plane area S1 of the first electrode and the plane area S2 of the second electrode are a square value (W2) or more of the width W. An area in which the wire is disposed is positioned between the first electrode and the second electrode. The area has a length X in a longitudinal direction equal to a length L between the first electrode and the second electrode along a facing direction of the first electrode and the second electrode, and a length Y in a short-length direction in a direction perpendicular to the longitudinal direction. The length X in the longitudinal direction is 1.5 times or more of the length Y in the short-length direction.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: August 22, 2023
    Assignee: NITTO DENKO CORPORATION
    Inventor: Yoshihiro Furukawa