Abstract: The invention relates to an electronic assembly, in particular for low power consumption electric switching devices such as low power contactors, time relays or the like. In order to provide protection against input current pulses, an ohmic resistor (6) is provided in the form of a resistive layer that is applied by pressing.

Abstract: A device for heating air, fluids and materials, in dry or wet environments powered in low voltage current or alternating or direct very safe allowable voltage, by increasing the temperature of any type of surface, whether flat or embossed, solid or open-work. The device includes electrodes coated with a layer of electrically resistant fluid or pasty substance. The assembly of devices is very thin, and is particularly designed for heating premises, swimming pools, pipes exposed to freezing, and container for warm food.

Abstract: A resistor for an electron gun assembly is configured to apply a voltage, which is divided with a predetermined resistance division ratio, to an electrode provided in the electron gun assembly. The resistor includes an insulating substrate, an electrode element provided in association with each of a plurality of terminal portions on the insulating substrate, a resistor element having a pattern for connecting the electrode elements and obtaining a predetermined resistance value, and an insulating coating layer that covers the resistor element. In at least one terminal portion B, the electrode element is disposed spaced apart from the insulating coating layer, and an intermediate resistor element is disposed between the electrode element and the insulating coating layer. The intermediate resistor element has a resistance value that is different from a resistance value of the electrode element.

Abstract: A novel method for interconnecting leads in a high pressure transducer without the use of solder employs a ceramic disc containing a number of through holes. Each hole has a tube inserted therein, which tubes are connected to the disc by brazing or a high temperature attachment. Each tube protrudes from both sides of the ceramic. The ceramic is coated in appropriate areas with molymanganese film, which is over plated with gold. This overcoat forms a brazed compound surface attached to the tubes of the ceramic. A semiconductor pressure transducer has output leads which are inserted through the ceramic into each tube. The other side end of the tube receives high temperature wires from a suitable connecting device. Each tube is then crimped and spot-welded to hold both the lead from the transducer and the high temperature leads to produce a strong bond without the use of solder. The header itself it typically welded to a pressure point.

Abstract: A chip resistor comprising a substrate having opposite parallel symmetrical first and second surfaces, a central longitudinal plane of symmetry, separate and spaced first and second resistive layers on the first and second surfaces. The resistive layers are electrically connected in parallel to each other and the first and second surfaces of the substrate are symmetrically located with respect to and equidistant from a central longitudinal plane. Thus, when electrical current passes through the resistive layers, a temperature distribution within the substrate will be substantially symmetrical about the central longitudinal plane of the substrate for eliminating thermal bending thereof. The splitting of the surge current between two resistive layers results in the lower temperature in each resistive layer when compared with the temperature in the single resistive layer of the prior art chip resistor loaded by the same current.

Abstract: The invention provides for a method of manufacturing a stacked power chip resistor. The method includes adhering a first chip resistor to a second chip resistor with a glass encapsulant, connecting a first terminal of the first chip resistor to a first terminal of the second chip resistor with the first metal barrier, and connecting a second terminal on the first chip resistor to a second terminal of the second chip resistor with a second metal barrier.

Abstract: Resistive materials have resistivities that are axis dependent are provided. Such resistive materials having a resistivity in a first direction and a very different resistivity in an orthogonal direction. These resistive materials are particularly suitable for use as resistors embedded in printed wiring boards.

Abstract: A thin film resistor that has a substantially zero TCR is provided as well as a method for fabricating the same. The thin film resistor includes at least two resistor materials located over one another. Each resistor material has a different temperature coefficient of resistivity such that the effective temperature coefficient of resistivity of the thin film resistor is substantially 0 ppm/° C. The thin film resistor may be integrated into a interconnect structure or it may be integrated with a metal-insulator-metal capacitor (MIMCAP).

Abstract: In one embodiment, an integrated circuit includes a thin film resistor, which includes a resistor material that has been deposited on a substrate surface within a channel defined by opposing first and second portions of a stencil structure formed on the substrate surface, the resistor material having an initial width determined by a width of the channel. The stencil structure has been adapted to receive a planarizing material that protects against reduction of the initial width of the resistor material during subsequent process steps for removing the stencil structure. A head mask overlays an end portion of the thin film resistor and a dielectric overlays the head mask, the dielectric defining a via formed in the dielectric above a portion of the head mask. A conductive material has been deposited in the via, coupled to the portion of the head mask and electrically connecting the thin film resistor to other components of the integrated circuit.

Abstract: The present invention relates to the resistors used for detecting current in a current-carrying circuit as a voltage, and aims to provides a resistor which assures highly accurate measurement of resistance even if the measuring point is not precisely placed. To obtain the above purpose, the resistor of the present invention comprises a sheet metal resistor element (11) and separate metal terminals (12),(13) electrically connected to both ends of the sheet resistor element(11). These terminals (12),(13) are made of metal having the same or greater electrical conductivity than that of the resistor element (11). With the above configuration, resistance of the terminals can be made smaller than that of the resistor element. This enables to reduce the proportion of resistance of the terminals in the entire resistor, allowing to ignore its effect on fluctuation of resistance due to deviation in measuring points of a resistance measuring terminal.

Abstract: A conductive substrate with a resistance layer comprising a substantially flat high conductivity substrate roughening treated on its surface by a resistance component and provided with a resistance layer by the resistance component so as to enable the interface between the high conductivity substrate and resistance component layer to be substantially flattened, enable acquisition of a thin film resistance layer with a stable resistance after dissolving away the high conductivity substrate, and able to maintain the peel strength with the insulating support, and a resistance board using the same.

Abstract: A resistor card for a fuel level sensor has improved resistance to corrosion and wear. The resistor card has a substrate with a resistive layer and a conductive layer. A nickel layer covers the conductive layer. A nickel-gold alloy layer covers the nickel layer. The nickel-gold alloy layer protects the conductive layer from sulfur corrosion and improves wear resistance.

Abstract: A circuit substrate includes resistive films are disposed on the surfaces of lands included in a circuit pattern and these resistive films are used as resistances connected in series to a capacitor. Therefore, the resistances are connected in series without increasing the inductance in the capacitor, and accordingly, a circuit having a small impedance variation with respect to frequency can be obtained. Therefore, it is possible to obtain a power supply circuit and so forth having stable operation and fast response.

Abstract: A transparency, e.g. a laminated windshield has a pair of spaced bus bars on an electric conductive member e.g. an electric conductive coating on a glass sheet. The perimeter of the coating is spaced from the peripheral edge of the sheet to provide a non-conductive strip. Ends the bus bars extend into the non-conductive strip to minimize/eliminate hot spots at the end portions of the bus bars. An additional feature to reduce hot spots includes bus bars having different lengths with portions of the coating between the bus bars not extending beyond the ends of the longer bus bar. In another, the windshield has a vision area, a bus bar between the top edge of the coating and the top edge of the vision area and a bus bar between the bottom edge of the coating and bottom edge of the vision area.

Abstract: A thin-film resistor includes a resistive element with a predetermined length and width deposited on a substrate. An insulator layer is patterned so as to cover all of the resistive element except the ends in the width direction and is tapered. Electrodes are connected to respective ends of the resistive element via a plating base layer. The electrodes have a reduced resistance. The thin-film resistor can exhibit high accuracy and a small range of variation of the resistance.

Abstract: A resistor foil, comprised of a copper layer having a first side and a second side. An intermediate layer having a thickness of between 5 Å and 70 Å is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 50 Å and 2 &mgr;m is disposed on the intermediate layer, and a second layer of a second resistor metal having a thickness of between 50 Å and 2 &mgr;m is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.

Abstract: A variable-resistance element exhibiting high wear resistance and superior microlinearity includes a resistor constituted from a first resistive layer containing a first reinforcing material and a second resistive layer containing conductive carbon black and a second reinforcing material, the second resistive layer being disposed on the first resistive layer. The first reinforcing material is pulverized carbon fibers having an average particle size of 3 &mgr;m. The second reinforcing material is thermal black having an average particle size of 0.35 &mgr;m.

Abstract: The object of this invention is to provide a panel-type heating element having an excellent durability and high effectiveness in power saving. To attain this object, the present invention provides a panel-type heating element consisting of a base which a thin film containing zinc oxide and tin oxide can form a layer upon. The panel-type heating element is advantageously manufactured by a method comprising spraying a solution containing a zinc compound and a tin compound on a base. The solution then oxidizes by heating the base in a high temperature reaction chamber to form a thin film consisting of sediment containing zinc oxide and tin oxide on the surface of the base. As a result, the thin film gives the base excellent acid, water and chemical resistance, and heats quickly.

Abstract: The present invention provides a high dopant concentration diffused resistor, a method of manufacture therefor, and an integrated circuit including the same. In one embodiment of the invention, the high dopant concentration diffused resistor includes a doped tub located over a semiconductor substrate and a doped resistor region located in the doped tub, the doped resistor region forming a junction within the doped tub. In a related embodiment, the high dopant concentration diffused resistor further includes first and second terminals each contacting the doped tub and the doped resistor region, wherein the first and second terminals cause the doped tub and doped resistor region to have a zero potential difference at any point across the junction when a voltage is applied to the first and second terminals.

Abstract: A heatable mirror having a transparent surface element made from a substrate of inorganic material and at least one reflective layer as well as at least one heat-conducting layer applied to the substrate and/or the reflective layer and which has contact elements. The heat-conducting layer is formed by conductive particles having an average diameter of 3 to 100 &mgr;m at least partially embedded in the surface of the substrate and/or the reflective layer and the heat-conducting layer is designed to be over the entire surface or strip-like, wherein the non-conductive region for the strip-like embodiment is an insulating separating layer between the strips.

Abstract: A high power resistor device and method for making a high power resistor device. A resistor is formed on a first end of a fired, ceramic chip with multiple internal conductor electrodes, and end terminations are then applied to both ends of the chip. A power resistor device having a high power rating is thus provided having buried conductor electrodes electrically connected to end terminations, where the connection at the first end is through the resistor to form a power resistor structured to dissipate heat efficiently. In an alternative method of the present invention, both ends of the chip may be dipped in resistor paste to form resistors on both ends of the chip. In yet another alternative method of the present invention, a conductor under-layer is formed under the resistor, such as by first dipping the end of the chip in a conductor paste and firing the chip.

Abstract: Disclosed is a resistor structure for embedding in a dielectric material including a thin film resistive material disposed on a surface of a conductive layer wherein the surface has an isotropic surface roughness having a Rz (din) value of 3 to 10 &mgr;m and a peak-to-peak wavelength of 2 to 20 &mgr;m.

Abstract: A surface-mount positive temperature coefficient thermistor includes a disk-shaped positive temperature coefficient thermistor element having electrodes provided on opposing main surfaces thereof, an insulating case having an inner space with the thermistor element inserted therein, and a pair of metal terminals arranged to make electrical contact with the respective main surface electrodes of the thermistor element, and to sandwich therebetween the thermistor element. The insulating case includes a pair of main surfaces that are substantially parallel to the main surfaces of the thermistor element, a pair of opening side surfaces each having an opening, and a pair of end surfaces each having a terminal insertion hole provided therein. One end of each of the pair of metal terminals is inserted from the respective terminal insertion holes into the inner space, and the metal terminals press-hold the thermistor element so as to sandwich the thermistor element therebetween.

Abstract: A process for forming stable integrated resistors (14) and capacitors (28) on organic substrates (12). The resistors (14) and capacitors (28) are capable of a wide range of resistance and capacitance values, yet can be processed in a manner that does not detrimentally effect the organic substrate (12) or entail complicated processing. The method generally entails the use of thick-film materials usually of the types used to form resistors and capacitors on ceramic substrates. The thick-film materials are applied to an electrically-conductive foil (20) and then heated to bond the thick-film material to the foil (20) and form a solid resistive or capacitive mass (16/30). The foil (20) is then laminated to an organic substrate (12), such that the resistive/capacitive mass (16/30) is attached to and preferably embedded in the organic substrate (12).

Abstract: A method of manufacturing a resistor foil, comprised of a copper layer having a first side and a second side. A tiecoat metal layer having a thickness of between 5 Å and 70 Å is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 100 Å and 500 Å is disposed on the tiecoat metal layer, and a second layer of a second resistor metal having a thickness of between 100 Å and 500 Å is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.

Abstract: The invention relates to a resistor assembly for dividing an applied voltage into an intermediate voltage being below the applied anode voltage in a cathode ray tube. The resistor assembly comprises an insulating substrate and a resistive voltage divider including a first and a second resistive layer provided on the insulating substrate, and an additional resistive network with a first network terminal and a second network terminal. The additional resistive network is coupled in series with the first resistive layer. Furthermore, the additional resistive network comprises first and second resistive portions which are releasably coupled to the network terminals via bridge connections. According to the invention, the first and second resistive portions have substantially different resistance values for selecting a predetermined resistance value from a range of resistance values of the additional resistive network.

Abstract: An electronic component having a substrate on which one or more grooves are formed on its opposing side faces; electrodes formed on the groove and top and bottom faces of the substrate at a portion adjacent to the groove; and a circuit element formed between the electrodes. An electrode is also formed on the opposing side faces of said substrate at a portion other than the grooves. This structure enables to improve the reliability of a soldered portion even for small electronic components with about 10 &mgr;m thick electrodes such as chip resistors, chip capacitors, and chip inductors.

Abstract: A method of forming trimmable resistors, resistor ray be embedded into a substrate. A portion of the resistor may be exposed, by segmenting the substrate, so that the resistor may be trimmed to a desired resistance level. Alternatively, a portion of a resistor may be embedded into a substrate, with another portion of the resistor being disposed on the outer surface of the substrate. The portion of the resistor on the outer surface may be trimmed to adjust the resistance of the resistor to a desired level.

Abstract: An electrically resistive foil comprising a resistive composite material including a conductive material and a non-conductive material alone or incorporated into a two layer foil material that includes a conductive metal layer and a layer of the resistive composite material. This invention also includes circuit boards comprising an insulative substrate and an integral resistor comprising the resistive composite material of this invention as well as methods for manufacturing printed circuit boards including integral resistors.

Abstract: An apparatus and method for conditioning polysilicon circuit elements includes a supply source configured to impress a desired voltage or current upon a polysilicon circuit element including at least a polysilicon resistor for a desired signal duration. The desired voltage or current and signal duration are chosen to cause an irreversible decrease in the resistance of the polysilicon circuit element without generating enough heat to re-alloy the resistor contacts or fuse open the resistor. The process of the present invention may be selectively performed on desired ones of a number of polysilicon resistors forming an array or matrix to thereby program the array or matrix with a desired binary code. Alternatively, the process may be used to pre-condition all the resistors in an array or matrix to thereby facilitate subsequent programming thereof via conventional fusing techniques.

Abstract: A surface mount resistor is formed from an elongated resistive body having first and second terminal ends and a raised center portion formed therebetween. The raised center portion includes slots in its edges which form a serpentine current path through the raised center portion of the resistor. A dielectric surrounds and encapsulates the raised center portion and an electrically conductive material coats the first and second terminal ends. The method for manufacturing involves utilizing an elongated ribbon which is of unitary construction and which is formed to create a carrier strip and a raised center portion for the resistors ultimately to be formed.

Abstract: A resistor is provided that is made by laminating at least two resistive layers, where these resistors have conductive particles held in a binder resin. The resistors are laminated such that a top resistor covers a bottom resistor, and a surface of the top resistor is exposed. The resistivity of the top resistor is made smaller than that of the bottom resistor. The top resistor contains carbon fiber and carbon black, where the central particle size of the carbon fiber ranges from 3.5 to 9.0 &mgr;m. The resistor has excellent durability and micro-linearity characteristics. The resistor may also be used as a variable resistor.

Abstract: Resistive materials having a plurality of perforations are provided. Such resistive materials are useful in the manufacture of resistors. These resistors are particularly suitable for use as resistors embedded in printed wiring boards.

Abstract: A thick film heater is shown wherein the thick film resistive circuit, as the heating element, is applied directly to a target object to be heated for very low temperature applications. The thick film used is polymer-based (preferably epoxy). The thick film resistive circuit is applied using conventional means. However, it is cured at higher temperatures and longer cycles than conventional thick film circuits, and preferably in multiple stages.

Abstract: The material for an electrical resistivity element contains at least 20 mass % and at most 60 mass % of nickel, less than 5 mass % of iron and the remaining part including unavoidable impurities and cobalt. The material for the electrical resistivity element is manufactured by preparing a composition that contains at least 20 mass % and at most 60 mass % of nickel, less than 5 mass % of iron and the remaining part including cobalt, melting and casting the composition to obtain an ingot, removing the surface of the ingot by hot working, and performing cold-working and heat treatment on the hot-worked body.

Abstract: A resistance layer, a buffering layer and a protective layer are formed in a predetermined area of a dielectric layer. An insulating layer is formed on the semiconductor wafer to cover the upper and side surfaces of the protective layer, the side surfaces of the buffering layer and the resistance layer, and the surface of the dielectric layer outside of the predetermined area. Two openings extending down to the protective layer are formed by performing a dry-etching process on the insulating layer. Two openings extending down to the buffering layer are formed by performing a first wet-etching process on the protective layer below the two openings of the insulating layer. Two openings extending down to the resistance layer are formed by performing a second wet-etching process on the buffering layer below the two openings of the protective layer.

Abstract: Disclosed is an electrical film resistor or a film thermistor formed by a composite of electrically-conducting oxide and electrically insulating aluminum oxide (Al2O3, the sapphire). In a preferred embodiment, the electrically-conducting oxide can be ruthenium oxide (RuO2) or iridium oxide (IrO2). The composite film is formed by a film deposition process such as rf sputtering deposition in the presence of an inert gas. By adjusting the composition ratio of the composite, or changing the reaction conditions of the film deposition, for example, the inert gas pressure or the substrate temperature, the composite film can be formed for applications in either electrical resistor devices or thermistors.

Abstract: There is provided a thin film resistor formed of titanium nitride containing oxygen in a solid solution condition.

Abstract: A chip resistor having a highly accurately adjusted low resistance value is obtained. The chip resistor having a vertically three-layered structure is obtained by forming a first electrode 1A by printing paste for an electrode on an insulating substrate 5 and drying it, a resistor layer 3 by printing paste for a resistor on the first electrode 1A and drying it, a second electrode 1B by printing paste for an electrode on the resistor layer 3 and the insulating substrate 5 and baking it. Trimming is applied to the thus fabricated chip resistor so as to adjust a resistance value to a given value.

Abstract: A high density resistor structure and a method for forming the structure are disclosed. The high density resistor structure can be constructed by an electrically insulative substrate; a refractory metal-silicon-nitrogen layer deposited on the top surface; and at least one resistor element patterned in the refractory metal-silicon-nitrogen layer in a plane parallel to the top surface. The method can be carried out by first providing the electrically insulative semiconductor substrate or a glass substrate, then sputter-depositing a TaSiN layer having a thickness between 200 Å and 2000 Å on top of the substrate; and then forming by a reactive ion etching technique at least one resistor element in the TaSiN film in a plane that is parallel to the top surface of the substrate.

Abstract: A thermistor element has a pair of electrodes formed in ohmic contact with and mutually opposite to each other on one of the surfaces of a thermistor body. These electrodes each have a thin-film contact layer and an external electrode layer which is formed either directly or indirectly over the contact layer and only on the surface on which these electrodes are formed opposite each other and is of a metallic material such as Au, Ag, Pd, Pt, Sn and their alloys.

Abstract: A cathode ray tube includes an evacuated envelope having a panel portion having a phosphor screen, a neck portion and a funnel portion connecting the panel portion and the neck portion; an electron gun housed in the neck portion having a cathode, a first grid electrode, a second grid electrode, plural focus electrodes and an anode arranged in the order named and fixed in predetermined axially spaced relationship by two glass beads; a voltage-dividing resistor attached to one of the two glass beads for producing an intermediate voltage to be applied to a first one of the plural focus electrodes adjacent to the anode by dividing a voltage applied to the anode; and a metal conductor facing and attached to a second one of the plural focus electrodes to surround the voltage-dividing resistor and the one of the two glass beads, the second one of the plural focus electrodes being disposed upstream of the first one of the plural focus electrodes.

Abstract: A resistor includes a mixture of at least one of a metal conductive oxide and a transition metal material with an insulating oxide. A method for producing such a resistor includes the steps of forming an electrode on one of an alumina substrate, a glass substrate and a glass tube; and flame-spraying a mixture of at least one of a metal conductive oxide and a transition metal material with an insulating oxide, thereby depositing the mixture on the one of the alumina substrate, the glass substrate and the glass tube.

Abstract: A resistance heater for heating fluids including a fluid-permeable porous substrate. An electrically conductive porous thin film is deposited on the porous substrate. An electrical connector coupled to the thin film and adapted to provide an electrical circuit through said thin film to effect heating of said thin film in order to heat a fluid passing through the pours of the thin film and substrate. A method of making and using a resistance heater is also disclosed.

Abstract: An electronic device includes a first conductive polymer layer sandwiched between a first external metal foil electrode and a first internal metal foil electrode, a second conductive polymer layer sandwiched between a second internal metal foil electrode and a second external metal foil electrode, a layer of fiber-reinforced epoxy resin bonding the first and second internal electrodes together, a first terminal providing electrical contact between the first internal electrode and the second external electrode, and a second terminal providing electrical contact between the second internal electrode and the first external electrode. In a preferred embodiment, the polymer layers exhibit PTC behavior, and the terminals are formed by a solder layer applied over a plated layer of conductive metal. Insulative layers are preferably provided on the external electrodes, and located so as to insulate the first and second terminals from each other.

Abstract: Thin films of Ti—Cr—Al—O are used as a resistor material. The films are rf sputter deposited from ceramic targets using a reactive working gas mixture of Ar and O2. Resistivity values from 104 to 1010 Ohm-cm have been measured for Ti—Cr—Al—O film <1 &mgr;m thick. The film resistivity can be discretely selected through control of the target composition and the deposition parameters. The application of Ti—Cr—Al—O as a thin film resistor has been found to be thermodynamically stable, unlike other metal-oxide films. The Ti—Cr—Al—O film can be used as a vertical or lateral resistor, for example, as a layer beneath a field emission cathode in a flat panel display; or used to control surface emissivity, for example, as a coating on an insulating material such as vertical wall supports in flat panel displays.

Abstract: A method and apparatus for an electronic component package of a passive component using wafer level processing is provided. Posts are formed on the active side of the substrate of an electronic component. A conductive layer leads the contact areas of the electronic component to the tops of the posts. The conductive layer on the top of the posts acting as leads, attaching to traces on a printed circuit board.

Abstract: The invention provides a production method capable of forming a thin film resistance element having a thickness and a shape controlled in a high accuracy in a printed circuit board. The production method of a thin film resistance element formed on a printed circuit board, has the steps of forming a thin film resistance layer having a predetermined thickness on the printed circuit board through an insulation layer by a dry process used in producing a semiconductor, forming an electrically conductive layer on the thin resistance layer, and etching the electrically conductive layer selectively so as to make, at least, a pair of electrically conductive pads, resulting in the thin film resistance element having a predetermined value of resistivity between the pair of electrically conductive pads. Thereby, it is possible to form the thin film resistance element having a thickness and a shape controlled in a high accuracy on the printed circuit board.

Abstract: A material and method of manufacture of resistors having the following characteristics, as deposited (no annealing required): (a) easily dry etchable; (b) high, low thermal coefficient of resistance (near zero) and (c) high reliability in both long term temperature stability (>1000 hours@+125° C.).

Abstract: A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to create an exposed central portion of the resistive material therebetween. According to the method the resistive strip is attached to a single co extensive strip of conductive material and a central portion of the conductive material is removed to create the exposed central portion of the resistive strip.