Abstract: A high stability, high resistance metal film resistor having layered metallic films deposited and annealed such that one layer has a positive TCR and a negative TCR Slope, while a second layer has a negative TCR and a positive TCR Slope, thereby yielding a resistive film having TCR and a TCR Slope approaching zero.

Abstract: A thin-film resistor comprising a thin film of a nitride of at least one element belonging to groups III-VI of the periodic table. The thin-film resistor has a metal oxide layer comprising at least one metal oxide selected from the group consisting of manganese oxide, iron oxide, cobalt oxide, nickel oxide, zinc oxide, indium oxide, tin oxide and indium tin oxide interposed between the nitride thin film and an electrode for external connection.

Abstract: A resistive element is formed on a printed circuit board using only printed circuit board fabrication techniques. Two printed circuit board strata are laminated together into a multi-layer printed circuit board. A desired trace pattern is etched into a first layer of a first stratum that has first and second conductive metallic layers clad to opposing sides of a first dielectric substrate. A bi-metallic clad substrate having a resistive layer clad to a first side of a second dielectric substrate, a third conductive layer clad to the resistive layer, and a fourth conductive layer clad to a second side of the second dielectric substrate represents the second stratum. The third conductive layer is etched to leave only pads. The resistive layer is etched to form resistive elements of desired resistivity between the pads. When the two strata are laminated together, the pads couple to the trace pattern at desired locations.

Abstract: A high power RF resistor for use, for example, as an isolation resistor in an RF hybrid splitter/combiner is formed on a thermally conductive substrate. A first insulating beryllia (BeO) layer extends over the substrate and has a top surface and a bottom surface. A first metallization layer extends over the top surface of the first insulating layer and includes a longitudinally-extending gap. A second insulating BeO layer is positioned above the first insulating layer and includes a top surface, a bottom surface and first and second side surfaces. A second metallization layer surrounds the bottom surface and the first and second side surfaces of the second insulating layer and has a longitudinally-extending gap, the gap in the second metallization layer positioned to be in alignment with the gap in the first metallization layer. This structure forms a Faraday shield between the resistive layer and ground to thereby reduce the I.sup.

Abstract: A circuit board including resistors on one surface of a board or substrate having through hole conductors arranged in a lattice like fashion. At least one electrode is formed on a surface of the resistors, at least one electrode being formed by removing a portion of a surface of the board or substrate coaxially with the through hole conductors thereby forming substantially disk-shaped resistors.

Abstract: A matrix of infrared generating cells is disclosed. Each cell includes a resistive element formed over and traversing a cavity formed on the surface of the supporting semiconductor substrate.

Abstract: A planar heat generating resistor has a heat generating resistor layer formed on or above a support member and a pair of opposing electrodes formed on the heat generating resistor layer, such that a width of the heat generating layer at the electrode area is larger than a width of the electrodes and a voltage is applied across the electrodes, in which a ratio of a maximum value of a gradient of .phi., .sqroot.(.differential..phi./.differential.x).sup.2 +(.differential..phi./.differential.y).sup.2 to a value of .sqroot.(.differential..phi./.differential.x).sup.2 +(.differential..phi./.differential.y).sup.2 at a center of the resistor is no larger than 1.4 when a Laplace equation .differential..sup.2 /.differential.x.sup.2 +.differential..sup.2 .phi./.differential.y.sup.2 =0 is solved for the heat generating resistor when an orthogonal coordinate system X-Y is defined on the resistor surface, a potential at a point (x,y) on the resistor surface is represented by .phi.

Abstract: A thin alumina support substrate is printed with a resistive thick film and trimmed to the desired resistance value so as to avoid undue toxicity during the trimming process. The thus formed thick film resistor on an alumina substrate is then solder-bonded to a relatively thick beryllia (BeO) dielectric heat sink which, in the exemplary embodiment, is in turn also solder-bonded on its opposite side to a larger metallic heat sink.

Abstract: A planar heat generator comprises a heating element of metallic foil; a first pair of sheets made of a plastic material which are bonded to each other so that the heating element is interposed therebetween; a second pair of sheets made of a plastic material which are bonded to the outer surfaces of the first pair of sheets, respectively; and a pair of protective covers which are made of a plastic material having a melting point at least approximate to that of the material of the second pair of sheets. The protective covers are larger in area than the second pair of sheets and are bonded by fusion not only to the outer surfaces of the second pair of sheets, respectively, but also to each other at peripheral areas which extend beyond the peripheral margins of the second pair of sheets.

Abstract: A plurality of resistors connected in a ladder format and disposed in parallel with each other. Each of the resistors has a resistance part and two mutual connection ends connected to the resistance part. The mutual connection ends are gathered at one side with respect to the resistance part.

Abstract: A circuit board that can be manufactured economically and reliably comprises first and second insulating films and an electrically conductive heat-seal film. Circuit patterns of first and second electrical parts are formed on the first and second insulating films, respectively. These circuit patterns are selectively connected with each other through the heat-seal film. The first insulating film has a hole in which the second insulating film is retained in such a way that the patterns on the first and second insulating films are substantially coplanar with each other.

Abstract: In a thermal head comprising a plurality of heat-generating elements formed on a glaze layer on a substrate, grooves extending to the midway of the glaze layer in the thickness direction of the glaze layer and having a depth of 0.3 to 30 .mu.m are formed in the surface portion of the glaze layer between every two adjacent heat-generating elements. This thermal head is improved in both the rising and falling response characteristics of the heat-generating temperature by the presence of these grooves, and sharp images having a high resolving power can be obtained.

Abstract: A roughened surface is formed on an insulating ceramics substrate having an electrode pattern by bonding or partially thrusting ceramics particles to or in the substrate, and a gas-sensitive metal oxide thick film is firmly bonded to the roughened surface.

Abstract: In a chip resistor made of thin film having its connecting electrodes for connecting the resistor to a substrate, the connecting electrodes are coated with electrical conducting paint then soldering is performed so as to ensure soldering of the connecting electrodes to the substrate.

Abstract: A matched load for an unloaded terminating end of a signal transmission line on a printed circuit wiring board avoids reflecting pulses back down the line. A non-reflective attenuation region is provided under the unloaded terminating end, such region being wedge-shaped and doped to a reduced resistivity, and situated in the silicon substrate of the board. Data pulses at the unloaded terminating end of the transmission line, modulated at the selected operating frequency of the board, are substantially attenuated by the doped region.

Abstract: A buried-resistance semiconductor device is constructed by forming a P-type monocrystalline silicon substrate on which an epitaxial layer of silicon doped with type N impurities is grown, a portion of the epitaxial layer being insulated by a P-type insulating region extending from the substrate to the surface of the epitaxial layer. Two suitably-spaced terminals are secured to the surface of the epitaxial layer in the area bounded by the insulating region. Two separation regions extending into the surface layer are formed in the part of the epitaxial layer between the terminals, and a buried region extends from the substrate between the separation regions without being in contact with them. The three regions are of P-type material, and have an elongated shape and are bounded at the ends by the insulating region.

Abstract: The heater of the present invention includes a paper or plastic substrate on which is printed a semi-conductor pattern (typically a colloidal graphite ink) having (a) a pair of longitudinal stripes extending parallel to and spaced apart from each other and (b) a plurality of identical bars spaced apart from each other and extending between and electrically connected to the stripes. A metallic conductor (typically copper stripping) overlies each of the longitudinal stripes in face-to-face engagement therewith, and the conductors are held in tight engagement with the stripes by a sealing layer that overlies the metallic conductors and is sealed, at opposite sides of the semi-conductor stripe associated with the particular metallic conductor, to portions of the substrate that are free from the printed semi-conductor pattern.

Abstract: A platinum resistor for the measurement of temperatures having a silicon substrate, an aluminum oxide film formed on said silicon substrate, and a platinum film formed on said aluminum oxide film.

Abstract: A high power thick film resistor having improved power handling capability is obtained with a resistor having two overlying thick film layers wherein the first thick film layer has a relatively low resistivity and the second thick film layer has a relatively high resistivity.

Abstract: An electrical heating device comprises a substrate, a pair of parallel, spaced apart elongated conductors extending longitudinally of the substrate, and a semi-conductor pattern carried on the substrate and electrically connected to and extending between the conductors. The semi-conductor pattern produces a thermal image for an infrared target. In some embodiments, the thermal image is irregular or circular in shape and the semi-conductor pattern includes a plurality of transversely-spaced bars having relatively wide portions outside, and relatively thin portions within, the area producing the thermal image.

Abstract: An improved thick film resistor is disclosed which is comprised of a substrate, a resistor body comprised of a plurality of overlying layers of a resistor material, and a pair of spaced apart terminals each of which has a primary contact portion and a plurality of spaced apart secondary contact portions. The secondary contact portions are interleaved between the layers of resistor material and extend partially into the resistor body and are in electrical and heat transferring contact with the respective primary contact portions of each terminal. The novel thick film resistor is compact in its dimensions and is capable of dissipating substantially large amounts of heat and providing lower current densities than conventional thick film resistors.

Abstract: A coated layer type resistor device having a first resistor element and a second resistor element. The ratio between the resistances of the first and second resistor elements is selected to be greater than a predetermined ratio. The first resistor element is formed on an insulator substrate and consists of a resistor layer and end conductor electrodes at the ends of the resistor layer, while the second resistor element is formed on the substrate and consists of a resistor layer, end conductor electrodes, and a plurality of intermediate conductors. The distance between adjacent ones of the intermediate conductors and the distance between one of the end conductor electrodes and the adjacent intermediate conductor in the second resistor element is equal to the distance between the end conductor electrodes in the first resistor element, so that the temperature coefficient property of the resistance is equal in both the first and second resistor elements.

Abstract: Electric heater assembly for use typically with hand-held soldering or desoldering devices includes an elongated resistance element formed from a thin flat metal foil having three connected areas of different resistance, the differing resistance being caused by the different widths of the areas. The first area, to which terminals are attached, is the widest and acts as a heat sink. The second area decreases in width to the first area and acts as a transition area between the first and third areas. The first and second areas include first and second separated portions for providing electrical current to the first area and returning it therefrom. The first area includes first and second strips respectively connected to the first and second portions of the second area. The strips extend adjacent a first side edge of the third area in a side-by-side relationship to the distal end of the resistance element and then back towards the second area to a position where they are connected to one another.

Abstract: A precision resistor of the type formed by defining a resistive path in a thin foil of resistance material attached to a substrate. Metallic interface layers are deposited on terminal pads between which the resistive path extends, so that when solder-coated copper leads are spot-welded to the terminal pads, the junction between the copper leads and the terminal pads is both a spot-weld and a solder connection.

Abstract: System and method for producing a composite, particularly applicable for repairing damage to a structural component, wherein an electrical resistance heating element basically in the form of a layer of conductive carbon or graphite, e.g., in fiber form, becomes bonded to and forms a part of the cured composite. In the repair of a parent structure, a patch comprising a heat curable resinous material is applied to the parent structure, and a heat bondable adhesive film is positioned between the parent structure and the patch. An electrical resistance heating element in the form of a layer of graphite fibers is provided in contact with, or forming a part of, the patch, the heating element being capable of bonding the patch to the parent structure upon heating the adhesive bond to a predetermined temperature, to form a unitary structure comprised of the damaged parent structure, the patch and the heating element.

Abstract: An input device for use in a display unit serving as a terminal of a computer has first and second insulating sheets and an insulating spacer sandwiched between the first and second sheets. The first sheet has first terminal leads on its both ends, while the second sheet has second terminal leads which extend in perpendicular relation to the first terminal leads. The upper surface is covered with a flexible, insulating, protective sheet. The spacer includes lattice-like conductors and consists of a material having cells of gas and elasticity and flexibility such as silicone foam. A fixed voltage is alternately applied across both ends of the first sheet and across both ends of the second sheet. When the protective sheet is depressed at a point P as by a depression pen, the position of the point is measured and represented by means of X- and Y-coordinates.

Abstract: A chip resistor provided with a thin-film resistor has lateral electrodes formed at both sides of the substrate of the chip resistor. The lateral electrodes are formed by printing and firing conductive paste of a silver resin, not by thin-film technology. Electrode layers are formed on the lateral electrodes and on the thin-film electrode by plating. The chip resistor is thus constructed so as to be readily connectable to a motherboard by dip soldering or reflow soldering.

Abstract: A thick film resistor includes a ceramic substrate 10, a pair of spaced apart electrical connections 30 affixed to the substrate 10, a region of electrically resistive material 21 coated onto the ceramic 10 and not in contact with either of the electrical connections 30, the electrically resistive material adapted to be trimmed 25 and 26 along an edge to thereby lower its resistance, and a pair of spaced apart strips of electrically conductive material 12 and 14 formed on the substrate 10 in electrical contact with the resistive material 21 and extending to a respective one of the pair of connectors 30, the strips 12 and 14 being substantially parallel where in contact with resistive material 21 except at ends of the strips 13 and 15 opposite the location to be trimmed 25. The invention places highest electric field concentrations away from the edge to be trimmed.

Abstract: An electric hotplate has a hotplate body in the form of a thin ceramic substrate, to whose bottom surface is applied, e.g. by printing, a thin resistive material film. This resistive material film is covered by a protective coating, which prevents damage. Between the protective coating and the bottom tray of the hotplate is provided a thermal insulating layer. The hotplate has an extremely low thermal capacity, so that rapid preliminary cooking or boiling is possible with low power consumption.

Abstract: An electrical heating device comprises a substrate, an elongated conductor extending longitudinally of the substrate, a semi-conductor pattern carried on the substrate and electrically connected to and extending from the conductor pair, and a sealing layer overlying the conductor and sealed to the substrate at opposite sides of the conductor. The conductor comprises a pair of rectangular in cross-section metallic conductor elements, placed one on top of the other in face-to-face engagement with and unattached to each other. The bottom conductor elements faces towards the substrate and the upper conductor elements faces towards and engaging the sealing layer.

Abstract: A resistor having of an insulating substrate bearing a thin layer of the alloy CrSi.sub.x, where 1.ltoreq.x.ltoreq.5 and which layer is doped with nitrogen. The doping may be spread homogeneously throughout the thickness or be concentrated in one or two thickness zones on the outside and/or on the side adjoining the substrate. As a result of the nitrogen doping an improvement of the stability of the resistor is obtained.

Abstract: A resistor sheet input tablet comprising two rectangular resistor sheets each provided at two opposite edges thereof with electrodes, the rectangular resistor sheets being superposed such that the electrodes on one of the resistor sheets lie perpendicularly to those on the other resistor sheets, wherein the resistor sheets have a two resistor layer construction comprising (a) a main resistor layer consisting of a thin metal film deposited thereon which in turn is bonded to (b) an electrically insulating layer and (c) a protective resistor layer formed on the surface of the main resistor layer.

Abstract: A novel construction for a thick film resistor is disclosed. A substrate has a first face deposited with a layer of resistive material. Between the substrate and this first layer is located a strip of conductive material. The strip of material is oriented at approximately right angles to the current path through the first layer, midway along the current path. A second layer of resistive material is located on a second face, parallel to the first face, and the first and second layers are connected electrically in series such that the current path through the second layer is orthogonal to the current path through the first layer.

Abstract: An electrical resistor and method of making the same is disclosed wherein a ceramic substrate is coated with a relatively rough dielectric film which is subsequently coated with a thin metal film such as nichrome.

Abstract: A part for a slide variable resistor provided on an insulated support thereof with a film resistive layer adapted for a slide terminal to be slid along the surface thereof, which part is characterized in that said film resistive layer comprises a main resistive layer pattern bound to the insulated support and a protective resistive layer pattern coated on said main resistive layer pattern, wherein the protective resistive layer pattern has a larger sheet resistivity than said main resistive layer pattern.

Abstract: An array of electrically interconnected spaced electrical components on an apertured substrate wafer, each component being connected to terminal conductor pads on one surface of the substrate and to terminal conductor pads on the opposite surface of the substrate by thick film conductor strips which extend along the walls of the apertures is disclosed.

Abstract: The heater of the present invention includes a paper or plastic substrate on which is printed a semi-conductor pattern (typically a colloidal graphite ink) having (a) a pair of longitudinal stripes extending parallel to and spaced apart from each other and (b) a plurality of identical bars spaced apart from each other and extending between and electrically connected to the stripes. A metallic conductor (typically copper stripping) overlies each of the longitudinal stripes in face-to-face engagement therewith, and the conductors are held in tight engagement with the stripes by a sealing layer that overlies the metallic conductors and is sealed, at opposite sides of the semi-conductor stripe associated with the particular metallic conductor, to portions of the substrate that are free from the printed semi-conductor pattern.

Abstract: A thin film bar resistor comprises: an insulative substrate, a pair of conductive thin film resistor terminals spaced apart on the substrate, an approximately square thin film resistance body disposed on the substrate between the terminals to be separated from them by guard margins, the body consisting of lower and upper layers of unanodized and anodized tantalum nitride, thin film regions of unanodized tantalum nitride in the guard margins to connect such body to the terminals, and thin film conductive leads connected to the terminals.

Abstract: A heat generating element particularly well suited for use in an electrical space heater and method of making same include an electrically nonconductive substrate on which is coated a layer of an electrically nonconductive ceramic material having finely divided, micron size metallic particles dispersed therein. A path of electrical conductivity is established in the otherwise nonconductive ceramic material by burnishing the surface of the ceramic material between two separated points. Thus, as electrical current flows along the burnished path, heat will be generated due to the electrical resistance thereof.

Abstract: To form a temperature sensor, for example suitable in an automotive vehicle, to determine ambient temperatures, or to provide a temperature compensated thin-film circuit, for example for incorporation with an oscillator circuit, two stable thin-film layers are applied to a non-conductive substrate, the layers being capable of being etched.

Abstract: An electrical network containing at least one electric resistor, includes a support foil and at least one resistance layer coating the support foil forming the at least one electric resistor. The support foil and resistance layer are folded along a zig-zag line forming two outer surfaces of the resistance layer. Contact layers are each disposed on a different one of the outer surfaces of the resistance layer, a plastic layer is applied on the contact layers, and outer contact layers each make contact with a different one of the contact layers. A method is also provided for producing the same.

Abstract: A resistive element which is formed in a semiconductor substrate comprises a first semiconductor region which is formed in the semiconductor substrate and in which an impurity is diffused at a first concentration; a second semiconductor region which is connected to the first semiconductor region at one end and in which an impurity is diffused at a second concentration higher than the first impurity concentration; a third semiconductor region which is connected to the first semiconductor region at the other end and in which an impurity is diffused at a third concentration higher than the first impurity concentration; and the second and third semiconductor regions respectively including a portion whose cross section has a smaller area than the area of a boundary defined by the second and third semiconductor region with the first semiconductor region.

Abstract: A thin film resistor having a controlled temperature coefficient of resistance (TCR) ranging from negative to positive degrees kelvin and having relatively high resistivity. The resistor is a multilayer superlattice crystal containing a plurality of alternating, ultra-thin layers of two different metals. TCR is varied by controlling the thickness of the individual layers. The resistor can be readily prepared by methods compatible with thin film circuitry manufacturing techniques.

Abstract: A high frequency stripline-type power divider/combiner comprising a patterned metal layer having an input and two output strips, a dielectric substrate, and a resistive material layer interposed between the metal layer and substrate. A portion of the resistive material layer defines a resistive bridge that extends between and resistively interconnects the output strips, thereby acting as a resistive load for the cancellation of reflected power output signals. The patterned metal layer and resistive bridge are concurrently defined by standard photolithographic and etching techniques, thereby allowing the simple and accurate fabrication of an integral power divider/combiner.

Abstract: A humidity sensitive resistor, comprising a pair of detecting electrodes (2) and (3) formed on an insulating substrate (1), and a humidity sensitive film (4) formed to coat on this detecting electrodes, the humidity sensitive film (4) being made of an integrated structure of a first layer macromolecular resin film (5) containing a polyvinyl alcohol polymer and an electrolyte and a second layer of hygroscopic macromolecular resin film (6) covering on the surface of the first layer, and humidity being detected with the aid of a change of the resistance value of this humidity sensitive film (4).

Abstract: A variable resistor element (10) comprises two thick film resistance layers or tracks (12, 14; 40, 50) electrically insulated one from another and on an insulating substrate (11). The thick film resistance layers (40, 50) may consist of the same resistance composition and thereby have the same resistivity, but the paths (40, 50) having different widths to effect different resistances; or, the widths of the resistance layers (12, 14) may be the same but the layers (12, 14) comprise different resistance compositions having different resistivities. An electrical contactor (20) has flexible fingers (22) wipably and respectively engaging the surface of each resistance layer (12, 14; 40, 50) to complete a circuit across the tracks (12, 14; 40, 50) and through the terminals (16 and 66) of the respective layers.

Abstract: Waveform distortion of a signal passing through an insulator coated conductor is prevented by the application of a solution containing electrically conductive particles to the surface of the insulative material to form a conductive layer over the surface of the insulator. The conductive layer permits charges to be uniformly dispersed through the insulative material when current is passed through the conductor. The conductive material comprises a mixture of carbon and cellulose in the form of a solution which, upon application to the insulative surface, forms the conductive layer with a strong power of adhesion to the underlying material. The conductive layer partially penetrates into the underlying material to create a gradual variation in the dielectric constant of the insulative material.

Abstract: A voltage-dependent resistor having at least one zinc oxide (ZnO) layer adjacent to at least one metal oxide layer of bismuth oxide (Bi.sub.2 O.sub.3) and at least one of the members selected from the group consisting of cobalt oxide (Co.sub.2 O.sub.3) manganese oxide (MnO.sub.2) antimony oxide (Sb.sub.2 O.sub.3) and zinc oxide (ZnO).

Abstract: Improved indium oxide resistor inks useful in constructing multilayer integrated circuits, particularly on porcelain-coated metal substrates, are provided. The subject inks, which are characterized by an improved temperature coefficient of resistance (TCR), comprise: indium oxide, magnesium oxide as a TCR controlling agent, a barium calcium borosilicate glass frit and a suitable organic vehicle.

Abstract: A multilayer thermistor and a method of making it are disclosed. The thertor has a positive temperature coefficient of resistance (PTCR) and a room temperature resistance lower than prior art thermistors of the same size. The thermistor is comprised of a plurality of layers of material having the PTCR characteristic laminated in alternation with layers of electrodes, the outer two layers of the thermistor being PTCR layers. Alternate electrodes are electrically connected in common to a pair of conductors forming thereby parallel resistance paths across each layer. The more resistance paths the thermistor has, the lower the overall resistance of the device.