Abstract: A support table (1) for inspecting and/or orienting electronic components (B) prior to the assembling of a printed circuit board with these components, onto which support table the components, which are initially held at a nozzle end (7) by means of negative pressure, are set down following release by the nozzle end, wherein the table (1) has a transparent support plate (2), preferably a glass plate, and a delimiting edging (5, 6p, 6z, 12) preventing a displacement of a component (B) deposited temporarily on the support plate caused by air exiting the nozzle is provided, and an optical inspection device is arranged below the support table (6u) and an optical inspection device is arranged above the support table (6o).

Abstract: Systems and methods of enhancing the resolution or restoring details associated with high resolution images into a filtered digital surface model (DSM) for location-based applications and analyses. The disclosed methods include mapping the changing gray scale values (intensity) from the images to changes in elevation in the DSM using a regression over a local neighborhood of pixels. Further, the disclosed methods do not rely on information about the sensor illumination geometry, and are extendable to be able to utilize any types of images. Additionally, the disclosed embodiments are sensor agnostic. That is, the disclosed methods can be applied on any type of images collected by any type of sensor.

Abstract: The invention relates to an inspection system (10) for defect analysis of a wire connection (11) between a substrate (13) and a semiconductor component (15, 16) of a product (12), the inspection system comprising a first projection device (24), a line scan camera (28) and a processing device, the first projection device having at least one slit projection means (25), the slit projection means being capable of projecting a light slit (33) onto a wire (21, 22) of the wire connection, light of the light slit reflected by the wire in a detection plane (39) of the line scan camera extending perpendicularly, preferably orthogonally to a substrate surface (14) being detectable by means of the line scan camera, analysis image information of the product being derivable from a plurality of line scan image information of the line scan camera by means of the processing device, wherein the slit projection means is arranged in relation to the line scan camera in such a manner that the light slit can be projected onto the p

Abstract: Image data pertaining to substrate transfer is efficiently collected and stored for use in analyzing transfer errors. A substrate processing device includes a first control part for stopping a transfer part upon detecting a transfer error in the transfer part for transferring a substrate; a storage part for storing substrate transfer operations of the transfer part as image data; and a second control part for accumulating the image data in an accumulation part at a predetermined period. The first control part obtains information indicating a state of the substrate from the transfer part or a processing part, and notifies the second control part that the transfer part is stopped due to the transfer error. The second control part retrieves image data of a predetermined period of time including the time that the transfer error occurs from the accumulation part, and converts the image data into a file.

Abstract: A method is disclosed evaluating a silicon layer crystallized by irradiation with pulses form an excimer-laser. The crystallization produces periodic features on the crystallized layer dependent on the number of and energy density ED in the pulses to which the layer has been exposed. An area of the layer is illuminated with light. A microscope image of the illuminated area is made from light diffracted from the illuminated are by the periodic features. The microscope image includes corresponding periodic features. The ED is determined from a measure of the contrast of the periodic features in the microscope image.

Abstract: A test structure includes a dedicated addressing circuit that allows large numbers of test devices to be tested simultaneously and the measurement signals read out serially for different test devices. The test structure may be configured for wafer, die or package-level testing. The test structure may be integrated on a common die with the test devices in a single package, provided on separate die in a common package, separately packaged chips or in the form of a collection of standard die configured as the test structure. If on separate die, the test and addressing circuitry is fabricated from a more mature fabrication process than that being characterized for the devices under test. The processes being characterized may be unqualified whereas the test circuitry may be fabricated with different and more mature or qualified processes.

Abstract: A charged particle beam writing apparatus includes a storage unit to store writing data of a region to be written in a target object, a first dividing unit to read the writing data and divide the region to be written into at least one first data processing region that overlaps with at least a first region where a pattern has been arranged, and at least one second data processing region that overlaps with a second region where no pattern is arranged without overlapping with the first region, a data processing unit to perform data processing of predetermined data processing contents for at least one first data processing region without performing the data processing for at least one second data processing region, and a writing unit to write a pattern on the target object, based on processed data.

Abstract: A method, which includes: a first chip-position calculation step of taking an image of an upper surface of a reference chip and an image of a lower surface of a correction chip to calculate positions of the chips; a second chip-movement step of moving the reference chip to a position, based on a displacement amount between the chips that has been calculated based on the positions of the chips, at which a distance between the chips corresponds to a predetermined offset amount, and then placing the correction chip on the suction stage; a second chip-position calculation step of taking an image of an upper surface of the correction chip, and calculating a second position of the correction chip; and a correction amount calculation step of calculating a correction amount of the predetermined offset amount based on the position of the reference chip and the second position of the correction chip.

Abstract: A microscope system and method allow for a desired x?-direction scanning along a specimen to be angularly offset from an x-direction of the XY translation stage, and rotates an image sensor associated with the microscope to place the pixel rows of the image sensor substantially parallel to the desired x?-direction. The angle of offset of the x?-direction relative to the x-direction is determined and the XY translation stage is employed to move the specimen relative to the image sensor to different positions along the desired x?-direction without a substantial shift of the image sensor relative to the specimen in a y?-direction, the y?-direction being orthogonal to the x? direction of the specimen. The movement is based on the angle of offset.

Abstract: A method for the quality evaluation of a component produced by an additive manufacturing method and device includes at least the following steps: providing image data that characterizes at least one component site of a component produced by an additive manufacturing method; converting the image data into a binary image; eroding the binary image into a structure image; determining contour data of the structure image; determining at least one image section of the image data that is delimited by the contour data; inspecting the at least one image section for the presence of an image region corresponding to a quality defect; and classifying the component as being qualitatively OK if no quality defect is present, or classifying the component as being qualitatively not OK if a quality defect is present.

Abstract: A method for inspecting a group of dies of a wafer, wherein the wafer comprises a group of wafer segments, wherein each wafer segment comprises a die of the group of dies, a molded material that surrounds the die and redistribution layer (RDL) conductors that are coupled to the die and are positioned above the die and the molded material, wherein the method includes the steps of: receiving design information about the RDL conductors of each wafer segment of the group of wafer segments; obtaining, during a setup process, first images of the group of wafer segments; wherein the obtaining of the first images comprises illuminating the group of wafer segments with radiation and detecting radiation scattered or reflected from the group of wafer segments as a result of the illuminating; generating reference information based on the design information about the RDL conductors of one or more wafer segments of the group of wafer segments and at least one first image of the one or more first images; acquiring, during a

Abstract: Methods and systems for generating a wafer inspection process are provided. One method includes storing output of detector(s) of an inspection system during scanning of a wafer regardless of whether the output corresponds to defects detected on the wafer and separating physical locations on the wafer that correspond to bit failures detected by testing of the water into a first portion of the physical locations at which the defects were not detected and a second portion of the physical locations at which the defects were detected. In addition, the method includes applying defect detection method(s) to the stored output corresponding to the first portion of the physical locations to detect defects at the first portion of the physical locations and generating a wafer inspection process based on the defects detected by the defect detection method(s) at the first portion of the physical locations.

Abstract: Systems and methods of enhancing the resolution or restoring details associated with high resolution images into a filtered digital surface model (DSM) for location-based applications and analyses. The disclosed methods include mapping the changing gray scale values (intensity) from the images to changes in elevation in the DSM using a regression over a local neighborhood of pixels. Further, the disclosed methods do not rely on information about the sensor illumination geometry, and are extendable to be able to utilize any types of images. Additionally, the disclosed embodiments are sensor agnostic. That is, the disclosed methods can be applied on any type of images collected by any type of sensor.

Abstract: An optical inspection system inspects points of interest on an item. A two-axis gimbal holds a camera and is controlled to adjust an angle of incidence and angle of approach of a line of sight of the camera with respect to the point of interest. A Y-axis actuator adjusts a position of the camera along a Y-axis of the item, and an X-axis actuator adjusts a position of the camera along an X-axis of the item. A controller controls the gimbal, the Y-axis actuator and the X-axis actuator. Upon selecting a point of interest, angle of incidence, and angle of approach, the camera displays and/or captures an image, and the image can be inspected by a human inspector or automated inspection system.

Abstract: A method for determining overlay between layers of a multilayer structure may include obtaining a given image representing the multilayer structure, obtaining expected images for layers of the multilayer structure, providing a combined expected image of the multilayer structure as a combination of the expected images of said layers, performing registration of the given image against the combined expected image, and providing segmentation of the given image, thereby producing a segmented image, and maps of the layers of said multilayered structure. The method may further include determining overlay between any two selected layers of the multilayer structure by processing the maps of the two selected layers together with the expected images of said two selected layers.

Abstract: A workpiece processing apparatus includes: a first rotational distance information storage unit that stores multiple pieces of first rotational distance information, each of which is information having, in association with each other, a rotational angle, and first distance information regarding a distance from a rotation center to an edge of a circular workpiece corresponding to the rotational angle, in a case where the workpiece is rotated; an acquiring unit that acquires information for positioning the workpiece, information for specifying an orientation of the workpiece, and information regarding a defective portion at the edge of the workpiece, using the multiple pieces of first rotational distance information stored in the first rotational distance information storage unit; and an output unit that outputs the information for positioning the workpiece, the information for specifying the orientation of the workpiece, and the information regarding the defective portion, which are acquired by the acquiring u

Abstract: An optical image capturing module and an alignment method and an observation method for an upper substrate and a lower substrate using the optical image capturing module are provided. The upper substrate and the lower substrate are disposed opposite. The alignment method includes the following steps of: emitting a light ray; filtering the light ray and dividing the light ray into a light ray at first wavelength and a light ray at second wavelength, whereby the light ray at first wavelength irradiates a pattern on the upper substrate, and the light ray at second wavelength irradiates a pattern on the lower substrate; reflecting the pattern on the upper substrate to an image capturing device; reflecting the pattern on the lower substrate to the image capturing device; and determining the positions of the pattern on the upper substrate and the pattern on the lower substrate on the image capturing device.

Abstract: An inspecting device for inspecting an inspection target is provided. The inspecting device includes a mono-color image-retrieving module, illuminating modules and a control module. The mono-color image-retrieving module is disposed above the inspection target with an optical axis orienting toward the inspection target. Each of the illuminating modules includes light-emitting elements of different colors. The control module controls the illuminating modules to sequentially generate illuminating lights both in an order of different colors and different incident angles to further control the mono-color image-retrieving module to sequentially retrieve mono-color images each in response to one illumination of the illuminating lights. The control module performs an inspection of the inspection target based on the mono-color images.

Abstract: In part, the invention relates to computing systems and methods for electronically indicating the acceptability of a product. An image capture and communication device may analyze a product label that includes one or more monitors, authentication elements, and identification elements. The image capture and communication device may determine the type and features of the monitors, authentication elements, and identification elements. The image capture and communication device may transmit data based on the type and features to a host server, which may transmit data associated with the host product to the image capture and communication device in, inter alia, the form of an acceptability report.

Abstract: A number one camera and number two camera are provided in the top section and lower section of a mounting and inspection data creation device. A number one lighting device and top side shielding plate are provided on the lower side of a lens of number one camera. A number two lighting device and lower side shielding plate are provided on the top side of a lens of number two camera. Component is set on transparent setting plate that is positioned between top side shielding plate and lower side shielding plate, and when imaging the top side (pickup side) of component with number one camera, top side shielding plate is slid out of the imaging area of number one camera. When imaging the bottom side (mounting side) of component with number two camera, lower side shielding plate is slid out of the imaging area of number two camera. Mounting data is created based on component bottom side image taken by number two camera, and inspection data is created based on component top side image taken by number one camera.

Abstract: A charged particle beam writing apparatus includes a storage unit to store writing data of a region to be written in a target object, a first dividing unit to read the writing data and divide the region to be written into at least one first data processing region that overlaps with at least a first region where a pattern has been arranged, and at least one second data processing region that overlaps with a second region where no pattern is arranged without overlapping with the first region, a data processing unit to perform data processing of predetermined data processing contents for at least one first data processing region without performing the data processing for at least one second data processing region, and a writing unit to write a pattern on the target object, based on processed data.

Abstract: Methods and systems for measuring a property of a component of a fuel cell system include performing a three-dimensional optical scan of at least a portion of a surface of the component to produce a three-dimensional representation of the topography of the at least a portion of the surface and measuring at least one property of the component based on the three-dimensional representation. Further embodiments include systems and methods for measuring dimensions of a fuel cell component using a line scan imaging device and/or a matrix camera.

Abstract: Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes.

Abstract: A method is disclosed whereby luminescence images are captured from as-cut or partially processed bandgap materials such as multicrystalline silicon wafers. These images are then processed to provide information about defects such as dislocations within the bandgap material. The resultant information is then utilized to predict various key parameters of a solar cell manufactured from the bandgap material, such as open circuit voltage and short circuit current. The information may also be utilized to apply a classification to the bandgap material. The methods can also be used to adjust or assess the effect of additional processing steps, such as annealing, intended to reduce the density of defects in the bandgap materials.

Abstract: An apparatus detects a pre-aligning element at a wafer. The wafer has the pre-aligning element at a wafer edge. The apparatus includes a sensor arrangement and an evaluation unit. The sensor arrangement is configured to illuminate subsequent edge portions of the wafer edge, to receive transmitted fractions and reflected fractions of the illumination from the illuminated edge portions with an illumination sensor, and to output a first and a second sensor signal. The first sensor signal is based on the transmitted fractions of the illumination and the second sensor signal is based on the reflected fractions of the illumination. The evaluation unit is configured to evaluate the first sensor signal and to determine a first position information with respect to a coarse position of the pre-aligning element if the first sensor signal indicates that the transmitted fractions of the illumination has reached a predetermined threshold value.

Abstract: A method and system are provided for inspecting a plurality of target features arrayed in spaced arrangement on a surface of a target object, such as but not limited to inspection of the location of cooling air holes in the surface of a turbine blade or vane.

Abstract: A dispensing system for depositing material on an electronic substrate includes a frame, a dispensing unit gantry movably coupled to the frame, a dispensing unit coupled to the dispensing unit gantry, a vision system gantry coupled to the frame, and a vision system coupled to the vision system gantry. A controller is configured to manipulate the vision system with the vision gantry system to move to the position defined by a feature, to acquire an image of at least a portion of a feature, to search for an edge of interest along a center of the image, and to return a value indicating an offset of zero (0), which is interpreted as the location that is exactly as expected, and an offset that reflects where the edge of interest intersected that axis location.

Abstract: Provided are an inspection device and an inspection method capable of achieving improved magnetic field sensitivity by using a magnetic thin film of a small film thickness. A light-emitting unit 1 emits light of a first wavelength for acquiring magnetic field inspection information and a second wavelength for acquiring inspection object surface information. A selection unit 6 selects information from an inspection object 4 and information from a magnetophotonic crystal film 3 acquired by light irradiation performed by an irradiation unit 2. An image generation unit 9 generates image data based on the magnetic field inspection information acquired with the first wavelength and the inspection object surface information acquired with the second wavelength selected by the selection unit. Each of the generated image data is displayed on a display unit 10.

Abstract: A board printing apparatus includes a board working table, a first printing table, a second printing table, and a control portion controlling printing operations. The control portion is configured to perform second printing on a board held by the board working table by a large component mask of the second printing table after a first printing performed on the board held by the board working table by a small component mask of the first printing table.

Abstract: A CMOS image sensor includes a pixel array unit, a row selection unit, and a logic circuit. The pixel array unit is used for sensing an object. The pixel array unit includes M pixels and P multiplexers and each of the M pixels is electrically connected to one of the P multiplexers, wherein M is a positive integer and P is a positive integer smaller than M. The row selection unit and the logic circuit are electrically connected to the P multiplexers. The row selection unit is used for generating a row selection signal. The logic circuit is used for determining a sensing region corresponding to the object wherein the sensing region includes N of the M pixels. Furthermore, the logic circuit controls Q multiplexers, which are electrically connected to the N pixels, to transmit the row selection signal to the N pixels.

Abstract: In measuring pattern with large process fluctuation, correct measurement cannot be carried out if noises, such as pattern that is not the subject to be measured, and dirt, are present in periphery of pattern to be measured in previously registered measurement region. Among the image data of sample, predetermined region aligned by pattern matching is set as region not to be measured that is excluded from subjects of pattern measurement. For example, in measuring pattern with large process fluctuation, only region including pattern with small process fluctuation is used in pattern matching, while in measuring the pattern, predetermined region, which was used in pattern matching and aligned, is set as region not to be measured. Stable pattern measurement can be easily carried out with respect to pattern with large process fluctuation, without being affected by region where measurement region and region not to be measured overlap with each other.

Abstract: In accordance with an aspect of the presently disclosed subject matter, there is provided an analysis system for classifying possible defects identified within an inspection image of an inspected object, the system comprising a pattern matcher configured to determine an anchor location with respect to the inspection image, based on a matching of a template and a portion of the inspection image; wherein an accuracy of the determining of the anchor location exceeds a resolution of the inspection image; a distribution analysis module configured to determine, based on the anchor location and a mask which defines different segments within an area, a distribution of a potential defect with respect to one or more of the segments; and a classifier, configured to classify the potential defect based on the distribution.

Abstract: A subject determination apparatus includes: an image obtaining unit, first and second similarity degree determination units, an information obtaining unit, and a subject determination unit. The second similarity degree determination unit determines whether a similarity degree between a reference image and an image of a candidate region of a specific subject image in one of frame images sequentially obtained by the image obtaining unit is equal to or more than a second threshold value smaller than a first threshold value if the similarity degree is determined by the first similarity degree determination unit to be less than the first threshold value. The information obtaining unit obtains information indicating a similarity degree between the reference image and an image of a region corresponding to the candidate region in another frame image obtained a predetermined number of frames before the one frame image.

Abstract: An installation of optical inspection of integrated circuits or the like, comprising: a planar conveyor along a first direction of the objects to be analyzed and a photographic system placed above an area of the conveyor and in a fixed position with respect thereto, the photographic system comprising at least one first set of digital cameras each comprising an orthogonal array of pixels, said cameras being aligned in a second direction different from the first one, the cameras being all oriented so that one of the orthogonal directions of their pixel array forms a first angle with the first direction.

Abstract: A contactless component-inspecting apparatus captures, using a camera, images of an object to be inspected that is assembled or mounted during a component assembly process and compares the captured image and a previously inputted image to determine whether the object passes or fails the inspection.

Abstract: Semiconductor wafer inspection device comprising a wager transport arm provided with at least one wafer support element, a wafer gripper, the gripper having two distant branches designed to take hold of the opposed edges of the wafer, the gripper being mounted so as to rotate on a shaft in order to be able to rotate the wafer between an approximately horizontal position and an approximately vertical position, and at least two inspection systems placed on one side of the wafer and on the other, in an approximately vertical position symmetrically with respect to the plane passing through the wafer.

Abstract: Various embodiments are directed to imaging systems and methods for generating an image of a sub-surface feature of an object through a surface of the object. An illumination array may comprise a plurality of illumination sources positioned around the sub-surface feature of the object. An imaging device may comprise an objective. A computer system may be in communication with the illumination array. The computer system may be programmed to calculate an optimized illumination pattern of the plurality of illumination sources for imaging the sub-surface feature; activate the optimized illumination pattern; and instruct the imaging device to capture an image of the sub-surface feature with the imaging device based on reflected illumination from the optimized illumination pattern.

Abstract: A transfer pathway of mounting heads 10 in a component-mounting round during which the mounting head 10 moves back and forth between a component feeding unit 4 and a substrate conveyance mechanism 2 is derived by a transfer pathway calculation unit 25 for each component-mounting round from mounting program data 21a. On the basis of data pertaining to the thus-derived transfer pathway, image data output from a line sensor camera assigned to a head transfer range segment that the transfer pathway of the mounting head 10 crosses in each of component-mounting rounds are selected and captured by an image selection processing unit 24. The image data output from the line sensor camera whose focusing point substantially matches the imaging target can be used for detecting whether or not a component still exists.

Abstract: A method of determining a physical characteristic of an adhesive material on a semiconductor device element using structured light is provided. The method includes the steps of: (1) applying a structured light pattern to an adhesive material on a semiconductor device element; (2) creating an image of the structured light pattern using a camera; and (3) analyzing the image of the structured light pattern to determine a physical characteristic of the adhesive material. Additional methods and systems for determining physical characteristics of semiconductor devices and elements using structured light are also provided.

Abstract: An image capturing device comprising, a light source configured to emit light having a predetermined wavelength, a polarization beamsplitter configured to receive the light from the light source, a Faraday rotator configured to rotate a polarization plane of the light via the polarization beamsplitter by changing the intensity of the magnetic field, an objective lens configured to illuminate an inspection target with the light transmitted through the Faraday rotator and a sensor configured to capture an optical image of the inspection target by causing the light reflected by the inspection target to be incident through the objective lens, the Faraday rotator, and the polarization beamsplitter.

Abstract: Disclosed are methods and apparatus for qualifying a photolithographic reticle. A reticle inspection tool is used to acquire at least two images at different imaging configurations from each pattern area of the reticle. A reticle pattern is reconstructed based on each at least two images from each pattern area of the reticle. For each reconstructed reticle pattern, a lithographic process with two or more different process conditions is modeled on such reconstructed reticle pattern to generate two or more corresponding modeled test wafer patterns. Each two or more modelled test wafer patterns is analyzed to identify hot spot patterns of the reticle patterns that are susceptible to the different process conditions altering wafer patterns formed with such hot spot patterns.

Abstract: The invention may be embodied in a time delay integration (TDI) based sensor wafer inspection system that introduces controlled blur into the sampled image to suppress high spectral frequencies and thereby mitigate the occurrence of aliasing in the sampled image. Image blur may be introduced in the scan direction by desynchronizing the image motion (scan rate) from the charge transfer rate within the TDI sensor (sample clock rate). The scan rate may be desynchronized from the TDI sample clock rate by altering the speed of wafer movement, the sample clock rate, or the magnification of the imaging optics. Image blur may be introduced in the cross-scan direction by imparting a small alignment difference between the direction of image motion (image scan direction) and the direction that charges transfer within the TDI sensor (sensor direction).

Abstract: In a control unit of an electronic component mounting apparatus, when an imaging form of a component imaging unit is set to a first mode, a component recognition unit recognizes a first electronic component based on an imaged image due to a first imaging element of the component imaging unit, and recognizes a second electronic component based on an imaged image due to a second imaging element of the component imaging unit. Meanwhile, when the imaging form is set to a second mode, the component recognition unit recognizes the electronic components based on an image in which the imaged image by the first imaging element is combined with the imaged image by the second imaging element.

Abstract: A control unit of an electronic component mounting apparatus controls a component imaging unit so as to move an electronic component that is held by the holding unit, when the holding unit is moved in a direction, which is oblique to a conveyance direction of a substrate and is close to the substrate, by a movement mechanism unit.

Abstract: A component imaging unit of an electronic component mounting apparatus has three area cameras, and each of visual fields are common to each other regardless of the area cameras. When the imaging form of the component imaging unit is set to a first mode, a component recognition unit recognizes the electronic components held by the holding unit, based on an image imaged by one area camera. Meanwhile, when the imaging form is set to a second mode, in the component imaging unit, the component recognition unit recognizes the electronic component held by the holding unit, based on each of images, each of which is imaged by three area cameras.

Abstract: A Time Delay and Integration (TDI) imaging system utilizing variable voltage readout clock signals having progressively increasing amplitudes defined as a function of pixel row location, where pixel rows positioned to receive/collect/transfer image-related charges at the start of the TDI imaging process are controlled using lower amplitude readout clock signals than pixel rows positioned to receive/collect/transfer image-related charges near the end of the TDI process. The clock signal amplitude for each pixel row is determined by the expected maximum amplitude needed to hold and transfer image charges by the pixels of that row. Multiple (e.g., three) primary phase signals are generated that are passed through splitters to provide multiple identical secondary phase signals, and then drivers having gain control circuitry are utilized to produce voltage readout clock signals having the same phases as the primary phase signals, but having two or more different voltage amplitudes.

Abstract: A focus height sensor in an optical system for inspection of semiconductor devices includes a sensor beam source that emits a beam of electromagnetic radiation. A reflector receives the beam of electromagnetic radiation from the sensor beam source and directs the beam toward a surface of a semiconductor device positioned within a field of view of the optical system. The reflector is positioned to receive at least a portion of the beam back from the surface of the semiconductor device to direct the returned beam to a sensor. The sensor receives the returned beam and outputs a signal correlating to a position of the surface within the field of view along an optical axis of the optical system.

Abstract: A triangulation system comprising an area camera, a communication interface, a first image processing module, a second image processing module; wherein the area camera is arranged to obtain, at an acquisition rate, a stream of images of illuminated regions of an object; wherein the area camera is prevented from performing height calculations; wherein the communication interface is arranged to convey, in real time thereby in correspondence to the acquisition rate, the stream of images from the area camera to the first image processing module; wherein the first image processing module is arranged to process, in real time, the stream of images to provide first compressed information; wherein the second image processing module is arranged to process, at a non-real time image processing rate, the first compressed information to provide height information indicative of heights of at least the illuminated regions of the object.

Abstract: Disclosed herein are a calibration block for measuring warpage, a warpage measuring apparatus using the same, and a method thereof. The calibration block includes a substrate having one planar surface; and a stepped part forming a step at the center of the other surface of the substrate.

Abstract: A ready for rotation state detection device is configured to detect a state in which a substrate, which is placed on a concave portion formed in a surface of a turntable, will not fly out of the concave portion when the turntable is rotated in a chamber. The ready for rotation state detection device includes a ready for rotation state detection unit configured to detect that a height of a surface of an end of the substrate is equal to or lower than a predetermined value indicating that the turntable is rotatable, upon receiving the substrate on the concave portion.