Abstract: The pattern inspection apparatus of the present invention performs comparison between images of regions corresponding to patterns formed to be same patterns, thereby determining mismatch portions across the images to be defects. The apparatus includes multiple sensors that synchronously acquire images of shiftable multiple detection systems different from one another, and an image comparator section corresponding thereto. In addition, the apparatus includes a means for detecting a statistical offset value from the feature amount to be a defect, thereby properly detecting the defect even when a brightness difference is occurring in association with film a thickness difference in a wafer.

Abstract: A method of detecting potential changed objects in a first image and a second image, where the first and second images at least partially overlap. The method includes obtaining data describing first and second images and detecting sets of objects in images. A common coordinate system for the sets of objects is calculated. Objects in the sets are eliminated based on positions of the objects and objects outside an area of overlap of the images are eliminated. Data indicating the zero or more remaining objects in the sets is output to indicate potential changed objects.

Abstract: A method and apparatus for reviewing defects of a semiconductor device is provided which involves detecting a defect on a SEM image taken at low magnification, and reviewing the defect on a SEM image taken at high magnification, and which can review a lot of defects in a short period of time thereby to improve the efficiency of defect review. In the present invention, the method for reviewing defects of a semiconductor device includes the steps of obtaining an image including a defect on the semiconductor device detected by a detection device by use of a scanning electron microscope at a first magnification, making a reference image from the image including the defect obtained at the first magnification, detecting the defect by comparing the image including the defect obtained at the first magnification to the reference image made from the image including the defect at the first magnification, and taking an image of the detected defect at a second magnification that is larger than the first magnification.

Abstract: Image readers 6A and 6B that read images of electronic components held by first mounting heads 14A and 14B are each configured to have a line sensor arranged at an oblique arrangement angle with respect to a first direction, and in an image acquiring step of selecting any one of a first-directional scanning operation and a second-directional scanning operation is to be conducted by mounting heads 14A and 14B based on a predetermined scanning operation selecting condition set in advance, and acquiring image signals from the image readers 6A and 6B, image conversion processing of arranging one-dimensional images obtained by converting one-dimensional images sequentially output from the line sensor by an arrangement angle in parallel to generate a two-dimensional image is executed.

Abstract: A substrate transfer apparatus that reduces the quantity of sensors used to detect the position of a substrate so as to simplify the structure and lower costs. The substrate transfer apparatus transfers a substrate (S) between a core chamber (11) and a peripheral chamber (12 or 13). A transfer robot (15) is arranged in the core chamber. The transfer robot includes a hand (17) for carrying the substrate and is capable of extending/drawing and pivoting the hand. A sensor (19) detects an edge surface of the substrate. The sensor is arranged at a position that the edge surface of the substrate passes by when the hand is extended/drawn between the core chamber and the peripheral chamber and that the edge surface of the substrate passes by when the hand is pivoted in the core chamber.

Abstract: Embodiments of the invention include systems and methods relating to self-learning machine vision systems. In an embodiment, the invention includes a self-learning machine vision system including a video input; a processor in communication with the video input; and a video output in communication with the processor. The processor is configured to process video data from the video input and identify a number of repeating units within the video data. The processor is further configured to identify repeating units that deviate from the other repeating units. The system can further display an image of the repeating units through the video output with indicia to indicate identified deviant repeating units.

Abstract: When the degree of matching between patterns decreases due to a pattern fluctuation or an appearance fluctuation that has occurred during manufacturing steps, a heavy work burden would be placed on an operator. A data processing unit of a pattern matching apparatus calculates a threshold for determination of matching between a first template image and a partial region of a search target image obtained by capturing an image of the surface of a sample, on the basis of a result of evaluation of a similarity between the search target image and a second template image, the second template image having been captured in a wider range than the first template image.

Abstract: Methods are provided for producing optical carrierographic images of a semiconductor sample. Focused and spatially overlapped optical beams excite carriers across within the semiconductor sample, where the optical beams are modulated such that a beat frequency is substantially less than either modulation frequency. An infrared detector detects infrared radiation emitted from the semiconductor sample in response to absorption of the optical beams, thereby obtaining a plurality of carrierographic signals at different points in time during at least one beat period, which are processed with a lock-in amplifier, with a reference signal at the beat frequency, to obtain an amplitude signal and a phase signal. Carrierographic lock-in images of the sample are obtained in a scanning configuration, or in an imaging format using an imaging detector.

Abstract: Images of a work piece in which measurement object is restricted to a specific point or domain are taken by a camera which takes the image of the work piece from a front-view direction and a camera which takes the image from obliquely above, and a height of each measurement object region is measured. Each pixel of the front-view image used in measurement processing is virtually disposed in a three-dimensional coordinate system including x- and y-axes constituting a coordinate system of the image and a z-axis indicating the height, and a perspective transform is performed to produce a processing result image expressing measurement result. A measurement value is set as the z-coordinate at the pixel which is a height measurement object, and the z-coordinates of other pixels are set at other pixels. A mark for identifying a position and an auxiliary line indicating the height are set at measurement object points and measurement object region in the image.

Abstract: To provide a component placement apparatus capable of preventing free operation of a mounting head within the movable region from being restricted as well as improving the mounting takt time.

Abstract: A hotspot searching apparatus manufactures a small number of chips or regions on a semiconductor wafer under respectively different manufacturing process conditions, compares SEM images of their external appearances to output a point having large differences as a narrow process window, that is, a process monitoring point that should be managed in mass production, the narrow process window having a narrow manufacturing process condition (exposure condition) in the manufacturing of the semiconductor wafer, and sets the point as a measurement point by a CD-SEM apparatus, such that it extracts and determines plural circuit pattern parts having a narrow manufacturing process margin as the process monitoring point in a short time and a process monitoring point monitoring performs shape inspection or shape length measurement in detail at high resolution.

Abstract: Disclosed herein is a reflow inspection system. The reflow inspection system according to an embodiment of the present invention includes an oven, a stage on which a reflow inspection target is placed inside the oven, and which includes a temperature detecting sensor for detecting a temperature of the reflow inspection target formed on one side thereof; a light source unit formed on one side of the oven and irradiating the reflow inspection target with light, an imaging unit sucking smoke generated in the reflow inspection target, and obtaining image information of the reflow inspection target to thereby transmit the obtained image information to the outside, an image processing unit processing the image information obtained in the imaging unit, and a control unit connected to the stage, the temperature detecting sensor, and the image processing unit to perform control of a reflow inspection process.

Abstract: A device for noncontact determination of the edge profile at a thin disk-shaped object helps determining the edge profile at semiconductor wafers in which exact image recording is not impaired by specular reflections of the edge profile. A plurality of light sources in the form of laser radiation sources each emitting a line-shaped light bundle are arranged so as to be coplanar in a common plane representing a measurement plane oriented orthogonal to a base plane of the object and are directed from different directions to a common intersection of the laser radiation sources in the edge region of the object. A light sheet is formed in the measurement plane and at least one base camera is directed in the base plane lateral to the measurement plane to capture scattered light proceeding from a light line generated by the light sheet when impinging the object edge region.

Abstract: An autofocus (AF) system and method is provided that maps the topography of a substrate such as a semiconductor wafer, in a manner that corrects for Goos Hanchen (GH) effect. In addition, a new and useful detector is provided that is particularly useful in an AF system and method. The detector preferably has both color and polarization filtering integrally associated with the detector, so that polarization and color filtering is provided at the detector, on a pixel by pixel basis.

Abstract: A defect inspection system can suppress an effect of light from a rough surface or a circuit pattern and increasing a gain of light from a defect to detect the defect with high sensitivity. When a lens with a large NA value is used, the diameter is 10a, an angle between the sample surface and a traveling direction of the light from a defect being ?1. A system receives the light from the defect at a reduced elevation angle ?2 with respect to the sample surface to reduce the scattered light, and to increase the light from the defect. The diameter 10a is smaller than the diameter 10b, resulting in a reduction in the ability to focus the scattered light. When a lens having a diameter 10c is used, the lens interferes with the sample. To avoid the interference, a portion of the lens interfering with the sample is removed.

Abstract: Methods and systems for generating a wafer inspection process are provided. One method includes storing output of detector(s) of an inspection system during scanning of a wafer regardless of whether the output corresponds to defects detected on the wafer and separating physical locations on the wafer that correspond to bit failures detected by testing of the wafer into a first portion of the physical locations at which the defects were not detected and a second portion of the physical locations at which the defects were detected. In addition, the method includes applying defect detection method(s) to the stored output corresponding to the first portion of the physical locations to detect defects at the first portion of the physical locations and generating a wafer inspection process based on the defects detected by the defect detection method(s) at the first portion of the physical locations.

Abstract: An optical inspecting system for inspecting a surface of a solar cell chip includes a housing, a control device, an image capturing device and a lighting device configured in the housing. The lighting device provides monochromatic lights on the solar cell chip, and the image capturing device captures the image of the solar cell chip. The control device is electrically connected to the image capturing device and the lighting device for controlling the optical inspecting system to perform defect and color inspecting processes on the surface of the solar cell chip. By the communication among the image capturing device, the lighting device, and the control device, images with different resolutions can be obtained according to different inspecting processes, and monochrome sensor array can be used for decreasing error.

Abstract: A first illuminating devices, when the component adsorbed by an adsorbing nozzle and located in an imaging field of vision is a surface mounted component, illuminate the bottom surface of a component by irradiating light to the component obliquely from below, and a second illuminating device, when the component adsorbed by the adsorbing nozzle and located in the imaging field of vision is a through hole component, only illuminate the downwards extending parts of the component by irradiating light at an irradiation angle closer to a horizontal direction irradiation than the irradiation angle of the light of the first illuminating device to the component are included. That the component is illuminated by the first illuminating devices and that the component is illuminated by the second illuminating devices are switched based on whether the component is a surface mounted component or a through hole component.

Abstract: An image input module adjusting device includes a board moving mechanism configured to movably hold a board in directions crossing each other; a board moving restriction mechanism configured to restrict movement of the board; an engaging member moving mechanism configured to move an engaging member engaged with a position adjusting component provided on the board; a control part configured to drive the engaging member moving mechanism while allowing the board moving restriction mechanism to move the board, to move and thereby the engaging member is engaged with the position adjusting component and the board is moved to an adjusting original position; a lens position adjusting mechanism configured to perform the position adjusting of the lens; and a focus adjusting mechanism configured to perform the focus adjusting of the lens relative to the image input sensor while the movement of the board is restricted.

Abstract: A system and method for illuminating an elongated field of view of a linear or high aspect ratio area image sensor comprises providing illumination with an elongated field shape with a plurality of discrete light sources and projecting the illumination toward an object to be imaged; wherein the illumination projected on the object is substantially spatially invariant in intensity and angular distribution along the elongated field shape on the object.

Abstract: An alignment method for assembling substrates in different spaces without fiducial mark and its system are provided, and the alignment method has steps of: pre-defining partially standard character regions of two substrates; capturing at least two partially actual images of two substrates in different waiting spaces, respectively; comparing to obtain at least two partially actual character regions of the two substrates, respectively; building actual coordinate systems of the two substrates, respectively; comparing the actual coordinate systems of the two substrates with each other to obtain a set of offset values; moving the two substrates from the different waiting spaces to an alignment-and-installation space based on the set of offset values and a predetermined movement value, respectively; and stacking the two substrates with each other to finish the alignment and installation in the alignment-and-installation space.

Abstract: A method is provided for imaging a workpiece by capturing successive frames of an elongate stationary field of view transverse to a workpiece transit path of a robot, while the workpiece is transported by the robot. The robot transit path is illuminated with an elongate illumination pattern transverse to the transit path to obtain a workpiece image of successive frames. Motion-induced image distortion is corrected by computing respective correct locations of respective ones of the frames along the transit path.

Abstract: A component mounting method includes: identifying, by image processing, a dark color region from image data obtained by imaging a two-dimensional region including a pickup face of a component to be picked up; deriving position data indicating a position of the identified dark color region; and deriving, based on the derived position data, a pickup position indicating a position at which a nozzle picks up the component. The imaging is performed by an imaging unit, and the dark color region indicates a dark color portion between electrodes of the component.

Abstract: A component transfer apparatus includes: an upthrust section that thrusts up a wafer component held by a wafer holding table from below; an extraction head that suctions the wafer component thrust up by the upthrust section or an adjustment chip placed on the upthrust section; an imaging section that performs imaging of the wafer component or the adjustment chip being suctioned by the extraction head; and a control section that controls driving of the extraction head and operations of the imaging section. Upon suction position adjustment, the control section causes the imaging section to perform imaging of the wafer component or the adjustment chip being suctioned by the extraction head, and adjusts a suction position of the wafer component by the extraction head based on a result of the imaging.

Abstract: A method for estimating the efficiency of a solar cell to be manufactured from a wafer is disclosed, wherein the efficiency estimate is obtained from a density of crystallite boundaries on a surface of the wafer. In embodiments the density of crystallite boundaries is obtained from a digital image of the surface of the wafer, from which first a filtered image, and then a binary image is generated. The binary image is evaluated to obtain the density of crystallite boundaries. Alternatively, the efficiency estimate is obtained from the sizes of crystallites on the surface of the wafer. An apparatus for obtaining the efficiency estimate is also disclosed.

Abstract: A method and apparatus for optimizing inspection high-speed optical inspection of parts using intelligent image analysis to determine optimal focus using high numerical aperture (NA) optics, achieve a superior signal-to-noise ratio, resolution, and inspection speed performance with very limited depth of field lenses.

Abstract: A workbench and an assistance method for manufacturing or checking electrical wiring harnesses. The workbench comprises: an assembly board; image projection devices on the assembly board; optical sensors arranged on the assembly board to provide information about its position; cameras arranged to capture gestures of the technician in charge of the workbench; a computer with a set of computer programs adapted to provide, through the image projection devices images in 1:1 scale of templates of the electrical wiring harness being manufactured or checked projected onto the assembly board and, superimposed on them, complementary images of aid requested by the technician, acting on virtual menus and/or buttons projected onto the assembly board.

Abstract: An imaging system receives a height measurement and a resistance measurement, the measurements being made at a two-dimensional position on a surface. A display system maps the resistance to a predetermined material color value, and displays the height measurement and the material color value at the two-dimensional position on the surface.

Abstract: In an image correction method, an image of an object is captured, and a standard image of the object is obtain from a storage system of a computing device. A target area contains most image characteristics of the object is determined from the standard image of the object, and a standard pixel block having N×N pixels is extracted from the target area. The captured image is divided into M pixel blocks having N×N pixels. Each of the pixel blocks of the captured image are analyzed with the standard pixel block. A pixel value of each pixel of the captured image is corrected according the analysis, and the corrected image is output to a display device of a computing device for display.

Abstract: A component mounting method includes: identifying, by image processing, a dark color region from image data obtained by imaging a two-dimensional region including a pickup face of a component to be picked up; deriving position data indicating a position of the identified dark color region; and deriving, based on the derived position data, a pickup position indicating a position at which a nozzle picks up the component. The imaging is performed by an imaging unit, and the dark color region indicates a dark color portion between electrodes of the component.

Abstract: A method and an inspection system that includes: a multi wafer support device arranged to concurrently support multiple wafers; optics arranged to acquire images of the multiple wafers supported by the multi wafer support element; a mechanical stage arranged to introduce movement between the multi wafer support element and the optics; and a processor arranged to process the images acquired by the optics.

Abstract: Described are computer-based methods and apparatuses, including computer program products, for aligning a wafer for fabrication. A first image of a first portion of a wafer is received from a first image capturing device. A second image of a second portion of the wafer is received from a second image capturing device, wherein an image capturing device transform defines a first relationship between the first image capturing device and the second image capturing device. A first fiducial pattern in the first image and a second fiducial pattern in the second image are identified, based on the image capturing device transform, a fiducial transform that defines, based on a specification for the wafer, a second relationship between the first fiducial pattern and the second fiducial pattern, and a threshold value configured to identify low contrast fiducial patterns on wafers. An alignment of the wafer is determined based on the identified first and second fiducial patterns.

Abstract: A first imaging unit forming a first image by imaging a first surface of an electronic component having the first surface and a second surface, a second imaging unit forming a second image by imaging the second surface, a grasping unit grasping the electronic component, a movable unit moving the grasping unit, and a control unit detecting a position of the first surface using the first image, detecting a position of the second surface using the second image, and controlling the grasping unit and the movable unit are provided. The grasping unit brings relative positions between the grasping unit and the first surface into predetermined relative positions and grasps the electronic component using position information of the first surface detected by the control unit, and the movable unit moves the second surface to a predetermined position using position information of the second surface detected by the control unit.

Abstract: The present invention discloses apparatuses and methods for simultaneous viewing and reading top and bottom images from a workpiece. The present ID reader can comprise an enclosure covering a top and bottom section of the workpiece with optical elements to guide the light from the workpiece images to a camera. The optical element can be disposed to receive images from a high angle with respect to the surface of the workpiece. The present ID reader can further comprise a light source assembly to illuminate the image. The light source assembly can utilize a coaxial light path with the images, preferably for bright field illumination. The light source assembly can also utilize a non-coaxial light path, preferably for dark field illumination.

Abstract: An apparatus for inspection of a surface of a device comprises a projection module operative to project a pattern along a projection axis of the projection module onto the device. An imaging module receives an image of the pattern reflected from the device along an imaging axis of the imaging module onto an image sensor. A lens comprised in the imaging module has a first magnification in a first direction orthogonal to the imaging axis and a second magnification different from the first magnification in a second direction orthogonal to both the first direction and the imaging axis, which produces different fields of view of the image sensor and resolutions of the image in the first and second directions.

Abstract: An inspecting method for grasping the inspection result on an intermediate (or an n-th) treatment without long extension of time, in case predetermined treatments of a predetermined number (N times) are exerted on a plurality of sheets running on a conveyor line, before all the treatments of N-times are ended. The inspecting method for inspecting an object subjected to the predetermined treatment includes performing the predetermined treatment repeatedly by the N-times (N: a natural number of 2 or more) sequentially on the individual objects being conveyed on the conveyor line, and an inspecting step of testing such a leading one of the objects as has been subjected to the n-th (n: a natural number of 1 or more but N or less) treatment, and returning the tested object to after such one of the targets as was subjected to the n-th treatment.

Abstract: A die bonder that eliminates the need for moving a recognition camera for capturing an image related to adhesive application and achieves high reliability with high throughput is disclosed. The die bonder includes a lead frame; a syringe located above the lead frame and enclosing therein a paste adhesive; a recognition camera lateral to the syringe; an illumination lamp disposed in the vicinity of the recognition camera; and a reflector plate disposed opposite the illumination lamp. The reflector plate is adapted to reflect light from the illumination lamp onto the lead frame at an application surface of the paste adhesive. The recognition camera, illumination lamp, and reflector plate are arranged in a manner that the reflector plate is disposed on ?Y side and the recognition camera and the illumination lamp are disposed on +Y side with respect to the syringe located above the lead frame transported in X direction.

Abstract: A device for edge- and surface inspection of flat objects, particularly patterned, sawn, broken, or partial wafers, and wafers of any kind on film frames, dies, displays, glass-ceramic or metal samples or batches of such materials, Die waffle packs, and multichip modules, comprises an inspection head, with an object lens and a bright field illumination unit having a light source and an optical assembly, wherein light generated by said light source is directed by said optical assembly towards said object with an angle of incidence for illuminating said object and wherein said light is reflected from said object in the direction of said object lens; and a support for supporting said object at said edge, said support having several support arms along said edge, wherein at least one of said support arms is removable from said edge while the edge is inspected in the range of said removable support arm.

Abstract: A component such as a pressure vessel includes a cladding layer bonded to a substrate by a welding process. The component is inspected by a method that includes using a first camera to record a first image of an inspection portion of the cladding layer, the inspection portion having a pattern of markings; causing or allowing a temperature change in the component; using a second camera to record a second image of the inspection portion; and identifying the deformation of the pattern of markings on the inspection portion by reference to relative movement of the respective markings between the first and second image. The temperature change may occur as a result of cooling of the component after the welding process. Analysis of the deformation may be conducted by a Digital Image Correlation process, enabling possible defects or flaws in the component to be identified.

Abstract: A system and method for testing a multimeter provides a mechanical arm to set a gear of the multimeter. Values displayed on the multimeter are captured by a camera. The computer obtains the displayed values from captured images using a difference image method. If a difference between each two obtained values is in an allowable error range of the multimeter, the computer displays that the gear is qualified. If the difference between each two obtained values is not in the allowable error range, the computer displays that the gear is out of tolerance.

Abstract: A transfer pathway of mounting heads 10 in a component-mounting round during which the mounting head 10 moves back and forth between a component feeding unit 4 and a substrate conveyance mechanism 2 is derived by a transfer pathway calculation unit 25 for each component-mounting round from mounting program data 21a. On the basis of data pertaining to the thus-derived transfer pathway, image data output from a line sensor camera assigned to a head transfer range segment that the transfer pathway of the mounting head 10 crosses in each of component-mounting rounds are selected and captured by an image selection processing unit 24. The image data output from the line sensor camera whose focusing point substantially matches the imaging target can be used for detecting whether or not a component still exists.

Abstract: Method and machine utilizes the real-time recipe to perform weak point inspection on a series of wafers during the fabrication of integrated circuits. Each real-time recipe essentially corresponds to a practical fabrication history of a wafer to be examined and/or the examination results of at least one examined wafer of same “lot”. Therefore, different wafers can be examined by using different recipes where each recipe corresponds to a specific condition of a wafer to be examined, even these wafers are received by a machine for examining at the same time.

Abstract: It is an objective to provide a component mounting system capable of enhancing work efficiency by diminishing work load stemming from preparation of image recognition data, an image recognition data preparation apparatus, and an image recognition data preparation method. A line camera structurally similar to a line camera used in a component mounting machine outputs image data while a component is irradiated with reflective illumination light and transmissive illumination light. The thus-output image data are acquired and subjected to recognition processing, to thus prepare image recognition data on the basis of a result of recognition processing. Subsequently, a recognition test using the thus-prepared image recognition data is performed, thereby determining whether or not the image recognition data are appropriate. A recognition test which would be performed in an actual component mounting machine thereby becomes unnecessary.

Abstract: A color image of an inspection object is taken by an imaging means capable of taking a color image to obtain color information of an RGB color space. A gray-scale image of a color component of the RGB color space or another color space is generated, and the inspection object is detected by a pattern recognition technique. Alternatively, a binary image is generated from the generated gray-scale image, and the inspection object is detected by performing pattern recognition on the binary image. Color data of a pixel occupied by the detected inspection object is compared with color data of a non-defective inspection object which is previously prepared to judge whether or not the inspection object is defective. In addition, this judgment result is reflected in another manufacturing step through a network and product quality is improved.

Abstract: A wafer inspection system comprises a camera having a field of view, an object mount configured to position at least a portion of surface 5 of an object 3 at an object plane 15 relative to the camera and within the field of view of the camera and at least one surface portion 41 carrying a multitude of retroreflectors 95 disposed at a greater ?d distance from the camera than the object plane and within the field of view of the camera.

Abstract: In an electronic device test apparatus using image processing technology to position an IC device relative to a socket, a calibration method of an electronic device test apparatus of calibrating a relative position of a device camera with respect to a socket, the method comprising: calculating an offset amount of a socket guide with respect to the socket on the basis of a relative position of the socket camera with respect to the socket guide and a relative position of a socket camera with respect to the socket; and adding this offset amount to the relative position of the device camera with respect to the socket guide so as to calculate the relative position of the device camera with respect to the socket.

Abstract: An electronic part recognition apparatus and a chip mounter having the same are provided. The apparatus includes a part conveyor unit for moving an electronic part along a path and mounting the part at a mounting position, a position recognition portion for continuously recognizing position information of the part conveyor unit moving along the path, a controller for receiving the position information from the position recognition portion and generating a photographing signal, and an image processing unit for receiving the photographing signal from the controller and time-exposing the part to light to photograph an image of the part when the part is located at a part recognition region while the conveyor unit moves. The apparatus can capture an image of a part suctioned by a nozzle installed in a head of a chip mounter and moved without stoppage of the head to recognize a state of the suctioned electronic part.

Abstract: Methods (600) and systems (100) for inspecting an indirect bandgap semiconductor structure (140) are described. A light source (110) generates light (612) suitable for inducing photoluminescence in the indirect bandgap semiconductor structure (140). A short-pass filter unit (114) reduces long-wavelength light of the generated light above a specificed emission peak. A collimator (112) collimates (616) the light. A large area of the indirect bandgap semiconductor structure (140) is substantially uniformly and simultaneously illuminated (618) with the collimated, short-pass filtered light. An image capture device (130) captures (620) images of photoluminescence simultaneously induced by the substantially uniform, simultaneous illumination incident across the large area for the indirect bandgap semiconductor structure.

Abstract: A method for producing an image of an object within a chamber of a microfluidic device includes providing the microfluidic device having x, y, and z dimensions and a chamber depth center point located along the z dimension. The chamber depth center point is located a known z dimension distance from a fiducial marking embedded within the microfluidic device. The method also includes placing the microfluidic device within an imaging system that includes an optical device capable of detecting the fiducial marking. The optical device defines an optical path axially aligned with the z dimension and has a focal plane perpendicular to the optical path. When the focal plane is moved along the optical path, the fiducial marking is maximally detected when the focal plane is at the z depth in comparison to when the focal plane is not substantially in-plane with the z depth.

Abstract: An apparatus for inspecting pattern defects, the apparatus including: an image acquisition unit which acquires an image of a specimen and stores the acquired image in an image memory; a defect candidate extraction unit which performs a defect candidate extraction process by using the acquired image, which is read from the image memory; and a defect detection unit which performs a defect detection process based on a partial image containing a defect candidate that is extracted by the defect candidate extraction unit, wherein the defect detection process performed by the defect detection unit is performed asynchronously with an image acquisition process that is performed by the image acquisition unit.