Abstract: A robust video tool is provided for use in a machine vision inspection system. The robust video tool comprises a region of interest, a user interface, edge detection operations, and excluded region operations that determine a set of current-feature edge points which includes edge points detected in the region of interest and excludes edge points in an excluded region. The excluded region is determined by an excluded region generator, based on at least one previously characterized feature which is a feature characterized by using a video tool that detects the edge points of, and characterizes dimensional parameters of, the previously characterized feature. Importantly, the robust video tool features and operations are configured to allow learn mode programming on a workpiece that is either properly fabricated or improperly fabricated, and the resulting program will operate reliably on a run mode workpiece that is either properly fabricated or improperly fabricated.

Abstract: A pick and place machine is described which uses an imprint left in a layer of fluid by a component that has been dipped in the fluid to guide a placement process. An apparatus for placing a component is disclosed, which includes a surface that receives a layer of fluid, an imprint of a component in the layer of fluid, and a camera that captures an image of the imprint in the fluid. A method of placing a component with a pick and place machine is disclosed which includes dipping a component in a layer of fluid, capturing an image of the layer of fluid, analyzing the image of the layer of fluid, and placing the component based on results of the analysis of the image of the layer of fluid. The image can be used to determine the status of the component or where to place the component.

Abstract: An image capturing device assembly for use with a test probe and a testing system. The image capturing device assembly including an image capturing device module configured for coupling to an external surface of the test probe and having an image capturing device housed within. The image capturing device is configured to generate a digital output video signal or the analog output video signal of a testing site. A digital monitor is coupled to the image capturing device via a wired or wireless link and configured to receive the digital output signal and generate a display of the testing site on the display monitor.

Abstract: A system and method for positioning a portion of an object to be measured includes installing a digital camera adjacent to a charge coupled device (CCD) lens of an image measuring machine, setting positioning parameters corresponding to different positions of the digital camera on a Z-axis of a world coordinate system, receiving an image of the object captured by the digital camera, and selecting corresponding positioning parameters according to a position of the digital camera. The method further includes selecting a point of the portion of the object in the image, calculating coordinates of the selected point in a plane of the CCD lens, and controlling the CCD lens to move to the calculated coordinates so as to position the CCD lens on the portion of the object.

Abstract: A substrate inspection method capable of accurately inspecting a substrate is provided. A jig having reference points represented by known coordinates in a three-dimensional world coordinate system is photographed by a camera and coordinates of the reference points in a pixel image coordinate system defined by pixels of an image forming device is determined. The coordinates in the pixel image coordinate system are transformed into those in a camera coordinate system set on the camera, and world-camera coordinate system transformation parameters are calculated. Image data in the pixel image coordinate system obtained by photographing a substrate to be inspected is transformed into image data in a world coordinate system for inspection. The accurate inspection of the substrate to be inspected can be achieved because distortion in the image of the substrate to be inspected in the world coordinate system attributable to the position and attitude of the camera is reduced.

Abstract: An image generating apparatus includes: a lighting apparatus that emits illumination light to an imaging area where at least a part of an electronic component is located; an imaging apparatus that images the imaging area irradiated with the illumination light; and an image processing apparatus that processes a captured image obtained by the imaging. The image processing apparatus generates a before-adjustment image based on the captured image, generates an adjusted image by adjusting luminance of the before-adjustment image, and generates an optimal image by setting a difference in average luminance between a designated area and a comparison area in the adjusted image largest.

Abstract: A wafer inspection method comprises imaging a full surface of the wafer at an imaging resolution insufficient to resolve individual microstructures which are repetitively arranged on the wafer. A mask 109 is applied to the recorded image and unmasked portions 111 of the image are further processed by averaging. The unmasked portions 111 are selected such that they include memory portions of the wafer.

Abstract: An inspection system includes optics, an object support for mounting an object in a region of an object plane of the optics, a bright-field light source, and a dark-field light source. The inspection system also includes an image detector having a radiation sensitive substrate disposed in a region of an image plane of the optics and a beam dump.

Abstract: A ring shape lighting device, used for lighting the mark around the CCD camera, has a lighting device, a lighting brightness control device, a lighting height control device, a lighting color control device and a controller. The controller controls these devices and detects the marks using the CCD camera, by changing the lighting brightness at 1 percent step from 1 to 100 percent with different combinations of lighting height and lighting color. The device detects the mark contrasts using a contrast detection/determination device and detects the variance using a variance detection/determination device. The device then determines the best lighting condition based on the variance.

Abstract: The present invention discloses a line-width inspection device. The line-width inspection device has a platform, an image capturing device, a main light source device and at least one compensation light source device. The image capturing device is mounted above the platform, aligned with an inspection area of the platform and captures images of a pattern under inspection in the inspection area. The main light source device is disposed above the platform and correspondingly provides forward illumination to the inspection area, and an incident direction thereof is perpendicular to the platform. The at least one compensation light source device is mounted above the platform and provides compensation illumination to the inspection area. The additional compensation light source device can prevent edges of the pattern under inspection from occurring shadows and affecting image capturing, so as to enhance precision of image capturing.

Abstract: To effectively utilize the polarization property of an inspection subject for obtaining higher inspection sensitivity, for the polarization of lighting, it is necessary to observe differences in the reflection, diffraction, and scattered light from the inspection subject because of polarization by applying light having the same elevation angle and wavelength in the same direction but different polarization. According to conventional techniques, a plurality of measurements by changing polarizations is required to cause a prolonged inspection time period that is an important specification of inspection apparatuses.

Abstract: The resent invention provides a television receiver including: a radio frequency section for an electromagnetic wave type remote control, the radio frequency section configured to transmit and receive an electromagnetic wave to and from the electromagnetic wave type remote control; and a retaining section configured to retain said radio frequency section for the electromagnetic wave type remote control; wherein said radio frequency section for the electromagnetic wave type remote control includes a radio frequency circuit board section, an antenna part, and a ground connecting section, said retaining section includes a conductive column support standing on a bezel, a column support standing on said bezel, and a conductive sheet metal parallel with said bezel and fixed to said conductive column support.

Abstract: A method of detecting an object of detection formed in the inside of or on a non-exposed surface of a workpiece having a rugged exposed surface, the detection being made on the exposed surface side of the workpiece by use of an imaging unit. The detecting method includes: a flattening step of coating the exposed surface of the workpiece with a liquid resin transmissive to the wavelength of light to be detected by the imaging unit so as to flatten the exposed surface of the workpiece; and a detecting step of detecting the object of detection formed in the inside of or on the non-exposed surface of the workpiece by use of the imaging unit on the exposed surface side of the workpiece coated with the liquid resin, after the flattening step.

Abstract: A system may include a support configured to rotatably support a wafer. The system may also include an imager for generating an image of a wafer, where the image includes a first coordinate reference. The system may also include a profiler for generating a profile of the wafer, where the profile includes a second coordinate reference. The system may further include control programming for locating at least one structural feature of an edge of the wafer recognizable by both the imager and the profiler for allowing the first coordinate reference to be mapped to the second coordinate reference. The wafer used in calibration may have discrete edge features detectable in an edge imager and in an edge profiler.

Abstract: This pattern inspection apparatus includes an inspection region information storage unit that stores an inspection region specified in a pattern region, a pattern surface height detection unit that detects a pattern surface height signal corresponding to a pattern surface height measurement position on the inspection sample, an autofocus mechanism that focuses on the inspection sample using the pattern surface height signal detected by the pattern surface height detection unit, a determination unit, and an autofocus mechanism control unit. When the determination unit determines that the pattern surface height measurement position is located within the inspection region, the autofocus mechanism control unit drives the autofocus mechanism, and the determination unit determines that the pattern surface height measurement position is not located within the inspection region, the autofocus mechanism control unit stops the autofocus mechanism.

Abstract: Improving detectability of a diameter of a pressure-bonded ball bonded by a bonding apparatus by calculating the diameter of the pressure-bonded ball by obtaining a first tentative radius by subtracting a distance between a line representing an outline of a pad short side and a curving line representing an outline of a pressure-bonded ball from a distance between the line representing the outline of the pad short side and a bonding-control-center position of the pressure-bonded ball; obtaining a second tentative radius by subtracting a distance between a line representing an outline of a pad short side that faces toward the pad with which the first tentative radius is calculated and an outline of a pressure-bonded ball from a distance between the line representing the outline of the pad short side and a bonding-control-center position of the pressure-bonded ball; and averaging the same number of the first and the second tentative radii.

Abstract: A substrate position detection method includes rotating the susceptor so that the substrate receiving portion is moved into an image taking area of a imaging apparatus; detecting first two position detection marks provided in the process chamber so that the first two position detection marks are within the image taking area, wherein a first perpendicular bisector of the first two position detection marks passes through a rotational center of the susceptor; detecting second two position detection marks provided in the susceptor so that the second two position detection marks can be within the image taking area, wherein a second perpendicular bisector of the second two position detection marks passes through the rotational center of the susceptor and a center of the substrate receiving portion; and determining whether the substrate receiving portion is positioned in a predetermined range in accordance with the detected first two and second two position detection marks.

Abstract: In the present invention, an image of a substrate is picked up by an image pickup unit with the substrate being held by a transfer member. A drive unit for the transfer member is controlled by a driving signal from a first controller. A driving signal outputted to the first controller is outputted also to a second controller so that the second controller controls the image pickup unit based on the driving signal, thereby synchronizing drive of the transfer member with the image pickup by the image pickup unit. According to the present invention, the throughput in performing a defect inspection for the substrate is improved and a precise image is captured and subjected to accurate inspection.

Abstract: It is an objective to provide a part-mounting system that makes it possible to quickly ascertain a defective judgment location and input a result of judgment of the defective judgment location even if an operator is away from an inspection portion when the inspection portion has found a defective judgment location. An image of a location on a substrate Pb where a print status of solder Sd or a mounted status of parts Pt is judged as being defective by an inspection portion is displayed on all image display portions 31 of a plurality of operation panels 30 or some of the image display portions 31 selected by an operator OP. Through an operation input portion 32 of the operation panel 30 including the image display portion 31 on which the image of the defective judgment location is displayed, the operator OP can input a result of judgment made as to whether or not the print status of the solder Sd or the mounted status of the parts Pt at the defective judgment location is defective.

Abstract: An alignment system for aligning a wafer when lithographically fabricating LEDs having an LED wavelength ?LED is disclosed. The system includes the wafer. The wafer has a roughened alignment mark with a root-mean-square (RMS) surface roughness ?S. The system has a lens configured to superimpose an image of the reticle alignment mark with an image of the roughened alignment mark. The roughened alignment marked image is formed with alignment light having a wavelength ?A that is in the range from about 2?S to about 8?S. An image sensor detects the superimposed image. An image processing unit processes the detected superimposed image to measure an alignment offset between the wafer and the reticle.

Abstract: The electronic controller fetches an external signal and performs an input process such as A-D conversion. Upon receipt of processing results for executing operations according to a predetermined program, an output process is performed for sending a signal to the outside board on operation results, a timer outputs at least two of an input process start signal for starting the input process, an output process start signal for starting the output process, and an operation start signal for starting the operation.

Abstract: A coordinate measuring machine is disclosed having an orientor automatically orienting a substrate associated therewith. A control and computing unit is further associated with the coordinate measuring machine, so that self-calibration may be performed on the basis of at least two different and automatically set orientations of the substrate.

Abstract: The present invention relates to a device (10), a method and an application thereof for optically measuring the surface of a tested product (5), especially a PCB-product for reflow soldering paste inspection. The device comprises at least one white light source (1) for emitting a beam of white light, at least one collimation unit (4) for collimating said beam of white light (30), at least one spectrometer unit, preferably an optical prism (2) or an optical diffraction grading (51), for splitting said beam of white light (30) into a beam of multichromatic light (31) being directed onto said tested product (5) under a predetermined incident angle ?, and at least one camera (3) for recording a reflected beam of monochromatic light (32) of said tested product (5). Z-axis surface height information of said tested product (5) can be extracted from a hue value of said reflected beam of mono chromatic light (32) while relatively moving said tested product (5) in a x-axis scanning direction (9).

Abstract: Methods (600) and systems (100) for inspecting an indirect bandgap semiconductor structure (140) are described. A light source (110) generates light (612) suitable for inducing photoluminescence in the indirect bandgap semiconductor structure (140). A short-pass filter unit (114) reduces long-wavelength light of the generated light above a specified emission peak. A collimator (112) collimates (616) the light. A large area of the indirect bandgap semiconductor structure (140) is substantially uniformly and simultaneously illuminated (618) with the collimated, short-pass filtered light. An image capture device (130) captures (620) images of photoluminescence simultaneously induced by the substantially uniform, simultaneous illumination incident across the large area for the indirect bandgap semiconductor structure.

Abstract: An installation of optical inspection of integrated circuits or the like, comprising: a planar conveyor along a first direction of the objects to be analyzed and a photographic system placed above an area of the conveyor and in a fixed position with respect thereto, the photographic system comprising at least one first set of digital cameras each comprising an orthogonal array of pixels, said cameras being aligned in a second direction different from the first one, the cameras being all oriented so that one of the orthogonal directions of their pixel array forms a first angle with the first direction.

Abstract: An installation of optical inspection of integrated circuits or the like, comprising: a photographic system placed above a scene in a plane defined by a first and a second direction, the photographic system comprising several digital cameras each comprising an orthogonal array of pixels, all cameras having their respective optical axes inclined by a first angle with respect to a third direction perpendicular to the two others; and two projectors of determined patterns, these patterns being such that two straight lines projected by each of the projectors are aligned in the plane defined by the first two directions and are coplanar with a straight line interconnecting the optical centers of the two projectors.

Abstract: A substrate processing apparatus includes: a holding unit holding a substrate; a rotation driving unit rotating the substrate held on the holding unit; a moving mechanism moving the holding unit between a delivery position and an edge exposure position; an exposure unit provided on the edge exposure position side and exposing an edge portion of a coating film above the substrate held on the holding unit; an image capturing unit provided on the edge exposure position side and above the exposure unit and capturing an image of the substrate held on the holding unit; and a direction change unit changing a direction of an optical path formed between the substrate held on the holding unit and the image capturing unit. The direction change unit includes a first reflecting mirror, a second reflecting mirror, and a third reflecting mirror.

Abstract: A component presence/absence judging apparatus judges the presence/absence of a component through a registration step and an inspection step. The registration step comprises an ante-mounting color information acquisition step, a post-mounting color information acquisition step and an inspection area determination step. Ante-mounting color information is acquired from an ante-mounting image taken at a predetermined portion on an ante-mounting board. Post-mounting color information is acquired from a post-mounting image taken at the predetermined portion on a post-mounting board. Then, a section having a large difference between both color information of the ante-mounting image and the post-mounting image is identified and is determined as an inspection area. At the inspection step, the presence/absence of the component at a predetermined place on each inspection board to be inspected is judged in dependence on the color information on the determined inspection area.

Abstract: The edges of semiconductor wafers are examined by an imaging method and the positions and forms of defects on the edge are determined, and in addition, a ring-shaped region on the flat area of the semiconductor wafer, the outer margin of which is ?10 mm from the edge, is examined by means of photoelastic stress measurement and the positions of stressed regions in the ring-shaped region are determined, wherein the positions of the defects and the positions of the stressed regions are compared with one another, and the defects are classified in classes on the basis of their form and the results of the photoelastic stress measurement.

Abstract: A method places a component at a desired position on a substrate by means of a placement device. The component is transported to an intermediate position above the desired position and a position difference between the intermediate position and the desired position is determined by means of a camera and a processor. Subsequently, the component is transported to the desired position on the substrate, making use of the position difference. The camera, which is arranged at the side of the component opposite the component's side facing the substrate, takes an image of at least the portion of the substrate that includes the desired position as well as the placement device.

Abstract: A reticle pattern defect correcting apparatus comprises a lithographic emulation system including an optical emulation system and a micromachining defect correcting system including a reticle defect correcting mechanism with a cantilever. Since correction of a reticle pattern defect is carried out while the transferred image is being observed in real time by the optical emulation system, it is possible to achieve an efficient reticle pattern correction while avoiding overcorrection and other problems.

Abstract: There is provided a profile measuring device. The profile measuring device includes: a projector which projects a certain pattern on an object to be measured using incoherent light having a plurality of wavelength components; a first imaging device which captures a first image of the object on which the certain pattern is projected; a second imaging device which captures a second image of the object on which the certain pattern is projected; and a computing device which measures a profile of the object based on the first image and the second image.

Abstract: An inspection system and a method for inspecting a diced wafer. The method includes: acquiring multiple images of multiple portions of the diced wafer according to a predefined image acquisition scheme; locating multiple unique features within the multiple images; and assigning a die index to each die of the multiple dice and associating between the multiple dice and multiple reference dice in response to locations of the multiple unique features and to at least one expected die dimension.

Abstract: A focused multi-planar image acquisition in real time even while a test object is moving, is achieved with a system and a method for a focused multi-planar image acquisition in a prober. When a surface of a test object is positioned laterally in relation to tips of separated probe needles, a microscope is focused on the surface of the test object at a first time and on a plane of the probe needles at a second time. The objective lens is provided with a microscope objective lens focusing system, which can focus the objective lens, independently of a vertical adjustment drive of the microscope, on the surface of the test object in a first focal plane and in a second focal plane, which is on a level with the probe needle tips.

Abstract: The present invention relates to an automated electrical connection module for automatically attaching a junction box to a composite solar cell structure. The electrical connection module includes a thermode assembly having heating elements for forming a soldered connection between the junction box and the composite solar cell structure and a temperature sensing device in thermal communication with the heating elements for detecting a temperature profile during the connection process. The heating elements and temperature sensing device are linked to a controller configured to monitor and compare the energy input into the heating elements with the temperature near the tip of the heating elements throughout the connection process. The electrical connection module further provides a vision system configured to capture images of the soldered connection between the junction box and the composite solar cell structure.

Abstract: The formation of marks on devices is described. In one embodiment, a method for marking a device includes forming a plurality of unique marks sequentially on a device. The method includes defining a virtual array having a plurality of cells extending in an x-direction and a plurality of cells extending in a y-direction, wherein the marks are each positioned in a cell in the virtual array. The method also includes capturing an image including the relative cell position of the marks within the virtual array and converting the relative position of the marks within the virtual array into a set of coordinates including an x value along the x-direction and a y value along the y-direction for each of the marks. The method also includes generating a device identification using a plurality of the x values and the y values. Other embodiments are described and claimed.

Abstract: A system, method, and computer program product are provided for validating a graphics processor design. In operation, a test image is identified. Additionally, a reference image is automatically selected from a set of reference images. Furthermore, a graphics processor design is validated using the test image and the selected reference image.

Abstract: A method and a system for stabilizing the sight line of a chip component being carried on two discs, for stabilizing delivery of the chip component between the two discs, and improving and stabilizing the inspection accuracy in the visual check of the chip component. This is achieved by employing a mechanism for carrying the chip component while supporting it on the horizontal plane of the first rotary disc and then carrying the chip component while suction-holding it on the vertical plane of the second rotary disc. When the chip component is carried on the first rotary disc, the upper surface and one side face of the chip component are imaged by first and second cameras. When the chip component is carried on the second rotary disc, the lower surface and the other side face of the chip component are imaged by third and fourth cameras.

Abstract: The electronic controller fetches an external signal and performs an input process such as A-D conversion. Upon receipt of processing results for executing operations according to a predetermined program, an output process is performed for sending a signal to the outside board on operation results, a timer outputs at least two of an input process start signal for starting the input process, an output process start signal for starting the output process, and an operation start signal for starting the operation.

Abstract: A method for inspecting a slider having a substantially rectangular parallelepiped shape is provided. The method has: a lifting step of lifting said slider upward and stopping said slider at an inspecting position while supporting said slider at an undersurface of said slider, wherein said undersurface is a surface that is other than a first surface, said first surface being an air bearing surface or a surface that is to be formed in said air bearing surface; and an inspection step of simultaneously inspecting said first surface and a second surface of said slider, said second surface being a surface that is other than said first surface and said undersurface, wherein said first surface is inspected by a first camera and said second surface is inspected by a second camera, said first and second cameras being arranged in advance such that an optical axis thereof passes through said inspecting position.

Abstract: A system and method for monitoring a manufacturing process of a fan-out wafer, the method may include acquiring a first set of images of dies after a completion of a first manufacturing stage of a manufacturing process of the fan-out wafer; processing the first set of images to detect defects; performing at least one corrective operation in response to at least one defect detected by processing the first set of images; acquiring a second set of images of dies after a completion of a second manufacturing stage of the manufacturing process of the fan-out wafer, the second manufacturing process follows the first manufacturing process; processing the second set of images to detect defects; and performing at least one corrective operation in response to at least one defect detected by processing the second set of images.

Abstract: A coplanarity inspection device for a printed circuit board includes a base, a supporting disk, a driver, a printed circuit board, a light source, an image acquisition means, and a controller. The supporting disk is arranged on the base, and the driver rotates the supporting disk. The printed circuit board is placed on the supporting disk, and includes a to-be measured side facing downward. The light source projects light beams on the to-be measured side of the printed circuit board. The image acquisition means aims at a specific area of the to-be measured side for image acquisition. The controller is to control the driver, and to store image taken by the image acquisition means. As such, the coplanarity inspection device for a printed circuit board can be employed to inspect whether the coplanarity of the printed circuit board satisfies the standard of setting values in a certain range.

Abstract: An apparatus for inspecting pattern defects, the apparatus including: an image acquisition unit which acquires an image of a specimen and stores the acquired image in an image memory; a defect candidate extraction unit which performs a defect candidate extraction process by using the acquired image, which is read from the image memory; and a defect detection unit which performs a defect detection process and a defect classification process based on a partial image containing a defect candidate that is extracted by the defect candidate extraction unit, wherein the processes performed by the defect detection unit is performed off-line asynchronously with an image acquisition process that is performed by the image acquisition unit.

Abstract: A method is provided for imaging a workpiece by capturing successive frames of an elongate stationary field of view transverse to a workpiece transit path of a robot, while the workpiece is transported by the robot. The robot transit path is illuminated with an elongate illumination pattern transverse to the transit path to obtain a workpiece image of successive frames. Motion-induced image distortion is prevented or reduced adjusting the camera frame rate in real time in proportion to changes in robot velocity profile of the workpiece along the transit path.

Abstract: A color Liquid Crystal Display (LCD) device for displaying a color image using at least four different primary colors, the device including an array of Liquid Crystal (LC) elements, driving circuitry adapted to receive an input corresponding to the color image and to selectively activate the LC elements of the LC array to produce an attenuation pattern corresponding to a gray-level representation or the color image, and an array of color sub-pixel filter elements juxtaposed and in registry with the array of LC elements such that each color sub-pixel filter element is in registry with one of the LC elements, wherein the array of color sub-pixel filter elements comprises at least four types of color sub-pixel filter elements, which transmit light of the at least four primary colors, respectively.

Abstract: Systems and methods are disclosed that facilitate permitting a user to select one of a plurality of job setups stored in a camera sensor. The plurality of job setups can be pre-programmed into the sensor utilizing conventional methods. During sensor operation, a user can select a particular application, and a simple signal can be generated for transmission over existing input/output lines to the camera sensor, upon receipt of which the camera sensor can initiate the particular job setup associated with the signal. Job setup signals can be formatted in binary utilizing HIGH and LOW voltages or can be transmitted as a simple Morse Code message and/or integer value.

Abstract: A method and a system for preparing a pattern's reference-model to be used for automatic inspection of surface are disclosed. The system according to the present invention is comprised of an imaging device that captured images of plurality of the patters; a dedicated software that uses dedicated algorithms to correct and align the captured images; and a controller operative for collecting the same located and same coincident pixel of each of the images; choosing, according to predetermined criteria, one of the collected pixels; creating a new image with same dimensions as the captured images and locating the chosen pixel in the same place corresponding to the place of the collected pixels in the origin images; repeating the process as defined above for each pixel of the captured images; and providing the new created image as a reference model for inspecting the pattern.

Abstract: A vision system is provided to determine a positional relationship between a semiconductor wafer on a platen and an element on a processing machine, such as a printing screen, on a remote side of the semiconductor wafer from the platen. A source directs infrared light through an aperture in the platen to illuminate the semiconductor wafer and cast a shadow onto the element adjacent an edge of the semiconductor wafer. A video camera produces an image using light received from the platen aperture, wherein some of that received light was reflected by the wafer. The edge of the semiconductor wafer in the image is well defined by a dark/light transition.

Abstract: The invention provides a substrate surface imaging method and apparatus that compensates for non-linear movement of the substrate surface during an imaging sequence. In one aspect of the invention, the imaging method and apparatus compensate for the non-linear substrate surface movement by adjusting the image receiver trigger points to correspond to image positions on the substrate surface. In another aspect, the invention provides synchronous imaging where the distance between each image position is determined by counting the number of stepper motor steps between image positions. In still another aspect, the invention provides for asynchronous substrate imaging by determining an image trigger time between each image position and using the image trigger time to trigger the receiver at the appropriate time to accurately image the substrate surface.

Abstract: A color image of an inspection object is taken by an imaging means capable of taking a color image to obtain color information of an RGB color space. A gray-scale image of a color component of the RGB color space or another color space is generated, and the inspection object is detected by a pattern recognition technique. Alternatively, a binary image is generated from the generated gray-scale image, and the inspection object is detected by performing pattern recognition on the binary image. Color data of a pixel occupied by the detected inspection object is compared with color data of a non-defective inspection object which is previously prepared to judge whether or not the inspection object is defective. In addition, this judgment result is reflected in another manufacturing step through a network and product quality is improved.