Abstract: A lithographic apparatus is described, the apparatus comprising: a projection system configured to project a patterned beam of radiation onto a substrate; the projection system comprising a plurality of optical elements; a sensor frame; a first position measurement system configured to measure a position of the plurality of optical elements relative to the sensor frame; wherein the sensor frame comprises: N sub-frames, N being an integer >1, a coupling system coupling the N sub-frames and a second position measurement system configured to determine a relative position of the N sub-frames.

Abstract: There is disclosed an apparatus and method of aligning content put through a duplex scanner. By performing operations on data extracted from physical documents, digital documents that would otherwise appear skewed can be un-skewed. The process compares two images, e.g. a front and a back page for a document, and determines how they are offset from one another. The process uses a projection profile error minimization technique to calculate a translation for one or both pages to digitally align the margins for a digital document such that the margins match.

Abstract: An alignment system configured to be substantially insensitive to thermal variations in its system during alignment measurements. The alignment system includes a sensor system, a support structure, a sensing element, a position measurement system, and an athermal interface between the sensing element and the support structure. The sensor system is configured to determine a position of an alignment mark on a substrate and the support structure is configured to support the sensor system. The sensing element is configured to detect an unintentional displacement of the support structure and the position measurement system is configured to measure the unintentional displacement relative to a reference element based on the detected unintentional displacement. The athermal interface is configured to prevent detection of temperature induced displacement of the support structure by the sensing element.

Abstract: Offline metrology measurements are performed on substrates that have been subjected to lithographic processing. Model parameters are calculated by fitting the measurements to an extended high-order substrate model defined using a combination of basis functions that include an edge basis function related to a substrate edge. A radial edge basis function may be expressed in terms of distance from a substrate edge. The edge basis function may, for example, be an exponential decay function or a rational function. Lithographic processing of a subsequent substrate is controlled using the calculated high-order substrate model parameters, in combination with low-order substrate model parameters obtained by fitting inline measurements to a low order model.

Abstract: A maskless exposure device includes an exposure head that includes a digital micro-mirror device configured to reflect a source beam received from an exposure source to a substrate to scan an exposure beam to the substrate, and a system control part configured to control the digital micro-mirror device using a graphic data system file. The graphic data system file includes data of an align-key. The align-key includes an X-align-key that extends in a direction parallel to a scan direction of the exposure head, and has a bar shape in a plan view, and a Y-align-key disposed adjacent to the X-align-key that has a frame shape in a plan view.

Abstract: A three-dimensional printing apparatus and a three-dimensional printing method are provided. The three-dimensional printing apparatus includes a tank, an injection module, a platform movably disposed above the bottom of the tank, a curing module, and a control module. The tank has a forming area and a separating area in a stepped manner on a bottom thereof, and the forming area is higher than the separating area. The injection module includes a storage tank and an injection pipe connected thereto, and a forming material is filled therein to be applied to the forming area. The curing module is disposed beside the tank or the platform to cure the forming material between the platform and the forming area to be a curing layer. The control module is electrically connected to the injection module, the curing module, and at least one of the tank and the platform to perform a relative movement.

Abstract: A stage mechanism includes a wedge with an inclined surface having a predetermined angle with respect to a horizontal direction, a roller relatively rolling on the inclined surface of the wedge by relative horizontal movement of the wedge, a fine movement mechanism supporting the roller, going up and down in accordance with up and down movement of the roller which relatively rolls on the inclined surfaces by the relative horizontal movement of the wedge, and capable of going up and down more finely than the up and down movement of the roller, a table supported by the fine movement mechanism, and an elastic body connected to the table, restraining horizontal movement of the table, and applying an elastic force, in at least one of upward and downward directions, to the table.

Abstract: A method and an apparatus are directed to characterizing a continuously moving 3D object via interferometry-based scanning. The method includes repeatedly forming several depth characterizations of the 3D object along respective scan lines of a plurality of scan lines on the surface of the 3D object. During this scanning, the 3D object is undergoing its continuous motion. The method further includes combining the determined depth characterization along the scan lines of the plurality of scan lines to form a depth map representing at least a depth of a portion associated with a location on the surface of the 3D object in the third direction on a grid of locations arranged in the first and second directions. Forming the depth characterizations includes scanning a frequency-dispersed pulsed optical signal in a first direction across the continuously moving 3D object, said 3D object moving in a second direction substantially orthogonal to the first direction.

Abstract: A wavelength error for each pulse in a first subset of pulses emitted from an optical source is determined, the wavelength error being the difference between a wavelength for a particular pulse and a target wavelength; a pulse-by-pulse correction signal is determined based on the determined wavelength error, the pulse-by-pulse correction signal including a correction signal associated with each pulse in the first subset of pulses; and a correction based on the determined pulse-by-pulse correction signal is applied to each pulse in a second subset of pulses emitted from the optical source, where applying a correction to a pulse in the second subset of pulses reduces the wavelength error of the pulse in the second subset of pulses.

Abstract: Metrology targets are formed by a lithographic process, each target comprising a bottom grating and a top grating. Overlay performance of the lithographic process can be measured by illuminating each target with radiation and observing asymmetry in diffracted radiation. Parameters of metrology recipe and target design are selected so as to maximize accuracy of measurement of overlay, rather than reproducibility. The method includes calculating at least one of a relative amplitude and a relative phase between (i) a first radiation component representing radiation diffracted by the top grating and (ii) a second radiation component representing radiation diffracted by the bottom grating after traveling through the top grating and intervening layers. The top grating design may be modified to bring the relative amplitude close to unity. The wavelength of illuminating radiation in the metrology recipe can be adjusted to bring the relative phase close to ?/2 or 3?/2.

Abstract: An optical arrangement, in particular a lithography system, includes: a movable component, in particular a mirror; at least one actuator for moving the component; and at least one stop having a stop face for delimiting the movement of the component. The optical arrangement further includes, on a stop or on a plurality of stops, at least two stop faces for delimiting the movement of the movable component in one and the same movement direction.

Abstract: The present disclosure provides a mask for photolithography patterning. The mask includes a substrate, a pattern layer on a surface of the substrate. The mask also includes a pellicle attached to the substrate and configured to isolate the pattern layer from ambient. The pellicle includes a membrane between the pattern layer and ambient, and an optical member disposed in the membrane. A method for manufacturing the mask is also provided.

Abstract: A lens assembly driving module includes a holder, a metal yoke, a lens unit, a magnet set, a coil, at least one elastic element and at least one damper agent. The metal yoke is coupled with the holder and includes a through hole and at least one extending structure. The extending structure is disposed around the through hole and extends along a direction from the through hole to the holder. The lens unit is movably disposed in the metal yoke. The lens unit includes an optical axis and at least one notch structure. The notch structure is disposed in an outer peripheral area of the lens unit and is corresponding to the extending structure. The damper agent is disposed between the extending structure of the metal yoke and the notch structure of the lens unit. The damper agent is applied to damp a movement of the lens unit.

Abstract: The present disclosure provides methods of defining internal secondary structures of an object to be formed at least in part by additive manufacturing. The object may include a primary structure having a volume. The methods may include applying a balancing parameter within an axis-aligned bounding box that encompasses the primary structure. The methods may further include refining the balancing parameter until the volume is delimited into a plurality of the internal structures. The plurality of internal structures may be oriented at an angle to a global z-axis that is substantially parallel to a build direction, such as angled in a range of 40 degrees to 70 degrees to the z-axis.

Abstract: Effects in multiple linear regression may be decorrelated to decompose and attribute risk to common and proper effects. In other words, an attribute risk may be decomposed to two or more causes, where each cause is characterized by multiple attributes. The risk decomposition may decompose risk into a first residual part associated with a first set of risk factors, a second residual part associated with a second set of risk factors, and a common part associated with a set of common hidden variables that minimize a correlation between the first set of factors and the second set of factors. The common hidden variables may be modeled using a hidden factor model. An effect of the correlation may be minimized on the first set of risk factors and the second set of risk factors, and how correlated the terms of the risk decomposition are may be quantified.

Abstract: A lithographic apparatus has a support structure configured to support a patterning device, the patterning device serving to pattern a radiation beam according to a desired pattern and having a planar main surface through which the radiation beam passes; an outlet opening configured to direct a flow of a gas onto the patterning device; and an inlet opening configured to extract the gas which has exited the outlet opening, wherein the outlet opening and inlet opening are in a facing surface facing the planar main surface of the patterning device.

Abstract: Embodiments described herein provide a system, a software application, and methods of a lithography process that provide at least one of the ability to decrease the stabilization time and write an exposure pattern into a photoresist on a substrate compensating for the change in the total pitch over a stabilization time. One embodiment of the system includes a slab, a stage disposed over the slab, a pair of supports disposed on the slab, a processing apparatus, and a chiller system. The pair of supports support a pair of tracks and the stage is configured to move along the pair of tracks. The processing apparatus has an apparatus support coupled to the slab and a processing unit supported by the apparatus support. The processing unit has a plurality of image projection systems. The chiller system has at least one fluid channel disposed in each track of the pair of tracks.

Abstract: Disclosed is a silicon wafer processing device; a pre-aligned optical assembly and an edge exposure assembly are provided on a synchronous bi-directional motion module, reducing the occupied space of the device and saving the installation cost; and furthermore, a synchronous bi-directional motion module, a rotation unit and a position compensation unit on a bottom plate are controlled by means of a control assembly, so as to reduce the operational complexity; and moreover, the synchronous bi-directional motion module is controlled to drive the pre-aligned optical assembly and the edge exposure assembly to simultaneously move, so that the operations of pre-aligning and edge exposure can be performed on silicon wafers of different sizes, thereby saving the switching time and increasing the work efficiency. Further disclosed is a method for processing a silicon wafer using a silicon wafer processing device.

Abstract: A lithography system is provided with: a measurement device measuring position information of marks on a substrate held in a first stage; and an exposure apparatus on a second stage, the substrate for which the position information measurement for the marks has been completed, performs alignment measurement to measure position information for part of marks selected from among the marks on the substrate, and performs exposure. The measurement device measures position information of many marks on the substrate to obtain higher-degree components of correction amounts of an arrangement of divided areas, and the exposure apparatus measures position information of a small number of marks on the substrate to obtain lower-degree components of the correction amounts of the arrangement of the divided areas and exposes the plurality of divided areas while controlling the position of the substrate by using the obtained lower-degree components and the higher-degree components obtained by the measurement device.

Abstract: A method of lithography includes obtaining a profile of a single field of a substrate that having a photoresist layer thereon, in which the profile includes a first feature and a second feature having different heights. A depth of focus distribution map is generated according to the profile. A project lens is tuned based on the generated depth of focus distribution map, such that the project lens provides a first focus length in a first project pixel of the project lens and a second focus length in a second project pixel of the project lens, wherein the first focus length and the second focus lengths. The single field of the substrate is exposed by using the tuned project lens.

Abstract: A system includes a visual sensor provided in an industrial machine or in the vicinity thereof to acquire a plurality of image data, a calculation unit that calculates a contamination degree of a lens or a lens cover of the visual sensor on the basis of the image data acquired by the visual sensor, and a prediction unit that calculates information on a predicted cleaning timing to be performed in the future, of the lens or the lens cover on the basis of the calculated contamination degree of the lens or the lens cover.

Abstract: An infrared imaging signal is generated. An image of an exit signal of the infrared imaging signal is captured. The infrared imaging signal is within a frequency band.

Abstract: A liquid immersion exposure apparatus is disclosed. It includes a projection system having a final element and a liquid immersion member that in turn includes a first member, which surrounds the final element and has a liquid supply port and a liquid suction port, and a second member, which is movable with respect to the first member and has a lower part under which a portion of a liquid immersion space is formed. During exposure of a plurality of shot regions of a substrate, the immersion space covers a portion of a surface of the substrate, and the first shot region is exposed while moving the substrate in a first scanning direction. After the exposure of the first shot region, the second shot region is exposed while moving the substrate in a second scanning direction.

Abstract: Methods and systems for characterizing dimensions and material properties of semiconductor devices by transmission small angle x-ray scatterometry (TSAXS) systems having relatively small tool footprint are described herein. The methods and systems described herein enable Q space resolution adequate for metrology of semiconductor structures with reduced optical path length. In general, the x-ray beam is focused closer to the wafer surface for relatively small targets and closer to the detector for relatively large targets. In some embodiments, a high resolution detector with small point spread function (PSF) is employed to mitigate detector PSF limits on achievable Q resolution. In some embodiments, the detector locates an incident photon with sub-pixel accuracy by determining the centroid of a cloud of electrons stimulated by the photon conversion event. In some embodiments, the detector resolves one or more x-ray photon energies in addition to location of incidence.

Abstract: An optical arrangement, for example a lithography system, includes: a first component, in particular a carrying frame; a second component, in particular a mirror, which is movable in relation to the first component; and at least one stop with at least one stop face for limiting the movement of the second component in relation to the first component. The optical arrangement, preferably the stop, can have a fixing device for fixing the second component. The fixing device can have a fixing element that is movable in relation to the stop face of the stop. Further aspects of the device likewise relate to an optical arrangement with a fixing device or with a transport lock.

Abstract: An exposure apparatus comprises a projection optical system for projecting a pattern of a mask, a substrate stage for holding a substrate, and a measurement device installed on the substrate stage, including a plate on which a substrate-side mark is formed, and a sensor for detecting light transmitted through a mask-side mark, the projection optical system, and the substrate-side mark, and configured to measure an amount of the light detected by the sensor. The substrate-side mark includes a central mark arranged in a center of a sensitive region of the sensor, and a peripheral mark arranged in a periphery of the central mark. The central mark is used in measurement of the light amount, including driving the substrate stage in a direction parallel to an optical axis of the projection optical system.

Abstract: A method for estimating a posture of a camera installed in a substrate processing apparatus to obliquely photograph an object includes removing the remaining background other than a substrate and performing ellipse fitting, adjusting a yaw direction of the camera by using a difference between the center of a camera image and the center of an elliptical substrate image obtained by performing the ellipse fitting, adjusting a roll direction of the camera by using a tilt angle of an ellipse in the elliptical substrate image obtained by performing the ellipse fitting, and adjusting a pitch direction of the camera by using a ratio of a minor axis to a major axis of the ellipse in the elliptical substrate image obtained by performing the ellipse fitting.

Abstract: An optical processing apparatus includes: a housing; a stage; and a light irradiation unit configured to cause a light source unit to emit light so as to form a strip-like irradiation area extending over an area wider than a width of a substrate in a right and left direction. The stage and the light irradiation unit are moved by a moving mechanism relatively to each other in a back and forth direction. Light emitted from the light irradiation unit is deviated by a light-path changing unit from a relative movement area of a substrate. When a substrate is relatively moved below the light irradiation unit without the intension of being subjected to a light irradiation process, a control unit outputs a control signal such that an irradiation area is not formed on a surface of the substrate by the light-path changing unit, while the light source unit emitting light.

Abstract: In immersion lithography after exposure of a substrate is complete, a detector is used to detect any residual liquid remaining on the substrate and/or substrate table.

Abstract: The present invention provides an exposure method of exposing a substrate via an original held by a stage while scanning the original, comprising: performing a first step of scan-driving the stage so that a maximum acceleration becomes a first acceleration; and performing a second step of scan-driving the stage while exposing the substrate so that the maximum acceleration becomes a second acceleration after the performing the first step, wherein the first acceleration is lower than the second acceleration.

Abstract: An apparatus configured to detect a substance, and method of operating and forming the same. In one embodiment, the apparatus includes a tunable resonator including an upper Bragg reflector and a lower Bragg reflector separated by a porous matrix. The tunable resonator is configured to be illuminated by a light source and produce a first spectral optical response from a substance absorbed within the porous matrix. The apparatus also includes a detector positioned proximate the tunable resonator configured to provide a first absorption signal representing the first spectral optical response.

Abstract: The present invention provides an exposure apparatus which exposes a substrate while scanning an original and the substrate, comprising: a stage that includes a first surface in which a first concave portion and a second concave portion to be supplied with a purge gas are formed, and is movable while holding the original; and a member including a second surface facing the first surface, wherein the first concave portion is provided in the first surface of the stage so as to define a first space in which the original is arranged, and at least one second concave portion is provided outside the first concave portion in the first surface of the stage so as to define a second space having a smaller volume than the first space.

Abstract: Disclosed herein is a laser processing apparatus including first and second laser mechanisms, a laser oscillator for oscillating an original laser beam, an optical system for branching the original laser beam into first and second laser beams, and first and second operation panels for respectively setting first and second processing conditions for the first and second laser mechanisms. The first and second laser mechanisms include first and second chuck tables for holding first and second workpieces, first and second X moving units for moving the first and second chuck tables in an X direction, first and second Y moving units for moving the first and second chuck tables in a Y direction perpendicular to the X direction, and first and second focusing units for focusing the first and second laser beams to the first and second workpieces held on the first and second chuck tables, respectively.

Abstract: Fringe-projection autofocus system devoid of a reference mirror. Contributions to error in determination of a target surface profile caused by air non-uniformities are measured based on multiple measurements of the target surface performed at different wavelengths, and/or angles of incidence, and/or grating pitches and subtracted from the measured profile, rendering the system substantially insensitive to presence of air turbulence. Same optical beams forming a fringe irradiance pattern on target surface are used for measurement of the surface profile and reduction of measurement error by the amount attributed to air turbulence.

Abstract: A laser processing head comprising a focusing device for focusing a processing laser beam onto a workpiece, the focusing device arranged in a processing beam path, an optical imaging device comprising a detector, wherein the optical imaging device is configured to image observation radiation from a processing region of the workpiece onto the detector along an observation beam path passing through the focusing device, a beam splitter for separating the observation beam path from the processing beam path of the processing laser beam, imaging optics arranged in the observation beam path between the beam splitter and the detector; and a stop arranged between the imaging optics and the detector, wherein the imaging optics produces an image of the stop in the processing beam path of the processing laser beam between the beam splitter and the workpiece.

Abstract: A shutter device for use in exposure by a photolithography machine and a method of using the shutter device are disclosed. The device includes a shutter blade (1); a rotating motor (2) for driving the shutter blade (1) to rotate; a controller in electric connection with the rotating motor (2); and a supporter (3) for supporting the rotating motor (2). The shutter blade (1) includes a rotation center (11) and, disposed in correspondence with the rotation center (11), at least one open portion (12) and at least one shielding portion (13). The rotation center (11) is coupled to the rotating motor (2) which drives the shutter blade (1) to rotate so that the shutter device opening and closure are accomplished to enable and disable exposure. The shielding portion (13) includes a hollow portion (131) which significantly reduces the mass of the shutter blade (1), thereby facilitating the control over the rotation of the shutter blade (1).

Abstract: An extreme ultraviolet light generation apparatus includes: a chamber; an optical unit; a chamber reference member including a housing space in which the optical unit is housed; a height positioning mechanism configured to position, at a predetermined installation position in the housing space, the optical unit to a predetermined installation height while contacting a first part of the optical unit; and a movement mechanism configured to linearly move the optical unit in the horizontal direction in the housing space while keeping the optical unit at a guide height, and including a guide member and a retraction part, wherein the guide height of the optical unit while being guided to move toward the installation position by the guide surface is substantially equal to the installation height.

Abstract: A porous member is used in a liquid removal system of an immersion lithographic projection apparatus to smooth uneven flows. A pressure differential across the porous member may be maintained at below the bubble point of the porous member so that a single-phase liquid flow is obtained. Alternatively, the porous member may be used to reduce unevenness in a two-phase flow.

Abstract: A charged-particle beam writing apparatus includes a writing chamber to house a stage having a writing object placed thereon, a beam irradiator to irradiate a charged particle beam to the writing object placed on the stage, a stage driver to move the stage, a temperature distribution calculator to calculate temperature distribution of the writing object caused by a heat source in the writing chamber, based on movement history information of the stage, a deformed amount calculator to calculate a deformed amount of the writing object based on a constraint condition of the writing object placed on the stage and the calculated temperature distribution, and a position corrector to correct an irradiation position of the charged particle beam to the writing object based on the calculated deformed amount. The beam irradiator irradiates the charged particle beam based on the irradiation position corrected by the position corrector.

Abstract: An encoder, which measures a relative moving amount of a second member relative to a first member, includes: a diffraction grating provided on the first member; a light-incident optical member causing a measuring light to come into a grating pattern surface of the diffraction grating substantially perpendicularly; a first reflecting member provided on the second member and reflecting a diffracted light generated from the diffraction grating; a first direction-changing member changing a direction of the diffracted light; a first photo-detector detecting an interference light generated by interference between a double diffracted light and other diffracted light than the double diffracted light or a reference light, the double diffracted light being generated, via diffraction of the diffracted light, from the diffraction grating; and a measuring section which obtains the relative moving amount of the second member relative to the first member by using a detection signal from the first photo-detector.

Abstract: The invention relates to a method and a device for characterizing a mask for microlithography. In a method according to the invention, structures of a mask intended for use in a lithography process in a microlithographic projection exposure apparatus are illuminated by an illumination optical unit, wherein the mask is imaged onto a detector unit by an imaging optical unit, wherein image data recorded by the detector unit are evaluated in an evaluation unit. In this case, for emulating an illumination setting predefined for the lithography process in the microlithographic projection exposure apparatus, the imaging of the mask onto the detector unit is carried out in a plurality of individual imagings which differ from one another with regard to the illumination setting set in the illumination optical unit or the polarization-influencing effect set in the imaging optical unit.

Abstract: An immersion lithographic apparatus has adaptations to prevent or reduce bubble formation in one or more gaps in the substrate table by preventing bubbles escaping from the gap into the beam path and/or extracting bubbles that may form in the gap.

Abstract: An inspection method includes the following steps: identifying a plurality of patterns within an image; and comparing the plurality of patterns with each other for measurement values thereof. The above-mentioned inspection method uses the pattern within the image as a basis for comparison; therefore, measurement values of the plurality of pixels constructing the pattern can be processed with statistical methods and then compared, and the false rate caused by variation of a few pixels is decreased significantly. An inspection system implementing the above-mentioned method is also disclosed.

Abstract: On a substrate conforming to a layout method for a plurality of marks for detection using a plurality of mark detection systems of which the detection centers are arranged at a predetermined spacing along an X-axis direction, a plurality of shot areas are formed in both an X-axis direction and a Y-axis direction orthogonal thereto in an XY plane, and sets including at least two marks separated in the X-axis direction are repeatedly arranged along the X-axis direction at spacing of a length in the X-axis-direction of each shot area, and the marks belonging to each set are separated from each other in the X-axis direction by a spacing determined based arrangement in the X-axis direction of the plurality of mark detection systems and the length. It is thereby possible to reliably detect a plurality of marks on a substrate using a plurality of mark detection systems.

Abstract: A lithographic projection apparatus is disclosed in which a space between the projection system and a sensor is filled with a liquid.

Abstract: A method for exposing a structure on a substrate includes positioning of an invariable reticle and a programmable reticle in a light path between a light source and a layer on a substrate to be exposed to light and exposing the layer on the substrate by light from the light source passing the invariable reticle and the programmable reticle.

Abstract: The present invention provides an imprint system including a processing unit configured to perform an imprint process, the processing unit including a dispenser configured to supply a droplet of an imprint material onto a substrate, a library configured to manage a plurality of different maps each indicating at least one of a supply position and a supply amount for a droplet to be supplied on the substrate from the dispenser, and a control unit configured to select one map to be used in the imprint process from the plurality of maps managed in the library based on information about a change of a result of the imprint process caused by a temporal change of at least one of a mold and the dispenser.

Abstract: A structure and method for employing the structure to reliably read indicia formed on a substrate such as a panel or wafer is disclosed. A gripping member pulls the substrate into at least partial compliance with a locating structure to facilitate the proper function of a code reader. Where the indicia are not read, the substrate is moved relative to the code reader, starting from a position that may be determined based on the material properties of the substrate.

Abstract: A three-dimensional interferometer for measuring a light field produced by an object, comprising a first interferometer arm, a second interferometer arm, a beam splitter arranged between an object point of the object and the first interferometer arm and the second interferometer arm, and is set up to split a beam coming from the object point at the beam splitter into the first beam and the second beam, a detection plane or a detection surface which is arranged downstream of the first interferometer arm and the second interferometer arm and is set up in such a manner that the first beam and the second beam are made to interfere in an interference region on said plane or surface, and an overlapping device which is arranged between the detection plane and the first interferometer arm and the second interferometer arm.

Abstract: An imprint lithography system that pressurizes and depressurizes an air cavity behind a retained imprint template or substrate so as to deflect the template or substrate to aid in filling the template pattern with fluid resist and/or separating the template from the cured resist on the substrate. The system includes a controller, pressure sensors, and an impedance valve for modulating the air cavity pressure so as to reduce pressure wave oscillations within the cavity that otherwise negatively impact overlay accuracy control, fluid spread control and separation control.